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Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)最新文献

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Hierarchical statistical inference model for specification based testing of analog circuits 基于规格的模拟电路测试的分层统计推理模型
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670862
Heebyung Yoon, P. Variyam, A. Chatterjee, N. Nagi
In this paper, we propose a framework for analyzing the effects of circuit parameter variations on high level system specifications in a hierarchical manner. The effects of parameter variations in one level of design hierarchy on those of the next are mapped through linear and piecewise linear sensitivity functions. The models allow computation of the statistical distributions of the circuit parameters and their correlations. This data is used to determine the critical circuit specifications that must be measured and those that may be eliminated from the testing process.
在本文中,我们提出了一个框架,以层次方式分析电路参数变化对高层次系统规格的影响。通过线性和分段线性灵敏度函数来映射设计层次中某一层次参数变化对下一层次参数变化的影响。该模型允许计算电路参数的统计分布及其相关性。这些数据用于确定必须测量的关键电路规格和那些可以从测试过程中消除的规格。
{"title":"Hierarchical statistical inference model for specification based testing of analog circuits","authors":"Heebyung Yoon, P. Variyam, A. Chatterjee, N. Nagi","doi":"10.1109/VTEST.1998.670862","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670862","url":null,"abstract":"In this paper, we propose a framework for analyzing the effects of circuit parameter variations on high level system specifications in a hierarchical manner. The effects of parameter variations in one level of design hierarchy on those of the next are mapped through linear and piecewise linear sensitivity functions. The models allow computation of the statistical distributions of the circuit parameters and their correlations. This data is used to determine the critical circuit specifications that must be measured and those that may be eliminated from the testing process.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123246282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Using verification technology for validation coverage analysis and test generation 使用验证技术进行验证覆盖分析和测试生成
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670877
Dinos Moundanos, J. Abraham
Despite great advances in Formal Verification (FV) simulation is still the primary means for design validation. The definition of pragmatic measures for the coverage achieved and the problem of automatic test generation (ATG) are of great importance. In this paper we introduce a new set of metrics, the Event Sequence Coverage Metrics (ESCMs). Our approach is based on an automatic method to extract the control flow of a circuit which can be explored for coverage analysis and ATG. We combine FV and traditional ATPG techniques to automatically generate sequences which traverse uncovered parts of the control graph or exercise uninstantiated control event sequences.
尽管形式验证(FV)有了很大的进步,但仿真仍然是设计验证的主要手段。实现覆盖的实用度量的定义和自动测试生成(ATG)问题具有重要的意义。在本文中,我们引入了一组新的度量,事件序列覆盖度量(ESCMs)。我们的方法是基于一种自动提取电路控制流的方法,可以用于覆盖分析和ATG。我们结合FV和传统的ATPG技术来自动生成序列,这些序列遍历控制图的未覆盖部分或执行未实例化的控制事件序列。
{"title":"Using verification technology for validation coverage analysis and test generation","authors":"Dinos Moundanos, J. Abraham","doi":"10.1109/VTEST.1998.670877","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670877","url":null,"abstract":"Despite great advances in Formal Verification (FV) simulation is still the primary means for design validation. The definition of pragmatic measures for the coverage achieved and the problem of automatic test generation (ATG) are of great importance. In this paper we introduce a new set of metrics, the Event Sequence Coverage Metrics (ESCMs). Our approach is based on an automatic method to extract the control flow of a circuit which can be explored for coverage analysis and ATG. We combine FV and traditional ATPG techniques to automatically generate sequences which traverse uncovered parts of the control graph or exercise uninstantiated control event sequences.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123780940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Hierarchical test access architecture for embedded cores in an integrated circuit 集成电路中嵌入式核的分层测试访问体系结构
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670842
D. Bhattacharya
The rapid emergence of reusable core-based designs, in the last few years, poses new challenges to the IEEE test access standard 1149.1. Due to widespread industrial acceptance of 1149.1 standard, ICs are now expected to be 1149.1-compliant. At the same time, a typical IC, like the TMS470 microcontroller manufactured by TI, often contains multiple cores with built-in 1149.1 compliant Test Access Port (TAP), as well as significant amounts of non-core logic, which does not have any built-in test access mechanism. In this paper, we present a new TAP design that enables systematic integration of TAP'ed cores with non-TAP'ed logic, and makes the total IC 1149.1 compliant, at the same time. This TAP design, designated Hierarchical Test Access Port (HTAP), has exactly the same I/O pin specifications as an 1149.1-compliant TAP, and can either serve as an 1149.1-compliant TAP, or act as an arbitrator between existing TAPs in the Embedded cores. Behavior of the HTAP-whether to act as a TAP or as an arbitrator of TAPs-is controlled via the TMS input pin.
在过去几年中,基于可重用核心的设计迅速出现,对IEEE测试访问标准1149.1提出了新的挑战。由于1149.1标准被广泛的工业接受,ic现在预计将符合1149.1标准。同时,一个典型的IC,如TI制造的TMS470微控制器,通常包含多个内核,内置1149.1兼容测试访问端口(TAP),以及大量的非核心逻辑,没有任何内置的测试访问机制。在本文中,我们提出了一种新的TAP设计,可以将TAP内核与非TAP逻辑系统集成,同时使整个IC 1149.1兼容。这种TAP设计,指定分层测试访问端口(HTAP),具有与1149.1兼容的TAP完全相同的I/O引脚规格,并且可以作为1149.1兼容的TAP,或作为嵌入式核心中现有TAP之间的仲裁器。htap的行为——作为TAP还是作为TAP的仲裁器——是通过TMS输入引脚控制的。
{"title":"Hierarchical test access architecture for embedded cores in an integrated circuit","authors":"D. Bhattacharya","doi":"10.1109/VTEST.1998.670842","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670842","url":null,"abstract":"The rapid emergence of reusable core-based designs, in the last few years, poses new challenges to the IEEE test access standard 1149.1. Due to widespread industrial acceptance of 1149.1 standard, ICs are now expected to be 1149.1-compliant. At the same time, a typical IC, like the TMS470 microcontroller manufactured by TI, often contains multiple cores with built-in 1149.1 compliant Test Access Port (TAP), as well as significant amounts of non-core logic, which does not have any built-in test access mechanism. In this paper, we present a new TAP design that enables systematic integration of TAP'ed cores with non-TAP'ed logic, and makes the total IC 1149.1 compliant, at the same time. This TAP design, designated Hierarchical Test Access Port (HTAP), has exactly the same I/O pin specifications as an 1149.1-compliant TAP, and can either serve as an 1149.1-compliant TAP, or act as an arbitrator between existing TAPs in the Embedded cores. Behavior of the HTAP-whether to act as a TAP or as an arbitrator of TAPs-is controlled via the TMS input pin.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122438353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 54
I/sub DDQ/ testing of opens in CMOS SRAMs CMOS sram开路的I/sub DDQ/测试
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670856
V. Champac, J. Castillejos, J. Figueras
The behavior of a CMOS SRAM memory in the presence of open defects is analyzed. It has been found that destructive read-out depends on the level of the precharge. Two techniques to test open defects producing data retention faults are proposed. In the first technique an initial condition is forced during the working phase. In this way, intermediate voltages appear during the memorizing phase. Hence, the quiescent current consumption (I/sub DDQ/) increases and the fault can be detected sensing the I/sub DDQ/. A second technique controlling the power supply level in conjunction with sequential access is proposed. This allows detection of open defects by I/sub DDQ/ testing. The cost of both proposed approaches is analyzed.
分析了存在开放缺陷时CMOS SRAM存储器的性能。已经发现,破坏性读出取决于预充液的水平。提出了两种测试产生数据保留错误的开放缺陷的技术。在第一种技术中,在工作阶段强制一个初始条件。这样,中间电压就会在记忆阶段出现。因此,静态电流消耗(I/sub DDQ/)增加,故障可以检测到I/sub DDQ/。提出了与顺序访问相结合的控制电源电平的第二种技术。这允许通过I/sub DDQ/测试来检测开放缺陷。分析了这两种方法的成本。
{"title":"I/sub DDQ/ testing of opens in CMOS SRAMs","authors":"V. Champac, J. Castillejos, J. Figueras","doi":"10.1109/VTEST.1998.670856","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670856","url":null,"abstract":"The behavior of a CMOS SRAM memory in the presence of open defects is analyzed. It has been found that destructive read-out depends on the level of the precharge. Two techniques to test open defects producing data retention faults are proposed. In the first technique an initial condition is forced during the working phase. In this way, intermediate voltages appear during the memorizing phase. Hence, the quiescent current consumption (I/sub DDQ/) increases and the fault can be detected sensing the I/sub DDQ/. A second technique controlling the power supply level in conjunction with sequential access is proposed. This allows detection of open defects by I/sub DDQ/ testing. The cost of both proposed approaches is analyzed.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122034580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A simple and efficient method for generating compact IDDQ test set for bridging faults 一种简单有效的桥接故障紧凑IDDQ测试集生成方法
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670857
T. Shinogi, T. Hayashi
This paper presents an efficient method for generating a compact test set for IDDQ testing of bridging faults in combinational CMOS circuits. This method is based on the iterative improvement method. Though our method is simple and easy to implement, it is efficient. Experimental results for large ISCAS benchmark circuits demonstrate its efficiency in comparison with results of previous methods.
本文提出了一种生成紧凑测试集的有效方法,用于组合CMOS电路中桥接故障的IDDQ测试。该方法基于迭代改进法。虽然我们的方法简单易行,但效率很高。大型ISCAS基准电路的实验结果证明了该方法的有效性。
{"title":"A simple and efficient method for generating compact IDDQ test set for bridging faults","authors":"T. Shinogi, T. Hayashi","doi":"10.1109/VTEST.1998.670857","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670857","url":null,"abstract":"This paper presents an efficient method for generating a compact test set for IDDQ testing of bridging faults in combinational CMOS circuits. This method is based on the iterative improvement method. Though our method is simple and easy to implement, it is efficient. Experimental results for large ISCAS benchmark circuits demonstrate its efficiency in comparison with results of previous methods.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129881433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Signal integrity problems in deep submicron arising from interconnects between cores 深亚微米中芯间互连引起的信号完整性问题
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670845
P. Nordholz, D. Treytnar, J. Otterstedt, H. Grabinski, D. Niggemeyer, T. Williams
The SIA Roadmap shows a very aggressive drive to deep submicron designs. A significant corner stone in the industries' ability to utilize this tremendous capabilities is the usage of reusable cores. When employing cores, one must be sensitive to the quality of the interconnects which will carry signals between cores and the ASIC portion of the network. In this work we will use an extremely accurate line simulator which solves the transmission line equations derived from Maxwell's equations for the simulation of line systems. We will show that the coupling between bus lines is significant, since the signal delay can be increased and even hazards can occur. Furthermore, these effects depend on the set of input signals of all bus lines and the skew between the individual input signals. The lines' cross sections are taken from the SIA Roadmap going from 0.35 /spl mu/m technology design down to 0.10 /spl mu/m technology design.
SIA路线图显示了对深亚微米设计的积极推动。工业能够利用这种巨大功能的一个重要基石是可重用核心的使用。当使用核心时,必须对互连的质量敏感,互连将在核心和网络的ASIC部分之间传递信号。在这项工作中,我们将使用一个非常精确的线路模拟器,它解决了由麦克斯韦方程组导出的传输线方程,用于模拟线路系统。我们将展示总线线路之间的耦合是显著的,因为信号延迟可能会增加,甚至可能发生危险。此外,这些影响取决于所有总线线路的输入信号集和各个输入信号之间的偏差。线条的横截面取自SIA路线图,从0.35 /spl mu/m的技术设计到0.10 /spl mu/m的技术设计。
{"title":"Signal integrity problems in deep submicron arising from interconnects between cores","authors":"P. Nordholz, D. Treytnar, J. Otterstedt, H. Grabinski, D. Niggemeyer, T. Williams","doi":"10.1109/VTEST.1998.670845","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670845","url":null,"abstract":"The SIA Roadmap shows a very aggressive drive to deep submicron designs. A significant corner stone in the industries' ability to utilize this tremendous capabilities is the usage of reusable cores. When employing cores, one must be sensitive to the quality of the interconnects which will carry signals between cores and the ASIC portion of the network. In this work we will use an extremely accurate line simulator which solves the transmission line equations derived from Maxwell's equations for the simulation of line systems. We will show that the coupling between bus lines is significant, since the signal delay can be increased and even hazards can occur. Furthermore, these effects depend on the set of input signals of all bus lines and the skew between the individual input signals. The lines' cross sections are taken from the SIA Roadmap going from 0.35 /spl mu/m technology design down to 0.10 /spl mu/m technology design.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128274662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 52
Undetectable fault removal of sequential circuits based on unreachable states 基于不可达状态的顺序电路不可检测故障去除
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670866
H. Yotsuyanagi, K. Kinoshita
We present a procedure to reduce sequential circuits by removing undetectable faults based on unreachable states. Procedures for obtaining unreachable stares and for identifying undetectable faults which can be the target of fault removal are presented. Experimental results for ISCAS benchmark circuits are shown.
提出了一种基于不可达状态去除不可检测故障来减少时序电路的方法。给出了获取不可达注视点和识别可作为故障去除目标的不可检测故障的程序。给出了ISCAS基准电路的实验结果。
{"title":"Undetectable fault removal of sequential circuits based on unreachable states","authors":"H. Yotsuyanagi, K. Kinoshita","doi":"10.1109/VTEST.1998.670866","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670866","url":null,"abstract":"We present a procedure to reduce sequential circuits by removing undetectable faults based on unreachable states. Procedures for obtaining unreachable stares and for identifying undetectable faults which can be the target of fault removal are presented. Experimental results for ISCAS benchmark circuits are shown.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130414155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
COMPACT: a hybrid method for compressing test data COMPACT:压缩测试数据的混合方法
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670850
M. Ishida, D. Ha, Takahiro J. Yamaguchi
The overall throughput of automatic test equipment (ATE) is sensitive to the download time of test data. An effective approach to the reduction of the download time is to compress test data before the download. The authors introduced a test data compression method which outperforms other methods for compressing test data. Our previous method was based on the Burrows-Wheeler transformation on the sequence of test patterns and run-length coding. In this paper, we present a new method, called COMPACT, which further improves our previous method. The key idea of COMPACT is to employ two data compression schemes, run-length coding for data with low activity and GZIP for data with high activity. COMPACT increases the compression ratio of test data, on average, by 1.9 times compared with our previous method.
自动测试设备(ATE)的总吞吐量对测试数据的下载时间非常敏感。减少下载时间的一种有效方法是在下载前对测试数据进行压缩。本文介绍了一种测试数据压缩方法,该方法优于其他测试数据压缩方法。我们之前的方法是基于测试模式序列和运行长度编码的Burrows-Wheeler转换。在本文中,我们提出了一种新的方法,称为COMPACT,它进一步改进了我们以前的方法。COMPACT的关键思想是采用两种数据压缩方案,游程编码用于低活动数据,GZIP用于高活动数据。与我们之前的方法相比,COMPACT平均将测试数据的压缩比提高了1.9倍。
{"title":"COMPACT: a hybrid method for compressing test data","authors":"M. Ishida, D. Ha, Takahiro J. Yamaguchi","doi":"10.1109/VTEST.1998.670850","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670850","url":null,"abstract":"The overall throughput of automatic test equipment (ATE) is sensitive to the download time of test data. An effective approach to the reduction of the download time is to compress test data before the download. The authors introduced a test data compression method which outperforms other methods for compressing test data. Our previous method was based on the Burrows-Wheeler transformation on the sequence of test patterns and run-length coding. In this paper, we present a new method, called COMPACT, which further improves our previous method. The key idea of COMPACT is to employ two data compression schemes, run-length coding for data with low activity and GZIP for data with high activity. COMPACT increases the compression ratio of test data, on average, by 1.9 times compared with our previous method.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"169 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123130198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 60
Bit serial pattern generation and response compaction using arithmetic functions 位串行模式生成和响应压缩使用算术函数
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670852
A. P. Stroele
Adders, subtracters, and multipliers, which are available in many data paths, can be utilized to generate patterns and compact test responses. While previous work studied configurations which process patterns and test responses that have the size of a data word, this paper investigates bit serial pattern generators and compactors as they are required, for example, to test a random logic portion of the circuit by means of a scan path. Different arithmetic pattern generators are proposed that can produce a variety of bit strings with long periods and similar fault coverage as pseudorandom bit strings. The paper also analyzes aliasing in arithmetic compactors that process the test responses bit by bit. An upper bound on the limiting value of the aliasing probability for large test lengths can be computed very efficiently. The results of this paper open up a new range of applications for arithmetic BIST.
加法器、减法器和乘法器在许多数据路径中都是可用的,可以用来生成模式和压缩测试响应。虽然以前的工作研究了处理模式和测试具有数据字大小的响应的配置,但本文研究了位串行模式发生器和压缩器,因为它们是必需的,例如,通过扫描路径来测试电路的随机逻辑部分。提出了不同的算法模式发生器,可以产生具有长周期和类似于伪随机比特串的故障覆盖率的各种比特串。本文还分析了逐位处理测试响应的算术压缩器中的混叠问题。对于较大的测试长度,混叠概率的极限值的上界可以很有效地计算出来。本文的研究结果为算术BIST开辟了一个新的应用领域。
{"title":"Bit serial pattern generation and response compaction using arithmetic functions","authors":"A. P. Stroele","doi":"10.1109/VTEST.1998.670852","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670852","url":null,"abstract":"Adders, subtracters, and multipliers, which are available in many data paths, can be utilized to generate patterns and compact test responses. While previous work studied configurations which process patterns and test responses that have the size of a data word, this paper investigates bit serial pattern generators and compactors as they are required, for example, to test a random logic portion of the circuit by means of a scan path. Different arithmetic pattern generators are proposed that can produce a variety of bit strings with long periods and similar fault coverage as pseudorandom bit strings. The paper also analyzes aliasing in arithmetic compactors that process the test responses bit by bit. An upper bound on the limiting value of the aliasing probability for large test lengths can be computed very efficiently. The results of this paper open up a new range of applications for arithmetic BIST.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132368286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Transition maximization techniques for enhancing the two-pattern fault coverage of pseudorandom test pattern generators 提高伪随机测试图发生器双模式故障覆盖率的过渡最大化技术
Pub Date : 1998-04-26 DOI: 10.1109/VTEST.1998.670905
B. Cockburn, A.L.-C. Kwong
This paper presents simulation evidence supporting the use of bit transition maximization techniques in the design of hardware test pattern generators (TPGs). Bit transition maximization is a heuristic technique that involves increasing the probability that a bit will change values going from one test pattern to the next. For most of the ISCAS-85 benchmarks and many of the ISCAS-89 benchmarks bit transition maximization enhances the fault coverage of two-pattern faults such as gate delay faults and CMOS transistor stuck-open faults. It achieves these benefits without reducing the fault coverage with respect to classical stuck-at faults.
本文给出了支持在硬件测试模式发生器(TPGs)设计中使用比特转移最大化技术的仿真证据。位转换最大化是一种启发式技术,它涉及增加位从一个测试模式到下一个测试模式改变值的概率。对于大多数ISCAS-85基准和许多ISCAS-89基准,位跃迁最大化提高了双模式故障(如栅极延迟故障和CMOS晶体管卡开故障)的故障覆盖率。它在不减少典型卡在故障的故障覆盖率的情况下实现了这些好处。
{"title":"Transition maximization techniques for enhancing the two-pattern fault coverage of pseudorandom test pattern generators","authors":"B. Cockburn, A.L.-C. Kwong","doi":"10.1109/VTEST.1998.670905","DOIUrl":"https://doi.org/10.1109/VTEST.1998.670905","url":null,"abstract":"This paper presents simulation evidence supporting the use of bit transition maximization techniques in the design of hardware test pattern generators (TPGs). Bit transition maximization is a heuristic technique that involves increasing the probability that a bit will change values going from one test pattern to the next. For most of the ISCAS-85 benchmarks and many of the ISCAS-89 benchmarks bit transition maximization enhances the fault coverage of two-pattern faults such as gate delay faults and CMOS transistor stuck-open faults. It achieves these benefits without reducing the fault coverage with respect to classical stuck-at faults.","PeriodicalId":128521,"journal":{"name":"Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122524645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231)
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