Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3487979
Lei Wang;Sha Tang;Tao Zhang;Zhangming Zhu
In this work, a new differential composite probe with parasitic series loops is developed. The proposed probe consists of a U-shaped loop as the driving element, a pair of series dual loops as parasitic loops, and two striplines with two output sub-miniature-As (SMAs). First, a traditional U-shaped loop probe is utilized to test the electromagnetic fields (E and H) at the same time. Second, a pair of series dual loops as parasitic elements is inserted on both sides of the U-shaped loop to improve the detection sensitivity. The reason is that additional parasitic loops can receive more electromagnetic field components, which can increase the detection sensitivity. It is noticed that a pair of special connected via is used to connect the end of series dual loops with the middle U-shaped loop in a mirrored manner. To prevent unwanted electromagnetic modes, two rows of via fences next to these detection loops are introduced into the proposed probe. In addition, to demonstrate the unique features of the presented probe, the probe’s simulation model is simulated, fabricated, and measured based on a standard $50~Omega $ microstrip line. Measured results reveal that the presented differential composite probe can not only test the electromagnetic fields (E and H) at the same time but also have high detection sensitivity and low profile.
{"title":"A New Differential Composite Probe With Parasitic Series Loops and High Sensitivity","authors":"Lei Wang;Sha Tang;Tao Zhang;Zhangming Zhu","doi":"10.1109/TCPMT.2024.3487979","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3487979","url":null,"abstract":"In this work, a new differential composite probe with parasitic series loops is developed. The proposed probe consists of a U-shaped loop as the driving element, a pair of series dual loops as parasitic loops, and two striplines with two output sub-miniature-As (SMAs). First, a traditional U-shaped loop probe is utilized to test the electromagnetic fields (E and H) at the same time. Second, a pair of series dual loops as parasitic elements is inserted on both sides of the U-shaped loop to improve the detection sensitivity. The reason is that additional parasitic loops can receive more electromagnetic field components, which can increase the detection sensitivity. It is noticed that a pair of special connected via is used to connect the end of series dual loops with the middle U-shaped loop in a mirrored manner. To prevent unwanted electromagnetic modes, two rows of via fences next to these detection loops are introduced into the proposed probe. In addition, to demonstrate the unique features of the presented probe, the probe’s simulation model is simulated, fabricated, and measured based on a standard \u0000<inline-formula> <tex-math>$50~Omega $ </tex-math></inline-formula>\u0000 microstrip line. Measured results reveal that the presented differential composite probe can not only test the electromagnetic fields (E and H) at the same time but also have high detection sensitivity and low profile.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"1905-1911"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3488009
Ian Hu;Yi-Rong Huang;Heng-Sheng Lin;Dao-Long Chen
Using numerical simulation to create a digital twin for process evaluation is vital for sustainable and intelligent manufacturing, which can predict manufacturing failures and design for optimization in advance. Material characterization plays a crucial role in a convinced numerical simulation creation. Encapsulation-induced warpage is a vital issue of integrated circuit (IC) packaging. A strip of flip-chip chip-scale package (fcCSP) was chosen as the test vehicle. A Moldex3D simulation model was developed to evaluate the encapsulating process from filling to curing to cooling. The effective curing shrinkage of epoxy molding compound (EMC) can be derived from the encapsulating process. The material properties of EMC, including effective curing shrinkage, thermal shrinkage, and viscoelasticity, are considered in the warpage simulation. The simulation result correlates well with the experiment result. Regarding package design, the effect of various factors on the warpage was investigated using Taguchi’s method. Several component sizes, material parameters, and process parameters were selected as the design factors, including the chip thickness, substrate core thickness, EMC thickness, EMC Young’s modulus, EMC coefficient of thermal expansion, EMC curing shrinkage, mold temperature, and transfer pressure. The evaluation results indicate that the material properties of EMC and mold temperature are the most critical parameters for warpage control of the IC package. This study demonstrates a digital twin for the encapsulating process and provides guidance for robust package design.
{"title":"Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process","authors":"Ian Hu;Yi-Rong Huang;Heng-Sheng Lin;Dao-Long Chen","doi":"10.1109/TCPMT.2024.3488009","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3488009","url":null,"abstract":"Using numerical simulation to create a digital twin for process evaluation is vital for sustainable and intelligent manufacturing, which can predict manufacturing failures and design for optimization in advance. Material characterization plays a crucial role in a convinced numerical simulation creation. Encapsulation-induced warpage is a vital issue of integrated circuit (IC) packaging. A strip of flip-chip chip-scale package (fcCSP) was chosen as the test vehicle. A Moldex3D simulation model was developed to evaluate the encapsulating process from filling to curing to cooling. The effective curing shrinkage of epoxy molding compound (EMC) can be derived from the encapsulating process. The material properties of EMC, including effective curing shrinkage, thermal shrinkage, and viscoelasticity, are considered in the warpage simulation. The simulation result correlates well with the experiment result. Regarding package design, the effect of various factors on the warpage was investigated using Taguchi’s method. Several component sizes, material parameters, and process parameters were selected as the design factors, including the chip thickness, substrate core thickness, EMC thickness, EMC Young’s modulus, EMC coefficient of thermal expansion, EMC curing shrinkage, mold temperature, and transfer pressure. The evaluation results indicate that the material properties of EMC and mold temperature are the most critical parameters for warpage control of the IC package. This study demonstrates a digital twin for the encapsulating process and provides guidance for robust package design.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2088-2097"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3488003
Rui Cao;Huimin He;Fengze Hou;Rui Ma;Fengman Liu;Qidong Wang;Liqiang Cao
With the development of artificial intelligence (AI) and other high-performance computing, the data transmission bandwidth in data centers has increased to 51.2 Tbps and will double every two years. The traditional pluggable optical modules have difficulty in satisfying the requirements. Co-packaged optics (CPO) integrates ASICs and optical engines (OEs) on the same substrate, providing a low energy loss and high throughput solution. However, the CPO structure is complicated and the package size is large. Therefore, the assembly-induced mechanical stresses and warpage of CPO are serious issues. In this article, assembly feasibility based on a $200times 200$ mm2 51.2-Tbps CPO was analyzed by a cross-scale simulation methodology with multiple mechanical stresses. First, the ASIC structure optimization of the CPO was carried out, and the CPO substrate was determined. Then, based on the above-optimized structure, the thermal reflow simulations of ASIC and mechanical compression simulations of OEs were conducted by the birth and death element method. The results showed that the stiffener ring in the ASIC package was optimized to be 3 mm in height and 15 mm in width. The 5-mm PCB was determined for the CPO substrate. The CPO substrate warpage under the socket after the thermal reflow was less than 0.05 mm and the maximum equivalent stresses of the ball grid array (BGA) in the whole assembly process were less than the yield strength of the SAC305 by submodel structure analysis. The socket terminal forces after mechanical compression were greater than 0.1 N. The analyzed results meet the process targets during the assembly of the CPO.
{"title":"Thermomechanical and Compression Analyses for Large-Scale Co-Packaged Optics (CPO) Assembly","authors":"Rui Cao;Huimin He;Fengze Hou;Rui Ma;Fengman Liu;Qidong Wang;Liqiang Cao","doi":"10.1109/TCPMT.2024.3488003","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3488003","url":null,"abstract":"With the development of artificial intelligence (AI) and other high-performance computing, the data transmission bandwidth in data centers has increased to 51.2 Tbps and will double every two years. The traditional pluggable optical modules have difficulty in satisfying the requirements. Co-packaged optics (CPO) integrates ASICs and optical engines (OEs) on the same substrate, providing a low energy loss and high throughput solution. However, the CPO structure is complicated and the package size is large. Therefore, the assembly-induced mechanical stresses and warpage of CPO are serious issues. In this article, assembly feasibility based on a \u0000<inline-formula> <tex-math>$200times 200$ </tex-math></inline-formula>\u0000 mm2 51.2-Tbps CPO was analyzed by a cross-scale simulation methodology with multiple mechanical stresses. First, the ASIC structure optimization of the CPO was carried out, and the CPO substrate was determined. Then, based on the above-optimized structure, the thermal reflow simulations of ASIC and mechanical compression simulations of OEs were conducted by the birth and death element method. The results showed that the stiffener ring in the ASIC package was optimized to be 3 mm in height and 15 mm in width. The 5-mm PCB was determined for the CPO substrate. The CPO substrate warpage under the socket after the thermal reflow was less than 0.05 mm and the maximum equivalent stresses of the ball grid array (BGA) in the whole assembly process were less than the yield strength of the SAC305 by submodel structure analysis. The socket terminal forces after mechanical compression were greater than 0.1 N. The analyzed results meet the process targets during the assembly of the CPO.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2079-2087"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3471051
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3471051","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3471051","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 9","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739383","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555090","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3471053
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3471053","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3471053","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 9","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739382","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3484225
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3484225","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3484225","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 10","pages":"C4-C4"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739375","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3471055
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3471055","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3471055","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 9","pages":"C4-C4"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739377","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142551995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3484223
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3484223","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3484223","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 10","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739380","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-30DOI: 10.1109/TCPMT.2024.3484219
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3484219","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3484219","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 10","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10739376","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142555069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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