Pub Date : 2023-07-04DOI: 10.1088/2058-8585/ace3d8
Georg Gramlich, Robert Huber, Florian Häslich, Akanksha Bhutani, Uli Lemmer, Thomas Zwick
In recent years, Aerosol-Jet (AJ) printing has become an increasingly popular technology applied in research ranging from the biomedical field to military applications to printed semiconductors. Extensive efforts have been made to understand the influence of process parameters and the underlying physical principles. Nevertheless, little attention has been paid to the optimization of ultra-small and highly precise printed features. Pushing the printer to its limits and manufacturing structures as small as tens of microns with a micrometer accuracy poses significant challenges, because effects that can be ignored for printing large features play a crucial role. This study demonstrates how the printing speed quickly causes intolerable distortions. In contrast to large-feature printing, the printing speed cannot be used as a free parameter to set the print thickness. We will discuss the non-constant printing behavior induced by the divert/boost shutter and present shutter on the fly as a solution to many problems, but only if the subroutine code is optimized. The modifications made to the code are disclosed in this paper for the first time. Knowing that printing precise features often results in a high print thickness, we will briefly discuss the issue of cracks caused by the drying of thick nanoparticle films. Altogether, this paper presents a range of important considerations for AJ printing ultra-fine features and an interesting insight into the particularities of operating the printer at its limits.
{"title":"Process considerations for Aerosol-Jet printing of ultra fine features","authors":"Georg Gramlich, Robert Huber, Florian Häslich, Akanksha Bhutani, Uli Lemmer, Thomas Zwick","doi":"10.1088/2058-8585/ace3d8","DOIUrl":"https://doi.org/10.1088/2058-8585/ace3d8","url":null,"abstract":"In recent years, Aerosol-Jet (AJ) printing has become an increasingly popular technology applied in research ranging from the biomedical field to military applications to printed semiconductors. Extensive efforts have been made to understand the influence of process parameters and the underlying physical principles. Nevertheless, little attention has been paid to the optimization of ultra-small and highly precise printed features. Pushing the printer to its limits and manufacturing structures as small as tens of microns with a micrometer accuracy poses significant challenges, because effects that can be ignored for printing large features play a crucial role. This study demonstrates how the printing speed quickly causes intolerable distortions. In contrast to large-feature printing, the printing speed cannot be used as a free parameter to set the print thickness. We will discuss the non-constant printing behavior induced by the divert/boost shutter and present shutter on the fly as a solution to many problems, but only if the subroutine code is optimized. The modifications made to the code are disclosed in this paper for the first time. Knowing that printing precise features often results in a high print thickness, we will briefly discuss the issue of cracks caused by the drying of thick nanoparticle films. Altogether, this paper presents a range of important considerations for AJ printing ultra-fine features and an interesting insight into the particularities of operating the printer at its limits.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49139940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-08DOI: 10.1088/2058-8585/acdca1
Mika-Matti Laurila
Continuous biosignal monitoring with on-skin worn sensor devices enables out-of-hospital patient monitoring (i.e. ubiquitous healthcare), which has high potential to reduce various disease-related societal costs through large-scale screening of disease risk groups. However, novel fabrication methods need to be adopted to enable the required large-scale deployment of such devices. Additive fabrication technologies have emerged as potential candidates to meet this challenge due to their low material consumption, scalability, and compatibility with skin-conformable low Tg polymeric substrates. This review article discusses recent advances in additively fabricated on-skin biosignal sensors and focuses on the following topics: (1) available additive fabrication technologies; (2) on-skin measurable mechanical and thermal biosignals and related additively fabricated biosignal sensors; and (3) the emerging field of printed electronic tattoo (e-tattoo)-type mechanical and thermal biosignal sensors.
{"title":"Additively fabricated on-skin sensors for mechanical and thermal biosignal monitoring","authors":"Mika-Matti Laurila","doi":"10.1088/2058-8585/acdca1","DOIUrl":"https://doi.org/10.1088/2058-8585/acdca1","url":null,"abstract":"Continuous biosignal monitoring with on-skin worn sensor devices enables out-of-hospital patient monitoring (i.e. ubiquitous healthcare), which has high potential to reduce various disease-related societal costs through large-scale screening of disease risk groups. However, novel fabrication methods need to be adopted to enable the required large-scale deployment of such devices. Additive fabrication technologies have emerged as potential candidates to meet this challenge due to their low material consumption, scalability, and compatibility with skin-conformable low Tg polymeric substrates. This review article discusses recent advances in additively fabricated on-skin biosignal sensors and focuses on the following topics: (1) available additive fabrication technologies; (2) on-skin measurable mechanical and thermal biosignals and related additively fabricated biosignal sensors; and (3) the emerging field of printed electronic tattoo (e-tattoo)-type mechanical and thermal biosignal sensors.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43149661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-02DOI: 10.1088/2058-8585/acdae2
John A Carr, F. Thompson, Austin Bumbalough
Print-assisted photovoltaic panel assembly (PAPPA), a novel printed electronic process presented herein, uses additive manufacturing to print flexible paneling components around commercial off-the-shelf thin-film solar cells. This builds a fully functional, flexible solar panel, suitable for space environments, via an automated process. Currently, thin-film space solar panels are manufactured via the compilation of piece parts by hand. In contrast PAPPA automates the labor-intensive paneling process. The advantages are twofold: (i) near-term: solar panel cost reduction alongside the enablement of very large-scale production and (ii) long-term: builds towards a capability for in-space solar panel manufacturing. Herein, details of the process, proof-of-concept functional testing, and implications for further development and application are presented.
{"title":"Initial steps towards a robotic solution for the manufacturing and assembly of thin-film space solar arrays","authors":"John A Carr, F. Thompson, Austin Bumbalough","doi":"10.1088/2058-8585/acdae2","DOIUrl":"https://doi.org/10.1088/2058-8585/acdae2","url":null,"abstract":"Print-assisted photovoltaic panel assembly (PAPPA), a novel printed electronic process presented herein, uses additive manufacturing to print flexible paneling components around commercial off-the-shelf thin-film solar cells. This builds a fully functional, flexible solar panel, suitable for space environments, via an automated process. Currently, thin-film space solar panels are manufactured via the compilation of piece parts by hand. In contrast PAPPA automates the labor-intensive paneling process. The advantages are twofold: (i) near-term: solar panel cost reduction alongside the enablement of very large-scale production and (ii) long-term: builds towards a capability for in-space solar panel manufacturing. Herein, details of the process, proof-of-concept functional testing, and implications for further development and application are presented.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49267982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Non-nucleic acid targets, consisting primarily of metal ions, organic small molecules and proteins. They act as important biomolecules or cell surface markers, supplying integrated and comprehensive bio-diagnostic information for the early diagnosis and treatment of diseases. Meanwhile, the analysis of non-nucleic acid targets also offers the foundation for individualized medicine and precision therapy. Therefore, a versatile platform for non-nucleic acid targets requires development. Clustered regularly interspaced short palindromic repeats-associated protein (CRISPR/Cas) systems is driving a revolution in medical diagnostics due to high base-resolution and isothermal signal amplification. Nevertheless, the majority of CRISPR/Cas settings reported currently are targeted for nucleic acids, leaving restricted usage to non-nucleic acid targets. This is owing to the lack of suitable signal recognition transduction elements for connecting CRISPR to non-nucleic acid targets. Functional nucleic acids (FNAs), comprising aptamers and nucleic acid enzymes, are of great concern to the biological and medical professions because of their specific target recognition and catalytic properties. As appropriate, functional recognition elements, FNAs can be integrated into CRISPR/Cas systems to exploit the powerful capabilities of both. This review emphasizes the technical tricks of integrating CRISPR/Cas systems and FNAs for non-nucleic acid targeting diagnostic applications. We first offer a general overview and the current state of research in diagnostics for CRISPR/Cas and FNAs, respectively, highlighting strengths and shortcomings. A categorical summary of non-nucleic acid-targeted diagnostics is provided, with a key emphasis on fundamental insights into the versatile non-nucleic acid-targeted diagnostic toolbox. We then review emerging diagnostic strategies based on CRISPR/Cas systems and FNAs that are fast, accurate and efficient in detecting non-nucleic acid targets. Finally, we identify the challenges that remain in this emerging field and look to the future of the field, expanding to the integration of nanomaterials, development of wearable devices and point-of-care testing.
{"title":"Integration of CRISPR/Cas with functional nucleic acids as versatile toolbox for non-nucleic acid target diagnostics: a review","authors":"Wenxian Zhang, Zhenzhen Chen, Yangguang Shi, Jiaqi Wang, Jingjing Zhang","doi":"10.1088/2058-8585/ace0cb","DOIUrl":"https://doi.org/10.1088/2058-8585/ace0cb","url":null,"abstract":"Non-nucleic acid targets, consisting primarily of metal ions, organic small molecules and proteins. They act as important biomolecules or cell surface markers, supplying integrated and comprehensive bio-diagnostic information for the early diagnosis and treatment of diseases. Meanwhile, the analysis of non-nucleic acid targets also offers the foundation for individualized medicine and precision therapy. Therefore, a versatile platform for non-nucleic acid targets requires development. Clustered regularly interspaced short palindromic repeats-associated protein (CRISPR/Cas) systems is driving a revolution in medical diagnostics due to high base-resolution and isothermal signal amplification. Nevertheless, the majority of CRISPR/Cas settings reported currently are targeted for nucleic acids, leaving restricted usage to non-nucleic acid targets. This is owing to the lack of suitable signal recognition transduction elements for connecting CRISPR to non-nucleic acid targets. Functional nucleic acids (FNAs), comprising aptamers and nucleic acid enzymes, are of great concern to the biological and medical professions because of their specific target recognition and catalytic properties. As appropriate, functional recognition elements, FNAs can be integrated into CRISPR/Cas systems to exploit the powerful capabilities of both. This review emphasizes the technical tricks of integrating CRISPR/Cas systems and FNAs for non-nucleic acid targeting diagnostic applications. We first offer a general overview and the current state of research in diagnostics for CRISPR/Cas and FNAs, respectively, highlighting strengths and shortcomings. A categorical summary of non-nucleic acid-targeted diagnostics is provided, with a key emphasis on fundamental insights into the versatile non-nucleic acid-targeted diagnostic toolbox. We then review emerging diagnostic strategies based on CRISPR/Cas systems and FNAs that are fast, accurate and efficient in detecting non-nucleic acid targets. Finally, we identify the challenges that remain in this emerging field and look to the future of the field, expanding to the integration of nanomaterials, development of wearable devices and point-of-care testing.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45738300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-01DOI: 10.1088/2058-8585/acdfe0
Nathalia Hammes, Catarina Ribeiro, Catarina Machado, João Ferreira, Ricardo Campos, Djibril Faye, Ana Cortez, Sandra Melo, Fernando Duarte, António Pontes, Júlio C. Viana, Paulo Pedrosa, Natália Homem
Flexible printed electronics (PE) has attracted strong interest during the last two decades and is one of the successful trends in material science, representing the future of PEs. This research work evaluates the use of screen-printing technology and materials for producing functional circuits for automotive interior parts, which can be subsequently processed through in-mold electronics (IME). Since the selection of the materials to build the printed system is of utmost importance, this study evaluates combinations of commercial polycarbonate substrates (LEXAN 8A13E, DE 1-4 060007 and LM 905 2-4 160009) and silver-based inks (ME603, ME604 and CP 6680), all suitable for IME. Different electrically conductive tracks varying in width and spacing (0.5, 0.3 and 0.2 mm) and two capacitive sensors were printed. Tensile tests and surface energy characterizations of the different polycarbonate substrates were carried out, then morphological, electrical, and thermoforming studies were performed on the printed substrates. Morphological characterization showed successful printing for wider lines (0.5 and 0.3 mm), but problems with screen clogging occurred for smaller line widths (0.2 mm). The electrical conductivity of printed tracks was in accordance to the printed layer thickness and ink solids percentage. The proof-of-concept of the electrical functionality was successful, when integrating the sensors into the PCB with SMD LEDs. Thermoforming showed limited functionality, with the best overall performance observed for specific combinations of substrate and ink. In essence, the results indicate that although all the selected substrates and silver-based inks have great compatibility among themselves and can be considered as materials for the production of functional automotive interior parts, there is no ideal pairing of inks and substrates. Therefore, this study emphasizes the importance of defining product specifications for a more suitable material selection.
{"title":"Materials screening and characterization for functional printed automotive interiors parts","authors":"Nathalia Hammes, Catarina Ribeiro, Catarina Machado, João Ferreira, Ricardo Campos, Djibril Faye, Ana Cortez, Sandra Melo, Fernando Duarte, António Pontes, Júlio C. Viana, Paulo Pedrosa, Natália Homem","doi":"10.1088/2058-8585/acdfe0","DOIUrl":"https://doi.org/10.1088/2058-8585/acdfe0","url":null,"abstract":"Flexible printed electronics (PE) has attracted strong interest during the last two decades and is one of the successful trends in material science, representing the future of PEs. This research work evaluates the use of screen-printing technology and materials for producing functional circuits for automotive interior parts, which can be subsequently processed through in-mold electronics (IME). Since the selection of the materials to build the printed system is of utmost importance, this study evaluates combinations of commercial polycarbonate substrates (LEXAN 8A13E, DE 1-4 060007 and LM 905 2-4 160009) and silver-based inks (ME603, ME604 and CP 6680), all suitable for IME. Different electrically conductive tracks varying in width and spacing (0.5, 0.3 and 0.2 mm) and two capacitive sensors were printed. Tensile tests and surface energy characterizations of the different polycarbonate substrates were carried out, then morphological, electrical, and thermoforming studies were performed on the printed substrates. Morphological characterization showed successful printing for wider lines (0.5 and 0.3 mm), but problems with screen clogging occurred for smaller line widths (0.2 mm). The electrical conductivity of printed tracks was in accordance to the printed layer thickness and ink solids percentage. The proof-of-concept of the electrical functionality was successful, when integrating the sensors into the PCB with SMD LEDs. Thermoforming showed limited functionality, with the best overall performance observed for specific combinations of substrate and ink. In essence, the results indicate that although all the selected substrates and silver-based inks have great compatibility among themselves and can be considered as materials for the production of functional automotive interior parts, there is no ideal pairing of inks and substrates. Therefore, this study emphasizes the importance of defining product specifications for a more suitable material selection.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47371156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-31DOI: 10.1088/2058-8585/acda46
T. Salo, Lukas Werft, Basel Adams, Donato Di Vito, A. Halme, Vitalij Scenev, H. Walter, T. Löher, J. Vanhala
Stretchable electronics can be realized using different manufacturing methods and hybrids thereof. An example of the latter is the combination of stretchable circuit boards with screen-printing, which will be discussed in this work. The hybrid stretchable electronics structures are based on photolithographically structured and rigid copper islands and screen-printed silver ink interconnections. This enables the assembly of components with a high number of contacts onto the copper islands and deformable silver ink lines between islands. The transition area between islands and lines is critical due to local stress concentration. The effect and potential mitigations were studied by measuring the electrical resistance of test interconnections under mechanical loading. The first set of samples was elongated up to 30% in tensile tests. The second set of samples was elongated 10%, 20%, and 30% in cyclic tests up to 10 000 cycles. After the tests, extensive failure analysis, e.g. scanning electron microscope, and finite element analysis were conducted. In tensile tests at maximum load, the interconnections either snap apart or their resistance increases by 640% in the transition area. Adding protective structures around the transition area, the resistance increase can be reduced to 12%. Stress concentration in the transition area can be controlled with the layout of the structures, as shown in the cyclic tests. Depending on a layout, the structures protect interconnections in the transition area (resistance <4 Ω at 10% and 20% throughout 10 000 cycles, and up to 5000 cycles at 30% elongation), or with particular designs, cause fatal damage of the circuitry and fail early. The identified failure mechanism is typically fatigue damage caused by the repeated bending of the protective structure. The observed resistance increase at the interface was closely related to the crack propagation phase in the protective structures.
{"title":"Mechanical properties of structured copper and printed silver hybrid stretchable electronic systems","authors":"T. Salo, Lukas Werft, Basel Adams, Donato Di Vito, A. Halme, Vitalij Scenev, H. Walter, T. Löher, J. Vanhala","doi":"10.1088/2058-8585/acda46","DOIUrl":"https://doi.org/10.1088/2058-8585/acda46","url":null,"abstract":"Stretchable electronics can be realized using different manufacturing methods and hybrids thereof. An example of the latter is the combination of stretchable circuit boards with screen-printing, which will be discussed in this work. The hybrid stretchable electronics structures are based on photolithographically structured and rigid copper islands and screen-printed silver ink interconnections. This enables the assembly of components with a high number of contacts onto the copper islands and deformable silver ink lines between islands. The transition area between islands and lines is critical due to local stress concentration. The effect and potential mitigations were studied by measuring the electrical resistance of test interconnections under mechanical loading. The first set of samples was elongated up to 30% in tensile tests. The second set of samples was elongated 10%, 20%, and 30% in cyclic tests up to 10 000 cycles. After the tests, extensive failure analysis, e.g. scanning electron microscope, and finite element analysis were conducted. In tensile tests at maximum load, the interconnections either snap apart or their resistance increases by 640% in the transition area. Adding protective structures around the transition area, the resistance increase can be reduced to 12%. Stress concentration in the transition area can be controlled with the layout of the structures, as shown in the cyclic tests. Depending on a layout, the structures protect interconnections in the transition area (resistance <4 Ω at 10% and 20% throughout 10 000 cycles, and up to 5000 cycles at 30% elongation), or with particular designs, cause fatal damage of the circuitry and fail early. The identified failure mechanism is typically fatigue damage caused by the repeated bending of the protective structure. The observed resistance increase at the interface was closely related to the crack propagation phase in the protective structures.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45947327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-31DOI: 10.1088/2058-8585/acda47
Mina Abbasipour, P. Kateb, F. Cicoira, D. Pasini
Kirigami metamaterials can be exploited in stretchable electronics owing to their architecture, which can be leveraged to amplify stretchability, bendability and deformability. Herein, we report a stretchable kirigami-structured poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS)/polydimethylsiloxane (PDMS) polymer composite. The electromechanical response and mechanical behavior of kirigami PEDOT:PSS-coated PDMS and polymer composite specimens were investigated and compared with their non-kirigami counterparts. The kirigami structure exhibited improved electromechanical properties owing to its characteristic architecture. This study illustrates the application of a kirigami polymer composite as a strain sensor for human motion detection.
{"title":"Stretchable kirigami-inspired conductive polymers for strain sensors applications","authors":"Mina Abbasipour, P. Kateb, F. Cicoira, D. Pasini","doi":"10.1088/2058-8585/acda47","DOIUrl":"https://doi.org/10.1088/2058-8585/acda47","url":null,"abstract":"Kirigami metamaterials can be exploited in stretchable electronics owing to their architecture, which can be leveraged to amplify stretchability, bendability and deformability. Herein, we report a stretchable kirigami-structured poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS)/polydimethylsiloxane (PDMS) polymer composite. The electromechanical response and mechanical behavior of kirigami PEDOT:PSS-coated PDMS and polymer composite specimens were investigated and compared with their non-kirigami counterparts. The kirigami structure exhibited improved electromechanical properties owing to its characteristic architecture. This study illustrates the application of a kirigami polymer composite as a strain sensor for human motion detection.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47283524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-31DOI: 10.1088/2058-8585/acda48
Daniel A. Skaf, Tiago Carneiro Gomes, Robabeh Majidzadeh, R. N. Hussein, T. Carmichael, S. Rondeau‐Gagné
Recent advances in the design and preparation of electroactive materials, particularly semiconducting and conductive polymers, have resulted in the creation of novel organic electronics with advanced functionality and performance competitive with that of devices made of silicon. With an increasing number of organic and printed electronics being engineered and produced at a larger scale, the environmental cost of the final organic electronic devices (life cycle, environmental impact, etc) needs to be considered. While e-waste is already a growing global problem, improving the sustainability of emerging electronics through a careful materials selection is highly desirable. In this work, we explore the use of shellac as a sustainable greener dielectric material in organic field-effect transistors. A careful examination of shellac in combination with diketopyrrolopyrrole-based semiconducting polymers was performed on rigid substrates through atomic force microscopy (AFM) and the fabrication of thin film transistors. All devices made from this green dielectric showed good performance and device characteristics. Building from this investigation, shellac was further integrated with paper substrates to fabricate paper-based thin film transistors. Thin film samples based on shellac on both silicon wafer and paper substrates were characterized by AFM to investigate solid-state morphology of shellac and selected semiconducting materials. Through careful optimization of the device architecture and processing time, device characteristics and performances on paper substrates (average charge mobilities and on/off current ratios) were comparable to those of devices prepared on silicon wafers, confirming that shellac, in combination with organic semiconducting polymers, can be an advantageous dielectric material to be used for the fabrication of greener and sustainable thin film electronics from renewable feedstocks and components.
{"title":"Shellac as dielectric materials in organic field-effect transistors: from silicon to paper substrates","authors":"Daniel A. Skaf, Tiago Carneiro Gomes, Robabeh Majidzadeh, R. N. Hussein, T. Carmichael, S. Rondeau‐Gagné","doi":"10.1088/2058-8585/acda48","DOIUrl":"https://doi.org/10.1088/2058-8585/acda48","url":null,"abstract":"Recent advances in the design and preparation of electroactive materials, particularly semiconducting and conductive polymers, have resulted in the creation of novel organic electronics with advanced functionality and performance competitive with that of devices made of silicon. With an increasing number of organic and printed electronics being engineered and produced at a larger scale, the environmental cost of the final organic electronic devices (life cycle, environmental impact, etc) needs to be considered. While e-waste is already a growing global problem, improving the sustainability of emerging electronics through a careful materials selection is highly desirable. In this work, we explore the use of shellac as a sustainable greener dielectric material in organic field-effect transistors. A careful examination of shellac in combination with diketopyrrolopyrrole-based semiconducting polymers was performed on rigid substrates through atomic force microscopy (AFM) and the fabrication of thin film transistors. All devices made from this green dielectric showed good performance and device characteristics. Building from this investigation, shellac was further integrated with paper substrates to fabricate paper-based thin film transistors. Thin film samples based on shellac on both silicon wafer and paper substrates were characterized by AFM to investigate solid-state morphology of shellac and selected semiconducting materials. Through careful optimization of the device architecture and processing time, device characteristics and performances on paper substrates (average charge mobilities and on/off current ratios) were comparable to those of devices prepared on silicon wafers, confirming that shellac, in combination with organic semiconducting polymers, can be an advantageous dielectric material to be used for the fabrication of greener and sustainable thin film electronics from renewable feedstocks and components.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46781194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-25DOI: 10.1088/2058-8585/acd8cd
Hai-qiang Zhao, Michael Hefenbrock, M. Beigl, M. Tahoori
The rapid development of emerging domains, such as the Internet of Things and wearable technologies, necessitates the development of flexible, stretchable, and non-toxic devices that can be manufactured at an ultra-low cost. Printed electronics has emerged as a viable solution by offering not only the aforementioned features but also a high degree of customization, which enables the personalization of products and facilitates the low-cost product development process even in small batches. In the context of printed electronics, printed neuromorphic circuits offer highly customized and bespoke realization of artificial neural networks to achieve desired functionality with very small number of hardware components. However, since analog components are utilized, the performance of printed neuromorphic circuits can be influenced by various factors. In this work, we focus on three main factors that perturb the circuit output from the designed values, namely, variations due to printing errors, aging effects of printed resistors, and input variations originating from sensing uncertainty. In the described approach, these variations are taken into account during the design (training) to ensure the dependability of the printed neuromorphic circuits. With this approach, the expected accuracy and the robustness of printed neural networks can be increased by 27% and 74%, respectively. Moreover, the ablation study suggests that, aging effect and printing variation may have similar effects on the functionality of printed neural networks. In contrast, the impact of sensing uncertainty on printed neural networks is almost orthogonal to aging and printing variations.
{"title":"Highly-dependable printed neuromorphic circuits based on additive manufacturing","authors":"Hai-qiang Zhao, Michael Hefenbrock, M. Beigl, M. Tahoori","doi":"10.1088/2058-8585/acd8cd","DOIUrl":"https://doi.org/10.1088/2058-8585/acd8cd","url":null,"abstract":"The rapid development of emerging domains, such as the Internet of Things and wearable technologies, necessitates the development of flexible, stretchable, and non-toxic devices that can be manufactured at an ultra-low cost. Printed electronics has emerged as a viable solution by offering not only the aforementioned features but also a high degree of customization, which enables the personalization of products and facilitates the low-cost product development process even in small batches. In the context of printed electronics, printed neuromorphic circuits offer highly customized and bespoke realization of artificial neural networks to achieve desired functionality with very small number of hardware components. However, since analog components are utilized, the performance of printed neuromorphic circuits can be influenced by various factors. In this work, we focus on three main factors that perturb the circuit output from the designed values, namely, variations due to printing errors, aging effects of printed resistors, and input variations originating from sensing uncertainty. In the described approach, these variations are taken into account during the design (training) to ensure the dependability of the printed neuromorphic circuits. With this approach, the expected accuracy and the robustness of printed neural networks can be increased by 27% and 74%, respectively. Moreover, the ablation study suggests that, aging effect and printing variation may have similar effects on the functionality of printed neural networks. In contrast, the impact of sensing uncertainty on printed neural networks is almost orthogonal to aging and printing variations.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45357092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-25DOI: 10.1088/2058-8585/acd8cc
David Batet, F. Vilaseca, E. Ramón, J. Esquivel, G. Gabriel
The selection of materials and technologies for green printed electronics design is a fundamental and time-consuming task. This paper represents a rigorous experimental overview in which different printing technologies, ink formulations, and paper-based substrates are examined and analyzed. Three printing techniques are investigated: inkjet printing, screen printing, and direct ink writing. Regarding the inks, formulations based on carbon and silver have been chosen as conductive materials. Initially, the electrical properties of the selected inks have been characterized on a conventional substrate in printed electronics such as polyethylene terephthalate. Later, the printing conditions are optimized for various paper-based substrates, including commercial papers and substrates based on cellulose nanofibers (CNF). CNF are also used as a coating for commercial papers and their influence on the printing quality is evaluated. The substrates are also characterized in terms of morphology, wettability, and thermal stability. This study facilitates the benchmarking tasks for researchers developing new devices and contributes toward the eco-design of flexible green printed electronics.
{"title":"Experimental overview for green printed electronics: inks, substrates, and printing techniques","authors":"David Batet, F. Vilaseca, E. Ramón, J. Esquivel, G. Gabriel","doi":"10.1088/2058-8585/acd8cc","DOIUrl":"https://doi.org/10.1088/2058-8585/acd8cc","url":null,"abstract":"The selection of materials and technologies for green printed electronics design is a fundamental and time-consuming task. This paper represents a rigorous experimental overview in which different printing technologies, ink formulations, and paper-based substrates are examined and analyzed. Three printing techniques are investigated: inkjet printing, screen printing, and direct ink writing. Regarding the inks, formulations based on carbon and silver have been chosen as conductive materials. Initially, the electrical properties of the selected inks have been characterized on a conventional substrate in printed electronics such as polyethylene terephthalate. Later, the printing conditions are optimized for various paper-based substrates, including commercial papers and substrates based on cellulose nanofibers (CNF). CNF are also used as a coating for commercial papers and their influence on the printing quality is evaluated. The substrates are also characterized in terms of morphology, wettability, and thermal stability. This study facilitates the benchmarking tasks for researchers developing new devices and contributes toward the eco-design of flexible green printed electronics.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":3.1,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49350794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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