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2022 Compound Semiconductor Week (CSW)最新文献

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Effect of gallium incorporation on electrical and material characteristics of TiO2 films for high-permittivity dielectric application 掺加镓对高介电常数介质用TiO2薄膜电学特性和材料特性的影响
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930362
Jie Zhang, Haochen Zhao, Tuofu Zhama, Yuping Zeng
In this work, effects of gallium incorporation on electrical and material characterization of TiO2 films were investigated. These 15 nm Ga-doped TiO2 films were grown by supercycle atomic layer deposition (ALD) and then annealed at 500 ºC in O2 ambient. The levels of Ga incorporation to TiO2 films were controlled by the ratio of Ga to Ti cycles during ALD growth. Material characterizations show that the Ga incorporation destabilizes the crystallization of TiO2 films, resulting in amorphous films even after 500 ºC O2 annealing. The bandgap of these Ga-doped TiO2 films were found to monotonically increase with the increased Ga content. Metal-oxide semiconductor capacitors (MOSCAPs) based on p-type Si substrate were fabricated to evaluate the electrical properties of the Ga-doped TiO2 films. Both leakage currents and capacitances were reduced as the Ga content increases. These well-behaved dielectrics under 500 ºC process suggest their great promises for back-end-of-line (BEOL) device applications.
在这项工作中,研究了镓掺入对TiO2薄膜电学和材料特性的影响。采用超循环原子层沉积(ALD)法制备了15 nm的ga掺杂TiO2薄膜,并在500℃O2环境下进行了退火处理。在ALD生长过程中,Ga与Ti循环的比例控制了TiO2薄膜中Ga的掺入水平。材料表征表明,Ga的掺入使TiO2薄膜的结晶不稳定,即使在500℃O2退火后仍形成非晶态薄膜。随着Ga含量的增加,TiO2薄膜的带隙单调增加。制备了基于p型Si衬底的金属氧化物半导体电容器(MOSCAPs),以评估ga掺杂TiO2薄膜的电学性能。随着Ga含量的增加,漏电流和电容均减小。这些在500ºC工艺下表现良好的电介质表明它们在后端线(BEOL)器件应用中的巨大前景。
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引用次数: 0
Growth of Si-doped GaN Nanowires With Low Density For Power Device Applications 用于功率器件的低密度掺硅GaN纳米线的生长
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930401
M. Benjelloun, Tanbir Sodhi, A. Kunti, L. Travers, A. Soltani, D. Morris, H. Maher, N. Gogneau, J. Harmand
In this work, the growth of low-density self-catalyzed n-doped gallium nitride (GaN) nanowires (NWs) on Si(111) substrate has been investigated for power device applications. In the first part of this study, the influence of the growth temperature on the morphology and the density of the NWs has been studied. We have found that the NWs density can be reduced to 1.55×109 NWs/cm2 at low growth temperature. However, under these conditions, a 1560 nm thick parasitic layer is also grown connecting the NWs by their bottom. To minimize this parasitic growth, we have developed a two-step growth procedure allowing us to maintain the NWs density around 1.91×109 NWs/cm2, while minimizing the parasitic layer’s thickness to 158 nm. In the second part, we have optimized the growth conditions to keep the NW characteristics (low density and thin parasitic layer) while inducing their n-type doping using silicon.
在这项工作中,研究了在Si(111)衬底上生长低密度自催化n掺杂氮化镓(GaN)纳米线(NWs)的功率器件应用。在本研究的第一部分中,研究了生长温度对NWs形貌和密度的影响。我们发现在低生长温度下,NWs密度可以降低到1.55×109 NWs/cm2。然而,在这些条件下,也生长了一个1560nm厚的寄生层,通过它们的底部连接NWs。为了最小化这种寄生生长,我们开发了一种两步生长程序,使我们能够将NWs密度保持在1.91×109 NWs/cm2左右,同时将寄生层的厚度最小化到158 nm。在第二部分,我们优化了生长条件,以保持NW特性(低密度和薄寄生层),同时用硅诱导它们的n型掺杂。
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引用次数: 0
Investigation of Drain Noise in Cryogenic InP High Electron Mobility Transistors Using On-wafer S-parameter and Microwave Noise Characterization 基于片上s参数和微波噪声表征的低温InP高电子迁移率晶体管漏极噪声研究
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930365
Bekari Gabritchidze, Iretomiwa Esho, Kieran A. Cleary, A. Readhead, A. Minnich
We report the on-wafer characterization of S-parameters and microwave noise (T50) of discrete InP HEMTs over a range of physical temperatures, 40 K – 300 K. From these data, we extract a small-signal model and the drain noise temperature (Td) at each bias and temperature. We find that T50 exhibits a temperature dependence that is incompatible with a fixed Td. In contrast, explaining the noise measurements requires Td to change from ~2500 K at room temperature (RT) to ~400 K at cryogenic temperatures. This trend is consistent with the predictions of a theory of drain noise based on real-space transfer of electrons from the channel to the barrier [5].
我们报道了离散InP hemt在40 K - 300 K物理温度范围内的s参数和微波噪声(T50)的片上表征。从这些数据中,我们提取了一个小信号模型和每个偏置和温度下的漏极噪声温度(Td)。我们发现T50表现出与固定Td不相容的温度依赖性。相比之下,解释噪声测量需要Td从室温(RT)的~ 2500k变化到低温下的~ 400k。这种趋势与基于电子从通道到势垒[5]的实空间转移的漏极噪声理论的预测是一致的。
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引用次数: 0
Considerations in the development of a gate process module for ultra-scaled GaN HEMTs 超大尺寸GaN hemt栅极工艺模块开发的考虑
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930349
Ragnar Ferrand-Drake del Castillo, N. Rorsman
With the overarching goal of attaining mm-wave GaN High Electron Mobility Transistors (HEMTs), vertical and lateral downscaling is of essence. Utilizing Passivation first technology (coupled with mini-FP T-gates), Schottky Gate (SG) is formed by Fluorine plasma etching, where the plasma etching allows highly defined nanoscale gate-length (Lg) features. However, it damages the crystalline structure of the top barrier layer and leads to Fluorine implantation with ramifications on the sheet carrier density(ns), mobility (μ) and threshold-voltage (VTH) shift towards enhancement mode. In this study, CF4 or NF3 etching with varying over etch times are implemented, with high temperature annealing (600–800°C) post gate recess etching to repair crystal structure damages caused by the etch process.
为了实现毫米波氮化镓高电子迁移率晶体管(hemt)的总体目标,垂直和横向缩小是必不可少的。利用钝化优先技术(加上mini-FP T-gates),肖特基栅极(SG)由氟等离子体蚀刻形成,其中等离子体蚀刻允许高度定义的纳米级栅极长度(Lg)特征。然而,它破坏了顶层势垒层的晶体结构,导致氟的注入,影响了载流子密度(ns)、迁移率(μ)和阈值电压(VTH)向增强模式的转变。在本研究中,采用不同蚀刻时间的CF4或NF3蚀刻,在栅极凹槽蚀刻后进行高温退火(600-800℃),以修复蚀刻过程中造成的晶体结构损伤。
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引用次数: 0
Uniform N-Polar III-Nitrides on Si(111) by MBE MBE法测定Si(111)上均匀n -极性iii -氮化物
Pub Date : 2022-06-01 DOI: 10.1109/csw55288.2022.9930360
A. Roshko, M. Brubaker, G. Burton, Todd Harvey, K. Bertness
The importance of growth conditions for N-polar nitride MBE growth on Si is examined. It is found that metal-rich conditions at the initiation of growth lead to Al-Si eutectic formation. The eutectic can cause holes in the substrate and AlN layer, and floats on the nitride surface but can be incorporated into the nitride if the growth becomes N-rich. The inclusion of Si from the eutectic can cause polarity inversion, with greater levels of Si and inversion found in samples initiated with higher Al levels and, therefore, higher levels of eutectic formation. Evidence of eutectic was not found in samples where growth was started close to stoichiometry. In addition, the eutectic related defects in the nitride buffers typically did not propagate into nanostructures grown on them by selective area growth.
研究了生长条件对n -极性氮化物MBE在Si上生长的重要性。发现在生长起始时富金属条件导致Al-Si共晶的形成。共晶会在衬底和AlN层中形成孔洞,并漂浮在氮化物表面,但当生长成为富n时,共晶会被纳入氮化物中。共晶中Si的加入会导致极性反转,在Al含量较高的样品中,Si和反转的含量更高,因此共晶的形成水平也更高。在接近化学计量开始生长的样品中没有发现共晶的证据。此外,氮化物缓冲层中与共晶有关的缺陷通常不会通过选择性区域生长扩展成纳米结构。
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引用次数: 0
Demonstration of Various h-BN Based Diodes with TCAD Simulation 用TCAD模拟演示各种h-BN基二极管
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930353
Ziyi He, K. Fu, Mingfei Xu, Jingan Zhou, Tao Li, Yuji Zhao
Hexagonal boron nitride (h-BN), a material currently unavailable in the material library of TCAD Silvaco, is manually defined in Silvaco Atlas with the physics properties previously reported. Two h-BN/GaN p-n diodes and a lateral h-BN Schottky barrier diode are simulated, and their thermal and electrical characteristics at forward bias are investigated, which gives a preliminary forecast of the future h-BN electronics devices.
六方氮化硼(h-BN)是目前TCAD Silvaco材料库中没有的一种材料,它在Silvaco Atlas中被手动定义为具有先前报道的物理性质。模拟了两个h-BN/GaN p-n二极管和一个横向h-BN肖特基势垒二极管,研究了它们在正偏压下的热学和电学特性,对未来的h-BN电子器件进行了初步的预测。
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引用次数: 0
Recent Advances of Interband Cascade Lasers and Resonant Cavity Infrared Detectors 带间级联激光器与谐振腔红外探测器的研究进展
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930438
C. Kim, M. Kim, A. Grede, C. Canedy, C. D. Merritt, W. Bewley, S. Tomasulo, I. Vurgaftman, J. R. Meyer
We review novel architectures that have recently enhanced the performance of interband cascade lasers (ICLs), ICL frequency combs, interband cascade LEDs (including ICLEDs grown on silicon), mid-IR resonant cavity detectors (RCIDs), and mid-IR photonic integrated circuits (PICs).
我们回顾了最近增强带间级联激光器(ICL), ICL频率梳,带间级联led(包括在硅上生长的icled),中红外谐振腔探测器(rcid)和中红外光子集成电路(pic)性能的新架构。
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引用次数: 0
Demonstration of dual switching operation of vertical gate-all-around transistor using InGaAs/GaSb core-shell nanowires on Si 基于InGaAs/GaSb芯壳纳米线的垂直栅全能晶体管双开关操作演示
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930398
H. Gamo, J. Motohisa, K. Tomioka
We demonstrated vertical gate-all-around field-effect transistor using the InGaAs/GaSb core-shell nanowires on Si. This device can operate both p-channel FET and n-channel TFET in the same channel architecture by changing bias polarity. The p-channel FET mode had a minimum subthreshold slope (SS) of 115 mV/decade and Ion/Ioff ratio of around 102 at VDS = −1.00 V. The n-channel TFET mode showed SS of 105 mV/decade at VDS = 0.50 V.
我们在Si上使用InGaAs/GaSb核壳纳米线演示了垂直栅全能场效应晶体管。该器件通过改变偏置极性,可以在同一沟道结构中同时工作p沟道场效应管和n沟道场效应管。在VDS = - 1.00 V时,p沟道场效应管模式的最小亚阈值斜率(SS)为115 mV/ 10年,离子/ off比约为102。在VDS = 0.50 V时,n沟道TFET模式的SS为105 mV/ 10年。
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引用次数: 0
Characterizations of Second-order Nonlinear Optical Susceptibility for ε-phase Gallium Oxide ε相氧化镓的二阶非线性光磁化率表征
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930385
Jingan Zhou, X. Zhao, Rui Xu, K. Fu, Tao Li, Mingfei Xu, Ziyi He, Jacob T. Robinson, Hanyu Zhu, Xiaodong Zhang, Yuji Zhao
In this work, we report the second-order nonlinear optical susceptibility χ(2) for epsilon phase Gallium Oxide (ε-Ga2O3) thin film on sapphire. ε-Ga2O3 exhibits hexagonal P63mc space group symmetry, which is a non-centrosymmetric structure with non-zero second order susceptibility. By focusing a pulsed laser beam on to a polished ε-Ga2O3 thin film, we collected the generated second harmonic photons with an ultra-sensitive femtowatt photodetector, obtaining effective second-order nonlinear optical susceptibility of χ(2) = 4.89×10−3 pm/V at wavelength of 800 nm. Two different measurement systems collecting reflected and transmitted photons were applied separately to make the result more convincing. The wavelength dependence from 790 nm to 900 nm and polarization dependence from TM mode to TE mode were measured as well. These results will be helpful for the design and fabrication of Ga2O3 based integrated photonics platform in the infrared-visible spectral range.
本文报道了蓝宝石表面ε相氧化镓(ε-Ga2O3)薄膜的二阶非线性光学磁化率χ(2)。ε-Ga2O3表现为六方P63mc空间群对称,为非中心对称结构,具有非零二阶磁化率。通过将脉冲激光束聚焦在抛光后的ε-Ga2O3薄膜上,利用超灵敏飞瓦光电探测器收集了产生的二次谐波光子,在800 nm波长处获得了有效的二阶非线性光导率χ(2) = 4.89×10−3 pm/V。为了使结果更有说服力,我们分别使用了两种不同的测量系统来收集反射光子和透射光子。测量了从790 nm到900 nm的波长依赖性和从TM模式到TE模式的偏振依赖性。这些结果将有助于设计和制造基于Ga2O3的红外-可见光谱集成光子学平台。
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引用次数: 0
Diamond Power Electronics: From 1kV towards 10kV Breakdown Voltage 金刚石电力电子:从1kV到10kV击穿电压
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930383
Z. Han, H. Lee, B. Bayram, C. Bayram
The rapidly growing demand for power electronics to rout, control, and convert electrical power motivates recent research into devices based on ultra-wide-bandgaps semiconductors. Diamond-based semiconductor devices have drawn increasing attention in high-power applications due to diamond’s extraordinary electrical and physical properties. It has a 5.5 eV band gap and over 7.7MV cm−1 breakdown field. Diamond is also one of the best thermal conductors with thermal conductivity over 2200 Wm−1k−1, making it an ideal material for high power applications where heat dissipation is challenging [1]. To demonstrate diamond’s advantages in power electronics, diamond power diodes and transistors are fabricated with breakdown voltages much higher than devices based on other wide band-gap materials.
电力电子设备在路由、控制和转换电力方面的需求迅速增长,促使最近对基于超宽带隙半导体的设备进行了研究。由于金刚石具有非凡的电学和物理特性,以金刚石为基础的半导体器件在大功率应用中越来越受到关注。它具有5.5 eV的带隙和超过7.7MV cm−1的击穿场。金刚石也是最好的热导体之一,其导热系数超过2200 Wm−1k−1,使其成为高功率应用中散热具有挑战性的理想材料。为了证明金刚石在电力电子领域的优势,金刚石功率二极管和晶体管的击穿电压远远高于基于其他宽带隙材料的器件。
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引用次数: 0
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2022 Compound Semiconductor Week (CSW)
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