Pub Date : 2024-08-14DOI: 10.1109/TSM.2024.3434277
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2024.3434277","DOIUrl":"https://doi.org/10.1109/TSM.2024.3434277","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636311","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141985952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-14DOI: 10.1109/tsm.2024.3444465
Gurpreet S. Lugani, Robert Skaggs, Bryan Morris, Tyler Tolman, Douglas Tervo, Stefan Uhlenbrock, Jon Hacker, Chye Seng Tan, James P. Nehlsen, Robert G. Ridgeway, Lois Wong Broadway, Francis P. Rudy
{"title":"Direct Emissions Reduction in Plasma Dry Etching Using Alternate Chemistries: Opportunities, Challenges and Need for Collaboration","authors":"Gurpreet S. Lugani, Robert Skaggs, Bryan Morris, Tyler Tolman, Douglas Tervo, Stefan Uhlenbrock, Jon Hacker, Chye Seng Tan, James P. Nehlsen, Robert G. Ridgeway, Lois Wong Broadway, Francis P. Rudy","doi":"10.1109/tsm.2024.3444465","DOIUrl":"https://doi.org/10.1109/tsm.2024.3444465","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-14DOI: 10.1109/TSM.2024.3429588
Jeanne Paulette Bickford;Delphine Le Cunff;Ralf Buengener;Stefan Radloff;Paul Werbaneth
As this Special Section goes to publication, semiconductor manufacturing in the United Status, and globally, continues to expand at a seemingly torrid pace. Assisted by government funding and driven in part by artificial intelligence workloads that gobble up increasing amounts of data center computing capacity, Intel and TSMC fabs are going up in Arizona, TI and Samsung fabs are coming to Texas, and Micron has big plans in New York. Unfortunately, just like those flying cars we were once promised, AI has not yet eliminated the need for the skilled trades and engineers required to build and successfully operate a fab. As a result, workforce development has become an important part of the increasingly complex semiconductor manufacturing process: Where are the thousands of engineers the semiconductor industry needs to staff these new fabs going to come from? How can we make more students excited about science and engineering? While the Guest Editors don’t have all the answers, we are happy that ASMC contributes to the solution by actively supporting student presentations and posters and annually recognizing the best student paper of the conference. And, maybe some day, the artificial intelligence systems that semiconductor manufacturing has enabled will give us those Star Wars or Star Trek robots that can build fabs and make chips too.
{"title":"Guest Editorial Special section on the 2023 SEMI Advanced Semiconductor Manufacturing Conference","authors":"Jeanne Paulette Bickford;Delphine Le Cunff;Ralf Buengener;Stefan Radloff;Paul Werbaneth","doi":"10.1109/TSM.2024.3429588","DOIUrl":"https://doi.org/10.1109/TSM.2024.3429588","url":null,"abstract":"As this Special Section goes to publication, semiconductor manufacturing in the United Status, and globally, continues to expand at a seemingly torrid pace. Assisted by government funding and driven in part by artificial intelligence workloads that gobble up increasing amounts of data center computing capacity, Intel and TSMC fabs are going up in Arizona, TI and Samsung fabs are coming to Texas, and Micron has big plans in New York. Unfortunately, just like those flying cars we were once promised, AI has not yet eliminated the need for the skilled trades and engineers required to build and successfully operate a fab. As a result, workforce development has become an important part of the increasingly complex semiconductor manufacturing process: Where are the thousands of engineers the semiconductor industry needs to staff these new fabs going to come from? How can we make more students excited about science and engineering? While the Guest Editors don’t have all the answers, we are happy that ASMC contributes to the solution by actively supporting student presentations and posters and annually recognizing the best student paper of the conference. And, maybe some day, the artificial intelligence systems that semiconductor manufacturing has enabled will give us those Star Wars or Star Trek robots that can build fabs and make chips too.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636306","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141991409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-14DOI: 10.1109/TSM.2024.3411140
{"title":"Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices","authors":"","doi":"10.1109/TSM.2024.3411140","DOIUrl":"https://doi.org/10.1109/TSM.2024.3411140","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636191","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141991504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-14DOI: 10.1109/tsm.2024.3438098
Teresa E. Bodtker, Richard A. Riley, Soley Ozer, Sanaz K. Gardner, Ryan J. Russell, Jeffrey Birdsall, Sam P. Johnson
{"title":"Leading Sustainability Applications for More Responsible Logic Technology Development","authors":"Teresa E. Bodtker, Richard A. Riley, Soley Ozer, Sanaz K. Gardner, Ryan J. Russell, Jeffrey Birdsall, Sam P. Johnson","doi":"10.1109/tsm.2024.3438098","DOIUrl":"https://doi.org/10.1109/tsm.2024.3438098","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-14DOI: 10.1109/TSM.2024.3442028
{"title":"IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations","authors":"","doi":"10.1109/TSM.2024.3442028","DOIUrl":"https://doi.org/10.1109/TSM.2024.3442028","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636272","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141985909","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-06DOI: 10.1109/tsm.2024.3439271
Nathan Marchack, Eric A. Joseph
{"title":"Centering Sustainability in Process Development Through Improved Characterization of HFC-PFC Byproducts","authors":"Nathan Marchack, Eric A. Joseph","doi":"10.1109/tsm.2024.3439271","DOIUrl":"https://doi.org/10.1109/tsm.2024.3439271","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141942146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-05DOI: 10.1109/tsm.2024.3438622
Wojciech T. Osowiecki, Martyn J. Coogans, Saravanapriyan Sriraman, Rakesh Ranjan, Yu Lu, David M. Fried
{"title":"Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI","authors":"Wojciech T. Osowiecki, Martyn J. Coogans, Saravanapriyan Sriraman, Rakesh Ranjan, Yu Lu, David M. Fried","doi":"10.1109/tsm.2024.3438622","DOIUrl":"https://doi.org/10.1109/tsm.2024.3438622","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141942147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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