Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810189
Gergana Vacheva, Nikolay Hinov, H. Kanchev, B. Gilev
In this paper is presented the modelling of a buck DC/DC converter with neural network controller. The possibilities of this control method for function approximation are demonstrated. The converter model is implemented in the MATLAB/Simulink environment and its operation with neural network and PI controller is studied. Simulation results highlight the advantages of neural network-based control of the DC-DC converter. The presented study of modelling and control of the power electronic converter is intended for educational purposes and student training.
{"title":"Application of Neural Network for Smart Control of a Buck DC/DC Converter","authors":"Gergana Vacheva, Nikolay Hinov, H. Kanchev, B. Gilev","doi":"10.1109/ISSE.2019.8810189","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810189","url":null,"abstract":"In this paper is presented the modelling of a buck DC/DC converter with neural network controller. The possibilities of this control method for function approximation are demonstrated. The converter model is implemented in the MATLAB/Simulink environment and its operation with neural network and PI controller is studied. Simulation results highlight the advantages of neural network-based control of the DC-DC converter. The presented study of modelling and control of the power electronic converter is intended for educational purposes and student training.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"20 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88180173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810178
K. Stojek, J. Felba, D. Lizanets, Milena Kiliszkiewicz, T. Falat, Kamil Gorzka
Research goal was to detect defects and imperfections of sintered silver layer at thermal joints. Such defects may influence the contact area which lower mechanical strength of the joint with the usual consequence of reducing the heat flow between joined elements. Research obtained different types of layer quality analysis: $X-text{ray}$ analysis was done to obtain layer imaging, threshold (image binarization)was used for analysis of achieved images, scanning electron microscope imaging in energy dispersive $X-text{rasy}$ scattering was performed to determine sintered layer surface composition.
{"title":"Defects Investigation in Low-Temperature and Low-Pressure Sintered Silver Thermal Joints for Non-Metalized Semiconductors","authors":"K. Stojek, J. Felba, D. Lizanets, Milena Kiliszkiewicz, T. Falat, Kamil Gorzka","doi":"10.1109/ISSE.2019.8810178","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810178","url":null,"abstract":"Research goal was to detect defects and imperfections of sintered silver layer at thermal joints. Such defects may influence the contact area which lower mechanical strength of the joint with the usual consequence of reducing the heat flow between joined elements. Research obtained different types of layer quality analysis: $X-text{ray}$ analysis was done to obtain layer imaging, threshold (image binarization)was used for analysis of achieved images, scanning electron microscope imaging in energy dispersive $X-text{rasy}$ scattering was performed to determine sintered layer surface composition.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"44 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85294414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810292
Arne Neiser, Melanie Abb, D. Seehase, A. Reinhardt
To improve process stability, safety, performance and traceability for industrial machinery, the number of sensors has doubled in the last 10 years. Nevertheless, the evaluation of new or additional sensors is a constant task to improve the industrial machinery. In this context, there are two challenges: Firstly, the location must be determined, where the sensor should be located, on the other hand, the number of sensors used must be determined. It would be a tremendous improvement in terms of time and cost if a so-called wireless sensor node (WSN)could be used to test and implement these sensors. This paper shows the approach chosen for designing a WSN and the underlying technology. In addition, two experimental findings with this WSN are shown here. One with a temperature sensor and one with a residual oxygen sensor. The WSN will be optimized in a way to use the same sensors as used in an industrial soldering equipment in terms of temperature and sensor output.
{"title":"Wireless Sensor Nodes Optimized for Industrial Soldering Equipment","authors":"Arne Neiser, Melanie Abb, D. Seehase, A. Reinhardt","doi":"10.1109/ISSE.2019.8810292","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810292","url":null,"abstract":"To improve process stability, safety, performance and traceability for industrial machinery, the number of sensors has doubled in the last 10 years. Nevertheless, the evaluation of new or additional sensors is a constant task to improve the industrial machinery. In this context, there are two challenges: Firstly, the location must be determined, where the sensor should be located, on the other hand, the number of sensors used must be determined. It would be a tremendous improvement in terms of time and cost if a so-called wireless sensor node (WSN)could be used to test and implement these sensors. This paper shows the approach chosen for designing a WSN and the underlying technology. In addition, two experimental findings with this WSN are shown here. One with a temperature sensor and one with a residual oxygen sensor. The WSN will be optimized in a way to use the same sensors as used in an industrial soldering equipment in terms of temperature and sensor output.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"26 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76206566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810200
A. Fodor, G. Chindris, R. Jano, D. Pitica
Power dissipation for processors used in portable devices evolved along the evolution of processor capabilities, translated also into a significant amount of heat that must be removed from the cores. The current research aims to correctly model and simulate the processor assembly, as a whole, and to be able to approximate the temperature levels on the processor chip for an accurate thermal design. The simulation scenarios developed for this study include analyzing the temperature levels on the processor in case a high load task runs on one of the cores, for two multicore processing units. The results can be successfully integrated into the very early stages of thermal design for portable devices.
{"title":"Thermal Modelling and Simulation Techniques for Multicore Processors","authors":"A. Fodor, G. Chindris, R. Jano, D. Pitica","doi":"10.1109/ISSE.2019.8810200","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810200","url":null,"abstract":"Power dissipation for processors used in portable devices evolved along the evolution of processor capabilities, translated also into a significant amount of heat that must be removed from the cores. The current research aims to correctly model and simulate the processor assembly, as a whole, and to be able to approximate the temperature levels on the processor chip for an accurate thermal design. The simulation scenarios developed for this study include analyzing the temperature levels on the processor in case a high load task runs on one of the cores, for two multicore processing units. The results can be successfully integrated into the very early stages of thermal design for portable devices.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"24 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77028323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810230
M. Hirman, Tomáš Neuhöfer, F. Steiner
The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties.
{"title":"Bend Testing of SMD Chip Resistors Glued on Flexible Substrates","authors":"M. Hirman, Tomáš Neuhöfer, F. Steiner","doi":"10.1109/ISSE.2019.8810230","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810230","url":null,"abstract":"The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"24 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79586581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810199
K. Dušek, V. Zahradník, P. Veselý, D. Bušek, M. Placek
The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.
{"title":"Released of Latent Heat from Solder Joints to Surrounding During Solidification of Solder Alloy - Experimental Study","authors":"K. Dušek, V. Zahradník, P. Veselý, D. Bušek, M. Placek","doi":"10.1109/ISSE.2019.8810199","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810199","url":null,"abstract":"The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"102 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75842819","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810262
Martin Molhanec
The solder spreadability on the soldering surfaces is one of the critical parameters for reflow soldering which is used for electronic assembly. Solder spreadability gives us knowledge about wetting, surface tensions, and reliability issues like bridging etc. This article deals with full factorial experiments of solders spreadability of four different surface finishes (passivated copper, electroless nickel immersion gold - ENIG, immersion tin - ImSn and hot air solder levelling - HASL), and five types of solder paste with the following solder alloy composition: Sn62Pb36Ag2, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn42Bi58. Additionally, three different reflow soldering techniques (infra radiation, convection air and vapour phase soldering)were used in the experiment. The use of factorial experiments is a novelty in our approach. Results show that all used materials and solder pastes have good spreadability. The best results were achieved for copper surface finish.
{"title":"Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments","authors":"Martin Molhanec","doi":"10.1109/ISSE.2019.8810262","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810262","url":null,"abstract":"The solder spreadability on the soldering surfaces is one of the critical parameters for reflow soldering which is used for electronic assembly. Solder spreadability gives us knowledge about wetting, surface tensions, and reliability issues like bridging etc. This article deals with full factorial experiments of solders spreadability of four different surface finishes (passivated copper, electroless nickel immersion gold - ENIG, immersion tin - ImSn and hot air solder levelling - HASL), and five types of solder paste with the following solder alloy composition: Sn62Pb36Ag2, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn42Bi58. Additionally, three different reflow soldering techniques (infra radiation, convection air and vapour phase soldering)were used in the experiment. The use of factorial experiments is a novelty in our approach. Results show that all used materials and solder pastes have good spreadability. The best results were achieved for copper surface finish.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89624244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810263
R. Jano, A. Fodor
The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.
{"title":"Optimizations for Heat Dissipation Strategies on PC Motherboards","authors":"R. Jano, A. Fodor","doi":"10.1109/ISSE.2019.8810263","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810263","url":null,"abstract":"The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"48 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73532725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810244
Jan Kalčík, R. Soukup
Smart firefighter protective suits can monitor their inner and outer temperature in order to prevent the burning of sensitive human skin. Embroidered large area sensors, which were developed at the University of West Bohemia in cooperation with industrial partners, are ideal for this measurement due to their seamless integration into a suit, their flexibility, breathability, fast response to rapid temperature change, washing resistance and large-surface measurement. These sensors performed well during testing on a thermal test bench with an IR heater and showed better results than conventional platinum sensors in terms of dynamic characteristics of measurement.
{"title":"Large Area Temperature Measurement in Smart Textiles","authors":"Jan Kalčík, R. Soukup","doi":"10.1109/ISSE.2019.8810244","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810244","url":null,"abstract":"Smart firefighter protective suits can monitor their inner and outer temperature in order to prevent the burning of sensitive human skin. Embroidered large area sensors, which were developed at the University of West Bohemia in cooperation with industrial partners, are ideal for this measurement due to their seamless integration into a suit, their flexibility, breathability, fast response to rapid temperature change, washing resistance and large-surface measurement. These sensors performed well during testing on a thermal test bench with an IR heater and showed better results than conventional platinum sensors in terms of dynamic characteristics of measurement.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"40 9 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80213184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810157
Mohamed Amine Alaya, A. Géczy
The paper investigates specific factors, which may affect the heat transfer during the heat-level type Vapour Phase Soldering (VPS) process. Nowadays many electronics manufacturers rely on the VPS as reflow soldering method, a process based on condensation heating. The article describes the effect of the PCB thickness on the heat transfer and the impact of the PCB height level (vertical positioning) in the workspace of the oven (e.g. same thickness with different height, different thickness with same top PCB surface height). Also, the paper highlights the phenomena of the temperature fall at the start of the cooling process according to these factors. For the investigation, measurements were performed in a heat-level process based VPS oven to fixed parameters, to provide precise and consequent results within the confines of the specific control method. The measurement and calculation of the heating factor help to understand the outcome from both the time and the temperature side of the critical parts of the soldering profile.
{"title":"Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering","authors":"Mohamed Amine Alaya, A. Géczy","doi":"10.1109/ISSE.2019.8810157","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810157","url":null,"abstract":"The paper investigates specific factors, which may affect the heat transfer during the heat-level type Vapour Phase Soldering (VPS) process. Nowadays many electronics manufacturers rely on the VPS as reflow soldering method, a process based on condensation heating. The article describes the effect of the PCB thickness on the heat transfer and the impact of the PCB height level (vertical positioning) in the workspace of the oven (e.g. same thickness with different height, different thickness with same top PCB surface height). Also, the paper highlights the phenomena of the temperature fall at the start of the cooling process according to these factors. For the investigation, measurements were performed in a heat-level process based VPS oven to fixed parameters, to provide precise and consequent results within the confines of the specific control method. The measurement and calculation of the heating factor help to understand the outcome from both the time and the temperature side of the critical parts of the soldering profile.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"66 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87612770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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