Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256227
Afef Bouchaala, L. Courau, P. Galy, O. Bonnaud
As the layout density increases in highly integrated multilayer packages, the noise that exists in the Power Distribution Network (PDN) is increasingly coupled to the signal traces. Thus, precise modeling to describe this coupling phenomenon becomes necessary. This paper presents a fast and an efficient method to a predictive co-modeling of signal traces and multilayered Power/Ground planes. The method is based on Multi-Conductor Transmission Lines. A particular case of signal's return path discontinuity is studied and corresponds to a microstrip-to-microstrip via transition.
{"title":"Predictive method for efficient transmission lines and multilayered Power/Ground planes co-modeling using Multi-Conductor Transmission Lines","authors":"Afef Bouchaala, L. Courau, P. Galy, O. Bonnaud","doi":"10.1109/ISEMC.2015.7256227","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256227","url":null,"abstract":"As the layout density increases in highly integrated multilayer packages, the noise that exists in the Power Distribution Network (PDN) is increasingly coupled to the signal traces. Thus, precise modeling to describe this coupling phenomenon becomes necessary. This paper presents a fast and an efficient method to a predictive co-modeling of signal traces and multilayered Power/Ground planes. The method is based on Multi-Conductor Transmission Lines. A particular case of signal's return path discontinuity is studied and corresponds to a microstrip-to-microstrip via transition.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126659063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256148
I. Nicolae, P. Nicolae, Ionuţ-Daniel Smărăndescu
The paper studies high order harmonics in distorted regimes with fast variable loads. Our experimental setup uses a three-phase load, built in laboratory by connecting in pairs, in different configurations, several laptops (from different manufacturers) across phases of a three-phase system. Our original dedicated data acquisition system acquired single phase waveforms, each of 5 periods, corresponding to phase currents and voltages, with a sampling frequency of 19 kHz. The acquired data were decomposed with a Discrete Wavelet Transform relying on our original function implementing a Daubechy filter of length 8. Considering the high variable operating regimes of laptops, the analysis was made individually for the first 4 periods of each analyzed sequence. Per period validations were performed considering the total RMS, calculated firstly according to definition, with a definite integral as the limit of a Riemann sum, and secondly as defined by Morsi, with DWT. 3-D diagrams were built to represent, for each level, the weights of details energy that we used as power-quality indices. The DWT analysis revealed that the weights of energies provided by harmonics with orders higher than 32 (sometimes 64) cannot be neglected when considering the signal's overall distorting residue, mainly for voltages. Transients were also detected on high order harmonics and the unbalance generated by them in the energetic picture was also discussed.
{"title":"DWT analysis of high order harmonics influence over distorted regimes with fast variable loads","authors":"I. Nicolae, P. Nicolae, Ionuţ-Daniel Smărăndescu","doi":"10.1109/ISEMC.2015.7256148","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256148","url":null,"abstract":"The paper studies high order harmonics in distorted regimes with fast variable loads. Our experimental setup uses a three-phase load, built in laboratory by connecting in pairs, in different configurations, several laptops (from different manufacturers) across phases of a three-phase system. Our original dedicated data acquisition system acquired single phase waveforms, each of 5 periods, corresponding to phase currents and voltages, with a sampling frequency of 19 kHz. The acquired data were decomposed with a Discrete Wavelet Transform relying on our original function implementing a Daubechy filter of length 8. Considering the high variable operating regimes of laptops, the analysis was made individually for the first 4 periods of each analyzed sequence. Per period validations were performed considering the total RMS, calculated firstly according to definition, with a definite integral as the limit of a Riemann sum, and secondly as defined by Morsi, with DWT. 3-D diagrams were built to represent, for each level, the weights of details energy that we used as power-quality indices. The DWT analysis revealed that the weights of energies provided by harmonics with orders higher than 32 (sometimes 64) cannot be neglected when considering the signal's overall distorting residue, mainly for voltages. Transients were also detected on high order harmonics and the unbalance generated by them in the energetic picture was also discussed.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114623802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256355
A. Talebzadeh, Y. Gan, Ki-Hyuk Kim, Yiqiang Zhang, D. Pommerenke
An electrostatic discharge (ESD) to a display screen may lead to sparking into the phone's structure, e.g., via the glue that connects the different glass layers of the touching panel/LCD, or it may just cause surface charging. The latter is the most likely case for a well-designed display, as the insulation design usually prevents any sparking to the electronics. Even if no spark is visible, strong surface charging occurs. These charges couple via displacement current and via their magnetic field into the display electronics. Most phone and tablet manufacturers currently suffer from damages or upsets caused by this type of spark-less ESD. As far as we know, no data has been published showing the magnitude, rise time and total charge parameters of these surface discharges for displays. In this paper, discharges to different displays have been measured at ±4, ±8, ±10 and ±14 kV. The discharge currents are measured using an F65 current clamp. Five different types of display screens have been tested and the results of transient current discharges are compared in this paper. During the experiments, repeatability of results is investigated. Moreover, the effects of touch position as well as dirty screens (i.e., presence of finger prints, etc) are investigated.
{"title":"Spark-less electrostatic discharge (ESD) on display screens","authors":"A. Talebzadeh, Y. Gan, Ki-Hyuk Kim, Yiqiang Zhang, D. Pommerenke","doi":"10.1109/ISEMC.2015.7256355","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256355","url":null,"abstract":"An electrostatic discharge (ESD) to a display screen may lead to sparking into the phone's structure, e.g., via the glue that connects the different glass layers of the touching panel/LCD, or it may just cause surface charging. The latter is the most likely case for a well-designed display, as the insulation design usually prevents any sparking to the electronics. Even if no spark is visible, strong surface charging occurs. These charges couple via displacement current and via their magnetic field into the display electronics. Most phone and tablet manufacturers currently suffer from damages or upsets caused by this type of spark-less ESD. As far as we know, no data has been published showing the magnitude, rise time and total charge parameters of these surface discharges for displays. In this paper, discharges to different displays have been measured at ±4, ±8, ±10 and ±14 kV. The discharge currents are measured using an F65 current clamp. Five different types of display screens have been tested and the results of transient current discharges are compared in this paper. During the experiments, repeatability of results is investigated. Moreover, the effects of touch position as well as dirty screens (i.e., presence of finger prints, etc) are investigated.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"575 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132074054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256239
K. Cai, S. Ji
The total DDR on-die AC power delivery noise can be decomposed into high pass filtered (HPF) Vppa and low pass filtered (LPF) Vppb. PI-SI co-simulation reveals that Vppa impacts timing (eye width) and Vppb impacts signal voltage amplitude (eye height), and they need to be budgeted in different manner. Consequently the Power Delivery Network (PDN) is optimized with significant Cpkg and Cdie reduction for a small form factor while maintaining the reliable SI performance, which is demonstrated with a DDR interface and correlated with lab measured data on a particular SoC platform.
{"title":"Cost competitive PI-SI co-design for DDR interfaces","authors":"K. Cai, S. Ji","doi":"10.1109/ISEMC.2015.7256239","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256239","url":null,"abstract":"The total DDR on-die AC power delivery noise can be decomposed into high pass filtered (HPF) Vppa and low pass filtered (LPF) Vppb. PI-SI co-simulation reveals that Vppa impacts timing (eye width) and Vppb impacts signal voltage amplitude (eye height), and they need to be budgeted in different manner. Consequently the Power Delivery Network (PDN) is optimized with significant Cpkg and Cdie reduction for a small form factor while maintaining the reliable SI performance, which is demonstrated with a DDR interface and correlated with lab measured data on a particular SoC platform.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133422498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256363
K. Weide-Zaage, A. Moujbani, G. Duchamp, T. Dubois, F. Verdier, H. Frémont
The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.
{"title":"How SI/EMC and reliability issues could interact together in embedded electronic systems?","authors":"K. Weide-Zaage, A. Moujbani, G. Duchamp, T. Dubois, F. Verdier, H. Frémont","doi":"10.1109/ISEMC.2015.7256363","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256363","url":null,"abstract":"The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123168094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256178
H. Karcoon, S. Parr, S. Dickmann, R. Rambousky
Line feed-throughs are an important construction element used in securing the screening effect of shielded rooms, facilities and devices. Without taking special precautions at the feed-through point, the shielding effectiveness can be significantly reduced, especially if cavity resonances occur. Therefore, it is important to analyze how line feed-throughs and line lengths quantitatively affect the shielding effectiveness of such rooms. This can be addressed using the semi-analytical formulation developed in this paper, consisting of a combination of numerical 3D-field simulation (FIT) and analytical formulation. Using this method, practical protective measures have been derived and confirmed by performing measurements on a practical example. Our main focus is on the susceptibility of electronic systems in metallic rooms of a ship in an Intentional Electromagnetic Interference (IEMI) environment.
{"title":"Shielding effectiveness of screened rooms with line feed-throughs - a semi-analytical approach","authors":"H. Karcoon, S. Parr, S. Dickmann, R. Rambousky","doi":"10.1109/ISEMC.2015.7256178","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256178","url":null,"abstract":"Line feed-throughs are an important construction element used in securing the screening effect of shielded rooms, facilities and devices. Without taking special precautions at the feed-through point, the shielding effectiveness can be significantly reduced, especially if cavity resonances occur. Therefore, it is important to analyze how line feed-throughs and line lengths quantitatively affect the shielding effectiveness of such rooms. This can be addressed using the semi-analytical formulation developed in this paper, consisting of a combination of numerical 3D-field simulation (FIT) and analytical formulation. Using this method, practical protective measures have been derived and confirmed by performing measurements on a practical example. Our main focus is on the susceptibility of electronic systems in metallic rooms of a ship in an Intentional Electromagnetic Interference (IEMI) environment.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128842443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256331
V. Mordachev
The practical method of worst-case estimation of the total electromagnetic background near ground surface created by different radio systems is offered. This method takes into consideration heterogeneity of radioelectronic environment formed by the full set of stationary and mobile transmitters of different radio services, and peculiarities of radio wave propagation on different distances between transmitters and observation point, and of statistical features of electromagnetic fields in observation point generated by these transmitters. The presented method allow to estimate the fundamental upper bound of electromagnetic background total intensity created by heterogeneous radioelectronic environment, directly on the basis of estimation of the total electromagnetic loading on territory as the total equivalent isotropic radiated power of full set of transmitters of all services falling to the unit of the area of considered territory. The presented results ensure the facilities of EMC diagnostics and design of ultra wide band radio systems using nonsine radio waves, and cognitive radio systems using frequency bands on the secondary basis, and of support of the acceptable electromagnetic environmental conditions in populous areas.
{"title":"Worst-case estimation of electromagnetic background near ground surface created by heterogeneous radioelectronic environment","authors":"V. Mordachev","doi":"10.1109/ISEMC.2015.7256331","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256331","url":null,"abstract":"The practical method of worst-case estimation of the total electromagnetic background near ground surface created by different radio systems is offered. This method takes into consideration heterogeneity of radioelectronic environment formed by the full set of stationary and mobile transmitters of different radio services, and peculiarities of radio wave propagation on different distances between transmitters and observation point, and of statistical features of electromagnetic fields in observation point generated by these transmitters. The presented method allow to estimate the fundamental upper bound of electromagnetic background total intensity created by heterogeneous radioelectronic environment, directly on the basis of estimation of the total electromagnetic loading on territory as the total equivalent isotropic radiated power of full set of transmitters of all services falling to the unit of the area of considered territory. The presented results ensure the facilities of EMC diagnostics and design of ultra wide band radio systems using nonsine radio waves, and cognitive radio systems using frequency bands on the secondary basis, and of support of the acceptable electromagnetic environmental conditions in populous areas.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115366831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256125
J. Catrysse, F. Vanhee, T. Claeys, A. Degraeve, D. Pissoort
In a number of applications, due to concerns such as weight and flexibility, shielding materials are used with anisotropic materials. Typically, in the case of some conductive textile materials, conductive yarns are only used in one direction (warp). Other materials will have different conductivity as a function of the direction, such as deployed metal grids. In this paper, measured Shielding Effectiveness SE results obtained by using different measuring setups are compared and discussed.
{"title":"Shielding Effectiveness of anisotropic materials: How to measure?","authors":"J. Catrysse, F. Vanhee, T. Claeys, A. Degraeve, D. Pissoort","doi":"10.1109/ISEMC.2015.7256125","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256125","url":null,"abstract":"In a number of applications, due to concerns such as weight and flexibility, shielding materials are used with anisotropic materials. Typically, in the case of some conductive textile materials, conductive yarns are only used in one direction (warp). Other materials will have different conductivity as a function of the direction, such as deployed metal grids. In this paper, measured Shielding Effectiveness SE results obtained by using different measuring setups are compared and discussed.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"167 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114930280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256401
Xinwei Song, Junjun Wang, Bing Li, D. Su
Cable parameters are required when system simulation or fault diagnosis is implemented. For mounted cables, such as underground cables and airborne cables, specific methods of parameter extraction should be applied. In this paper, an easy-to-use measurement method with two general cases for extraction of the complex propagation constant and characteristic impedance is developed. This method is especially suitable for high-frequency cables and not confined to a certain type of connectors. In complement to many existing methods, principles of eliminating effects of connectors which could lead to considerable errors at high frequencies are given. The proposed method is validated by a standard coaxial cable of 75-ohm characteristic impedance, with several connectors and possible connecting lines at both ends, over the frequency range 400 kHz to 400 MHz.
{"title":"A general measurement method of parameter extraction for high-frequency mounted cables with arbitrary connectors","authors":"Xinwei Song, Junjun Wang, Bing Li, D. Su","doi":"10.1109/ISEMC.2015.7256401","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256401","url":null,"abstract":"Cable parameters are required when system simulation or fault diagnosis is implemented. For mounted cables, such as underground cables and airborne cables, specific methods of parameter extraction should be applied. In this paper, an easy-to-use measurement method with two general cases for extraction of the complex propagation constant and characteristic impedance is developed. This method is especially suitable for high-frequency cables and not confined to a certain type of connectors. In complement to many existing methods, principles of eliminating effects of connectors which could lead to considerable errors at high frequencies are given. The proposed method is validated by a standard coaxial cable of 75-ohm characteristic impedance, with several connectors and possible connecting lines at both ends, over the frequency range 400 kHz to 400 MHz.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"418 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117328274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-09-14DOI: 10.1109/ISEMC.2015.7256189
J. Bernal, M. Freire, S. Ramiro
The performance of a shunt capacitor low-pass filter at high frequencies is limited by the mutual inductance appearing between the input loop, defined by the noise source and the capacitor, and the output loop created by the capacitor and the loading impedance. In this work we present a simple modification of the layout of the shunt capacitor filter that allows to decrease the impairing effect of this mutual inductance, thus increasing the attenuation provided by the shunt capacitor filter at high frequencies. We demonstrate that this attenuation can be increased up to approximately 10 dBs with proper filter design when comparing with a typical shunt-capacitor filter configuration. The interest of this technique resides in its simplicity, that allows to improve the filter performance without increasing the cost, the design time or the space required on the board by the filter. The proposed technique is based on forcing a mutual inductance coupling between currents flowing through the shunt capacitor and currents on the signal trace. In this work, we present a lumped-element equivalent circuit that explains the effect. Also, several filter test boards are designed, fabricated and measured, and key design parameters to maximize this technique's benefits are identified.
{"title":"Simple and cost-effective method for improving the high frequency performance of surface-mount shunt capacitors filters","authors":"J. Bernal, M. Freire, S. Ramiro","doi":"10.1109/ISEMC.2015.7256189","DOIUrl":"https://doi.org/10.1109/ISEMC.2015.7256189","url":null,"abstract":"The performance of a shunt capacitor low-pass filter at high frequencies is limited by the mutual inductance appearing between the input loop, defined by the noise source and the capacitor, and the output loop created by the capacitor and the loading impedance. In this work we present a simple modification of the layout of the shunt capacitor filter that allows to decrease the impairing effect of this mutual inductance, thus increasing the attenuation provided by the shunt capacitor filter at high frequencies. We demonstrate that this attenuation can be increased up to approximately 10 dBs with proper filter design when comparing with a typical shunt-capacitor filter configuration. The interest of this technique resides in its simplicity, that allows to improve the filter performance without increasing the cost, the design time or the space required on the board by the filter. The proposed technique is based on forcing a mutual inductance coupling between currents flowing through the shunt capacitor and currents on the signal trace. In this work, we present a lumped-element equivalent circuit that explains the effect. Also, several filter test boards are designed, fabricated and measured, and key design parameters to maximize this technique's benefits are identified.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116258826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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