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IEEE ELECTRON DEVICES SOCIETY IEEE 电子设备协会
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3444215
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引用次数: 0
Blank Page 空白页
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3444221
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引用次数: 0
Current Kink Effect in $beta $-Ga$_{text{2}}$O$_{text{3}}$ MOSFETs Induced by Incomplete Ionization of Donors 供体不完全电离诱发的 $beta $-Ga$_{text{2}}$O$_{text{3}}$ MOSFET 中的电流扭结效应
IF 3.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/ted.2024.3440950
Xinxin Yu, Hehe Gong, Jianjun Zhou, Zhenghao Shen, Fangfang Ren, Dunjun Chen, Xin Ou, Shulin Gu, Yuechan Kong, Zhonghui Li, Tangsheng Chen, Rong Zhang, Youdou Zheng, Jiandong Ye
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引用次数: 0
IEEE Transactions on Electron Devices Information for Authors 电气和电子工程师学会《电子器件学报》(IEEE Transactions on Electron Devices)为作者提供的信息
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3444219
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引用次数: 0
Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices 电气和电子工程师学会电子器件期刊》智能传感器系统特刊
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3428843
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引用次数: 0
TechRxiv: Share Your Preprint Research with the World! TechRxiv:与世界分享您的预印本研究成果!
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3446209
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引用次数: 0
Simulation Study on Comparison of “Inside-Channel” and “On-Dielectric” Source Contact Modifications on the Performance of the Vertical Organic Field Effect Transistors 比较 "沟道内 "和 "介质上 "源触点修改对垂直有机场效应晶体管性能影响的仿真研究
IF 3.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/ted.2024.3442188
Sirsendu Ghosh, Ramesh Singh Bisht, Pramod Kumar
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引用次数: 0
Bridging the Data Gap in Photovoltaics with Synthetic Data Generation 通过合成数据生成弥补光伏领域的数据差距
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-23 DOI: 10.1109/TED.2024.3444217
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引用次数: 0
Comprehensive Characterization Method for Modeling Retention Transients in NAND Flash Memory NAND 闪存中保持瞬态建模的综合表征方法
IF 3.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-22 DOI: 10.1109/ted.2024.3442984
Wen-Chien Liu, Yung-Yueh Chiu, Toshiaki Takeshita, Riichiro Shirota
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引用次数: 0
Suppression of Threshold Voltage Variation by H₂ Plasma Improved KrF Photoresist Profile 通过 H₂ 等离子体改进 KrF 光刻胶剖面来抑制阈值电压变化
IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-16 DOI: 10.1109/TED.2024.3433311
Cheng-Hao Liang;Ran Bi;Hao Liu;Song He;Hang Li;Yu-Long Jiang
The effect of H2 plasma improved KrF photoresist (PR) profile after exposure without bottom anti-reflection coating (BARC) on planar PMOSFET performance in static random access memory (SRAM) is investigated. The proposed H2 plasma treatment is revealed to be able to obtain a well-controlled KrF PR profile with a more PR-safer process. It is demonstrated that such a KrF PR profile can effectively prevent the ions of NMOSFET pocket ion implantation from entering the substrate of PMOSFET. Hence, ~17% reduction of threshold voltage local variation for PMOSFETs in SRAM and ~8 mV improvement of static noise margin (SNM) for SRAM cell can be obtained without performance degradation for both NMOSFETs and PMOSFETs.
研究了 H2 等离子体在无底部抗反射涂层 (BARC) 曝光后对 KrF 光阻 (PR) 曲线的改进对静态随机存取存储器 (SRAM) 中平面 PMOSFET 性能的影响。结果表明,所建议的 H2 等离子体处理方法能够获得控制良好的 KrF PR 曲线,并采用更安全的 PR 工艺。研究表明,这种 KrF PR 曲线能有效防止 NMOSFET 袋式离子注入的离子进入 PMOSFET 的基底。因此,在不降低 NMOSFET 和 PMOSFET 性能的情况下,可将 SRAM 中 PMOSFET 的阈值电压局部变化降低约 17%,并将 SRAM 单元的静态噪声裕量 (SNM) 提高约 8 mV。
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引用次数: 0
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