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Experimental Analysis on the Interaction Between Interface Trap Charges and Polarization on the Memory Window of Metal-Ferroelectric–Insulator-Si (MFIS) FeFET 金属-费电-绝缘体-硅 (MFIS) FeFET 存储窗口上的界面陷波电荷与极化之间相互作用的实验分析
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3442163
Giuk Kim;Hyojun Choi;Sangho Lee;Hunbeom Shin;Sangmok Lee;Yunseok Nam;Hyunjun Kang;Seokjoong Shin;Hoon Kim;Youngjin Lim;Kang Kim;Il-Kwon Oh;Sang-Hee Ko Park;Jinho Ahn;Sanghun Jeon
In this study, we investigated the impact of unstable and stable interface trap charges (<inline-formula> <tex-math>${Q}_{text {it}}text {)}$ </tex-math></inline-formula> on <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> switching in metal-ferroelectric–insulator-Si (MFIS) ferroelectric field-effect transistors (FeFETs), which vary with the thickness of the insulator. We also examine how these variations ultimately affect the various performance metrics of MFIS FeFETs. To achieve this, we varied the thickness of the insulator (<inline-formula> <tex-math>${t}_{text {IL}}text {)}$ </tex-math></inline-formula> in MFIS FeFETs to 1.5, 2.0, and 2.5 nm, thereby controlling the amount of <inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> injected from the channel into the ferroelectric (FE)/insulator interface. As <inline-formula> <tex-math>${t}_{text {IL}}$ </tex-math></inline-formula> decreases, the amount of <inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> increases, which amplifies the electric field across the FE layer. As a result, <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> switching enhances, and consequently, the MW characteristics of MFIS FeFETs improve. Furthermore, to analyze this in detail, we employed <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula>–<inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> measurements on MFIS FeFETs to simultaneously extract unstable and stable <inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> as well as <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> and MW. The results show that as <inline-formula> <tex-math>${t}_{text {IL}}$ </tex-math></inline-formula> increases to 1.5, 2.0, and 2.5 nm, <inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> during program/erase (PGM/ERS) operations decreases to 100%, 61%, and 54%, respectively. This leads to a corresponding decrease in <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> to 100%, 59%, and 52%. Additionally, after sufficient delay following the PGM/ERS operations, we observe that the proportion stable <inline-formula> <tex-math>${Q}_{text {it}}$ </tex-math></inline-formula> compared to <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> is 91%, regardless to <inline-formula> <tex-math>${t}_{text {IL}}$ </tex-math></inline-formula> and the remaining 9% of <inline-formula> <tex-math>${P}_{text {S}}$ </tex-math></inline-formula> contributes to the MW property. Consequently, as <inline-formula> <tex-math>${t}_{text {IL}}$ </tex-math></inline-formula> increases to 1.5, 2.0, and 2.5 nm, the net charge decreases to 100%, 61%, and 54%, resulting in MW values of 1.85, 1.05, and 0.85 V, respectively. Finally, we analyzed the impact of <inline-formula> <tex-math>${Q}_{text {it}}
在这项研究中,我们研究了不稳定和稳定的界面陷阱电荷({Q}_{text {it}}text {)}$对金属-铁电-绝缘体-硅(MFIS)铁电场效应晶体管(FeFET)中{P}_{text {S}}$开关的影响,这种影响会随着绝缘体厚度的变化而变化。我们还研究了这些变化如何最终影响 MFIS FeFET 的各种性能指标。为此,我们将 MFIS FeFET 中绝缘体的厚度(${t}_{text {IL}}text {)}$分别调整为 1.5、2.0 和 2.5 nm,从而控制从沟道注入铁电 (FE) / 绝缘体界面的 ${Q}_{text {it}}$。随着 ${t}_{text {IL}}$的减少,${Q}_{text {it}}$的量也会增加,从而放大铁电层上的电场。因此,${P}_{text {S}}$开关增强,从而改善了MFIS FeFET的MW特性。此外,为了详细分析这一点,我们对 MFIS FeFET 进行了 ${P}_{text {S}}$ - ${Q}_{text {it}}$ 测量,以同时提取不稳定和稳定的 ${Q}_{text {it}}$ 以及 ${P}_{text {S}}$ 和 MW。结果表明,当 ${t}_{text {IL}}$ 增加到 1.5、2.0 和 2.5 nm 时,编程/擦除 (PGM/ERS) 操作期间的 ${Q}_{text {it}}$ 分别下降到 100%、61% 和 54%。这导致 ${P}_{text {S}}$ 相应下降到 100%、59% 和 52%。此外,在PGM/ERS操作后经过足够的延迟,我们观察到与${P}_{text {S}}$相比,稳定的${Q}_{text {it}}$的比例为91%,与${t}_{text {IL}}$无关,剩余9%的${P}_{text {S}}$对MW特性做出了贡献。因此,当 ${t}_{text {IL}}$ 增加到 1.5、2.0 和 2.5 nm 时,净电荷分别减少到 100%、61% 和 54%,从而导致 MW 值分别为 1.85、1.05 和 0.85 V。最后,我们分析了作为 ${t}_{text {IL}}$ 函数的 ${Q}_{text {it}}$ 生成对 MFIS FeFET 的可变性和耐用性特性的影响。
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引用次数: 0
Bridging the Data Gap in Photovoltaics with Synthetic Data Generation 通过合成数据生成弥补光伏领域的数据差距
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3463273
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引用次数: 0
Blank Page 空白页
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3463279
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引用次数: 0
GaN-Based Freestanding Micro-LEDs With GHz Bandwidth and Low Efficiency Droop for Visible Light Communication 基于氮化镓的独立式微型 LED,具有 GHz 带宽和低效率骤降,适用于可见光通信
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3456770
Jinpeng Huang;Guobin Wang;Handan Xu;Feifan Xu;Ting Zhi;Wenjuan Chen;Yimeng Sang;Dongqi Zhang;Junchi Yu;Honghui He;Ke Xu;Pengfei Tian;Tao Tao;Bin Liu;Rong Zhang
Visible light communication (VLC) based on micro light-emitting diodes (micro-LEDs) offers energy-efficient methods for explosive data transmission. However, the severe quantum-confined stark effect (QCSE) and carrier localization make it challenging for micro-LEDs to achieve both high modulation bandwidth and high external quantum efficiency (EQE). Herein, GaN-based freestanding micro-LEDs with varying quantum barrier (QB) thicknesses were designed and fabricated. The thinner QBs effectively reduce the QCSE and improve carrier transport, resulting in high modulation bandwidth and less efficiency droop. Homoepitaxial growth of micro-LEDs gives birth to further improved modulation bandwidth and optical power due to lower defect density and improved thermal dispassion. The −3 dB bandwidths of the 10 and $20~mu $ m-diameter freestanding micro-LEDs exceed 1.03 GHz and 823 MHz, respectively. A high optical power of 5.54 mW and a data rate of 4.08 Gb/s, while maintaining a relatively high EQE of 4.17%, were achieved on $20~mu $ m-diameter devices. The proposed methods systematically improve the modulation bandwidth and luminescence efficiency, demonstrating the significant potential for free-space VLC.
基于微型发光二极管(micro-LED)的可见光通信(VLC)为爆炸性数据传输提供了节能方法。然而,严重的量子约束效应(QCSE)和载流子局域化使得微型发光二极管在实现高调制带宽和高外部量子效率(EQE)方面面临挑战。在此,我们设计并制造了具有不同量子势垒(QB)厚度的氮化镓基独立微型 LED。较薄的量子势垒可有效降低 QCSE 并改善载流子传输,从而实现较高的调制带宽和较低的效率下降。由于缺陷密度更低,热分散性更好,微型 LED 的同向外延生长进一步提高了调制带宽和光功率。直径分别为 10 和 20~mu $ m 的独立式微型发光二极管的 -3 dB 带宽分别超过了 1.03 GHz 和 823 MHz。在直径为 20~mu $ m 的器件上实现了 5.54 mW 的高光功率和 4.08 Gb/s 的数据传输速率,同时保持了 4.17% 的相对较高的 EQE。所提出的方法系统地提高了调制带宽和发光效率,证明了自由空间 VLC 的巨大潜力。
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引用次数: 0
A Taylor Series Approximation Model for Characterizing the Output Resistance of a GFET 表征 GFET 输出电阻的泰勒级近似模型
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3458928
Xiomara Ribero-Figueroa;Anibal Pacheco-Sanchez;Tzu-Jung Huang;David Jiménez;Ivan Puchades;Reydezel Torres-Torres
The mobility-degradation-based model for the drain-to-source or output resistance of a graphene field-effect transistor (GFET) is linearized here using a Taylor series approximation. This simplification is shown to be valid from the magnitudes of the gate voltage not significantly higher than the Dirac voltage, and it enables the analytical determination of the transconductance parameter, the voltage related to residual charges, and a bias-independent series resistance of the GFET. Furthermore, a continuous representation of the device’s static response is achieved when substituting the extracted parameters into the model, regardless the transfer characteristic symmetry with respect to the Dirac voltage.
本文使用泰勒级数近似法对基于迁移率降解的石墨烯场效应晶体管(GFET)漏极至源极或输出电阻模型进行了线性化。从栅极电压不明显高于狄拉克电压的量级来看,这种简化是有效的,并能分析确定石墨烯场效应晶体管的跨导参数、与残余电荷相关的电压以及与偏置无关的串联电阻。此外,在将提取的参数代入模型时,可实现器件静态响应的连续表示,而无需考虑相对于狄拉克电压的传递特性对称性。
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引用次数: 0
IEEE Transactions on Electron Devices Information for Authors 电气和电子工程师学会《电子器件学报》(IEEE Transactions on Electron Devices)为作者提供的信息
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3463277
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引用次数: 0
Narrow Dual-Band Photodetector Based on Cs2AgBiBr6 Lead-Free Double Perovskite Single Crystal 基于 Cs2AgBiBr6 无铅双包晶单晶的窄双波段光电探测器
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3457548
Sampati Rao Sridhar;Naveen Kumar Tailor;Soumitra Satapathi;Brijesh Kumar
Narrowband photodetectors play a vital role in imaging and sensing applications. Due to exceptional optoelectronic properties and tunable bandgap, perovskites are highly suitable for realizing narrowband photodetection. In this work, a narrow dual-band photodetector based on lead-free perovskite single crystal (PSC) Cs2AgBiBr6 is fabricated. The detector showed a narrowband response spectrum with dual bands with a peak response at 530 and 590 nm. A detectivity of 109 Jones with a full-width half maximum (FWHM) of 42 nm is achieved in both bands. The detector showed a rise time ( ${t}_{text {r}}$ ) of 92 ms and a fall time ( ${t}_{text {f}}$ ) of 271 ms under 530 nm illumination, along with a stable performance up to 25 days in ambient conditions. This attempt demonstrates a stable narrow dual-band photodetection using a lead-free Cs2AgBiBr6 double PSC for multispectral imaging applications.
窄带光电探测器在成像和传感应用中发挥着至关重要的作用。由于具有优异的光电特性和可调带隙,包晶非常适合实现窄带光电探测。在这项研究中,我们制作了一种基于无铅包晶单晶(PSC)Cs2AgBiBr6 的窄双波段光电探测器。该探测器显示出窄带响应光谱,在 530 纳米和 590 纳米处具有双波段峰值响应。两个波段的检测率均为 109 Jones,全宽半最大值(FWHM)均为 42 nm。在 530 纳米光照下,探测器的上升时间({t}_{text {r}}$)为 92 毫秒,下降时间({t}_{text {f}}$)为 271 毫秒,并且在环境条件下性能稳定达 25 天。这一尝试展示了使用无铅 Cs2AgBiBr6 双 PSC 进行多光谱成像应用的稳定窄双波段光电探测。
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引用次数: 0
Metal Interlayer Insertion for Grain Engineering in Ferroelectric Hf₀.₅Zr₀.₅O₂ 铁电 Hf₀.₅Zr₀.₅O₂中用于晶粒工程的金属层间插入技术
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3447614
Anh-Duy Nguyen;Si-Un Song;An Hoang Thuy Nguyen;Cuong-Manh Nguyen;Ye-Eun Hong;Yeongshin Ham;Jae-Kyeong Kim;Jong-Hwa Baek;Kyungsoo Hwang;Geon Park;Hyun Soo Kim;Hoyeon Sin;Rino Choi
Since its discovery in the previous decade, ferroelectricity (FE) in zirconium-doped hafnium oxide (HZO) has been studied intensively. With HZO being incorporated in multiple applications, grain size reduction has become essential to enhance the ferroelectric performance and scalability. A common method is implementing a dielectric interlayer (IL) in the middle of HZO films while sacrificing operating power caused by voltage drop across the additional material. This research implemented W and Mo metal ILs in the middle of the HZO stack to prevent grain growth. The effects of the ILs on ferroelectric performance were studied using metal-ferroelectric–insulator-silicon structure. Transmission electron microscopy (TEM) and grazing-incidence X-ray diffraction were used to examine the grain formation in HZO. The results show that metal ILs have successfully improved the ferroelectric performance by suppressing the nonferroelectric monoclinic phase while promoting the formation of the orthorhombic phase. The sample with W IL acting as electrodes for both upper and under HZO thin films was more resilient to fatigue than that with the Mo IL. Hence, W metal ILs can enable HZO implementation in a wider range of application.
自从前十年发现掺锆氧化铪(HZO)的铁电性(FE)以来,人们一直在对其进行深入研究。随着 HZO 被应用于多种领域,缩小晶粒尺寸对于提高铁电性能和可扩展性至关重要。一种常见的方法是在 HZO 薄膜中间加入介电中间层 (IL),但会因附加材料上的电压降而牺牲工作功率。这项研究在 HZO 叠层中间加入了 W 和 Mo 金属 IL,以防止晶粒生长。利用金属-铁电-绝缘体-硅结构研究了绝缘体对铁电性能的影响。透射电子显微镜(TEM)和掠入射 X 射线衍射被用来研究 HZO 中晶粒的形成。结果表明,金属绝缘体抑制了非铁电性单斜相,同时促进了正交相的形成,从而成功地改善了铁电性能。使用 W IL 作为上层和下层 HZO 薄膜电极的样品比使用 Mo IL 的样品具有更强的抗疲劳性。因此,金属 W IL 可使 HZO 的应用范围更广。
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引用次数: 0
IEEE ELECTRON DEVICES SOCIETY IEEE 电子设备协会
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3463271
{"title":"IEEE ELECTRON DEVICES SOCIETY","authors":"","doi":"10.1109/TED.2024.3463271","DOIUrl":"https://doi.org/10.1109/TED.2024.3463271","url":null,"abstract":"","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9,"publicationDate":"2024-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10691650","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142320483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Leakage Current and Breakdown Characteristics of Isolation in Gallium Nitride Lateral Power Devices 氮化镓侧向功率器件的泄漏电流和隔离击穿特性
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/TED.2024.3458945
Mansura Sadek;Sang-Woo Han;Anusmita Chakravorty;Jesse T. Kemmerling;Rian Guan;Jianan Song;Yixin Xiong;James Lundh;Karl D. Hobart;Travis J. Anderson;Rongming Chu
In gallium nitride (GaN) lateral power devices with advanced E-field management, isolation becomes a bottleneck for achieving higher breakdown voltage (BV). To understand the physical mechanism of isolation, the experimental analysis of isolation structures is done in this work. This article presents the measured leakage current and breakdown characteristics of isolation structures, compatible with lateral devices. For unimplanted isolation structures, leakage is injection barrier limited and breakdown is by surface punchthrough. BV has a quadratic dependence on the isolation length. Ion implantation introduces trap-limited hopping conduction, marked by the exponentially field-dependent conductance. After implantation, despite an increase in leakage current, BV increases drastically. The dependence of BV on isolation length changes from quadratic in unimplanted isolation to linear in implanted one due to flattening of E-field. To achieve high BV in GaN lateral power devices, the implanted isolation structure is preferred at the cost of high isolation leakage.
在采用先进电场管理的氮化镓(GaN)横向功率器件中,隔离成为实现更高击穿电压(BV)的瓶颈。为了了解隔离的物理机制,本文对隔离结构进行了实验分析。本文介绍了与横向器件兼容的隔离结构的测量漏电流和击穿特性。对于非植入式隔离结构,漏电流受注入势垒限制,击穿则通过表面击穿实现。BV 与隔离长度呈二次关系。离子注入引入了陷阱限制的跳变传导,其特点是电导呈指数变化。离子注入后,尽管漏电流增加,但 BV 却急剧增加。由于电场的扁平化,BV 与隔离长度的关系从未遭植入隔离时的二次方关系变为植入隔离时的线性关系。为了在氮化镓横向功率器件中实现高 BV,最好采用植入式隔离结构,但代价是要付出高隔离泄漏的代价。
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引用次数: 0
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IEEE Transactions on Electron Devices
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