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Photoluminescence-based dopant imaging of Ga-, P- and Sb-doped Czochralski-grown silicon wafers for solar cells 太阳能电池用掺Ga、P和sb硅晶圆的光致发光掺杂成像
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-01-23 DOI: 10.1016/j.jcrysgro.2026.128504
Afsaneh Kashizadeh , Rabin Basnet , Khoa Nguyen , Stephane Armand , Christian Samundsett , Wei Han , Yichun Wang , AnYao Liu , Daniel Macdonald
Recharged Czochralski (RCz) silicon is now the dominant substrate for industrial photovoltaics, yet research on radial dopant uniformity remains limited. In this study, we apply high-resolution steady-state photoluminescence (PL) imaging of the doping concentration, calibrated using eddy-current resistivity measurements, to characterize radial and axial dopant distributions in RCz-grown silicon wafers doped with antimony (Sb), phosphorus (P), and gallium (Ga). Despite their markedly different segregation coefficients, all three dopants exhibit highly uniform radial concentration profiles, with only weak (<10%) reductions in dopant concentration toward the wafer edges. These trends are consistent with the suppression of radial concentration gradients by crystal-crucible counter-rotation in the RCz process. Localized variations observed in the central ∼30 mm region are attributed to dopant redistribution driven by buoyancy- and Marangoni-driven melt convection. Axially along the length of the ingot, the wafers exhibit dopant distributions that are consistent with the combined effects of dopant segregation and evaporation: Sb-doped wafers show minimal doping variation along the ingot, whereas P- and Ga-doped wafers exhibit increasing doping concentrations toward the ingot tail. Calibrated PL measurements also reveal changes in apparent doping concentration arising from oxygen-related thermal donor (TD) formation and annihilation in Sb-doped samples after thermal treatments. These results demonstrate that RCz growth yields wafers with excellent radial dopant uniformity for the n- and p-type dopants studied here.
可充电奇克拉尔斯基硅(RCz)是目前工业光伏的主要衬底,但对径向掺杂均匀性的研究仍然有限。在这项研究中,我们应用高分辨率稳态光致发光(PL)成像的掺杂浓度,使用涡流电阻率测量校准,以表征径向和轴向的掺杂分布在rcz生长的硅晶圆掺杂锑(Sb),磷(P)和镓(Ga)。尽管这三种掺杂剂的偏析系数明显不同,但它们的径向浓度分布高度均匀,沿晶圆边缘的掺杂剂浓度只有微弱的(<10%)下降。这些趋势与晶体-坩埚反旋转对径向浓度梯度的抑制是一致的。在中心~ 30 mm区域观测到的局部变化归因于浮力和marangoni驱动的熔体对流驱动的掺杂剂再分布。沿铸锭长度轴向,晶圆的掺杂分布与掺杂偏析和蒸发的综合效应一致:sb掺杂晶圆沿铸锭方向的掺杂变化最小,而P和ga掺杂晶圆沿铸锭尾部的掺杂浓度增加。校准后的PL测量还揭示了在热处理后,由氧相关热供体(TD)的形成和湮灭引起的表观掺杂浓度的变化。这些结果表明,对于本文研究的n型和p型掺杂剂,RCz生长产生的晶圆具有优异的径向掺杂均匀性。
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引用次数: 0
Growth-temperature-dependent oxygen vacancy engineering and optical properties of Ga2S3-Ga2O3 composite films via thermal oxidation 热氧化制备Ga2S3-Ga2O3复合薄膜的生长温度依赖性氧空位工程和光学性能
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-02-03 DOI: 10.1016/j.jcrysgro.2026.128518
Jiao Hou, Yunfei Deng, Chuangming Liang, Jinpeng Luo, Weijia Yang
Ga2S3-Ga2O3 composite thin films were successfully produced by thermally oxidizing Ga2S3 precursors deposited via magnetron sputtering. The impact of Ga2S3 deposition temperatures ranging from 25 to 450 °C on the structural, chemical, and optical properties of the resulting composites was thoroughly examined. Analysis confirmed the presence of both β-Ga2O3 and Ga2S3 phases in the films. Films deposited at 300 °C displayed optimal features, such as a smooth surface, improved crystallinity, and strong absorption in the solar-blind ultraviolet range (∼273 nm). X-ray photoelectron spectroscopy investigations indicated that the composite structure and growth temperature play a significant role in adjusting oxygen vacancy levels, crucial for device efficiency. This study showcases an effective method for producing high-quality Ga2S3-Ga2O3 heterojunction films with promising applications in ultraviolet photodetection and gas sensing.
采用磁控溅射法对Ga2S3前驱体进行热氧化,成功制备了Ga2S3- ga2o3复合薄膜。研究了25 ~ 450℃的Ga2S3沉积温度对复合材料结构、化学和光学性能的影响。分析证实了膜中同时存在β-Ga2O3和Ga2S3相。在300°C下沉积的薄膜显示出最佳的特性,如光滑的表面,改善的结晶度,以及在太阳盲紫外范围(~ 273 nm)内的强吸收。x射线光电子能谱研究表明,复合材料的结构和生长温度在调节氧空位水平方面起着重要作用,这对器件效率至关重要。本研究展示了一种制备高质量Ga2S3-Ga2O3异质结薄膜的有效方法,在紫外光探测和气体传感方面具有广阔的应用前景。
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引用次数: 0
Characterization of GaN layers grown on polycrystalline AlN substrates by hydride vapor phase epitaxy 氢化物气相外延法在多晶AlN衬底上生长GaN层的表征
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-01-31 DOI: 10.1016/j.jcrysgro.2026.128515
Anna Honda , Eun-Min Kwon , Kyoung-Hwa Kim , Jae-Hak Lee , Yoshio Honda , Takeshi Kato , Jun-Seok Park , Hyung-Soo Ahn
Gallium nitride (GaN) layers were grown on low-cost polycrystalline aluminum nitride (pc-AlN) substrates by hydride vapor phase epitaxy (HVPE) using a sputtered AlN buffer layer. Cross-sectional scanning electron microscopy (SEM) revealed relatively uniform GaN growth without interfacial voids or delamination, while transmission electron microscopy (TEM) demonstrated recrystallization behavior in the sputtered AlN buffer layer and the formation of a laterally coalesced GaN/AlN interface. Energy-dispersive X-ray spectroscopy (EDS) confirmed Ga- and N-rich composition in the GaN region with minimal Al interdiffusion, indicating a chemically sharp GaN/AlN interface. Atomic force microscopy (AFM) showed a root-mean-square (RMS) surface roughness of 0.39 µm, consistent with the grain structure of the underlying polycrystalline substrate. X-ray diffraction (XRD) confirmed the wurtzite GaN structure with distinct (002) and (102) reflections, reflecting the polycrystalline nature of the GaN layer. Cathodoluminescence (CL) mapping showed localized emission variations associated with grain boundaries, along with near-band-edge (NBE) and deep-level luminescence features. These results demonstrate the feasibility of continuous HVPE growth of GaN on pc-AlN substrates using a sputtered AlN buffer layer, suggesting a pathway for further optimization of GaN growth on cost-effective non-single-crystal AlN platforms.
利用溅射AlN缓冲层,采用氢化物气相外延(HVPE)技术在低成本多晶氮化铝(pc-AlN)衬底上生长了氮化镓(GaN)层。横断面扫描电子显微镜(SEM)显示相对均匀的GaN生长,没有界面空洞或分层,而透射电子显微镜(TEM)显示在溅射的AlN缓冲层中有再结晶行为,并形成横向聚结的GaN/AlN界面。能量色散x射线能谱(EDS)证实了氮化镓(Ga)和氮化氮(n)在氮化镓(GaN)区域的富Ga和富n成分,且Al的相互扩散极小,表明氮化镓/氮化镓界面具有明显的化学性质。原子力显微镜(AFM)显示,表面均方根(RMS)粗糙度为0.39µm,与多晶衬底的晶粒结构一致。x射线衍射(XRD)证实了纤锌矿GaN结构具有明显的(002)和(102)反射,反映了GaN层的多晶性质。阴极发光(CL)图显示了与晶界相关的局部发射变化,以及近带边缘(NBE)和深能级发光特征。这些结果证明了使用溅射AlN缓冲层在pc-AlN衬底上连续HVPE生长GaN的可行性,为进一步优化GaN在具有成本效益的非单晶AlN平台上的生长提供了途径。
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引用次数: 0
Fabrication of N-polar AlN films on 4H-SiC substrates via polarity inversion technique 极性反转技术在4H-SiC衬底上制备n极性AlN薄膜
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-01-22 DOI: 10.1016/j.jcrysgro.2026.128503
Yuning Wang , Tomohiro Tamano , Tomoya Higashi , Ryota Akaike , Hiroki Yasunaga , Hideto Miyake
N-polar aluminum nitride (AlN) is an ultra-wide bandgap semiconductor with significant potential not only in optical devices but also in high-power, high-frequency, and high-temperature electronic applications. However, the epitaxial growth of device-grade N-polar AlN films has been hindered by challenges in controlling surface kinetics and polarity. In this study, we demonstrate the fabrication of high-quality N-polar AlN films on Si-face 4H-SiC substrates by combining sputter deposition with face-to-face annealing (FFA Sp), and employing a controlled polarity inversion technique. The resulting N-polar AlN films were crack-free and exhibited atomically smooth surfaces, with a root-mean-square (RMS) roughness of approximately 0.15  nm. The full width at half maximum (FWHM) values of the X-ray rocking curves for the (0002) and (10–12) diffraction peaks were measured to be 89 arcsec and 238 arcsec, respectively, corresponding to threading dislocation density (TDD) of approximately 6.5 × 108 cm−2. Cross-sectional TEM analysis confirmed similarly low TDD (∼1.5 × 108 cm−2). These results demonstrate an effective and scalable route for achieving high-quality N-polar AlN films on 4H-SiC substrates.
n极氮化铝(AlN)是一种超宽带隙半导体,不仅在光学器件,而且在高功率、高频和高温电子应用中具有重要的潜力。然而,器件级n极性AlN薄膜的外延生长一直受到表面动力学和极性控制方面的挑战的阻碍。在这项研究中,我们展示了通过结合溅射沉积和面对面退火(FFA Sp),并采用可控极性反转技术,在Si-face 4H-SiC衬底上制备高质量的n极性AlN薄膜。得到的n极性AlN薄膜无裂纹,表面原子光滑,均方根(RMS)粗糙度约为0.15 nm。(0002)和(10-12)衍射峰的x射线摇摆曲线的半最大值全宽度(FWHM)值分别为89 arcsec和238 arcsec,对应的螺纹位错密度(TDD)约为6.5 × 108 cm−2。横断面TEM分析证实了类似的低TDD (~ 1.5 × 108 cm−2)。这些结果证明了在4H-SiC衬底上获得高质量n极AlN薄膜的有效和可扩展的途径。
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引用次数: 0
Effects of iron incorporation on the properties of tin sulfide thin films: a multi-technique investigation 铁掺入对硫化锡薄膜性能的影响:多技术研究
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-01-31 DOI: 10.1016/j.jcrysgro.2026.128513
J. Vijaya Raja Sekaran , K. Vijayakumar , S. Dinesh , C. Vignesh , G. Anburaj , M. Surendra Varma , M. Jerome Rozario , L. Guganathan , C. Rajeevgandhi , K. Vinoth
This study presents a systematic investigation into the effects of iron (Fe) incorporation (pure, 15, 25, 35, and 45 at%) on the structural, morphological, and optical properties of tin sulfide (SnS) thin films. A multi-technique approach employing X-ray diffraction (XRD), scanning electron microscopy with energy-dispersive X-ray spectroscopy (SEM-EDX), transmission electron microscopy (TEM), and photoluminescence (PL) spectroscopy was used for characterization. XRD analysis confirmed the orthorhombic phase of SnS in undoped films and revealed a lattice contraction at lower Fe concentrations (≤25 at%) due to successful substitutional doping. At higher concentrations (≥35 at%), the formation of secondary phases, identified as FeS2 and Sn2S3, was observed, leading to degraded crystallinity. SEM and TEM analyses corroborated these findings, showing a transition from a dense, homogeneous morphology to a rough, agglomerated surface with distinct secondary phase nanoparticles at 45 at% Fe. EDX mapping confirmed homogeneous element distribution at lower doping levels and Fe clustering at higher levels. PL spectroscopy demonstrated a blue shift in the emission peak at intermediate doping levels (25 at%), attributed to the Burstein-Moss effect from increased charge carriers. However, severe PL quenching and the emergence of deep-level emissions occurred at higher Fe concentrations (35 and 45 at%), indicating the introduction of non-radiative recombination centers. The results conclusively identify an optimal Fe incorporation threshold near 25 at%, beyond which the beneficial properties of SnS are significantly compromised by phase segregation and defect generation. This work provides critical insights for tailoring Fe-doped SnS properties for optoelectronic applications.
本研究系统地研究了铁(Fe)掺入(纯、15、25、35和45 at%)对硫化锡(SnS)薄膜结构、形态和光学性能的影响。采用x射线衍射(XRD)、扫描电镜-能量色散x射线能谱(SEM-EDX)、透射电镜(TEM)和光致发光(PL)光谱等多技术方法进行表征。XRD分析证实了未掺杂薄膜中sn的正交相,并发现由于成功的取代掺杂,在较低铁浓度(≤25 at%)下,sn的晶格收缩。在较高的浓度(≥35 At %)下,观察到二级相的形成,鉴定为FeS2和Sn2S3,导致结晶度下降。扫描电镜和透射电镜分析证实了这些发现,显示从致密,均匀的形态转变为粗糙,团聚表面具有明显的二次相纳米颗粒。EDX图谱证实了低掺杂水平下元素的均匀分布和高掺杂水平下铁的聚类。PL光谱显示,在中等掺杂水平(25% at%)下,由于载流子增加导致的Burstein-Moss效应,发射峰出现蓝移。然而,在较高的铁浓度(35和45 at%)下,发生了严重的PL猝灭和深能级辐射的出现,表明引入了非辐射复合中心。结果确定了一个最佳的铁掺入阈值,接近25% at%,超过这个阈值,SnS的有益性能会受到相偏析和缺陷产生的显著影响。这项工作为为光电应用量身定制掺铁SnS特性提供了关键见解。
{"title":"Effects of iron incorporation on the properties of tin sulfide thin films: a multi-technique investigation","authors":"J. Vijaya Raja Sekaran ,&nbsp;K. Vijayakumar ,&nbsp;S. Dinesh ,&nbsp;C. Vignesh ,&nbsp;G. Anburaj ,&nbsp;M. Surendra Varma ,&nbsp;M. Jerome Rozario ,&nbsp;L. Guganathan ,&nbsp;C. Rajeevgandhi ,&nbsp;K. Vinoth","doi":"10.1016/j.jcrysgro.2026.128513","DOIUrl":"10.1016/j.jcrysgro.2026.128513","url":null,"abstract":"<div><div>This study presents a systematic investigation into the effects of iron (Fe) incorporation (pure, 15, 25, 35, and 45 at%) on the structural, morphological, and optical properties of tin sulfide (SnS) thin films. A multi-technique approach employing X-ray diffraction (XRD), scanning electron microscopy with energy-dispersive X-ray spectroscopy (SEM-EDX), transmission electron microscopy (TEM), and photoluminescence (PL) spectroscopy was used for characterization. XRD analysis confirmed the orthorhombic phase of SnS in undoped films and revealed a lattice contraction at lower Fe concentrations (≤25 at%) due to successful substitutional doping. At higher concentrations (≥35 at%), the formation of secondary phases, identified as FeS<sub>2</sub> and Sn<sub>2</sub>S<sub>3</sub>, was observed, leading to degraded crystallinity. SEM and TEM analyses corroborated these findings, showing a transition from a dense, homogeneous morphology to a rough, agglomerated surface with distinct secondary phase nanoparticles at 45 at% Fe. EDX mapping confirmed homogeneous element distribution at lower doping levels and Fe clustering at higher levels. PL spectroscopy demonstrated a blue shift in the emission peak at intermediate doping levels (25 at%), attributed to the Burstein-Moss effect from increased charge carriers. However, severe PL quenching and the emergence of deep-level emissions occurred at higher Fe concentrations (35 and 45 at%), indicating the introduction of non-radiative recombination centers. The results conclusively identify an optimal Fe incorporation threshold near 25 at%, beyond which the beneficial properties of SnS are significantly compromised by phase segregation and defect generation. This work provides critical insights for tailoring Fe-doped SnS properties for optoelectronic applications.</div></div>","PeriodicalId":353,"journal":{"name":"Journal of Crystal Growth","volume":"680 ","pages":"Article 128513"},"PeriodicalIF":2.0,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146171216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study of crystalline N-Polar Aluminum Nitride growth on both on-axis and off-axis Si (111) using plasma assisted molecular beam epitaxy 利用等离子体辅助分子束外延在Si(111)上生长n极性氮化铝晶体的研究
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-02-05 DOI: 10.1016/j.jcrysgro.2026.128519
Tahmid Sami Rahman , Sunil Choudhary , Brian Chang-Chien , Seungjun Kim , Elaheh Ahmadi
This study reports the successful growth of high-quality N-polar Aluminum Nitride (AlN) on off-axis Si(111) substrates using plasma-assisted molecular beam epitaxy (PAMBE), along with a comparative analysis of AlN films grown on both on-axis and off-axis Si(111). Motivated by the growing interest in off-axis Si(111) substrates for subsequent regrowth by metal–organic chemical vapor deposition (MOCVD), we focus on AlN growth on Si(111) with a 4°miscut. Through systematic optimization of growth conditions, including surface preparation and Al pre-deposition, we achieved a 100% yield of N-polar AlN across all attempts with off-axis Si(111). High crystalline quality of the AlN growth on miscut Si (111) substrate is confirmed by full width at half maximum (FWHM) values of the (002) X-ray rocking curve. N-polarity was verified for both on-axis and off-axis samples through in situ Reflection High-Energy Electron Diffraction (RHEED) and post-growth potassium hydroxide (KOH) etching. High-angle annular dark-field (HAADF) and annular bright-field (ABF) scanning transmission electron microscopy (STEM) imaging further confirm N-polarity based on the relative atomic positions along the growth direction. These results highlight the advantages of miscut Si(111) substrates for improving epitaxial AlN quality and establish a foundation for future N-polar III-nitride device development on silicon platforms.
本研究报道了利用等离子体辅助分子束外延(PAMBE)在离轴Si(111)衬底上成功生长高质量n-极性氮化铝(AlN),并对在轴上和离轴Si(111)上生长的AlN薄膜进行了比较分析。由于人们对离轴Si(111)衬底的兴趣日益浓厚,从而可以通过金属有机化学气相沉积(MOCVD)进行再生,我们将重点放在了4°错切Si(111)上的AlN生长上。通过系统优化生长条件,包括表面制备和Al预沉积,我们在所有离轴Si的尝试中都实现了100%的n极性AlN产率(111)。x射线摆动曲线(002)的半最大值全宽度(FWHM)值证实了在错切Si(111)衬底上生长的AlN的高结晶质量。通过原位反射高能电子衍射(RHEED)和生长后氢氧化钾(KOH)蚀刻验证了轴上和离轴样品的n极性。高角环形暗场(HAADF)和环形明场(ABF)扫描透射电子显微镜(STEM)成像进一步根据生长方向的相对原子位置确定了n极性。这些结果突出了误切Si(111)衬底在提高外延AlN质量方面的优势,并为未来在硅平台上开发n -极性iii -氮化物器件奠定了基础。
{"title":"Study of crystalline N-Polar Aluminum Nitride growth on both on-axis and off-axis Si (111) using plasma assisted molecular beam epitaxy","authors":"Tahmid Sami Rahman ,&nbsp;Sunil Choudhary ,&nbsp;Brian Chang-Chien ,&nbsp;Seungjun Kim ,&nbsp;Elaheh Ahmadi","doi":"10.1016/j.jcrysgro.2026.128519","DOIUrl":"10.1016/j.jcrysgro.2026.128519","url":null,"abstract":"<div><div>This study reports the successful growth of high-quality N-polar Aluminum Nitride (AlN) on off-axis Si(111) substrates using plasma-assisted molecular beam epitaxy (PAMBE), along with a comparative analysis of AlN films grown on both on-axis and off-axis Si(111). Motivated by the growing interest in off-axis Si(111) substrates for subsequent regrowth by metal–organic chemical vapor deposition (MOCVD), we focus on AlN growth on Si(111) with a 4°miscut. Through systematic optimization of growth conditions, including surface preparation and Al pre-deposition, we achieved a 100% yield of N-polar AlN across all attempts with off-axis Si(111). High crystalline quality of the AlN growth on miscut Si (111) substrate is confirmed by full width at half maximum (FWHM) values of the (002) X-ray rocking curve. N-polarity was verified for both on-axis and off-axis samples through in situ Reflection High-Energy Electron Diffraction (RHEED) and post-growth potassium hydroxide (KOH) etching. High-angle annular dark-field (HAADF) and annular bright-field (ABF) scanning transmission electron microscopy (STEM) imaging further confirm N-polarity based on the relative atomic positions along the growth direction. These results highlight the advantages of miscut Si(111) substrates for improving epitaxial AlN quality and establish a foundation for future N-polar III-nitride device development on silicon platforms.</div></div>","PeriodicalId":353,"journal":{"name":"Journal of Crystal Growth","volume":"680 ","pages":"Article 128519"},"PeriodicalIF":2.0,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146171292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Indirect carbonation of titanium gypsum using an aspartic acid-ammonia system for the synthesis of pure vaterite 用天冬氨酸-氨水体系间接碳酸化钛石膏制备纯水晶石
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-02-01 DOI: 10.1016/j.jcrysgro.2026.128506
Yuan Gong , Yujie Qu , Hongxia Wei , Chunlei Li , Lanying Wang , Kangtai Shi , Kehao Qin
The controllable regulation of CaCO3 polymorphs represents a fundamental challenge in indirect carbonation technology. This study developed an aspartic acid (Asp)–ammonia mediated indirect carbonation system for titanium gypsum (TG) to synthesize high-purity vaterite. The selective calcium leaching behavior facilitated by Asp and the formation mechanism of pure vaterite were elucidated through systematic investigation of the leaching and carbonation processes. The results demonstrate that via complexation, Asp achieves a calcium leaching efficiency of 78.30 ± 1.22% from TG, with complete dissolution of the CaSO4·2H2O phase under optimal conditions. In situ conductivity monitoring during carbonation revealed a two-stage polymorph transformation mechanism: an initial calcite-dominant growth stage driven by free Ca2+, followed by a vaterite formation stage sustained by complexed calcium. The adsorption of Asp onto pre-formed calcite surfaces was identified as the critical factor inducing its transformation to vaterite and ensuring vaterite stability. The final product consisted of vaterite-type CaCO3 with 97.31% purity and a phase content exceeding 99%, demonstrating the effectiveness of this approach for sustainable waste valorization and CO2 sequestration.
CaCO3多晶的可控调控是间接碳酸化技术面临的一个根本性挑战。建立了一种天冬氨酸-氨介导的钛石膏间接碳酸化体系,用于合成高纯度钒矾。通过对浸出过程和碳酸化过程的系统研究,阐明了Asp对钙的选择性浸出行为和纯钒石的形成机制。结果表明,通过络合作用,Asp从TG中浸出钙的效率为78.30±1.22%,且在最佳条件下CaSO4·2H2O相完全溶解。碳化过程中的原位电导率监测揭示了一个两阶段的多晶转变机制:由游离Ca2+驱动的方解石为主的初始生长阶段,随后是由络合钙维持的水晶石形成阶段。预成型方解石表面对Asp−的吸附是诱导其向水晶石转变并保证水晶石稳定性的关键因素。最终产物为纯度为97.31%、相含量超过99%的灰岩型CaCO3,证明了该方法对废物可持续增值和CO2封存的有效性。
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引用次数: 0
Formation mechanism and process investigation of nitrogen-vacancy centers in diamond fabricated by microwave plasma chemical vapor deposition 微波等离子体化学气相沉积金刚石中氮空位中心形成机理及工艺研究
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-02-05 DOI: 10.1016/j.jcrysgro.2026.128520
Tengfei Lu , Qijun Wang , Tian Shao , Jiajun Xu , Diwei Zou , Wei Shen , Gai Wu
Nitrogen-vacancy (NV) center is regarded as one of the most significant point defects in diamond crystals and has emerged as a highly promising candidate for quantum technologies. In this study, the stable diamond NV centers of good coherent properties have been successfully fabricated without relying on a pure 12C source or post-treatment processes, such as electron irradiation or high-temperature annealing. Instead, the nitrogen/hydrogen (N2/H2) gas ratio has been optimized during the microwave plasma chemical vapor deposition (MPCVD) process. Additionally, the relationship between the nitrogen concentration in the process gas and the coherence times of the NV center, as well as the synergistic effect of boron-nitrogen co-doping on NV center formation have been systematically examined. As a result, it can be indicated that during the fabrication of diamond NV centers via the MPCVD process, the nitrogen doping flow rate has a significant non-monotonic effect on the coherence times (T2 and T2*). The maximum coherence times for T2 (6.83 μs) and T2* (288.1 ns) are achieved at the nitrogen flow rate of 0.05 sccm. Both coherence times then fluctuate in a similar trend in the range of 2.25–4.79 μs for T2 and 57.2–193.6 ns for T2* as the flow rate increases up to 5.00 sccm. Furthermore, both experimental and computational results demonstrate that B-N co-doping probably suppresses the formation of NV centers, as boron may act as an inhibitor in the process. Thus, this study could provide critical experimental insights into the controlled synthesis of NV centers and advances the understanding of defect engineering in diamond-based quantum materials.
氮空位中心被认为是金刚石晶体中最重要的点缺陷之一,已成为量子技术中极具前景的候选材料。在本研究中,不依赖于纯12C源或后处理工艺,如电子辐照或高温退火,成功制备了具有良好相干性能的稳定金刚石NV中心。在微波等离子体化学气相沉积(MPCVD)工艺中,优化了氮/氢(N2/H2)气体比。此外,系统地研究了工艺气体中氮浓度与NV中心相干次数的关系,以及硼氮共掺杂对NV中心形成的协同效应。结果表明,在MPCVD工艺制备金刚石NV中心过程中,氮掺杂流量对相干次数(T2和T2*)有显著的非单调影响。当氮气流量为0.05 sccm时,T2和T2*的最大相干时间分别为6.83 μs和288.1 ns。当流量增加到5.00 sccm时,T2的相干时间波动在2.25 ~ 4.79 μs, T2*的相干时间波动在57.2 ~ 193.6 ns。此外,实验和计算结果都表明,B-N共掺杂可能抑制了NV中心的形成,因为硼可能在这一过程中起到抑制剂的作用。因此,该研究可以为NV中心的受控合成提供关键的实验见解,并推进对金刚石基量子材料缺陷工程的理解。
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引用次数: 0
Evaluation of high quality 4-inch VGF-InAs substrates for infrared applications 用于红外应用的高质量4英寸VGF-InAs基板的评估
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-02-02 DOI: 10.1016/j.jcrysgro.2026.128517
Xinyu Lv , Youwen Zhao , Yong Huang , Wei Lu , Chenhui Li , Wenwen yang , Yihan Bai , Yingqiang Xu , Guiying Shen
High-quality [100]-oriented 4-inch InAs single crystals with low dislocation density are successfully grown using the vertical gradient freezing (VGF) method and subsequently processed into substrates with superior surface quality through chemical mechanical polishing (CMP) for infrared detection applications. Comprehensive characterization of the InAs substrates is performed to evaluate the crystalline quality, optical/electrical properties, and surface characteristics. XRD analysis reveals excellent crystallinity and uniformity of the crystal, with an average rocking curve FWHM of 15.11 arcsec measured at 45 points on the 4-inch InAs substrate. The crystal demonstrates excellent crystalline integrity, as evidenced by dislocation etch pit density (EPD) measurements of 527 cm−2 and 648 cm−2 at the head and tail positions, respectively. In addition, the substrates exhibit remarkable electrical uniformity and achieved an average infrared transmittance of approximately 50% across the spectral range of 760–2300 cm⁻1. The 4-inch InAs substrates prepared by CMP and cleaning exhibit excellent flatness, atomically smooth and clean surfaces, with a total thickness variation (TTV) of less than 5 μm and a root-mean-square (RMS) roughness below 0.5 nm. Based on the “epi-ready” 4-inch InAs substrate, high-quality InAs/GaSb type-II superlattices are grown by metal–organic chemical vapor deposition (MOCVD). These optimized 4-inch InAs substrates provide a robust foundation for developing infrared detectors with higher pixel density.
采用垂直梯度冷冻(VGF)方法成功生长出具有低位错密度的高质量[100]取向4英寸InAs单晶,并随后通过化学机械抛光(CMP)加工成具有优异表面质量的衬底,用于红外探测应用。对InAs衬底进行了全面的表征,以评估其晶体质量、光学/电学性能和表面特性。XRD分析表明,该晶体具有良好的结晶度和均匀性,在4英寸InAs衬底上的45个点测量到的平均摆动曲线FWHM为15.11 arcsec。通过位错蚀刻坑密度(EPD)测量,该晶体的头部和尾部位置分别为527 cm−2和648 cm−2,证明了该晶体具有优异的晶体完整性。此外,基板表现出显著的电均匀性,在760-2300 cm⁻1的光谱范围内,平均红外透过率约为50%。通过CMP和清洗制备的4英寸InAs衬底具有优异的平整度,表面原子光滑,表面清洁,总厚度变化(TTV)小于5 μm,均方根(RMS)粗糙度小于0.5 nm。基于“外延就绪”的4英寸InAs衬底,采用金属有机化学气相沉积(MOCVD)方法生长出高质量的InAs/GaSb ii型超晶格。这些优化的4英寸InAs衬底为开发更高像素密度的红外探测器提供了坚实的基础。
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引用次数: 0
Multilayer nucleation at step walls: a low-barrier pathway for polytype control in SiC crystal growth 台阶壁上的多层成核:SiC晶体生长中多型控制的低势垒途径
IF 2 4区 材料科学 Q3 CRYSTALLOGRAPHY Pub Date : 2026-04-01 Epub Date: 2026-01-29 DOI: 10.1016/j.jcrysgro.2026.128502
C.W. Lan
Unwanted polytype inclusions, such as 6H in 4H-SiC during physical vapor transport (PVT) or 4H in 3C-SiC during high-temperature solution growth (HTSG), pose significant challenges in SiC crystal growth for power electronics applications. Although prevailing studies highlight large-terrace two-dimensional (2D) nucleation under high supersaturation as the primary mechanism for polytype transitions, this does not fully explain inclusions at low driving forces. Here, we introduce a complementary low-barrier pathway inspired by multilayer twinning in silicon: a multilayer nucleation model at step-wall/terrace corners, governed by the interfacial wall affinity (Δγe, representing the energy reduction relative to the wall/fluid interface) and polytype energy penalty (σpoly). By linking the effective driving force Δgeff to supersaturation (S) and undercooling (ΔT), we integrate our model with classical 2D nucleation theory. Results demonstrate that macro-steps enable multilayer embryos to amortize stacking penalties through layer-by-layer energy redistribution, facilitating foreign polytype nucleation at substantially lower supersaturation. This step-wall-mediated mechanism accounts for polytype inclusions under low driving forces, bridging gaps in terrace-based models. Proposed strategies to mitigate inclusions include minimizing macro-steps and tuning wall affinity via doping to elevate barriers, as validated by recent Al-doping experiments, offering a robust framework for precise polytype control and defect reduction in high-performance SiC crystal growth.
不需要的多型夹杂物,如物理气相传输(PVT)过程中4H-SiC中的6H或高温溶液生长(HTSG)过程中3C-SiC中的4H,对电力电子应用中的SiC晶体生长构成重大挑战。虽然目前的研究强调高过饱和度下的大阶二维(2D)成核是多型转变的主要机制,但这并不能完全解释低驱动力下的包裹体。在这里,我们引入了一个受硅中多层孪晶启发的互补低势垒途径:台阶-壁/阶地角的多层成核模型,由界面壁亲合力(Δγe,代表相对于壁/流体界面的能量减少)和多型能量惩罚(σpoly)控制。通过将有效驱动力Δgeff与过饱和(S)和过冷(ΔT)联系起来,我们将模型与经典二维成核理论相结合。结果表明,宏观步骤使多层胚能够通过逐层的能量再分配来摊销堆叠惩罚,从而在低过饱和度下促进外源多型成核。这种台阶-壁介导的机制解释了低驱动力下的多型包裹体,弥补了阶地模式中的缺口。最近的al掺杂实验验证了减少夹杂物的策略,包括最小化宏观步骤和通过掺杂调节壁亲和来提高障碍,为高性能SiC晶体生长的精确多型控制和缺陷减少提供了一个强大的框架。
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Journal of Crystal Growth
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