This study investigates the size-dependent thermoelastic dynamics of microbeams utilizing graphene as an integrated heat source. A sophisticated mathematical model is developed by synergistically combining modified couple stress theory (MCST) with a nonlocal heat conduction framework. This integrated approach effectively captures size-dependent phenomena, the influence of applied electrical voltage, and material resistance on the dynamic thermoelastic response of Euler–Bernoulli microbeams. The nonlocal heat conduction model incorporates thermal relaxation time and material length-scale parameters to accurately represent size effects in thermal transport, while MCST introduces additional stiffness mechanisms that enhance the predictive accuracy of mechanical behavior. The microbeam system, subjected to a sinusoidal heat pulse and thermoelectric effects from the graphene strip, is analyzed under simply supported boundary conditions. Governing equations are solved analytically using the Laplace transform method, yielding closed-form solutions for temperature distribution, lateral deflection, axial displacement, and stress components. Comprehensive numerical simulations elucidate the impact of critical factors, including couple stress effects, applied voltage magnitude, electrical resistance, and thermal boundary conditions, on the microbeam’s dynamic response. Results demonstrate that size-dependent effects significantly increase structural stiffness while reducing flexibility, leading to substantial modifications in both thermal and mechanical responses.
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