Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810210
O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek
In this paper, the effect of different viscosity models on the numerical results of stencil printing modelling was addressed. The numerical model was established by defining the geometry of the printing squeegee, the stencil, and the shape of the rolling solder paste. The squeegee had a 53° attack angle, which was determined by prior measurements, and the blade height was 20 mm. The output parameters of the model included the shear rate distribution and velocity field within the rolling solder paste, and the pressure profile on the stencil. The material properties of the solder paste were set by measuring the rheological behaviour of Type3 (particle size: 20–45μm), Type4 (particle size: 20–38 μm), Type5 (particle size: 15–25 μm)solder pastes and by fitting viscosity models onto the measurement results. Two different material models were compared, the Cross and the Carreau-Yasuda models, where the effect of the different models on the numerical results was evaluated The results showed a significant difference in the pressure during stencil printing between the cases using the viscosity of solder pastes in initial state (Cross model)and in steady state (Carreu-Yasuda model). The difference was about 25% in the case of Type-3, Type-4, and Type-5 solder pastes respectively. These differences proved that appropriate material models should be used in the numerical models of the stencil printing, to be able to apply that in early-stage prediction in the concept of Industry 4.0.
{"title":"Investigating the Effect of Viscosity Models on the Stencil Printing by Numerical Modelling","authors":"O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek","doi":"10.1109/ISSE.2019.8810210","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810210","url":null,"abstract":"In this paper, the effect of different viscosity models on the numerical results of stencil printing modelling was addressed. The numerical model was established by defining the geometry of the printing squeegee, the stencil, and the shape of the rolling solder paste. The squeegee had a 53° attack angle, which was determined by prior measurements, and the blade height was 20 mm. The output parameters of the model included the shear rate distribution and velocity field within the rolling solder paste, and the pressure profile on the stencil. The material properties of the solder paste were set by measuring the rheological behaviour of Type3 (particle size: 20–45μm), Type4 (particle size: 20–38 μm), Type5 (particle size: 15–25 μm)solder pastes and by fitting viscosity models onto the measurement results. Two different material models were compared, the Cross and the Carreau-Yasuda models, where the effect of the different models on the numerical results was evaluated The results showed a significant difference in the pressure during stencil printing between the cases using the viscosity of solder pastes in initial state (Cross model)and in steady state (Carreu-Yasuda model). The difference was about 25% in the case of Type-3, Type-4, and Type-5 solder pastes respectively. These differences proved that appropriate material models should be used in the numerical models of the stencil printing, to be able to apply that in early-stage prediction in the concept of Industry 4.0.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"17 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85257300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810290
A. Ignat, D. Petreus, E. Lazar
An increasing number of microgrids are using renewable energy sources exclusively. When operating off-grid, the microgrids must cover the entire load demand. Since energy production is dependent on meteorological conditions for certain renewable resources, the uncertainty in weather prediction must be considered when scheduling the operation of a microgrid. The accuracy with which the load demand was estimated is another uncertainty that must be considered. Stochastic programming allows for those uncertainties to be included in the optimization problem, thus providing a more realistic result. This paper presents the use of stochastic programming for the day-ahead scheduling of an islanded microgrid that uses renewable energy sources. The purpose of the optimization is to achieve the minimum operating cost of the microgrid. The results obtained can be used as a stand-alone solution or as a starting point for a real-time scheduling algorithm.
{"title":"Cost Optimization and Day-Ahead Scheduling for a Renewable Energy Microgrid","authors":"A. Ignat, D. Petreus, E. Lazar","doi":"10.1109/ISSE.2019.8810290","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810290","url":null,"abstract":"An increasing number of microgrids are using renewable energy sources exclusively. When operating off-grid, the microgrids must cover the entire load demand. Since energy production is dependent on meteorological conditions for certain renewable resources, the uncertainty in weather prediction must be considered when scheduling the operation of a microgrid. The accuracy with which the load demand was estimated is another uncertainty that must be considered. Stochastic programming allows for those uncertainties to be included in the optimization problem, thus providing a more realistic result. This paper presents the use of stochastic programming for the day-ahead scheduling of an islanded microgrid that uses renewable energy sources. The purpose of the optimization is to achieve the minimum operating cost of the microgrid. The results obtained can be used as a stand-alone solution or as a starting point for a real-time scheduling algorithm.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"32 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83116422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810310
M. Taut, G. Chindris, D. Pitica
The present paper aims to approach some high complexity testing methods and models, precisely because of the need to optimize the control systems. Methods and models are developed to deliver performance that tends to ideality, or to the ideality of design specifications for such control systems required by today's industry. The highlighting of the results and the validity of the performances obtained using the above described techniques could be achieved by designing a real-time control system for controlling a DC motor subjected to controlled loads. Due to the control applications coming in an increasing number in the last part of time, the control with as high a precision of such a DC motor is imperative. The consequence of using a PID algorithm controller in a closed-loop feedback system determines both the system's response to the position and speed of the DC motor and their calculation accurately. All this system was developed using Real-Time Hardware-in-the-Loop Systems and mathematically characterized models in Simulink, Matlab (design and simulation tools)along with LabView and LabVIEW's NI RIO Platform.
{"title":"Real-Time System with Integrated PID Algorithm Used for DC Motor Control","authors":"M. Taut, G. Chindris, D. Pitica","doi":"10.1109/ISSE.2019.8810310","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810310","url":null,"abstract":"The present paper aims to approach some high complexity testing methods and models, precisely because of the need to optimize the control systems. Methods and models are developed to deliver performance that tends to ideality, or to the ideality of design specifications for such control systems required by today's industry. The highlighting of the results and the validity of the performances obtained using the above described techniques could be achieved by designing a real-time control system for controlling a DC motor subjected to controlled loads. Due to the control applications coming in an increasing number in the last part of time, the control with as high a precision of such a DC motor is imperative. The consequence of using a PID algorithm controller in a closed-loop feedback system determines both the system's response to the position and speed of the DC motor and their calculation accurately. All this system was developed using Real-Time Hardware-in-the-Loop Systems and mathematically characterized models in Simulink, Matlab (design and simulation tools)along with LabView and LabVIEW's NI RIO Platform.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"66 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81842087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810286
Dániel Straubinger, I. Bozsóki, B. Illés, A. Géczy
Vapour Phase Soldering (VPS)is a reflow soldering method, which is under investigation from many aspects, due to its unique heat transfer mechanism: condensation-based heating. To maintain and improve the quality of the solder joints the heat transient and distribution of a given assembly must be known paramters. In this paper, one dimensional modelling of heat distribution within the thickness of a Printed Circuit Board (PCB)is investigated. Heat transient is calculated for the VPS process at different positions within the PCB. The results are calculated in the confines of VPS, where heat transfer occurs on both sides of the PCB due to the occurring filmwise condensation. The results present information about temperature distribution along the thickness of the PCB in the time domain. This data can be incorporated into more complex simulation approaches and profile predicting algorithms for better temperature control.
{"title":"Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering","authors":"Dániel Straubinger, I. Bozsóki, B. Illés, A. Géczy","doi":"10.1109/ISSE.2019.8810286","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810286","url":null,"abstract":"Vapour Phase Soldering (VPS)is a reflow soldering method, which is under investigation from many aspects, due to its unique heat transfer mechanism: condensation-based heating. To maintain and improve the quality of the solder joints the heat transient and distribution of a given assembly must be known paramters. In this paper, one dimensional modelling of heat distribution within the thickness of a Printed Circuit Board (PCB)is investigated. Heat transient is calculated for the VPS process at different positions within the PCB. The results are calculated in the confines of VPS, where heat transfer occurs on both sides of the PCB due to the occurring filmwise condensation. The results present information about temperature distribution along the thickness of the PCB in the time domain. This data can be incorporated into more complex simulation approaches and profile predicting algorithms for better temperature control.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"22 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85199394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810272
B. Illés, T. Hurtony, O. Krammer, R. Bátorfi, B. Medgyes, G. Harsányi
The Sn thin film on Cu substrate has high Sn whisker growth susceptibility because of the intensive Cu6Sn5 intermetallic formation at the Sn-Cu interface. In this study, the whisker development on vacuum evaporated Sn thin film deposited on Cu substrates was investigated, starting directly from the Sn deposition. The aim was to obtain more information about the whiskering behavior of Sn thin film in the early stage of the life cycle. For the study, 99.99% pure tin was vacuum evaporated onto Cu substrates. Two different Cu substrates were applied with different surface roughness to investigate the effect of surface roughness on the whisker development. The average thickness of the evaporated Sn layer was ~2 μ m. Samples were stored at room temperature for 10 weeks. Whisker development was observed by scanning electron microscope. It was found that the large compressive stress in the Sn layer because of the intermetallic formation initiates the whisker development even after 1 day of the Sn layer deposition. Almost only filament type whiskers were detected. The characteristics of the whisker density showed exponential saturation up to 10 days of the study, while the length of the whiskers was growing further still the end of the study. It was also found that the surface roughness of the Cu substrate affects the rate of whisker growth.
{"title":"Early Stage Whisker Development from Sn Thin Film on Cu Substrate","authors":"B. Illés, T. Hurtony, O. Krammer, R. Bátorfi, B. Medgyes, G. Harsányi","doi":"10.1109/ISSE.2019.8810272","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810272","url":null,"abstract":"The Sn thin film on Cu substrate has high Sn whisker growth susceptibility because of the intensive Cu6Sn5 intermetallic formation at the Sn-Cu interface. In this study, the whisker development on vacuum evaporated Sn thin film deposited on Cu substrates was investigated, starting directly from the Sn deposition. The aim was to obtain more information about the whiskering behavior of Sn thin film in the early stage of the life cycle. For the study, 99.99% pure tin was vacuum evaporated onto Cu substrates. Two different Cu substrates were applied with different surface roughness to investigate the effect of surface roughness on the whisker development. The average thickness of the evaporated Sn layer was ~2 μ m. Samples were stored at room temperature for 10 weeks. Whisker development was observed by scanning electron microscope. It was found that the large compressive stress in the Sn layer because of the intermetallic formation initiates the whisker development even after 1 day of the Sn layer deposition. Almost only filament type whiskers were detected. The characteristics of the whisker density showed exponential saturation up to 10 days of the study, while the length of the whiskers was growing further still the end of the study. It was also found that the surface roughness of the Cu substrate affects the rate of whisker growth.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"9 35","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91508045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810284
E. Gieva, G. Nikolov, B. Nikolova
The Van der Pauw method is a method commonly used to measure the resistance and Hall coefficient of a sample. Its advantage lies in its ability to accurately measure the properties of a random sample, ensuring that the sample is approximately two-dimensional (i.e., it is much thinner than it is wide), rigid (without holes), and the electrodes are located on the perimeter. The Van der Pauw method uses a 4-point probe around the sample circumference, unlike the linear 4-point probe: this allows the Van der Pauw method to provide a mean resistance of the sample while the linear array provides resistance in the reading direction. [1] This difference becomes important for anisotropic materials, which can be correctly measured by the various modifications of the Van der Pauw method.
{"title":"Sheet Resistance Measurement of Inkjet Printed Layers","authors":"E. Gieva, G. Nikolov, B. Nikolova","doi":"10.1109/ISSE.2019.8810284","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810284","url":null,"abstract":"The Van der Pauw method is a method commonly used to measure the resistance and Hall coefficient of a sample. Its advantage lies in its ability to accurately measure the properties of a random sample, ensuring that the sample is approximately two-dimensional (i.e., it is much thinner than it is wide), rigid (without holes), and the electrodes are located on the perimeter. The Van der Pauw method uses a 4-point probe around the sample circumference, unlike the linear 4-point probe: this allows the Van der Pauw method to provide a mean resistance of the sample while the linear array provides resistance in the reading direction. [1] This difference becomes important for anisotropic materials, which can be correctly measured by the various modifications of the Van der Pauw method.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"29 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87481940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810289
Vladimir Voicu, D. Petreus, R. Etz
PV plants require monitoring to determine their performance ratio which is observed over time. Before constructing a solar energy system, it is important to know in advance how much energy such a project could potentially harvest from the sun and to identify the sources of losses which usually are pollution, cloudiness, and heat. For this reason it is essential to consider the solar irradiance. This paper describes the design and implementation of a data acquisition system used to determine the Global Horizontal Irradiance (GHI). It also uses and open-source clear sky model to estimate if the full potential of the solar energy is harvested on cloud free days. The necessary data travels with the aid of a Raspberry Pi from the pyranometer to a virtual machine hosted in the university. This VM uses a suite of available open-source solutions through its application of visualization, monitoring and analysis software. The collected solar radiation values from the pyranometer are cross referenced with the ones obtained from the solar radiation prediction model. This monitoring and analysis system is integrated alongside a PV plant to determine the performance of the energy harvested from the solar panels.
{"title":"Data Acquisition System for Solar Panels","authors":"Vladimir Voicu, D. Petreus, R. Etz","doi":"10.1109/ISSE.2019.8810289","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810289","url":null,"abstract":"PV plants require monitoring to determine their performance ratio which is observed over time. Before constructing a solar energy system, it is important to know in advance how much energy such a project could potentially harvest from the sun and to identify the sources of losses which usually are pollution, cloudiness, and heat. For this reason it is essential to consider the solar irradiance. This paper describes the design and implementation of a data acquisition system used to determine the Global Horizontal Irradiance (GHI). It also uses and open-source clear sky model to estimate if the full potential of the solar energy is harvested on cloud free days. The necessary data travels with the aid of a Raspberry Pi from the pyranometer to a virtual machine hosted in the university. This VM uses a suite of available open-source solutions through its application of visualization, monitoring and analysis software. The collected solar radiation values from the pyranometer are cross referenced with the ones obtained from the solar radiation prediction model. This monitoring and analysis system is integrated alongside a PV plant to determine the performance of the energy harvested from the solar panels.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"70 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86312549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810240
Michal Hrabal, I. Zhivkov, Patrícia Guricová, G. Dobrikov, R. Yordanov, M. Vala
Alternating Current Electroluminescence (ACEL)was measured in orange and blue phosphors and a mixture of them in a ratio of 2: 1. The phosphor, dielectric and top silver electrodes were prepared by screen printing. Nowadays ACEL is presented on the market as the only technique for quick and easy preparation of large area, low cost electroluminescent panels by the means of material printing. From the optical microscope images, we could conclude that the radiation of blue phosphor dominates over the orange one. These results are confirmed in the absolute irradiance spectra. Moreover, using samples, based on phosphor stripes leads to a decrease of the total irradiance, but, on the other hand, the uniformity of the emitted EL light is improved. Printing of striped active layer is preferred from the point of view of achieving more uniformly distributed light. The summarized fitting parameters show that driving frequency around 300 Hz will produce white light with reasonable intensity and with values of x, y coordinates higher than 0.31. The somewhat lower intensity of the emitted light can be improved by setting higher driving AC voltage. The voltage tested in this work was set to be constant at 250 Vpp.
{"title":"White Light AC Electroluminescent Displays","authors":"Michal Hrabal, I. Zhivkov, Patrícia Guricová, G. Dobrikov, R. Yordanov, M. Vala","doi":"10.1109/ISSE.2019.8810240","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810240","url":null,"abstract":"Alternating Current Electroluminescence (ACEL)was measured in orange and blue phosphors and a mixture of them in a ratio of 2: 1. The phosphor, dielectric and top silver electrodes were prepared by screen printing. Nowadays ACEL is presented on the market as the only technique for quick and easy preparation of large area, low cost electroluminescent panels by the means of material printing. From the optical microscope images, we could conclude that the radiation of blue phosphor dominates over the orange one. These results are confirmed in the absolute irradiance spectra. Moreover, using samples, based on phosphor stripes leads to a decrease of the total irradiance, but, on the other hand, the uniformity of the emitted EL light is improved. Printing of striped active layer is preferred from the point of view of achieving more uniformly distributed light. The summarized fitting parameters show that driving frequency around 300 Hz will produce white light with reasonable intensity and with values of x, y coordinates higher than 0.31. The somewhat lower intensity of the emitted light can be improved by setting higher driving AC voltage. The voltage tested in this work was set to be constant at 250 Vpp.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"92 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79551813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810280
P. Martinek, B. Villányi, O. Krammer
A method was developed for detecting the position of electronics components automatically before and after reflow soldering, allowing the analysis of component self-alignment. The method is based on image processing techniques like filtering, pattern recognition and particle swarm analysis. In the experiment, an FR4 based testboard was designed, which allows the measurement of component placement offsets by utilizing registration marks (fiducial points). Chip resistors (0603 size $-1.5times 0.75 {mm})$ were placed onto the testboard with intentional component misplacement in × (0–800 μ m) and in y $({0-300} mu m)$ direction. The position of the components of a test set was measured both before and after soldering, and the image processing method was customized based on the difference found between manual and automatic evaluation. Results showed that image processing techniques can successfully be applied to automatically evaluate component self-alignment. The error of the automatic position detection is only 10–15 μ m in average which means only a mistake of a 3–4 pixels during the image processing. The deviation of the error was also in the acceptable range taking also into account that results were validated against our former data created by manual evaluation of the exact positions.
{"title":"Measuring Component Self-Alignment by Automatic Image Processing Method","authors":"P. Martinek, B. Villányi, O. Krammer","doi":"10.1109/ISSE.2019.8810280","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810280","url":null,"abstract":"A method was developed for detecting the position of electronics components automatically before and after reflow soldering, allowing the analysis of component self-alignment. The method is based on image processing techniques like filtering, pattern recognition and particle swarm analysis. In the experiment, an FR4 based testboard was designed, which allows the measurement of component placement offsets by utilizing registration marks (fiducial points). Chip resistors (0603 size $-1.5times 0.75 {mm})$ were placed onto the testboard with intentional component misplacement in × (0–800 μ m) and in y $({0-300} mu m)$ direction. The position of the components of a test set was measured both before and after soldering, and the image processing method was customized based on the difference found between manual and automatic evaluation. Results showed that image processing techniques can successfully be applied to automatically evaluate component self-alignment. The error of the automatic position detection is only 10–15 μ m in average which means only a mistake of a 3–4 pixels during the image processing. The deviation of the error was also in the acceptable range taking also into account that results were validated against our former data created by manual evaluation of the exact positions.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"61 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81451049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810304
Adelina Ioana Ilieş, I. Ciascai, D. Pitica
Most of today‘s technologies use lithium-ion batteries to store energy. Although they are more expensive than other types of batteries like NiCd or NiMH, they are more lightweight and have a lower self-discharge rate which is especially beneficial when talking about portable devices. Batteries are frequently discarded even before their useful life is over, leading to large losses of material resources, and finally, to environmental contamination. The purpose of this paper is to develop a method to evaluate and reuse Lithium-ion battery cells that have been discarded before the end of their life cycle, and that can be reused for other applications. Over 125 Li-ion battery cells were tested, and their capacity was estimated by measurements. The obtained results show that a considerable number of the tested cells were still in good operation and can be reused for other purposes.
{"title":"Methods for Reusing Li-Ion Cells from Discarded Battery Packs","authors":"Adelina Ioana Ilieş, I. Ciascai, D. Pitica","doi":"10.1109/ISSE.2019.8810304","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810304","url":null,"abstract":"Most of today‘s technologies use lithium-ion batteries to store energy. Although they are more expensive than other types of batteries like NiCd or NiMH, they are more lightweight and have a lower self-discharge rate which is especially beneficial when talking about portable devices. Batteries are frequently discarded even before their useful life is over, leading to large losses of material resources, and finally, to environmental contamination. The purpose of this paper is to develop a method to evaluate and reuse Lithium-ion battery cells that have been discarded before the end of their life cycle, and that can be reused for other applications. Over 125 Li-ion battery cells were tested, and their capacity was estimated by measurements. The obtained results show that a considerable number of the tested cells were still in good operation and can be reused for other purposes.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"75 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74316470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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