Pub Date : 2024-09-25DOI: 10.1038/s44287-024-00105-x
Gerard Joseph Lim, Wen Siang Lew
The future of spintronics hinges on the effective collaboration between academia and industry. Here we explore the crucial role of partnership in advancing research and innovation, highlighting how these collaborations can drive technological breakthroughs in the field of spintronics and facilitate their transition to practical applications.
{"title":"Bridging academia and industry for the future of spintronics","authors":"Gerard Joseph Lim, Wen Siang Lew","doi":"10.1038/s44287-024-00105-x","DOIUrl":"10.1038/s44287-024-00105-x","url":null,"abstract":"The future of spintronics hinges on the effective collaboration between academia and industry. Here we explore the crucial role of partnership in advancing research and innovation, highlighting how these collaborations can drive technological breakthroughs in the field of spintronics and facilitate their transition to practical applications.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 11","pages":"692-693"},"PeriodicalIF":0.0,"publicationDate":"2024-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142600832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-25DOI: 10.1038/s44287-024-00089-8
Antonio Frisoli, Daniele Leonardis
Research has increasingly focused on wearable systems that provide informative haptic sensations to the hands, enhancing user interaction in virtual reality (VR) and augmented reality (AR) environments. Concurrently, the evolution of VR visors in terms of wearability, quality of the visual immersion and immediateness of bare-hand interaction poses both opportunities and challenges for haptic systems, which must match these visors in usability, hand-tracking compliance and quality of experience. Designing haptic devices involves trade-offs between the dimensions and quality of feedback, often falling short of the richness and complexity of natural haptic sensations. Recent studies have explored various actuating methods and haptic prototypes to enhance the wearability and feedback richness of haptic devices. Notably, the development of soft interfaces actuated by diverse principles has emerged as a key trend. Moreover, beyond simulating physical interaction, haptic technologies can provide high-level information for various applications, including posture correction, navigation and remote control of humanoid robots. In this Review, we provide an overview of wearable haptics for VR applications, introducing principles of haptic rendering and the relationship between stimulus modalities and actuating solutions. We discuss emerging actuating methods and wearable device designs, examining their experimental applications in innovative scenarios of VR and beyond. This Review provides an overview of haptic perception principles and rendering strategies developed for wearable haptics solutions. The Review then revises the scientific literature regarding emerging actuators and device prototypes, and their applications in innovative scenarios focused on, but not limited to, virtual reality (VR).
{"title":"Wearable haptics for virtual reality and beyond","authors":"Antonio Frisoli, Daniele Leonardis","doi":"10.1038/s44287-024-00089-8","DOIUrl":"10.1038/s44287-024-00089-8","url":null,"abstract":"Research has increasingly focused on wearable systems that provide informative haptic sensations to the hands, enhancing user interaction in virtual reality (VR) and augmented reality (AR) environments. Concurrently, the evolution of VR visors in terms of wearability, quality of the visual immersion and immediateness of bare-hand interaction poses both opportunities and challenges for haptic systems, which must match these visors in usability, hand-tracking compliance and quality of experience. Designing haptic devices involves trade-offs between the dimensions and quality of feedback, often falling short of the richness and complexity of natural haptic sensations. Recent studies have explored various actuating methods and haptic prototypes to enhance the wearability and feedback richness of haptic devices. Notably, the development of soft interfaces actuated by diverse principles has emerged as a key trend. Moreover, beyond simulating physical interaction, haptic technologies can provide high-level information for various applications, including posture correction, navigation and remote control of humanoid robots. In this Review, we provide an overview of wearable haptics for VR applications, introducing principles of haptic rendering and the relationship between stimulus modalities and actuating solutions. We discuss emerging actuating methods and wearable device designs, examining their experimental applications in innovative scenarios of VR and beyond. This Review provides an overview of haptic perception principles and rendering strategies developed for wearable haptics solutions. The Review then revises the scientific literature regarding emerging actuators and device prototypes, and their applications in innovative scenarios focused on, but not limited to, virtual reality (VR).","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"666-679"},"PeriodicalIF":0.0,"publicationDate":"2024-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142431089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-19DOI: 10.1038/s44287-024-00101-1
Ren-Min Ma
Nanolaser research focuses on miniaturizing lasers to enhance performance and broaden their range of applications. Here, we present opportunities and challenges of a new class of singular nanolasers capable of achieving atomic-scale field localization, highlighting their potential applications.
{"title":"Nanolaser technology with atomic-scale field localization","authors":"Ren-Min Ma","doi":"10.1038/s44287-024-00101-1","DOIUrl":"10.1038/s44287-024-00101-1","url":null,"abstract":"Nanolaser research focuses on miniaturizing lasers to enhance performance and broaden their range of applications. Here, we present opportunities and challenges of a new class of singular nanolasers capable of achieving atomic-scale field localization, highlighting their potential applications.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"632-633"},"PeriodicalIF":0.0,"publicationDate":"2024-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142267758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-17DOI: 10.1038/s44287-024-00104-y
Silvia Conti
An article in Nature Electronics presents an integrated fingertip-microgrid system for autonomous energy management and real-time health-status evaluations.
自然-电子学》上的一篇文章介绍了一种用于自主能源管理和实时健康状况评估的指尖微电网集成系统。
{"title":"A self-powered integrated fingertip-microgrid sensing system","authors":"Silvia Conti","doi":"10.1038/s44287-024-00104-y","DOIUrl":"10.1038/s44287-024-00104-y","url":null,"abstract":"An article in Nature Electronics presents an integrated fingertip-microgrid system for autonomous energy management and real-time health-status evaluations.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"637-637"},"PeriodicalIF":0.0,"publicationDate":"2024-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142267760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-16DOI: 10.1038/s44287-024-00096-9
Giorgio Dell’Erba
In the endeavour to bring printed electronics to market, the greatest probability of failure occurs during the scale-up stages. Technical challenges notwithstanding, it is non-technical aspects that often prevent its commercial success.
{"title":"The scale-up of printed electronics is more than just technical challenges","authors":"Giorgio Dell’Erba","doi":"10.1038/s44287-024-00096-9","DOIUrl":"10.1038/s44287-024-00096-9","url":null,"abstract":"In the endeavour to bring printed electronics to market, the greatest probability of failure occurs during the scale-up stages. Technical challenges notwithstanding, it is non-technical aspects that often prevent its commercial success.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"634-636"},"PeriodicalIF":0.0,"publicationDate":"2024-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s44287-024-00096-9.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142267761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-13DOI: 10.1038/s44287-024-00088-9
Eva Lagunas, Symeon Chatzinotas, Björn Ottersten
The satellite communications sector is experiencing a revolution pushed by the unprecedented deployment of satellites in low-Earth orbit (LEO) constellations for connectivity solutions. Innovative technologies have led to cost-effective manufacturing. Lower launch costs have encouraged private ventures to deploy broadband LEO networks targeting market opportunities such as internet services for remote or under-served areas, mobile connectivity, governmental services and communication services for emergency response and disaster relief. Ubiquitous coverage and resilience are key characteristics of space-based communications. However, LEO satellite operators face several technical challenges, which need to be addressed to unleash the full potential of this promising technology. Here, we describe the developments in the field of LEO broadband constellations and discuss the challenges to establish a LEO-based extension to current 5G and coming 6G cellular networks. We also present the advancements that are, from the beginning of the 2020s, empowering LEO constellations to become a fundamental complement to, and be integrated with, terrestrial-based communication networks. Finally, we introduce the activities related to standardization, experimental validations and demonstrations and present our own vision on the potential of the technology to transform the space-based connectivity. Low-Earth orbit constellations and their potential to connect the unconnected are at the forefront of the new space era. This work provides an overview of the low-Earth orbit broadband communications and their integration with 5G and 6G cellular networks.
{"title":"Low-Earth orbit satellite constellations for global communication network connectivity","authors":"Eva Lagunas, Symeon Chatzinotas, Björn Ottersten","doi":"10.1038/s44287-024-00088-9","DOIUrl":"10.1038/s44287-024-00088-9","url":null,"abstract":"The satellite communications sector is experiencing a revolution pushed by the unprecedented deployment of satellites in low-Earth orbit (LEO) constellations for connectivity solutions. Innovative technologies have led to cost-effective manufacturing. Lower launch costs have encouraged private ventures to deploy broadband LEO networks targeting market opportunities such as internet services for remote or under-served areas, mobile connectivity, governmental services and communication services for emergency response and disaster relief. Ubiquitous coverage and resilience are key characteristics of space-based communications. However, LEO satellite operators face several technical challenges, which need to be addressed to unleash the full potential of this promising technology. Here, we describe the developments in the field of LEO broadband constellations and discuss the challenges to establish a LEO-based extension to current 5G and coming 6G cellular networks. We also present the advancements that are, from the beginning of the 2020s, empowering LEO constellations to become a fundamental complement to, and be integrated with, terrestrial-based communication networks. Finally, we introduce the activities related to standardization, experimental validations and demonstrations and present our own vision on the potential of the technology to transform the space-based connectivity. Low-Earth orbit constellations and their potential to connect the unconnected are at the forefront of the new space era. This work provides an overview of the low-Earth orbit broadband communications and their integration with 5G and 6G cellular networks.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"656-665"},"PeriodicalIF":0.0,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142215484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-13DOI: 10.1038/s44287-024-00098-7
Leon Chua’s lifelong contributions to computer science and electrical engineering exemplify the power of interdisciplinary research, where insights from one field can lead to breakthroughs in another.
Leon Chua 对计算机科学和电气工程的毕生贡献体现了跨学科研究的力量，一个领域的见解可以带来另一个领域的突破。
{"title":"From memristor to the edge of chaos","authors":"","doi":"10.1038/s44287-024-00098-7","DOIUrl":"10.1038/s44287-024-00098-7","url":null,"abstract":"Leon Chua’s lifelong contributions to computer science and electrical engineering exemplify the power of interdisciplinary research, where insights from one field can lead to breakthroughs in another.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 9","pages":"559-560"},"PeriodicalIF":0.0,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s44287-024-00098-7.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142174389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-12DOI: 10.1038/s44287-024-00093-y
Peng Wu, Jianfeng Jiang, Lian-Mao Peng
2D materials hold great promise for logic scaling beyond the limit of silicon MOSFET. However, in the absence of widely accepted guidelines for the performance comparison of the two technologies, it is essential to set proper standards to benchmark 2D transistors against silicon transistors.
{"title":"Setting a standard for benchmarking 2D transistors with silicon","authors":"Peng Wu, Jianfeng Jiang, Lian-Mao Peng","doi":"10.1038/s44287-024-00093-y","DOIUrl":"10.1038/s44287-024-00093-y","url":null,"abstract":"2D materials hold great promise for logic scaling beyond the limit of silicon MOSFET. However, in the absence of widely accepted guidelines for the performance comparison of the two technologies, it is essential to set proper standards to benchmark 2D transistors against silicon transistors.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"629-631"},"PeriodicalIF":0.0,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142215519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-12DOI: 10.1038/s44287-024-00091-0
Minseong Park, Takuji Maekawa, Kyungwook Hwang, Jim Cable, Watanabe Noriyuki, Kisik Choi, Young-Kyun Noh, Youngtek Oh, Yongmin Baek, Kyusang Lee
The emergence of artificial intelligence, big data processing, electrical vehicle technologies and so on necessitates a new approach to address the scaling, power efficiency and performance challenges of silicon (Si)-based technology beyond Moore’s law. As a complementary technology, wide bandgap semiconductors, including GaN and SiC, have attracted great attention owing to their unique features of high carrier mobility and high breakdown voltages. However, there are still limitations for widespread applications of wide bandgap semiconductors including scalability, high production cost and thermal management. To overcome these barriers, remote epitaxy and 2D layer transfer technology have been introduced and are in the process of being industrialized to produce single-crystalline semiconductor-based freestanding membranes. In this Perspective, we present the status and challenges for manufacturing GaN and SiC membranes based on remote epitaxy technology that offers significant advantages via wafer reuse and high-quality freestanding epilayer production. We also discuss how industrialization of advanced membrane technology can benefit numerous applications, including heterogeneously integrated circuits, power and radiofrequency systems. This Perspective discusses the status and challenges of remote epitaxy technology towards industrialization of wide bandgap semiconductors for the future electronics.
{"title":"Remote epitaxy and freestanding wide bandgap semiconductor membrane technology","authors":"Minseong Park, Takuji Maekawa, Kyungwook Hwang, Jim Cable, Watanabe Noriyuki, Kisik Choi, Young-Kyun Noh, Youngtek Oh, Yongmin Baek, Kyusang Lee","doi":"10.1038/s44287-024-00091-0","DOIUrl":"10.1038/s44287-024-00091-0","url":null,"abstract":"The emergence of artificial intelligence, big data processing, electrical vehicle technologies and so on necessitates a new approach to address the scaling, power efficiency and performance challenges of silicon (Si)-based technology beyond Moore’s law. As a complementary technology, wide bandgap semiconductors, including GaN and SiC, have attracted great attention owing to their unique features of high carrier mobility and high breakdown voltages. However, there are still limitations for widespread applications of wide bandgap semiconductors including scalability, high production cost and thermal management. To overcome these barriers, remote epitaxy and 2D layer transfer technology have been introduced and are in the process of being industrialized to produce single-crystalline semiconductor-based freestanding membranes. In this Perspective, we present the status and challenges for manufacturing GaN and SiC membranes based on remote epitaxy technology that offers significant advantages via wafer reuse and high-quality freestanding epilayer production. We also discuss how industrialization of advanced membrane technology can benefit numerous applications, including heterogeneously integrated circuits, power and radiofrequency systems. This Perspective discusses the status and challenges of remote epitaxy technology towards industrialization of wide bandgap semiconductors for the future electronics.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 10","pages":"680-689"},"PeriodicalIF":0.0,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142215486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-05DOI: 10.1038/s44287-024-00100-2
Leon O. Chua
{"title":"Publisher Correction: Memristors on ‘edge of chaos’","authors":"Leon O. Chua","doi":"10.1038/s44287-024-00100-2","DOIUrl":"10.1038/s44287-024-00100-2","url":null,"abstract":"","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"1 9","pages":"628-628"},"PeriodicalIF":0.0,"publicationDate":"2024-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s44287-024-00100-2.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142174409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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