Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507074
K. Saarinen, L. Frisk
Radio frequency identification (RFID) is an emerging technology in the field of identification and security. With RFID tags it is possible to identify objects individually and reliably using radio waves. However, due to numerous applications, RFID tags are exposed to various environmental conditions which may impair their reliability. Long-term reliability is generally studied using accelerated environmental tests. In earlier studies a combination of high humidity and high temperature has been found to be very harmful to RFID tags. Consequently, in this study failure times and mechanisms between three accelerated humidity tests were compared to find a test which is most suitable for RFID tags. A passive ultra high frequency (UHF) RFID tag with a polyethylene terephthalate (PET) substrate was tested using two constant humidity tests and a humidity cycling test. According to this study, the selection of test conditions for reliability studies in humid environments should be carefully considered. PET substrate is susceptible to hydrolysis when a combination of high humidity and high temperature is present. Consequently, a standard 85°C/85% test is very harsh for RFID tags with PET substrate. On the other hand if a cycling test is used instead of a constant test to acclerate the test, the failure mechanism may alter. Therefore it is important to investigate the effects of changing humidity, but a constant humidity test cannot be directly replaced by the faster humidity cycling test due to the different stresses caused by the tests.
{"title":"Reliability of UHF RFID tags in humid environments","authors":"K. Saarinen, L. Frisk","doi":"10.1109/EPTC.2012.6507074","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507074","url":null,"abstract":"Radio frequency identification (RFID) is an emerging technology in the field of identification and security. With RFID tags it is possible to identify objects individually and reliably using radio waves. However, due to numerous applications, RFID tags are exposed to various environmental conditions which may impair their reliability. Long-term reliability is generally studied using accelerated environmental tests. In earlier studies a combination of high humidity and high temperature has been found to be very harmful to RFID tags. Consequently, in this study failure times and mechanisms between three accelerated humidity tests were compared to find a test which is most suitable for RFID tags. A passive ultra high frequency (UHF) RFID tag with a polyethylene terephthalate (PET) substrate was tested using two constant humidity tests and a humidity cycling test. According to this study, the selection of test conditions for reliability studies in humid environments should be carefully considered. PET substrate is susceptible to hydrolysis when a combination of high humidity and high temperature is present. Consequently, a standard 85°C/85% test is very harsh for RFID tags with PET substrate. On the other hand if a cycling test is used instead of a constant test to acclerate the test, the failure mechanism may alter. Therefore it is important to investigate the effects of changing humidity, but a constant humidity test cannot be directly replaced by the faster humidity cycling test due to the different stresses caused by the tests.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132195559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507108
Daquan Yu, Xiaoyang Liu, R. He, X. Jing, Chongshen Song, Fengwei Dai, Yu Sun, L. Wan
TSV was regarded as the core technology enabling 3D IC integration. For volume production, the requirement of low-cost TSV fabrication process was a big challenge. In order to find a fast filling method, new Cu plating solutions are desirable and some new filling method using solder, Cu cored solder ball were studied. A new TSV structure composed of intermetallic compounds (IMCs) was proposed in present paper and the manufacturing process was introduced. To form such a TSV structure, it needs to fill liquid solder into the vias and accelerate the inter-diffusion of solder and metal on the sidewall of the vias by annealing. The feasibility of the formation of IMC TSVs was studied using SnPb solder. The solder was filled into the vias in which partial annular Cu layer was plated. Successful voids free filling with thin protrusion of solder material on the top of the vias was achieved. Finite element analysis (FEA) of TSV filling with Cu, solder and Sn-based IMC were carried out and the results showed that the IMC filled TSVs can get comparable or even lower stress depending on the CTE of the IMCs. According to present results, it can be concluded that the IMC TSVs have the following merits: fast and low cost forming process, good high temperature stability and the lower stress.
{"title":"Development of new TSV structure composing of intermetallic compounds","authors":"Daquan Yu, Xiaoyang Liu, R. He, X. Jing, Chongshen Song, Fengwei Dai, Yu Sun, L. Wan","doi":"10.1109/EPTC.2012.6507108","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507108","url":null,"abstract":"TSV was regarded as the core technology enabling 3D IC integration. For volume production, the requirement of low-cost TSV fabrication process was a big challenge. In order to find a fast filling method, new Cu plating solutions are desirable and some new filling method using solder, Cu cored solder ball were studied. A new TSV structure composed of intermetallic compounds (IMCs) was proposed in present paper and the manufacturing process was introduced. To form such a TSV structure, it needs to fill liquid solder into the vias and accelerate the inter-diffusion of solder and metal on the sidewall of the vias by annealing. The feasibility of the formation of IMC TSVs was studied using SnPb solder. The solder was filled into the vias in which partial annular Cu layer was plated. Successful voids free filling with thin protrusion of solder material on the top of the vias was achieved. Finite element analysis (FEA) of TSV filling with Cu, solder and Sn-based IMC were carried out and the results showed that the IMC filled TSVs can get comparable or even lower stress depending on the CTE of the IMCs. According to present results, it can be concluded that the IMC TSVs have the following merits: fast and low cost forming process, good high temperature stability and the lower stress.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134030634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507146
X. Shan, M. B. Mohahidin, A. Lu
Large area polymer films with patterned microstructures are expected to be widely used in various areas, such as functional optical films for flexible displays, lighting devices as well as structured films for microfluidic components. Large area embossing is a promising method for patterning microstructures on polymer substrates. We have investigated the process feasibility of roll-to-roll hot embossing as well as roll-to-plate hot embossing for large area, high-volume fabrication of microstructures on polymer substrates. Micro pillar (with diameter of 50μm) arrays were formed on polypropylene films via both roll-to-roll and roll-to-plate hot embossing. In this paper, we will report our achievement in roll-to-roll process study and explore potential industrial applications.
{"title":"Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films","authors":"X. Shan, M. B. Mohahidin, A. Lu","doi":"10.1109/EPTC.2012.6507146","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507146","url":null,"abstract":"Large area polymer films with patterned microstructures are expected to be widely used in various areas, such as functional optical films for flexible displays, lighting devices as well as structured films for microfluidic components. Large area embossing is a promising method for patterning microstructures on polymer substrates. We have investigated the process feasibility of roll-to-roll hot embossing as well as roll-to-plate hot embossing for large area, high-volume fabrication of microstructures on polymer substrates. Micro pillar (with diameter of 50μm) arrays were formed on polypropylene films via both roll-to-roll and roll-to-plate hot embossing. In this paper, we will report our achievement in roll-to-roll process study and explore potential industrial applications.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"447 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134435034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507055
Dandong Ge, F. Che, Yik Siong Tay, S. L. Gan, M. Yazid
Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, the creep-fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to to understand the solder failure due to soft solder creep fatigue behavior. In this work, tensile creep tests for two soft solders, solder A and B, have been conducted at various temperatures and stress levels using a Dynamic Mechanical Analyzer (DMA). Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models were implemented in finite element analysis (FEA) to investigate the creep behavior of solder in the power packages for the evaluation of package reliability. Results show that solder A has better creep resistance than solder B, which indicates that the package with using solder A should have higher creep fatigue reliability than package with using solder B when subjected to thermal cycling. The storage modulus, liquidus temperature/solidus temperature for two types of solders were also measured by DMA and Differential Scanning Calorimetry (DSC), respectively.
{"title":"Study on creep fatigue behaviour of soft solders die attach for power package applications","authors":"Dandong Ge, F. Che, Yik Siong Tay, S. L. Gan, M. Yazid","doi":"10.1109/EPTC.2012.6507055","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507055","url":null,"abstract":"Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, the creep-fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to to understand the solder failure due to soft solder creep fatigue behavior. In this work, tensile creep tests for two soft solders, solder A and B, have been conducted at various temperatures and stress levels using a Dynamic Mechanical Analyzer (DMA). Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models were implemented in finite element analysis (FEA) to investigate the creep behavior of solder in the power packages for the evaluation of package reliability. Results show that solder A has better creep resistance than solder B, which indicates that the package with using solder A should have higher creep fatigue reliability than package with using solder B when subjected to thermal cycling. The storage modulus, liquidus temperature/solidus temperature for two types of solders were also measured by DMA and Differential Scanning Calorimetry (DSC), respectively.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132044299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507060
Changhyun Cho, Jonghyun Cho, Jonghoon J. Kim, Joungho Kim, J. Pak
In this paper, we present a new embedded current probe that can support measurement-based approach for extracting switching current waveform that was injected into power distribution network (PDN). The proposed embedded current probing structure utilizes magnetic coupling behavior between primary conducting via and secondary toroidal coil structure surrounding and it can be used as a sensor which relates the induced voltage across toroidal coil to the switching current of conducting via. This paper will present characterization of magnetic coupling behavior of proposed embedded current probing structure, demonstration of proposed current extraction method by implementing the current probing structure in a board level PDN and validation of SSN analysis by applying the extracted current waveform through the simulation and measurement result.
{"title":"Design and implementation of magnetically coupled current probe for monitoring simultaneous switching current in package","authors":"Changhyun Cho, Jonghyun Cho, Jonghoon J. Kim, Joungho Kim, J. Pak","doi":"10.1109/EPTC.2012.6507060","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507060","url":null,"abstract":"In this paper, we present a new embedded current probe that can support measurement-based approach for extracting switching current waveform that was injected into power distribution network (PDN). The proposed embedded current probing structure utilizes magnetic coupling behavior between primary conducting via and secondary toroidal coil structure surrounding and it can be used as a sensor which relates the induced voltage across toroidal coil to the switching current of conducting via. This paper will present characterization of magnetic coupling behavior of proposed embedded current probing structure, demonstration of proposed current extraction method by implementing the current probing structure in a board level PDN and validation of SSN analysis by applying the extracted current waveform through the simulation and measurement result.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128964482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507124
M. Briindel, U. Scholz, F. Haag, E. Graf, T. Braun, K. Becker
In this paper, we present the application of a substrateless packaging technology consisting of sub sequential molding of ASIC and MEMS dice und forming redistribution layers (RDL) on the molding compound. Acceleration sensors and pressure sensors were packaged, each sensor type presenting its own challenges. For pressure sensors it is crucial to ensure the access of the surrounding media to the pressure sensitive membrane. This was achieved by structuring the redistribution layer without changing the process, making the application of standard equipment and materials relatively easy. The acceleration sensors needed to be modified by trough silicon vias to fit the packaging process. For the redistribution layer, a novel approach was evaluated in parallel to the standard thin-film technology for the acceleration sensor package. All sensor packages fabricated by the process have been found to be within the specifications of standard packages using the same MEMS dice.
{"title":"Substrateless sensor packaging using wafer level fan-out technology","authors":"M. Briindel, U. Scholz, F. Haag, E. Graf, T. Braun, K. Becker","doi":"10.1109/EPTC.2012.6507124","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507124","url":null,"abstract":"In this paper, we present the application of a substrateless packaging technology consisting of sub sequential molding of ASIC and MEMS dice und forming redistribution layers (RDL) on the molding compound. Acceleration sensors and pressure sensors were packaged, each sensor type presenting its own challenges. For pressure sensors it is crucial to ensure the access of the surrounding media to the pressure sensitive membrane. This was achieved by structuring the redistribution layer without changing the process, making the application of standard equipment and materials relatively easy. The acceleration sensors needed to be modified by trough silicon vias to fit the packaging process. For the redistribution layer, a novel approach was evaluated in parallel to the standard thin-film technology for the acceleration sensor package. All sensor packages fabricated by the process have been found to be within the specifications of standard packages using the same MEMS dice.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128755790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507104
B. Soon, Navab Singh, J. Tsai, Chengkuo Lee
In this paper, we demonstrate wafer level encapsulation of MEMS using physical vapor deposition of aluminum (Al). A cavity area, which simulates the area of a MEMS device, is fully encapsulated by dual layer of amorphous silicon and Al. The encapsulation process takes place in the PVD chamber, thus the vacuum level in the sealed cavity is assumed to be high. The proposed processes are entirely CMOS compatible and readily deployed into any standard CMOS foundry and semiconductor wafer fabrication.
{"title":"Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD)","authors":"B. Soon, Navab Singh, J. Tsai, Chengkuo Lee","doi":"10.1109/EPTC.2012.6507104","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507104","url":null,"abstract":"In this paper, we demonstrate wafer level encapsulation of MEMS using physical vapor deposition of aluminum (Al). A cavity area, which simulates the area of a MEMS device, is fully encapsulated by dual layer of amorphous silicon and Al. The encapsulation process takes place in the PVD chamber, thus the vacuum level in the sealed cavity is assumed to be high. The proposed processes are entirely CMOS compatible and readily deployed into any standard CMOS foundry and semiconductor wafer fabrication.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116901307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507187
S. Sushanth Kumar, Satishchandra C Warn, Roland Lee
In automobiles, an ECM (Electronic Control Module) is used for controlling internal ambient temperature of vehicles to enhance comfort level of passengers. It typically contains a display module to show various operational modes such as cooling air temperature, ON/OFF for blower, AC, de-fogger etc. The display module uses LEDs as source of illumination. Adequate illumination requires packaging of several LEDs m a compact/constrained space. Also LEDs must operate at very high ambient temperature of 85°C that leads to significant thermal management challenges. This paper describes parametric studies using various thermal management techniques such as heat spreader, increased PCB copper layer thickness, increased copper pad size for LED, high conductive plastic back cover along with pedestals, thermal via for LEDs and vent holes for the enclosure; to bring down LED temperatures within its safe operating limit. LEDs are modeled in detail (using contact resistance between the die and lead frame) in order to improve the accuracy of junction temperature prediction. A combination of thermal management solutions/techniques are used to mitigate heat from LEDs with significant bearing on cost competitiveness.
在汽车中，ECM (Electronic Control Module)用于控制车辆内部环境温度，以提高乘客的舒适度。它通常包含一个显示模块，以显示各种操作模式，如冷却空气温度，开/关鼓风机，交流，除雾器等。显示模块使用led作为照明光源。充足的照明需要在一个紧凑/受限的空间内封装几个led。此外，led必须在85°C的高环境温度下工作，这导致了重大的热管理挑战。本文描述了使用各种热管理技术的参数化研究，例如散热器，增加PCB铜层厚度，增加LED铜垫尺寸，高导电性塑料后盖以及基座，LED的热通孔和外壳的通风口;将LED温度降低到安全工作范围内。为了提高结温预测的准确性，对led进行了详细的建模(使用芯片和引线框架之间的接触电阻)。热管理解决方案/技术的组合用于减少led的热量，这对成本竞争力有重要影响。
{"title":"LED thermal management of an automotive electronic control module with display","authors":"S. Sushanth Kumar, Satishchandra C Warn, Roland Lee","doi":"10.1109/EPTC.2012.6507187","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507187","url":null,"abstract":"In automobiles, an ECM (Electronic Control Module) is used for controlling internal ambient temperature of vehicles to enhance comfort level of passengers. It typically contains a display module to show various operational modes such as cooling air temperature, ON/OFF for blower, AC, de-fogger etc. The display module uses LEDs as source of illumination. Adequate illumination requires packaging of several LEDs m a compact/constrained space. Also LEDs must operate at very high ambient temperature of 85°C that leads to significant thermal management challenges. This paper describes parametric studies using various thermal management techniques such as heat spreader, increased PCB copper layer thickness, increased copper pad size for LED, high conductive plastic back cover along with pedestals, thermal via for LEDs and vent holes for the enclosure; to bring down LED temperatures within its safe operating limit. LEDs are modeled in detail (using contact resistance between the die and lead frame) in order to improve the accuracy of junction temperature prediction. A combination of thermal management solutions/techniques are used to mitigate heat from LEDs with significant bearing on cost competitiveness.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123194311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507052
V. Chidambaram, Ho Beng Yeung, C. Sing, Daniel Rhee Min Woo
The accomplishment of fully functional high-pressure high-temperature (HPHT) well is possible only, when the packaging and interconnections in the well logging equipments can survive at higher temperatures. Currently, there are numerous choices for substrate materials and interconnection materials. However, there are hardly any encapsulation materials that can endure at 300°C. Thus, the limiting factor for the evaluation and monitoring of HPHT wells is; the availability of high-temperature endurable encapsulation material. In this paper, the endurability of three prospective candidates for high-temperature encapsulation have been characterized and reported. The three prospective candidates are benzocyclobutene (BCB), ceramic filled cyanate ester and quartz filled cyanate ester. The high-temperature endurability has been evaluated in this work by high-temperature storage at 300°C up to 500 hours. Adhesion strength of these prospective candidates with the alumina ceramic substrate and the Si die was verified by room shear testing and hot shear testing. It has been determined that the quartz filled cyanate ester could comply with the minimum indispensable requirement for this application, when sandwiched between alumina ceramic substrates, despite the loss of strength during long-term thermal aging at 300°C. The material degradation has been studied in this work, using thermo-gravimetric analysis.
{"title":"High-temperature endurable encapsulation material","authors":"V. Chidambaram, Ho Beng Yeung, C. Sing, Daniel Rhee Min Woo","doi":"10.1109/EPTC.2012.6507052","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507052","url":null,"abstract":"The accomplishment of fully functional high-pressure high-temperature (HPHT) well is possible only, when the packaging and interconnections in the well logging equipments can survive at higher temperatures. Currently, there are numerous choices for substrate materials and interconnection materials. However, there are hardly any encapsulation materials that can endure at 300°C. Thus, the limiting factor for the evaluation and monitoring of HPHT wells is; the availability of high-temperature endurable encapsulation material. In this paper, the endurability of three prospective candidates for high-temperature encapsulation have been characterized and reported. The three prospective candidates are benzocyclobutene (BCB), ceramic filled cyanate ester and quartz filled cyanate ester. The high-temperature endurability has been evaluated in this work by high-temperature storage at 300°C up to 500 hours. Adhesion strength of these prospective candidates with the alumina ceramic substrate and the Si die was verified by room shear testing and hot shear testing. It has been determined that the quartz filled cyanate ester could comply with the minimum indispensable requirement for this application, when sandwiched between alumina ceramic substrates, despite the loss of strength during long-term thermal aging at 300°C. The material degradation has been studied in this work, using thermo-gravimetric analysis.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131273785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-01DOI: 10.1109/EPTC.2012.6507134
Chan Wai Kok, Tham Veng Leong, W. Yong
Bare copper (Cu) wire is one of the promising materials used in assembly packaging to replace gold wire. As copper is harder compared to gold, the formation of the looping during wire bonding is a concern and challenge especially to ball neck surface condition. Thus, the objective of this paper is to identify the key parameters that are having significant impact on the ball neck surface condition at wire bond and molding process. Evaluations are performed and the result do identified key factors that are having impact to the ball neck surface condition.
{"title":"Wire bond and molding factors influencing bare Cu wire surface conditions","authors":"Chan Wai Kok, Tham Veng Leong, W. Yong","doi":"10.1109/EPTC.2012.6507134","DOIUrl":"https://doi.org/10.1109/EPTC.2012.6507134","url":null,"abstract":"Bare copper (Cu) wire is one of the promising materials used in assembly packaging to replace gold wire. As copper is harder compared to gold, the formation of the looping during wire bonding is a concern and challenge especially to ball neck surface condition. Thus, the objective of this paper is to identify the key parameters that are having significant impact on the ball neck surface condition at wire bond and molding process. Evaluations are performed and the result do identified key factors that are having impact to the ball neck surface condition.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126401731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：