Hydrogen sensors utilizing field-effect transistors (FETs) have been extensively researched in the past few decades. Silicon-based H2 gas sensors have shown excellent performances. The next generation sensing and computing technologies demand scaling of semiconductor devices for high-density integration and inclusive performance enhancement. However, the dangling bonds and high surface scattering of silicon have restricted its application in an ultra-scaled domain. Thus, in this article, we propose an electrically doped MoTe2-based H2 gas sensor. We have used an analytical model to capture variation of work function with gas pressure. Next, technology computer-aided design (TCAD) tools are adopted to investigate the device performance. To understand the quantum transport in sub-10 nm MoTe2 channel, non-equilibrium green’s function (NEGF) method is deployed. The study exhibits the high potentiality of electrically doped 2D material like MoTe2-based H2 sensors which may spur future experiments.
利用场效应晶体管(fet)的氢传感器在过去的几十年里得到了广泛的研究。硅基氢气传感器表现出优异的性能。下一代传感和计算技术需要半导体器件的缩放,以实现高密度集成和包容性性能增强。然而,硅的悬空键和高表面散射限制了其在超尺度领域的应用。因此,在本文中,我们提出了一种基于电掺杂mote2的H2气体传感器。我们使用了一个解析模型来捕捉功函数随气体压力的变化。其次,采用计算机辅助设计(TCAD)工具对器件性能进行了研究。为了了解亚10nm MoTe2通道中的量子输运,采用了非平衡格林函数(non-equilibrium green 's function, NEGF)方法。该研究展示了电掺杂二维材料的高潜力,如基于mote2的H2传感器,这可能会刺激未来的实验。
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This study investigates the complete failure evolution mechanism in a pseudo-high-electron-mobility transistor (pHEMT) under L-band high-power microwave (HPM) injection, which is revealed to follow the pattern “field breakdown triggering-electrothermal coupling-thermal runaway,” breaking through the traditional understanding that attributes the damage mechanism simply to either field breakdown or thermal breakdown. By improving the multi-physics field algorithm and combining circuit device co-simulation, a pHEMT damage model under high-voltage conditions was established. The research shows that when the critical power threshold is exceeded, field breakdown first occurs inside the device, and hotspots form under the gate on the source side, which in turn triggers thermal runaway. By analyzing the evolution laws of carrier concentration, electric field, and ionization rate, the dynamic process of failure is clarified. Experimental verification indicates that the damaged low-noise amplifier exhibits irreversible gain reduction and S-parameter degradation. This finding provides a theoretical basis for failure prediction and protection design for high-reliability radio frequency systems.
{"title":"Simulation study on thermal damage of a GaAs pHEMT LNA under L-band high-power microwave injection","authors":"Ruxin Zheng, Chengjie Li, Shikuan Liu, Yixing Gu, Zhicheng Xue, Zhongyuan Zhou, Shiping Tang","doi":"10.1007/s10825-025-02445-9","DOIUrl":"10.1007/s10825-025-02445-9","url":null,"abstract":"<div><p>This study investigates the complete failure evolution mechanism in a pseudo-high-electron-mobility transistor (pHEMT) under L-band high-power microwave (HPM) injection, which is revealed to follow the pattern “field breakdown triggering-electrothermal coupling-thermal runaway,” breaking through the traditional understanding that attributes the damage mechanism simply to either field breakdown or thermal breakdown. By improving the multi-physics field algorithm and combining circuit device co-simulation, a pHEMT damage model under high-voltage conditions was established. The research shows that when the critical power threshold is exceeded, field breakdown first occurs inside the device, and hotspots form under the gate on the source side, which in turn triggers thermal runaway. By analyzing the evolution laws of carrier concentration, electric field, and ionization rate, the dynamic process of failure is clarified. Experimental verification indicates that the damaged low-noise amplifier exhibits irreversible gain reduction and S-parameter degradation. This finding provides a theoretical basis for failure prediction and protection design for high-reliability radio frequency systems.</p></div>","PeriodicalId":620,"journal":{"name":"Journal of Computational Electronics","volume":"25 1","pages":""},"PeriodicalIF":2.5,"publicationDate":"2025-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145456534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-31DOI: 10.1007/s10825-025-02451-x
Sidhartha Dash, Gunti Sneha, Guru Prasad Mishra
A graphene channel Z-shaped tunnel field-effect transistor (GC-ZTFET) sensor is proposed in this research for detecting hydrogen gas. Faster charge transport and more effective drain current modulation are made possible by graphene’s high carrier mobility and superior electrical conductivity. The unique Z-shaped gate structure efficiently enhances the electric field and interband tunneling rate within the channel region. A palladium metal with a suitable work function is considered as the gate catalyst for better gas sensing. The gas sensor modifies the flat band voltage and capacitance–voltage properties through the adsorption of gas atoms at the interface. This alternately affects the drain current, which is used as a sensing metric. The gas sensitivity is estimated in terms of drain current and current ratio. The suggested gas sensor offers greater sensitivity than TFET and Z-TFET. At HP = 10–10 torr, the GC-ZTFET exhibits a higher peak current sensitivity of 2.86 × 103, which is seven times and more than one decade higher than the results in the case of Z-TFET and TFET. It also exhibits exceptional sensitivity to very low gas pressures, making it a promising candidate for advanced gas sensor technologies. The sensitivity analysis is also expanded to explore the effects of variation in temperature and trap charge carriers at the catalyst-gate interface.
{"title":"An extensive sensitivity analysis of graphene channel Z-shaped TFET for hydrogen sensing","authors":"Sidhartha Dash, Gunti Sneha, Guru Prasad Mishra","doi":"10.1007/s10825-025-02451-x","DOIUrl":"10.1007/s10825-025-02451-x","url":null,"abstract":"<div><p>A graphene channel Z-shaped tunnel field-effect transistor (GC-ZTFET) sensor is proposed in this research for detecting hydrogen gas. Faster charge transport and more effective drain current modulation are made possible by graphene’s high carrier mobility and superior electrical conductivity. The unique Z-shaped gate structure efficiently enhances the electric field and interband tunneling rate within the channel region. A palladium metal with a suitable work function is considered as the gate catalyst for better gas sensing. The gas sensor modifies the flat band voltage and capacitance–voltage properties through the adsorption of gas atoms at the interface. This alternately affects the drain current, which is used as a sensing metric. The gas sensitivity is estimated in terms of drain current and current ratio. The suggested gas sensor offers greater sensitivity than TFET and Z-TFET. At HP = 10<sup>–10</sup> torr, the GC-ZTFET exhibits a higher peak current sensitivity of 2.86 × 10<sup>3</sup>, which is seven times and more than one decade higher than the results in the case of Z-TFET and TFET. It also exhibits exceptional sensitivity to very low gas pressures, making it a promising candidate for advanced gas sensor technologies. The sensitivity analysis is also expanded to explore the effects of variation in temperature and trap charge carriers at the catalyst-gate interface.</p></div>","PeriodicalId":620,"journal":{"name":"Journal of Computational Electronics","volume":"25 1","pages":""},"PeriodicalIF":2.5,"publicationDate":"2025-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145406362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-31DOI: 10.1007/s10825-025-02450-y
César Tablero-Crespo
Multi-band semiconductors are promising candidates for high-efficiency photovoltaic devices. Various technological methodologies have been explored and put into practice. However, the efficiencies achieved experimentally fall short of expectations. In this study, considering the relative scale of all inter-band absorption coefficients, it has been determined that the anticipated efficiencies are difficult to attain. Furthermore, with all the results and considering the mathematical and boundary properties, a fit as a function of the absorptivities for efficiencies and energies of all examined multi-band solar cell types has been obtained.