Pub Date : 2021-01-18DOI: 10.1108/SSMT-12-2019-0046
Gan Guisheng, Yang Donghua, Yiping Wu, Liu Xin, P. Sun, Xia Daquan, Cao Huadong, Jiang Liujie, Tian Mizhe
The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.,In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.,With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.,Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.
{"title":"Property of Sn-37Pb solder bumps with different diameter during thermal shock","authors":"Gan Guisheng, Yang Donghua, Yiping Wu, Liu Xin, P. Sun, Xia Daquan, Cao Huadong, Jiang Liujie, Tian Mizhe","doi":"10.1108/SSMT-12-2019-0046","DOIUrl":"https://doi.org/10.1108/SSMT-12-2019-0046","url":null,"abstract":"The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.,In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.,With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.,Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"33 1","pages":"94-104"},"PeriodicalIF":2.0,"publicationDate":"2021-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45775475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-01-13DOI: 10.1108/SSMT-08-2020-0035
Gan Guisheng, Jiang Liujie, Chen Shiqi, Yongqiang Deng, Yang Donghua, Jiang Zhaoqi, Cao Huadong, Tian Mizhe, Xu Qianzhu, Liu Xin
Purpose Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too much impact on the improvement of solders’ performance but were difficult to achieve satisfactory results. It is urgent to develop new soldering technology to avoid the bottleneck of lead-free solder. low-temperature-stirring soldering and ultrasonic-assisted soldering was developed in the authors’ early work, but slag inclusion and pore would gather and grow up to lead decreasing of the shear strength. In this paper, Cu/SAC0307 +Zn power/Cu joints with ultrasonic-assisted at low-temperature was successfully achieved. Design/methodology/approach 45um Zn-powder and SAC0307 No.4 solder powder were mixed to fill the Cu-Cu joint, and the content of Zn-powder were 0 and 5%, 7.5% and 10%, 12.5% and 15% respectively. During the soldering process under ambient atmosphere %252C the heating platform provided a constant 220%253 F and the ultrasonic vibrator applied a constant pressure of 4 MPa to the copper substrate. The soldering process was completed after holding 70 s at 300 W. Findings The Zn particles made the IMC at the joint interface and in the soldering seam from scallop-type Cu6Sn5 to flat-type Cu5Zn8. The shear strength of joints without Zn was only 12.43 MPa, the shear strength of joints with 10% Zn reached a peak of 34.25 MPa, and the shear strength of joints containing 10% Zn was 63.71% higher than that of joints without zinc particles, and then the shear strength decreased. In addition, with the increase of zinc content, the fracture mode of the joint changed from the brittle fracture of the original layered tears to the mixed tough and brittle fracture. Originality/value A new method that Zn micron-size powders and SAC0307 micron-size powders was mixed to fill the joint, and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted without flux at low-temperature.
{"title":"Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature","authors":"Gan Guisheng, Jiang Liujie, Chen Shiqi, Yongqiang Deng, Yang Donghua, Jiang Zhaoqi, Cao Huadong, Tian Mizhe, Xu Qianzhu, Liu Xin","doi":"10.1108/SSMT-08-2020-0035","DOIUrl":"https://doi.org/10.1108/SSMT-08-2020-0035","url":null,"abstract":"\u0000Purpose\u0000Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too much impact on the improvement of solders’ performance but were difficult to achieve satisfactory results. It is urgent to develop new soldering technology to avoid the bottleneck of lead-free solder. low-temperature-stirring soldering and ultrasonic-assisted soldering was developed in the authors’ early work, but slag inclusion and pore would gather and grow up to lead decreasing of the shear strength. In this paper, Cu/SAC0307 +Zn power/Cu joints with ultrasonic-assisted at low-temperature was successfully achieved.\u0000\u0000\u0000Design/methodology/approach\u000045um Zn-powder and SAC0307 No.4 solder powder were mixed to fill the Cu-Cu joint, and the content of Zn-powder were 0 and 5%, 7.5% and 10%, 12.5% and 15% respectively. During the soldering process under ambient atmosphere %252C the heating platform provided a constant 220%253 F and the ultrasonic vibrator applied a constant pressure of 4 MPa to the copper substrate. The soldering process was completed after holding 70 s at 300 W.\u0000\u0000\u0000Findings\u0000The Zn particles made the IMC at the joint interface and in the soldering seam from scallop-type Cu6Sn5 to flat-type Cu5Zn8. The shear strength of joints without Zn was only 12.43 MPa, the shear strength of joints with 10% Zn reached a peak of 34.25 MPa, and the shear strength of joints containing 10% Zn was 63.71% higher than that of joints without zinc particles, and then the shear strength decreased. In addition, with the increase of zinc content, the fracture mode of the joint changed from the brittle fracture of the original layered tears to the mixed tough and brittle fracture.\u0000\u0000\u0000Originality/value\u0000A new method that Zn micron-size powders and SAC0307 micron-size powders was mixed to fill the joint, and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted without flux at low-temperature.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2021-01-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43010906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-01-11DOI: 10.1108/SSMT-10-2020-0045
F. Nyarko, G. Takyi
Purpose A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted. Design/methodology/approach A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary conditions for the investigation of the thermo-mechanical response of the soldered interconnects when subjected to real outdoor conditions using finite element analysis (FEA) Software (Ansys. 18.2). Two types of soldered interconnections, namely, Sn60Pb40 and Sn3.8Ag0.7Cu (Pb-free), were modelled in this study. Findings Life prediction results from accumulated creep energy density damage show that the solder interconnects will achieve maximum life under the 2014 thermal cycle loading. In particular, the Sn60Pb40 solder interconnection is expected to achieve 14,153 cycles (25.85 years) whilst the Pb-free solder interconnection is expected to achieve 9,249 cycles (16.89 years). Additionally, under the test region average (TRA) thermal cycle, the Pb-free and Pb-Sn solder interconnections are expected to achieve 7,944 cycles (13.69 years) and 12,814 cycles (23.4 years), respectively. The study shows that Sn60Pb40 solder interconnections are likely to exhibit superior reliability over the Pb-free solder interconnections at the test site. Practical implications This study would be useful to electronics manufacturing industry in the search for a suitable alternative to SnPb solders and also the thermo-mechanical reliability research community and manufacturers in the design of robust PV modules. Originality/value The study has provided TRA data/results which could be used to represent the test region instead of a particular year. The study also indicates that more than six thermal cycles are required before any meaningful conclusions can be drawn. Finally, the life of the two types of solders (SnPb and Pb-free) as interconnecting materials for c-Si PV have been predicted for the test region (Kumasi in sub-Saharan Africa).
{"title":"Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana","authors":"F. Nyarko, G. Takyi","doi":"10.1108/SSMT-10-2020-0045","DOIUrl":"https://doi.org/10.1108/SSMT-10-2020-0045","url":null,"abstract":"\u0000Purpose\u0000A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted.\u0000\u0000\u0000Design/methodology/approach\u0000A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary conditions for the investigation of the thermo-mechanical response of the soldered interconnects when subjected to real outdoor conditions using finite element analysis (FEA) Software (Ansys. 18.2). Two types of soldered interconnections, namely, Sn60Pb40 and Sn3.8Ag0.7Cu (Pb-free), were modelled in this study.\u0000\u0000\u0000Findings\u0000Life prediction results from accumulated creep energy density damage show that the solder interconnects will achieve maximum life under the 2014 thermal cycle loading. In particular, the Sn60Pb40 solder interconnection is expected to achieve 14,153 cycles (25.85 years) whilst the Pb-free solder interconnection is expected to achieve 9,249 cycles (16.89 years). Additionally, under the test region average (TRA) thermal cycle, the Pb-free and Pb-Sn solder interconnections are expected to achieve 7,944 cycles (13.69 years) and 12,814 cycles (23.4 years), respectively. The study shows that Sn60Pb40 solder interconnections are likely to exhibit superior reliability over the Pb-free solder interconnections at the test site.\u0000\u0000\u0000Practical implications\u0000This study would be useful to electronics manufacturing industry in the search for a suitable alternative to SnPb solders and also the thermo-mechanical reliability research community and manufacturers in the design of robust PV modules.\u0000\u0000\u0000Originality/value\u0000The study has provided TRA data/results which could be used to represent the test region instead of a particular year. The study also indicates that more than six thermal cycles are required before any meaningful conclusions can be drawn. Finally, the life of the two types of solders (SnPb and Pb-free) as interconnecting materials for c-Si PV have been predicted for the test region (Kumasi in sub-Saharan Africa).\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2021-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45944109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-12-28DOI: 10.1108/ssmt-05-2020-0018
Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa
Purpose The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view. Design/methodology/approach In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view. Findings It was found that inverter types highly affect the solder joint health during its nominal operating. Originality/value The authors confirm the originality of this paper.
{"title":"Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters","authors":"Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa","doi":"10.1108/ssmt-05-2020-0018","DOIUrl":"https://doi.org/10.1108/ssmt-05-2020-0018","url":null,"abstract":"Purpose\u0000The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.\u0000\u0000\u0000Design/methodology/approach\u0000In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.\u0000\u0000\u0000Findings\u0000It was found that inverter types highly affect the solder joint health during its nominal operating.\u0000\u0000\u0000Originality/value\u0000The authors confirm the originality of this paper.","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-12-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46349786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-11-16DOI: 10.1108/ssmt-03-2020-0010
R. Muhammad, U. Ali
Purpose This paper aims to analyze the effect of cerium addition on the microstructure and the mechanical properties of Tin-Silver-Copper (SAC) alloy. The mechanical properties and refined microstructure of a solder joint are vital for the reliability and performance of electronics. SAC305 alloys are potential choices to use as lead-free solders because of their good properties as compared to the conventional Tin-Lead solder alloys. However, the presence of bulk intermetallic compounds (IMCs) in the microstructure of SAC305 alloys affects their overall performance. Therefore, addition of cerium restrains the growth of IMCs and refines the microstructure, hence improving the mechanical performance. Design/methodology/approach SAC305 alloy is doped with various composition of xCerium (x = 0.15, 0.35, 0.55, 0.75, 0.95) % by weight. Pure elements in powdered form were melted in the presence of argon with periodic stirring to ensure a uniform melted alloy. The molten alloy is then poured into a pre-heated die to obtain a tensile specimen. The yield strength and universal tensile strength were determined using a fixed strain rate of 10 mm per minute or 0.1667 mm s^(−1). The IMCs are identified using X-ray diffraction, whereas the elemental phase composition and microstructure evolution are, respectively, examined by using electron dispersive spectroscopy and scanning electron microscopy. Findings Improvement in the microstructure and mechanical properties is observed with 0.15% of cerium additions. The tensile test also showed that SAC305-0.15% cerium exhibits more stress-bearing capacity than other compositions. The 0.75% cerium doped alloy indicated some improvement because of a decrease in fracture dislocation regions, but microstructure refinement and the arrangement of IMCs are not those of 0.15% Ce. Different phases of Cu_6 Sn_5, Ag_3 Sn and CeSn_3 and ß-Sn are identified. Therefore, the addition of cerium in lower concentrations and presence of Ce-Sn IMCs improved the grain boundary structure and resulted refinement in the microstructure of the alloy, as well as an enhancement in the mechanical properties. Originality/value Characterization of microstructure and evaluation of mechanical properties are carried out to investigate the different composition of SAC305-xCerium alloys. Finally, an optimized cerium composition is selected for solder joint in electronics.
{"title":"Optimized cerium addition for microstructure and mechanical properties of SAC305","authors":"R. Muhammad, U. Ali","doi":"10.1108/ssmt-03-2020-0010","DOIUrl":"https://doi.org/10.1108/ssmt-03-2020-0010","url":null,"abstract":"\u0000Purpose\u0000This paper aims to analyze the effect of cerium addition on the microstructure and the mechanical properties of Tin-Silver-Copper (SAC) alloy. The mechanical properties and refined microstructure of a solder joint are vital for the reliability and performance of electronics. SAC305 alloys are potential choices to use as lead-free solders because of their good properties as compared to the conventional Tin-Lead solder alloys. However, the presence of bulk intermetallic compounds (IMCs) in the microstructure of SAC305 alloys affects their overall performance. Therefore, addition of cerium restrains the growth of IMCs and refines the microstructure, hence improving the mechanical performance.\u0000\u0000\u0000Design/methodology/approach\u0000SAC305 alloy is doped with various composition of xCerium (x = 0.15, 0.35, 0.55, 0.75, 0.95) % by weight. Pure elements in powdered form were melted in the presence of argon with periodic stirring to ensure a uniform melted alloy. The molten alloy is then poured into a pre-heated die to obtain a tensile specimen. The yield strength and universal tensile strength were determined using a fixed strain rate of 10 mm per minute or 0.1667 mm s^(−1). The IMCs are identified using X-ray diffraction, whereas the elemental phase composition and microstructure evolution are, respectively, examined by using electron dispersive spectroscopy and scanning electron microscopy.\u0000\u0000\u0000Findings\u0000Improvement in the microstructure and mechanical properties is observed with 0.15% of cerium additions. The tensile test also showed that SAC305-0.15% cerium exhibits more stress-bearing capacity than other compositions. The 0.75% cerium doped alloy indicated some improvement because of a decrease in fracture dislocation regions, but microstructure refinement and the arrangement of IMCs are not those of 0.15% Ce. Different phases of Cu_6 Sn_5, Ag_3 Sn and CeSn_3 and ß-Sn are identified. Therefore, the addition of cerium in lower concentrations and presence of Ce-Sn IMCs improved the grain boundary structure and resulted refinement in the microstructure of the alloy, as well as an enhancement in the mechanical properties.\u0000\u0000\u0000Originality/value\u0000Characterization of microstructure and evaluation of mechanical properties are carried out to investigate the different composition of SAC305-xCerium alloys. Finally, an optimized cerium composition is selected for solder joint in electronics.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45277632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-11-16DOI: 10.1108/ssmt-06-2020-0028
Buen Zhang, N. Jabarullah, A. Alkaim, S. Danshina, I. Krasnopevtseva, Yuan Zheng, N. Geetha
Purpose This paper aims to establish a more accurate model for lifetime estimation. Design/methodology/approach Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint. Findings A more precise model was found. Originality/value It is confirmed that the paper is original.
{"title":"Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling","authors":"Buen Zhang, N. Jabarullah, A. Alkaim, S. Danshina, I. Krasnopevtseva, Yuan Zheng, N. Geetha","doi":"10.1108/ssmt-06-2020-0028","DOIUrl":"https://doi.org/10.1108/ssmt-06-2020-0028","url":null,"abstract":"\u0000Purpose\u0000This paper aims to establish a more accurate model for lifetime estimation.\u0000\u0000\u0000Design/methodology/approach\u0000Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.\u0000\u0000\u0000Findings\u0000A more precise model was found.\u0000\u0000\u0000Originality/value\u0000It is confirmed that the paper is original.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-06-2020-0028","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48414835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-11-11DOI: 10.1108/ssmt-07-2020-0031
Feng Wang, Fangfang Zhang, Qixiang Huang, M. Salmani
Purpose The purpose of this paper is to propose a method with capability of short-time implementation. Design/methodology/approach This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints. Findings A new method with good agreement with experimental tests has been proposed. Originality/value It is confirmed that paper is original.
{"title":"An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems","authors":"Feng Wang, Fangfang Zhang, Qixiang Huang, M. Salmani","doi":"10.1108/ssmt-07-2020-0031","DOIUrl":"https://doi.org/10.1108/ssmt-07-2020-0031","url":null,"abstract":"\u0000Purpose\u0000The purpose of this paper is to propose a method with capability of short-time implementation.\u0000\u0000\u0000Design/methodology/approach\u0000This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.\u0000\u0000\u0000Findings\u0000A new method with good agreement with experimental tests has been proposed.\u0000\u0000\u0000Originality/value\u0000It is confirmed that paper is original.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-07-2020-0031","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46799602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-11-02DOI: 10.1108/ssmt-06-2020-0027
Haiyan Sun, Gao Bo, Jicong Zhao
Purpose This study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of copper post, the height of solder bump, the thickness of chip. The FEA results indicate the height of solder bumps is the most important factor in the whole structure. Design/methodology/approach The copper post bumps with 65 µm pitch are proposed to investigate the thermal-mechanical performance of WLP. The thermal cycle simulation is used to evaluate the reliability of WLP by using finite element analysis (FEA). Taguchi method is adopted to obtain the sensitivity of parameters of three-dimension finite element model, for an optimized configuration. Findings It can be found that the optimal design has increased thermal fatigue life by 147% compared with the original one. Originality/value It is concluded that the finite element simulation results show outstanding thermal-mechanical performances of the proposed 65 µm pitch copper post bumps of WLP, including low plastic strain, high thermal fatigue life, which are desired for mobile device.
{"title":"Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps","authors":"Haiyan Sun, Gao Bo, Jicong Zhao","doi":"10.1108/ssmt-06-2020-0027","DOIUrl":"https://doi.org/10.1108/ssmt-06-2020-0027","url":null,"abstract":"\u0000Purpose\u0000This study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of copper post, the height of solder bump, the thickness of chip. The FEA results indicate the height of solder bumps is the most important factor in the whole structure.\u0000\u0000\u0000Design/methodology/approach\u0000The copper post bumps with 65 µm pitch are proposed to investigate the thermal-mechanical performance of WLP. The thermal cycle simulation is used to evaluate the reliability of WLP by using finite element analysis (FEA). Taguchi method is adopted to obtain the sensitivity of parameters of three-dimension finite element model, for an optimized configuration.\u0000\u0000\u0000Findings\u0000It can be found that the optimal design has increased thermal fatigue life by 147% compared with the original one.\u0000\u0000\u0000Originality/value\u0000It is concluded that the finite element simulation results show outstanding thermal-mechanical performances of the proposed 65 µm pitch copper post bumps of WLP, including low plastic strain, high thermal fatigue life, which are desired for mobile device.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-06-2020-0027","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46172137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-10-15DOI: 10.1108/ssmt-05-2020-0020
Yang Gao, Fuwei Wang, Ding Shaohu, Bin Yang, Lin Liu, M. Salmani
Purpose This study aims to investigate the vibration effects on ball grid array lifetime. Design/methodology/approach Several finite element method simulations and experiments were performed. Findings An optimized circuit configuration was found. Originality/value The originality of paper is confirmed by authors.
{"title":"Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies","authors":"Yang Gao, Fuwei Wang, Ding Shaohu, Bin Yang, Lin Liu, M. Salmani","doi":"10.1108/ssmt-05-2020-0020","DOIUrl":"https://doi.org/10.1108/ssmt-05-2020-0020","url":null,"abstract":"\u0000Purpose\u0000This study aims to investigate the vibration effects on ball grid array lifetime.\u0000\u0000\u0000Design/methodology/approach\u0000Several finite element method simulations and experiments were performed.\u0000\u0000\u0000Findings\u0000An optimized circuit configuration was found.\u0000\u0000\u0000Originality/value\u0000The originality of paper is confirmed by authors.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-05-2020-0020","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43078502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-10-07DOI: 10.1108/ssmt-05-2020-0016
Chien-Yi Huang, Li-Cheng Shen, Ting Wu, C. M. Greene
Purpose This paper aims to discuss the key factors affecting the quality characteristics, such as the number of solder balls, the spread distance of residual underfill and the completion time of the underfilling. Design/methodology/approach The Taguchi method is applied to configure the orthogonal table and schedule and execute the experiment. In addition, principal components analysis is used to obtain the points. Then, based on gray relational analysis and the technique for order preference by similarity to ideal solution, the closeness between each quality characteristic and the ideal solution is adopted as the basis for evaluating the quality characteristics. Findings The optimal parameter combination is proposed, which includes 4 dispensing (11 mg/dispensing), a “half flow” interval state, 80°C preheating module PCB board and an L-shaped dispensing path and verification testing is performed. Originality/value For vehicles and handheld electronic products, solder joints that connect electronic components to printed circuit boards may be cracked due to collision, vibration or falling. Consequently, solder balls are closely surrounded and protected by the underfill to improve joint strength and resist external force factors, such as collision and vibration. This paper addresses the defects caused during the second reflow process of a vehicle electronic communication module after the underfilling process.
{"title":"Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module","authors":"Chien-Yi Huang, Li-Cheng Shen, Ting Wu, C. M. Greene","doi":"10.1108/ssmt-05-2020-0016","DOIUrl":"https://doi.org/10.1108/ssmt-05-2020-0016","url":null,"abstract":"\u0000Purpose\u0000This paper aims to discuss the key factors affecting the quality characteristics, such as the number of solder balls, the spread distance of residual underfill and the completion time of the underfilling.\u0000\u0000\u0000Design/methodology/approach\u0000The Taguchi method is applied to configure the orthogonal table and schedule and execute the experiment. In addition, principal components analysis is used to obtain the points. Then, based on gray relational analysis and the technique for order preference by similarity to ideal solution, the closeness between each quality characteristic and the ideal solution is adopted as the basis for evaluating the quality characteristics.\u0000\u0000\u0000Findings\u0000The optimal parameter combination is proposed, which includes 4 dispensing (11 mg/dispensing), a “half flow” interval state, 80°C preheating module PCB board and an L-shaped dispensing path and verification testing is performed.\u0000\u0000\u0000Originality/value\u0000For vehicles and handheld electronic products, solder joints that connect electronic components to printed circuit boards may be cracked due to collision, vibration or falling. Consequently, solder balls are closely surrounded and protected by the underfill to improve joint strength and resist external force factors, such as collision and vibration. This paper addresses the defects caused during the second reflow process of a vehicle electronic communication module after the underfilling process.\u0000","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2020-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-05-2020-0016","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43599096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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