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2022 Compound Semiconductor Week (CSW)最新文献

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Multiphysics Characterizations of Vertical GaN Schottky Diodes 垂直GaN肖特基二极管的多物理场特性
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930447
Atse Julien Eric N'Dohi, C. Sonneville, Soufiane Saidi, T. Ngo, P. de Mierry, É. Frayssinet, Y. Cordier, L. Phung, F. Morancho, K. Isoird, J. Tasselli, H. Maher, D. Planson
In this work, measurements from cathodo-luminescence (CL), micro-Raman spectroscopy and current-voltage I (V) have been coupled to assess the effects of physical parameters such as threading dislocations and effective doping level homogeneity on the electrical performances of vertical GaN Schottky diodes.
在这项工作中,阴极发光(CL),微拉曼光谱和电流电压I (V)的测量相结合,以评估物理参数,如螺纹位错和有效掺杂水平均匀性对垂直GaN肖特基二极管电性能的影响。
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引用次数: 0
Design and Optimization of New Enhanced Vertical GaN Nanowire Transistor Using Sentaurus TCAD for Power Applications 基于Sentaurus TCAD的新型增强型垂直GaN纳米线晶体管的设计与优化
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930376
M. Benjelloun, Nedal Al Taradeh, C. Rodriguez, N. Gogneau, A. Soltani, D. Morris, J. Harmand, H. Maher
A novel enhanced vertical GaN nanowire transistor structure is designed and optimized using the TCAD tool. The impact of the diameter, length, and doping concentration has been analyzed for the channel and drift region parts with and without surface traps. For the channel region, it has been observed that the device is Normally-OFF when the nanowire’s diameter and channel doping are less than 200 nm and 1×1017 cm−3, respectively. When considering a density of acceptor-type surface traps of 1×1013 cm−2.eV−1, the threshold voltage (Vth) has slightly increased. The breakdown voltage (VBR) of the device is found to increase as the length of the drift region increases and as the diameter of the nanowire decreases. Our simulation results show that the on-state resistance (RON) of the device increases drastically at low doping level of the drift region, when surface traps are taken into account. The threshold value of the doping level, above which RON remains small and insensitive to surface traps, increases as the nanowire diameter decreases.
利用TCAD工具设计并优化了一种新型的增强型垂直GaN纳米线晶体管结构。分析了直径、长度和掺杂浓度对沟道和漂移区的影响。对于沟道区域,当纳米线直径小于200 nm,沟道掺杂量小于1×1017 cm−3时,器件正常关闭。当考虑受体型表面陷阱密度为1×1013 cm−2时。eV−1,阈值电压Vth略有升高。该器件的击穿电压(VBR)随漂移区长度的增加和纳米线直径的减小而增加。仿真结果表明,当考虑表面陷阱时,器件的导态电阻(RON)在漂移区的低掺杂水平下急剧增加。随着纳米线直径的减小,掺杂水平的阈值随着纳米线直径的减小而增加,在该阈值之上,RON保持较小且对表面陷阱不敏感。
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引用次数: 0
Thermodynamics and Band Structure of ScxAl1-xN ScxAl1-xN的热力学和能带结构
Pub Date : 2022-06-01 DOI: 10.1109/csw55288.2022.9930119
Mahlet Molla, E. Kioupakis
ScxAl1-xN alloys at certain compositions have enhanced piezoelectric response which allows the coercive electric field for ferroelectric polarization switching to be below its dielectric breakdown limit. Therefore, the strain and polarization tunability of ScxAl1-xN would grant further applications in electronic and optoelectronic devices that would not be possible with AlN. In this work, we performed first-principles calculations based on hybrid density functional theory (DFT) and special quasi-random structure (SQS) methodology to study the ground-state thermodynamic and electronic properties of ScxAl1-xN as a function of Sc composition.
特定成分的ScxAl1-xN合金具有增强的压电响应,这使得铁电极化开关的顽固性电场低于其介电击穿极限。因此,ScxAl1-xN的应变和极化可调性将为AlN无法实现的电子和光电子器件提供进一步的应用。在这项工作中,我们基于混合密度泛函理论(DFT)和特殊准随机结构(SQS)方法进行第一性原理计算,研究了ScxAl1-xN的基态热力学和电子性质与Sc组成的关系。
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引用次数: 0
Green Light Emitting Diodes for the Ultimate Solid-State Lighting 绿色发光二极管的终极固态照明
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930416
J. Lee, Y. Tsai, C. Bayram
Cubic GaN is a promising platform for realizing high-efficiency green light emitting diodes, suitable for closing the green gap and enabling color-mixed solid-state lighting applications. Still, there are almost no studies on such LEDs and none showing how cubic GaN LED design rules compare to or differentiate against conventional hexagonal and nonpolar ones. Here, using the Open Boundary Quantum LED Simulator, we present design guidelines for highly efficient cubic green LEDs and detail the inherent advantages and design differences between polar, nonpolar, and cubic GaN LEDs.
立方氮化镓是实现高效绿色发光二极管的有前途的平台,适用于缩小绿隙和实现彩色混合固态照明应用。然而,几乎没有关于这种LED的研究,也没有研究表明立方GaN LED的设计规则与传统的六边形和非极性LED相比有何不同。在这里,利用开放边界量子LED模拟器,我们提出了高效立方绿色LED的设计指南,并详细介绍了极性、非极性和立方GaN LED的固有优势和设计差异。
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引用次数: 0
Techniques for reduction of threading dislocations in metamorphic growth of GaSb on GaAs for realization of high mobility n and p channels 为实现高迁移率n和p通道而减少GaAs上GaSb变质生长中螺纹位错的技术
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930421
F. F. Ince, A. T. Newell, K. Reilly, S. Seth, T. Rotter, A. Mansoori, D. Shima, P. Webster, E. Vaughan, G. Balakrishnan
Interfacial misfit dislocation growth (IMF) mode can be used to achieve spontaneous and fully relaxed GaSb on GaAs however a high residual threading dislocation density of ~ 108 dislocations/cm2 is present. In this paper, we demonstrate a method to decrease the threading dislocation density using defect filtering layers with different filter designs. Moreover, we show the comparison of mobility of n and p pseudomorphic channels grown on these structures with and without using defect filtering layers.
界面错配位错生长(IMF)模式可以在GaAs上实现自发和完全松弛的GaSb,但存在高的残余螺纹位错密度,约为108位错/cm2。在本文中,我们展示了一种使用不同滤波器设计的缺陷滤波层来降低螺纹位错密度的方法。此外,我们还展示了在这些结构上生长的n和p伪晶通道在使用和不使用缺陷滤波层时的迁移率的比较。
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引用次数: 0
MOCVD Growth of InxSey Monolayers InxSey单层膜的MOCVD生长
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930451
R. Günkel, J. Glowatzki, S. Patil, O. Maßmeyer, S. Chatterjee, A. Beyer, W. Stolz, K. Volz
Two-dimensional (2D) layered III–VI semiconductor crystals were grown on c-plane sapphire by MOCVD. A growth scheme for monolayered InxSey was found. By optimizing the growth parameters such as temperature and Se to In ratio, the growth behaviour changes from a vapor liquid solid growth mode to a layer by layer growth mode. Due to these encouraging achievements, further progress leading to the deposition of 2D materials over large areas is expected.
利用MOCVD技术在c面蓝宝石表面生长出二维(2D)层状III-VI半导体晶体。找到了一种单层InxSey的生长方案。通过优化生长参数如温度和Se to In比,使生长行为由气液固生长模式转变为逐层生长模式。由于这些令人鼓舞的成就,进一步的进展导致大面积的二维材料沉积有望实现。
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引用次数: 0
First Demonstration of 500 °C Operation of β-Ga2O3 MOSFET in Air β-Ga2O3 MOSFET在空气中500°C工作的首次演示
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930389
N. Sepelak, Jeremiah D. Williams, D. Dryden, Rachel Kahler, K. Liddy, Weisong Wang, K. Chabak, A. Green, A. Islam
β-Ga2O3 offers a robust platform for operation of electronic devices at high temperature and in extreme environments due to its large band gap of ~4.8 eV and low intrinsic carrier concentration. In this study, we characterize β-Ga2O3 field effect transistors from room temperature (RT) up to 500 °C. The devices, fabricated with Ni/Au gate metal and Al2O3 gate dielectric, exhibited stable operation up to 500 °C. The measured ID-VD characteristics showed no current degradation up to 450 °C; in fact, current improved in this temperature range due to activation carriers from dopants/traps in the device. At 500 °C, device exhibited a drop in ID; however, device characteristics are recovered once the device is brought back to RT even after 20 hours of device operation at 500 °C. All other device characteristics (gate leakage, ION/IOFF ratio, gm, Ron, contact resistance) showed monotonic variation with temperature, which has been explained using appropriate device physics and by considering the interaction of gate metals with Al2O3. Our results suggest that with appropriate choice of metals and gate dielectrics the 500 °C operation using β-Ga2O3 has no bottlenecks.
β-Ga2O3具有~4.8 eV的大带隙和较低的载流子浓度,为电子器件在高温和极端环境下的工作提供了坚实的平台。在这项研究中,我们从室温(RT)到500°C对β-Ga2O3场效应晶体管进行了表征。该器件由Ni/Au栅极金属和Al2O3栅极电介质制成,在高达500°C的温度下工作稳定。测量的ID-VD特性表明,在450°C以下没有电流降解;事实上,由于器件中掺杂剂/陷阱的激活载流子,电流在该温度范围内得到了改善。在500℃时,器件的ID下降;然而,即使在500°C下设备运行20小时后,一旦设备带回RT,设备特性也会恢复。所有其他器件特性(栅漏、ION/IOFF比、gm、Ron、接触电阻)随温度呈单调变化,这已经通过适当的器件物理和考虑栅极金属与Al2O3的相互作用来解释。我们的研究结果表明,通过适当选择金属和栅极电介质,β-Ga2O3在500°C的操作中没有瓶颈。
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引用次数: 1
Growth Optimization of InGaAs/GaAs Multi Quantum Well Microdisk Lasers on Flat-bottom CMOS-compatible (001) Si by Selective Area Heteroepitaxy 基于选择性面积异质外延的InGaAs/GaAs多量子阱微盘激光器生长优化
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930357
Bei Shi, Si Zhu, B. Song, J. Klamkin
InGaAs/GaAs multi-quantum wells were selectively grown on flat-bottom (001) silicon recesses and their efficiencies were improved by introducing GaAsP strain compensation layers. Room-temperature lasing from microdisks were subsequently fabricated and yield low lasing threshold.
在平底(001)硅凹槽上选择性地生长InGaAs/GaAs多量子阱,并通过引入GaAsP应变补偿层提高了其效率。随后制备了微盘室温激光,产生了低激光阈值。
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引用次数: 1
Structure Dependent Characteristics of Infrared Radiation from Metal-Semiconductor Surface Micro-Structures 金属-半导体表面微结构红外辐射的结构依赖特性
Pub Date : 2022-06-01 DOI: 10.1109/csw55288.2022.9930348
Hnin Lai Lai Aye, K. Hayashi, Haruki Orito, B. Lin, Ikuya Suzuki, B. Ma, Y. Ishitani
Longitudinal optical (LO) phonon resonant THz absorption and radiation subjected to metal-semiconductor surface stripe structures are observed due to oscillation of interface polarization charges. The radiation intensity is affected by the stripe structural characteristics accompanying independent LO peak positioned at 8.5THz. LO phonon scattering rate is more evident in wide and high mesa-height semiconductor stripes in which absorption efficiency is affected rather than narrower ones.
由于界面极化电荷的振荡,观察了金属半导体表面条形结构下纵向光学声子共振太赫兹吸收和辐射。辐射强度受条形结构特征的影响,条形结构特征伴随着位于8.5THz的独立LO峰。低声子散射率在宽、高台面高度的半导体条纹中更为明显,而在窄的半导体条纹中吸收效率受到影响。
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引用次数: 0
Compensating defects in high Al content Al0.85Ga0.15N films grown on an AlN substrate 在AlN衬底上生长高Al含量Al0.85Ga0.15N薄膜的缺陷补偿
Pub Date : 2022-06-01 DOI: 10.1109/CSW55288.2022.9930424
M. Zvanut, Subash Paudel, R. Page, Y. Cho, H. Xing, D. Jena
AlxGa1-xN is a promising semiconductor for power electronics, but the mechanism for the conductivity produced by Si doping is controversial. In this work, temperature-dependent Hall measurements were conducted to address the conduction mechanism and electron paramagnetic resonance (EPR) was used to observe the Si dopant and other point defects. The samples studied were 0.5 um thick Al0.85Ga0.15N films grown by molecular beam epitaxy on a 1 um AlN film on an AlN substrate. The results reveal a nearly temperature independent carrier density, suggesting impurity band conduction. Notably, 1019 cm−3 carriers were detected at room temperature, despite the presence of several defects detected by EPR. The centers include the neutral donor with DX character and a second center, with as-yet undetermined origin, that likely partially compensates the Si donors during growth. The minimal effect of the unintentional defects and DX-character of the dopant is reasoned to be due to 1) the small energy barrier between the donor and DX level and 2) the low density (1017 cm−3) of the unintentional defects. Thus, although the growth of high Al content AlGaN may incur unwanted defects and the Si dopant may be a DX center, usefully high carrier concentrations may be achieved.
AlxGa1-xN是一种很有前途的电力电子半导体材料,但硅掺杂产生电导率的机制存在争议。在这项工作中,通过温度相关的霍尔测量来解决传导机制,并使用电子顺磁共振(EPR)来观察Si掺杂剂和其他点缺陷。所研究的样品是在AlN衬底上的1 um AlN薄膜上通过分子束外延生长的0.5 um厚Al0.85Ga0.15N薄膜。结果显示载流子密度几乎与温度无关,表明杂质带导电。值得注意的是,尽管EPR检测到存在一些缺陷,但在室温下检测到1019 cm−3载流子。中心包括具有DX特征的中性供体和第二个中心,其来源尚未确定,可能在生长过程中部分补偿Si供体。非故意缺陷和掺杂剂DX特性的影响很小,原因是:(1)供体和DX能级之间的能垒很小;(2)非故意缺陷的密度低(1017 cm−3)。因此,尽管高Al含量的AlGaN的生长可能会产生不必要的缺陷,并且Si掺杂剂可能是DX中心,但可以实现有用的高载流子浓度。
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引用次数: 0
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2022 Compound Semiconductor Week (CSW)
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