Pub Date : 2024-10-24DOI: 10.1109/OJPEL.2024.3485891
Anliang Hu;Jürgen Biela
Fast and accurate switching loss models that can be used for different devices are crucial for optimization-based converter design. This paper proposes a novel data sheet based, fully analytical loss model for a SiC MOSFET and Schottky diode half-bridge including parasitics. In the model, nonlinear device characteristics are approximated by multi-step piecewise constants. Furthermore, a small number of assumptions are used to derive and to solve the approximated nonlinear differential equations for obtaining the switching losses. To evaluate the model, a new accuracy measure is proposed for a fair accuracy comparison with existing models. The proposed model is also comprehensively verified by double pulse tests using 5 SiC MOSFET (with different structures) and Schottky diode pairs from different manufacturers. The proposed fully analytical model exhibits on average the best accuracy with a high computational efficiency (less than 1 ms per operating point) compared to state-of-the-art analytical switching loss models, as validated by using both data sheet information and measured device characteristics.
可用于不同器件的快速准确开关损耗模型对于基于优化的转换器设计至关重要。本文针对 SiC MOSFET 和肖特基二极管半桥(包括寄生效应)提出了一种基于数据表的新型全分析损耗模型。在该模型中,非线性器件特性由多级片式常数近似表示。此外,还使用了少量假设来推导和求解近似非线性微分方程,以获得开关损耗。为了评估该模型,提出了一种新的精度测量方法,以便与现有模型进行公平的精度比较。此外,还通过使用 5 个不同制造商生产的 SiC MOSFET(具有不同结构)和肖特基二极管对进行双脉冲测试,对所提出的模型进行了全面验证。与最先进的分析开关损耗模型相比,所提出的全分析模型平均精度最高,计算效率高(每个工作点小于 1 毫秒),数据表信息和测量的器件特性均验证了这一点。
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With the increasing penetration of wind turbine (WT) systems with permanent magnet synchronous generators (PMSGs) into the power grids, the back-to-back converter (BTB) has become the key element interfacing wind sources and power grids. Compared to the grid-following voltage source converter (GFL-VSC), the grid-forming VSC (GFM-VSC) shows voltage and frequency support capabilities, which meets the requirement of grid codes for WT systems. Usually, the linear regulator is employed to realize the tracking of voltage and current of GFM-VSCs, but it has limitations of complex parameter design and dynamic performance. Recently, the model predictive control (MPC) is a promising alternative controller due to the easy adoption and fast control response. This paper proposes a novel MPC method for BTB to achieve grid-forming function. The model-based control concept of the MPC effectively overcomes the complex parameter-tuning process of the cascaded linear regulators. In addition, the overshoot in the step-response of the active power of GFM-VSCs during transient process is effectively improved by using a new multi-objective cost function. The reduced power overshoot is beneficial for fully utilizing the overload capacity of the converter, avoiding damage to semiconductor devices and causing system blocking. Finally, the simulation and experiments have confirmed the feasibility of the proposed MPC method.
{"title":"A Model Predictive Control With Grid-Forming Capability for Back-to-Back Converters in Wind Turbine Systems","authors":"Zhijie Zeng;Dawei Chen;Shiyao Qin;Shuai Yuan;Zhixiang Zou;Jinyu Chen;Chen Qi","doi":"10.1109/OJPEL.2024.3476028","DOIUrl":"https://doi.org/10.1109/OJPEL.2024.3476028","url":null,"abstract":"With the increasing penetration of wind turbine (WT) systems with permanent magnet synchronous generators (PMSGs) into the power grids, the back-to-back converter (BTB) has become the key element interfacing wind sources and power grids. Compared to the grid-following voltage source converter (GFL-VSC), the grid-forming VSC (GFM-VSC) shows voltage and frequency support capabilities, which meets the requirement of grid codes for WT systems. Usually, the linear regulator is employed to realize the tracking of voltage and current of GFM-VSCs, but it has limitations of complex parameter design and dynamic performance. Recently, the model predictive control (MPC) is a promising alternative controller due to the easy adoption and fast control response. This paper proposes a novel MPC method for BTB to achieve grid-forming function. The model-based control concept of the MPC effectively overcomes the complex parameter-tuning process of the cascaded linear regulators. In addition, the overshoot in the step-response of the active power of GFM-VSCs during transient process is effectively improved by using a new multi-objective cost function. The reduced power overshoot is beneficial for fully utilizing the overload capacity of the converter, avoiding damage to semiconductor devices and causing system blocking. Finally, the simulation and experiments have confirmed the feasibility of the proposed MPC method.","PeriodicalId":93182,"journal":{"name":"IEEE open journal of power electronics","volume":"5 ","pages":"1697-1708"},"PeriodicalIF":5.0,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10726784","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142565547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-16DOI: 10.1109/OJPEL.2024.3479293
Ran Yao;Zheyan Zhu;Hui Li;Wei Lai;Xianping Chen;Francesco Iannuzzo;Renkuan Liu;Xiaorong Luo
The conventional TO-247-3 packages with single-sided cooling limit the thermal and electrical performances of discrete SiC MOSFET devices. In this paper, a double-sided cooling press-pack (PP) packaging approach for the discrete SiC MOSFET device is proposed to optimize its thermal and electrical performances. First, a double-sided cooling PP structure for the discrete SiC MOSFET devices is designed with a copper foam gate pin and an embedded fixture. Then, based on finite element simulations, the steady-state thermal and electrical performances of the discrete SiC MOSFET device with the double-sided cooling PP package are analyzed, and the parasitic inductance of the designed SiC MOSFET device is extracted by the ANSYS Q3D software. Finally, a prototype of the double-sided cooling PP SiC MOSFET device is fabricated, and test platforms are established to verify its performance. The research findings demonstrate that the designed double-sided cooling PP SiC MOSFET device can reduce thermal resistance and switching loss by 47.4 % and 42.3%, respectively.
单面冷却的传统 TO-247-3 封装限制了分立式 SiC MOSFET 器件的热性能和电气性能。本文提出了一种用于分立式 SiC MOSFET 器件的双面冷却压包(PP)封装方法,以优化其热性能和电气性能。首先,设计了一种用于分立 SiC MOSFET 器件的双面冷却 PP 结构,该结构具有泡沫铜栅极引脚和嵌入式夹具。然后,基于有限元仿真,分析了采用双面冷却 PP 封装的分立 SiC MOSFET 器件的稳态热性能和电性能,并利用 ANSYS Q3D 软件提取了所设计 SiC MOSFET 器件的寄生电感。最后,制作了双面冷却 PP SiC MOSFET 器件的原型,并建立了测试平台来验证其性能。研究结果表明,所设计的双面冷却 PP SiC MOSFET 器件可将热阻和开关损耗分别降低 47.4% 和 42.3%。
{"title":"A Double-Sided Cooling Approach of Discrete SiC MOSFET Device Based on Press-Pack Package","authors":"Ran Yao;Zheyan Zhu;Hui Li;Wei Lai;Xianping Chen;Francesco Iannuzzo;Renkuan Liu;Xiaorong Luo","doi":"10.1109/OJPEL.2024.3479293","DOIUrl":"https://doi.org/10.1109/OJPEL.2024.3479293","url":null,"abstract":"The conventional TO-247-3 packages with single-sided cooling limit the thermal and electrical performances of discrete SiC MOSFET devices. In this paper, a double-sided cooling press-pack (PP) packaging approach for the discrete SiC MOSFET device is proposed to optimize its thermal and electrical performances. First, a double-sided cooling PP structure for the discrete SiC MOSFET devices is designed with a copper foam gate pin and an embedded fixture. Then, based on finite element simulations, the steady-state thermal and electrical performances of the discrete SiC MOSFET device with the double-sided cooling PP package are analyzed, and the parasitic inductance of the designed SiC MOSFET device is extracted by the ANSYS Q3D software. Finally, a prototype of the double-sided cooling PP SiC MOSFET device is fabricated, and test platforms are established to verify its performance. The research findings demonstrate that the designed double-sided cooling PP SiC MOSFET device can reduce thermal resistance and switching loss by 47.4 % and 42.3%, respectively.","PeriodicalId":93182,"journal":{"name":"IEEE open journal of power electronics","volume":"5 ","pages":"1629-1640"},"PeriodicalIF":5.0,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10719678","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142551998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-15DOI: 10.1109/OJPEL.2024.3481056
Hussain Sayed;Harish S. Krishnamoorthy
Managing the thermal behavior of GaN devices under test (DUT) poses significant challenges during accelerated thermal cycling (ATC) tests, particularly due to the compact packaging of small GaN devices (e.g., QFN package) and the sharp rise in the device's $R_{rm{DSon}}$