To address the quenching issues caused by the low thermal conductivity of epoxy resin (EP) in superconducting applications, this study enhances the comprehensive performance of epoxy-based composites by constructing a three-dimensional boron nitride thermal network. A self-supporting framework integrating boron nitride nanoribbons (BNNR) and boron nitride nanosheets (BNNS) was developed and incorporated into the epoxy matrix. The influence of filler content on the thermal conductivity, electrical insulation, and thermal expansion behavior of the composite was systematically investigated. The results demonstrate that the fabricated composites exhibit excellent thermal performance across the temperature range from 70 K to room temperature. With an 18.96 wt% incorporation of the three-dimensional thermal network, the composite achieves a thermal conductivity of 0.63 W/(m·K) at 70 K, representing a 575% enhancement compared to pure epoxy resin. Simultaneously, the material maintains outstanding electrical insulation characteristics, with volume resistivity consistently exceeding 1014 Ω·cm. Moreover, the composites’ linear coefficient of thermal expansion (CTE) decreases significantly with increasing filler content, effectively mitigating thermal stress in superconducting devices. This study provides novel insights and experimental foundations for developing high-thermal-conductivity epoxy-based insulating materials suitable for superconducting applications.
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