Copper matrix composites reinforced with tungsten particles were fabricated via submerged friction stir processing (FSP) using both rolled and annealed copper sheets to investigate the effect of tool traverse speed and initial microstructure on particle distribution, microstructure evolution, and material properties. Optimal particle distribution and the finest equiaxed grain structure (4.8 ± 0.5 µm) were achieved in the 800–20-R condition, attributed to the high strain rate (31.9 s⁻1), peak temperature (449 °C), and a high Zener-Hollomon parameter. In contrast, annealed samples showed improved particle dispersion only at higher traverse speeds, with sample 800–80-O exhibiting refined grains (8.1 ± 1.2 µm) and reduced agglomeration. Mechanical testing showed the highest hardness (107.4 ± 9.1 HV), ultimate tensile strength (314.5 ± 12.5 MPa), and toughness (85.2 ± 1.2 MJ/m3) in the 800–20-R sample due to uniform W dispersion and grain refinement. Electrical conductivity was also highest in this condition (71.3 ± 1.3% IACS), though still lower than annealed base copper (99.2 ± 1.5% IACS), indicating a trade-off between reinforcement and conductivity.
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