Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597675
M. T. Richardson, Y. Gianchandani
Batch mode micro-electro-discharge machining (muEDM) is a lithography-compatible microfabrication method suitable for making devices from bulk metals, including stainless steel. In high-density patterns, spurious discharges through debris can cause workpiece edge rounding, fast tool wear, and mushroom-shaped metal recasting of the tool. This paper reports a Si coating technique that acts as a discharge barrier on the sidewalls of batch Cu tools to diminish these effects. Copper tools were fabricated by electroplating into 80 mum tall SU-8 molds. The tools were then sputter coated with 500 Aring of Ti and 1000 Aring or 2000 Aring of Si. The Si on the top of the tool was removed by EDM on a flat surface. As a result, discharges occurred primarily at the top of the tool during machining. This provided a 93% reduction in mean tool wear, a 78% improvement in machining depth uniformity, more vertical sidewalls, and sharper workpiece edges. These results were obtained while machining 4.5 mum wide, 25 mum tall, 1 mm long unreleased stainless steel beams
{"title":"A passivated electrode batch /spl mu/EDM technology for bulk metal transducers and packages","authors":"M. T. Richardson, Y. Gianchandani","doi":"10.1109/ICSENS.2005.1597675","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597675","url":null,"abstract":"Batch mode micro-electro-discharge machining (muEDM) is a lithography-compatible microfabrication method suitable for making devices from bulk metals, including stainless steel. In high-density patterns, spurious discharges through debris can cause workpiece edge rounding, fast tool wear, and mushroom-shaped metal recasting of the tool. This paper reports a Si coating technique that acts as a discharge barrier on the sidewalls of batch Cu tools to diminish these effects. Copper tools were fabricated by electroplating into 80 mum tall SU-8 molds. The tools were then sputter coated with 500 Aring of Ti and 1000 Aring or 2000 Aring of Si. The Si on the top of the tool was removed by EDM on a flat surface. As a result, discharges occurred primarily at the top of the tool during machining. This provided a 93% reduction in mean tool wear, a 78% improvement in machining depth uniformity, more vertical sidewalls, and sharper workpiece edges. These results were obtained while machining 4.5 mum wide, 25 mum tall, 1 mm long unreleased stainless steel beams","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130097037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597665
G. L. Subrebost, G. Fedder
A silicon-based microdialysis chip that integrates sample acquisition and fractionation is demonstrated in this paper. A porous cellulose acetate film, created using the phase separation process, is suspended over silicon microchannels. Microfluidic fractionation is accomplished with passive microfluidic valves that are used to direct the dialysate into microfabricated collection chambers
{"title":"Silicon-based microdialysis chip with integrated fraction collection","authors":"G. L. Subrebost, G. Fedder","doi":"10.1109/ICSENS.2005.1597665","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597665","url":null,"abstract":"A silicon-based microdialysis chip that integrates sample acquisition and fractionation is demonstrated in this paper. A porous cellulose acetate film, created using the phase separation process, is suspended over silicon microchannels. Microfluidic fractionation is accomplished with passive microfluidic valves that are used to direct the dialysate into microfabricated collection chambers","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134016441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597685
M. Esashi, T. Ono, S. Yoshida
Multiprobe data systems have been developed for data storage. The systems can be applied for parallel scanning probe microscope, parallel electron beam exposure system and so on. Electrical recordings to a ferroelectric material and a conductive polymer have been performed. The conductive polymer film used as a recording media is 7nm thick doped polyaniline. The film conductance is reversibly modified by electrochemical oxidation and reduction and this phenomenon can be used as a recording media for rewritable data storage
{"title":"Multiprobe systems for data storage and other applications","authors":"M. Esashi, T. Ono, S. Yoshida","doi":"10.1109/ICSENS.2005.1597685","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597685","url":null,"abstract":"Multiprobe data systems have been developed for data storage. The systems can be applied for parallel scanning probe microscope, parallel electron beam exposure system and so on. Electrical recordings to a ferroelectric material and a conductive polymer have been performed. The conductive polymer film used as a recording media is 7nm thick doped polyaniline. The film conductance is reversibly modified by electrochemical oxidation and reduction and this phenomenon can be used as a recording media for rewritable data storage","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"9 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131830391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597738
P. Malcovati, M. Grassi, F. Borghetti, V. Ferragina, A. Baschirotto
In this paper we present the design and testing of an integrated wide-range interface for resistive sensors. The ASIC consists of a multi-scale trans-resistance continuous time amplifier (programmed by selecting a feedback resistor from an array), followed by a 13-bit incremental A/D converter. After calibration, employed to cancel offset and gain error mismatch between scales, the device shows a worst case error in the resistance value measurement of about 0.1% over a range of more than 5 decades [100Omega-20MOmega]
{"title":"Design and characterization of a 5-decade range integrated resistive gas sensor interface with 13-bit A/D converter","authors":"P. Malcovati, M. Grassi, F. Borghetti, V. Ferragina, A. Baschirotto","doi":"10.1109/ICSENS.2005.1597738","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597738","url":null,"abstract":"In this paper we present the design and testing of an integrated wide-range interface for resistive sensors. The ASIC consists of a multi-scale trans-resistance continuous time amplifier (programmed by selecting a feedback resistor from an array), followed by a 13-bit incremental A/D converter. After calibration, employed to cancel offset and gain error mismatch between scales, the device shows a worst case error in the resistance value measurement of about 0.1% over a range of more than 5 decades [100Omega-20MOmega]","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127572442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597913
C. Tsay, S. Lacour, S. Wagner, B. Morrison
Essential components of a stretchable microelectrode array (SMEA) to record from biological tissue include: a compliant and elastic substrate, stretchable conductors forming active electrodes and traces, and an electrical insulation layer. The materials and architecture of these SMEA components must be biocompatible, resistant to electrolytic environments, and electrically functional during and after mechanical stretching. While rigid MEA systems exist, many applications, such as retinal implants and sensitive skin, need soft, conformable, and stretchable electronic devices. This work focuses on the fabrication process, electromechanical characterization, and biocompatibility of stretchable micro-electrodes on silicone membranes. We deposit and pattern thin gold films on elastomeric silicone substrates, encapsulate them with an insulating photopatternable silicone layer, and show that the electrodes remain electrically conducting during stretch to >50% strain. The SMEA supports growths of organotypic brain slice cultures
{"title":"Architecture, Fabrication, and Properties of Stretchable Micro-Electrode Arrays","authors":"C. Tsay, S. Lacour, S. Wagner, B. Morrison","doi":"10.1109/ICSENS.2005.1597913","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597913","url":null,"abstract":"Essential components of a stretchable microelectrode array (SMEA) to record from biological tissue include: a compliant and elastic substrate, stretchable conductors forming active electrodes and traces, and an electrical insulation layer. The materials and architecture of these SMEA components must be biocompatible, resistant to electrolytic environments, and electrically functional during and after mechanical stretching. While rigid MEA systems exist, many applications, such as retinal implants and sensitive skin, need soft, conformable, and stretchable electronic devices. This work focuses on the fabrication process, electromechanical characterization, and biocompatibility of stretchable micro-electrodes on silicone membranes. We deposit and pattern thin gold films on elastomeric silicone substrates, encapsulate them with an insulating photopatternable silicone layer, and show that the electrodes remain electrically conducting during stretch to >50% strain. The SMEA supports growths of organotypic brain slice cultures","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"17 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131093937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597706
R. Loloee, R. Ghosh
Silicon carbide based devices are well suited for high temperatures applications such as gas sensors and electronic circuits for control and emissions applications in automobiles and power plants. We have developed a high sensitivity Pt-SiO2-SiC solid-state hydrogen gas sensor. The response time of this metal-oxide-semiconductor field-effect device to hydrogen-containing species at 600degC is in the millisecond regime. In good agreement with standard models, the sensor response to hydrogen concentration is logarithmic over at least four decades of concentration. Based on a detailed understanding of the hydrogen transduction mechanisms, we have determined the optimum sensor biasing conditions for reliable high temperature operation. We report on the measurement accuracy and stability for a sensor that has run for 18 continues days with negligible degradation in performance at 600degC
{"title":"Performance of silicon carbide high temperature gas sensors","authors":"R. Loloee, R. Ghosh","doi":"10.1109/ICSENS.2005.1597706","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597706","url":null,"abstract":"Silicon carbide based devices are well suited for high temperatures applications such as gas sensors and electronic circuits for control and emissions applications in automobiles and power plants. We have developed a high sensitivity Pt-SiO2-SiC solid-state hydrogen gas sensor. The response time of this metal-oxide-semiconductor field-effect device to hydrogen-containing species at 600degC is in the millisecond regime. In good agreement with standard models, the sensor response to hydrogen concentration is logarithmic over at least four decades of concentration. Based on a detailed understanding of the hydrogen transduction mechanisms, we have determined the optimum sensor biasing conditions for reliable high temperature operation. We report on the measurement accuracy and stability for a sensor that has run for 18 continues days with negligible degradation in performance at 600degC","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132860547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597795
N. Chen, J. Engel, Jack Chen, Z. Fan, Chang Liu
In this paper we present the development of micromachined thermal imaging mesh for conformal sensing system. The imaging mesh consists of an m-by-n matrix of gold thermal resistor network. The sensing and processing scheme allows us to image the presence of a localized heat source over a broad piece of imaging mesh. At the same time, this approach dramatically reduces the number of sensors hence the wiring required to image a given area. The mesh is fabricated on a piece of freestanding flexible polyimide fabric. Serpentine structure is specially designed to improve the conformability of the fabric to 3D objects. Thermal imaging data are presented in this paper
{"title":"Micromachined thermal imaging mesh for conformal sensing system","authors":"N. Chen, J. Engel, Jack Chen, Z. Fan, Chang Liu","doi":"10.1109/ICSENS.2005.1597795","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597795","url":null,"abstract":"In this paper we present the development of micromachined thermal imaging mesh for conformal sensing system. The imaging mesh consists of an m-by-n matrix of gold thermal resistor network. The sensing and processing scheme allows us to image the presence of a localized heat source over a broad piece of imaging mesh. At the same time, this approach dramatically reduces the number of sensors hence the wiring required to image a given area. The mesh is fabricated on a piece of freestanding flexible polyimide fabric. Serpentine structure is specially designed to improve the conformability of the fabric to 3D objects. Thermal imaging data are presented in this paper","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133014279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597759
Jian-Bo Sun, M. Qin, Qing‐An Huang
A flip-chip packaged thermal flow sensor is presented. The sensor chip was fabricated by standard CMOS technology and it consists of polysilicon resistor heaters, Al/polysilicon thermopiles and a substrate bipolar transistor in the center of the sensor chip. The sensor chip was flip-chip packaged on a thin ceramic substrate using copper pillar bump technology. Heat transfer is performed between the polysilicon heaters and the ceramic substrate via the pillar bump. The backside of the ceramic substrate provides a smooth surface for the sensor to contact with the flow. The change of flow-induced temperature distribution on the flow sensing surface is measured by thermopiles and the transistor. Meanwhile, the ceramic substrate holds the sensor chip and protects it from being contaminated or even destroyed by the environment. The packaged flow sensor shows good performances comparing with the unpackaged sensors
{"title":"A flip-chip packaged CMOS thermal flow sensor","authors":"Jian-Bo Sun, M. Qin, Qing‐An Huang","doi":"10.1109/ICSENS.2005.1597759","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597759","url":null,"abstract":"A flip-chip packaged thermal flow sensor is presented. The sensor chip was fabricated by standard CMOS technology and it consists of polysilicon resistor heaters, Al/polysilicon thermopiles and a substrate bipolar transistor in the center of the sensor chip. The sensor chip was flip-chip packaged on a thin ceramic substrate using copper pillar bump technology. Heat transfer is performed between the polysilicon heaters and the ceramic substrate via the pillar bump. The backside of the ceramic substrate provides a smooth surface for the sensor to contact with the flow. The change of flow-induced temperature distribution on the flow sensing surface is measured by thermopiles and the transistor. Meanwhile, the ceramic substrate holds the sensor chip and protects it from being contaminated or even destroyed by the environment. The packaged flow sensor shows good performances comparing with the unpackaged sensors","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133483392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597783
Maximillian A. Perez, E. J. Eklund, A. Shkel
This paper explores designs for the implementation of high sensitivity accelerometers based on Fabry-Perot interferometers. Although such structures have the potential to achieve mug resolutions, design and implementation challenges can be limiting. This paper discusses the creation of such devices using two distinct proof mass and optical designs: one of a monolithic flexure with a thin film metallic reflector and another of an elastomeric flexure with a thin film multilayer dielectric reflector. Each device was fabricated, tested and characterized and conclusions about the advantages and disadvantages of the different design features are presented
{"title":"Designing micromachined accelerometers with interferometric detection","authors":"Maximillian A. Perez, E. J. Eklund, A. Shkel","doi":"10.1109/ICSENS.2005.1597783","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597783","url":null,"abstract":"This paper explores designs for the implementation of high sensitivity accelerometers based on Fabry-Perot interferometers. Although such structures have the potential to achieve mug resolutions, design and implementation challenges can be limiting. This paper discusses the creation of such devices using two distinct proof mass and optical designs: one of a monolithic flexure with a thin film metallic reflector and another of an elastomeric flexure with a thin film multilayer dielectric reflector. Each device was fabricated, tested and characterized and conclusions about the advantages and disadvantages of the different design features are presented","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132186159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-31DOI: 10.1109/ICSENS.2005.1597903
N. Kularatna, C. Wijeratne, B. Melville
Low-cost accelerometers and gyro ICs were used to develop a smart sediment particle to study the sediment transport in rivers. With strap-down MEMS, battery, a processing subsystem and memory, this self contained unit captures semiprocessed data for durations up to 15 minutes. In a mixed-mode design, analog multiplier ICs with limited digital circuits transform the body frame data to a reference frame using Euler angles, with adequate accuracy despite cumulative errors. For 3D motion, up to nine sensor inputs from three orthogonal modules are coupled to a multiplexed analog processing module, and processed by a digital module for data conversion and storage. Despite the simplified mathematics used, experimental data from the proof-of-concept system provided adequate accuracy. Subsequent processing of the raw sensor data using an external PC program with smart algorithms allowed the comparison of accuracy of the mixed mode approach. The adopted mixed signal design approach helps the packaging requirements due to the specific nature of the problem with short recording durations
{"title":"Mixed signal approach for rapid prototyping of a compact smart pebble for sediment transport monitoring in river beds","authors":"N. Kularatna, C. Wijeratne, B. Melville","doi":"10.1109/ICSENS.2005.1597903","DOIUrl":"https://doi.org/10.1109/ICSENS.2005.1597903","url":null,"abstract":"Low-cost accelerometers and gyro ICs were used to develop a smart sediment particle to study the sediment transport in rivers. With strap-down MEMS, battery, a processing subsystem and memory, this self contained unit captures semiprocessed data for durations up to 15 minutes. In a mixed-mode design, analog multiplier ICs with limited digital circuits transform the body frame data to a reference frame using Euler angles, with adequate accuracy despite cumulative errors. For 3D motion, up to nine sensor inputs from three orthogonal modules are coupled to a multiplexed analog processing module, and processed by a digital module for data conversion and storage. Despite the simplified mathematics used, experimental data from the proof-of-concept system provided adequate accuracy. Subsequent processing of the raw sensor data using an external PC program with smart algorithms allowed the comparison of accuracy of the mixed mode approach. The adopted mixed signal design approach helps the packaging requirements due to the specific nature of the problem with short recording durations","PeriodicalId":119985,"journal":{"name":"IEEE Sensors, 2005.","volume":"220 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132404719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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