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IEEE Transactions on Electromagnetic Compatibility最新文献

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Upgrading the ICIM-CI Model to Account for Amplitude-Modulated Interference Signals 考虑调幅干扰信号的ICIM-CI模型升级
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-13 DOI: 10.1109/temc.2025.3615767
Antoine Duguet, David Hardy, Franck Salvador, Geneviève Duchamp, Tristan Dubois
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引用次数: 0
Enhancing the EMI-Resilience of Communication Networks Through Warning Propagation: A Multilayer Approach 通过预警传播增强通信网络emi弹性:一种多层方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-09 DOI: 10.1109/temc.2025.3615289
Mohammad Kameli, Davy Pissoort, Tim Claeys
{"title":"Enhancing the EMI-Resilience of Communication Networks Through Warning Propagation: A Multilayer Approach","authors":"Mohammad Kameli, Davy Pissoort, Tim Claeys","doi":"10.1109/temc.2025.3615289","DOIUrl":"https://doi.org/10.1109/temc.2025.3615289","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"87 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145255603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electromagnetic Warfare Intentional Interference: Victim Risk Assessment 电磁战故意干扰:受害者风险评估
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-07 DOI: 10.1109/temc.2025.3606007
Nigel Davies, Chris Williams, Mark Osborne, Huseyin Dogan, Duncan Ki-Aries, Nan Jiang
{"title":"Electromagnetic Warfare Intentional Interference: Victim Risk Assessment","authors":"Nigel Davies, Chris Williams, Mark Osborne, Huseyin Dogan, Duncan Ki-Aries, Nan Jiang","doi":"10.1109/temc.2025.3606007","DOIUrl":"https://doi.org/10.1109/temc.2025.3606007","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"107 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145241152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comprehensive Black Box EMI Model of Power Electronics Converters in Supraharmonics Frequency Range 电力电子变换器在超谐波频率范围内的综合黑匣子电磁干扰模型
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-07 DOI: 10.1109/temc.2025.3607560
Abduselam Hamid Beshir, Per Thaastrup Jensen, Pooya Davari
{"title":"Comprehensive Black Box EMI Model of Power Electronics Converters in Supraharmonics Frequency Range","authors":"Abduselam Hamid Beshir, Per Thaastrup Jensen, Pooya Davari","doi":"10.1109/temc.2025.3607560","DOIUrl":"https://doi.org/10.1109/temc.2025.3607560","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"12 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145241713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation, Diagnostics, and Prediction for Electromagnetic Susceptibility of 5G Super-Heterodyne RF Receiver Under Intentional Electromagnetic Interference 故意电磁干扰下5G超外差射频接收机电磁敏感性的研究、诊断与预测
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-06 DOI: 10.1109/temc.2025.3608267
Qiuhui Li, Yangbin Jiang, Hailong Wang, Ling Tian, Wei-Dong Li, Zhi Hao Jiang, Wei Hong
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引用次数: 0
Simulation and Experimental Study on Response Characteristics and Damage Patterns of Typical Photovoltaic Systems Illuminated by HEMP 典型光伏系统在HEMP光照下响应特性及损伤模式的仿真与实验研究
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-03 DOI: 10.1109/temc.2025.3608436
Shiji Li, Junna Li, Jiahao Zhu, Yongliang Wang, Tian Yang, Jian Liu, Xiaoyu Zhou, Qin Shang, Qixiang Huang, Fangzheng Wu, Aici Qiu
{"title":"Simulation and Experimental Study on Response Characteristics and Damage Patterns of Typical Photovoltaic Systems Illuminated by HEMP","authors":"Shiji Li, Junna Li, Jiahao Zhu, Yongliang Wang, Tian Yang, Jian Liu, Xiaoyu Zhou, Qin Shang, Qixiang Huang, Fangzheng Wu, Aici Qiu","doi":"10.1109/temc.2025.3608436","DOIUrl":"https://doi.org/10.1109/temc.2025.3608436","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"9 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145215685","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accurate Numerical Integration Method Using Magnetic Flux and Electric Charge for Electromagnetic Transient Simulations 电磁瞬变模拟中磁通量和电荷的精确数值积分方法
IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-02 DOI: 10.1109/TEMC.2025.3611510
Yohei Tanaka;Yoshihiro Baba
In electromagnetic transient (EMT) simulations of electrical and electronic circuits, the compact scheme (CS) is one of the numerical integration methods that can suppress numerical oscillations arising from step-like discontinuous currents or voltages. However, while CS suppresses numerical oscillations effectively, it has difficulty in accurately dealing with switching events in fixed-time step simulations, similar to other conventional methods. To address this problem, this study extends the concept of CS to present a numerical integration method using magnetic flux and electric charge instead of derivative values. The proposed method preserves one-stage and oscillation-free characteristics while allowing for high-accuracy simulation of switching events. The distinctive features of the proposed method are then demonstrated through some simulation cases.
在电气和电子电路的电磁瞬变(EMT)仿真中,紧凑格式(CS)是一种可以抑制阶梯式断续电流或电压引起的数值振荡的数值积分方法。然而,尽管CS有效地抑制了数值振荡,但与其他传统方法一样,它在固定时间步长模拟中难以准确处理切换事件。为了解决这一问题,本研究扩展了CS的概念,提出了一种用磁通量和电荷代替导数值的数值积分方法。该方法保留了单级和无振荡特性,同时允许对开关事件进行高精度模拟。并通过仿真实例验证了该方法的特点。
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引用次数: 0
Generative Adversarial Learning Based Power Noise Induced Eye Diagram Estimation Method for High-Speed Channel Design 基于生成对抗学习的高速信道功率噪声眼图估计方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-10-01 DOI: 10.1109/temc.2025.3610342
Junghyun Lee, Seonguk Choi, Keeyoung Son, Haeyeon Kim, Joonsang Park, Jiwon Yoon, Keunwoo Kim, Hyunjun An, Haeseok Suh, Youngwoo Kim, Joungho Kim
{"title":"Generative Adversarial Learning Based Power Noise Induced Eye Diagram Estimation Method for High-Speed Channel Design","authors":"Junghyun Lee, Seonguk Choi, Keeyoung Son, Haeyeon Kim, Joonsang Park, Jiwon Yoon, Keunwoo Kim, Hyunjun An, Haeseok Suh, Youngwoo Kim, Joungho Kim","doi":"10.1109/temc.2025.3610342","DOIUrl":"https://doi.org/10.1109/temc.2025.3610342","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"23 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145203020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Radiation Source Reconstruction for TSV-Based Chips and Multilayer Circuits via Optimized Neural Networks 基于优化神经网络的tsv芯片和多层电路辐射源重构
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-09-24 DOI: 10.1109/temc.2025.3609008
Hao Cheng, Weimin Wang, Yongle Wu, Keyan Li, Yuanan Liu
{"title":"Radiation Source Reconstruction for TSV-Based Chips and Multilayer Circuits via Optimized Neural Networks","authors":"Hao Cheng, Weimin Wang, Yongle Wu, Keyan Li, Yuanan Liu","doi":"10.1109/temc.2025.3609008","DOIUrl":"https://doi.org/10.1109/temc.2025.3609008","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"83 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145133772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
FDTD Computation of Ground-Level Electric Fields Generated by Compact Intracloud Discharges 紧凑云内放电地面电场的时域有限差分计算
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-09-22 DOI: 10.1109/temc.2025.3606658
Shota Ueda, Yoshihiro Baba, Vladimir A. Rakov
{"title":"FDTD Computation of Ground-Level Electric Fields Generated by Compact Intracloud Discharges","authors":"Shota Ueda, Yoshihiro Baba, Vladimir A. Rakov","doi":"10.1109/temc.2025.3606658","DOIUrl":"https://doi.org/10.1109/temc.2025.3606658","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"25 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145116376","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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IEEE Transactions on Electromagnetic Compatibility
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