Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Abstract In this paper, we present our results on a relatively new kind of blower called Volumetric Resistance Blower (VRB) for cooling of portable computing platforms like laptop computers. The VRB performance was modeled numerically and compared to traditional bladed blowers. The sources of noise, dominant in bladed blower are absent in case of VRB, because it uses a continuous porous disc instead of discrete blades. Thus, even though at iso-rpm, VRB yielded lower flow rate, its iso acoustic performance could be superior. Hence, further analysis was crucial to quantify the potential benefit. The acoustics experiments for bladed blower and VRB were conducted in a hemi-anechoic chamber in accordance with ECMA-74[1] and ECMA TR/99 [2] standards. Iso-acoustics pressure vs volume flow rate plot for both bladed blower and VRB are compared. VRB was found to have superior performance as compared to bladed blower. The volume flow rate at open flow condition for bladed blower and VRB are comparable, but as back pressure increased the flow rate yielded by VRB kept increasing and at stagnation condition, VRB showed around 79% higher static pressure. In the second part of the work, the experimentally validated numerical model for VRB was used for numerical optimization using a DOE approach and varying the geometrical parameters. Rotor distance (minimum distance from the axis of rotation of impeller to the cutwater surface) was found to be the most important parameter and an optimum value was found. A second DOE elucidated the optimal rotor hub center location in the 2-dimensional space inside the casing as when the rotor is tucked back into the casing as much as possible and when the rotor distance is above 20.15 mm. A partial P-Q curve is generated (up to 20 Pa) for optimal geometry configuration. Based on the numerical and experimental evidence, VRB is found to have the potential to replace traditional bladed design in portable computing devices. In addition, due to absence of blades, it creates lower tonal noise, giving a much more comfortable experience to the end user.
{"title":"Numerical And Experimental Investigation Of A Volumetric Resistance Blower Performance And Its Optimization For Portable Computing Device Applications","authors":"Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya","doi":"10.1115/1.4063917","DOIUrl":"https://doi.org/10.1115/1.4063917","url":null,"abstract":"Abstract In this paper, we present our results on a relatively new kind of blower called Volumetric Resistance Blower (VRB) for cooling of portable computing platforms like laptop computers. The VRB performance was modeled numerically and compared to traditional bladed blowers. The sources of noise, dominant in bladed blower are absent in case of VRB, because it uses a continuous porous disc instead of discrete blades. Thus, even though at iso-rpm, VRB yielded lower flow rate, its iso acoustic performance could be superior. Hence, further analysis was crucial to quantify the potential benefit. The acoustics experiments for bladed blower and VRB were conducted in a hemi-anechoic chamber in accordance with ECMA-74[1] and ECMA TR/99 [2] standards. Iso-acoustics pressure vs volume flow rate plot for both bladed blower and VRB are compared. VRB was found to have superior performance as compared to bladed blower. The volume flow rate at open flow condition for bladed blower and VRB are comparable, but as back pressure increased the flow rate yielded by VRB kept increasing and at stagnation condition, VRB showed around 79% higher static pressure. In the second part of the work, the experimentally validated numerical model for VRB was used for numerical optimization using a DOE approach and varying the geometrical parameters. Rotor distance (minimum distance from the axis of rotation of impeller to the cutwater surface) was found to be the most important parameter and an optimum value was found. A second DOE elucidated the optimal rotor hub center location in the 2-dimensional space inside the casing as when the rotor is tucked back into the casing as much as possible and when the rotor distance is above 20.15 mm. A partial P-Q curve is generated (up to 20 Pa) for optimal geometry configuration. Based on the numerical and experimental evidence, VRB is found to have the potential to replace traditional bladed design in portable computing devices. In addition, due to absence of blades, it creates lower tonal noise, giving a much more comfortable experience to the end user.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136104166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Utsav Gupta, Andras Vass-Varnai, Voon H Wong, Ayman Fayed
Abstract Power electronic components are found in all areas of an electric vehicle, from power train to motors and from battery to ancillary loads and these converters are manufactured in Silicon (Si). However, there are many other applications where the design requirements on power converters are too stringent to be met using conventional Silicon-based solutions. This includes applications in electric vehicles, defense & aerospace, subterranean exploration, and geothermal energy. For power converters in such applications, SiC offers many advantages over Si. While doing the electrical design of a power converter, the thermal aspects are usually neglected causing a vast difference in the simulation and real-life application. This paper aims to show how taking thermal characteristics into account for a power converter is beneficial and how it influences the results. This is done with two different SiC device models to replicate the results and to demonstrate the conclusiveness of the analysis. First, the electrical design of a buck converter is presented and then the thermal aspects of a design are explained in detail. Finally, both aspects are combined, and detailed simulations are shown in multiple different cases which provide a significant difference in the results validating the hypothesis.
{"title":"Analysis And Modeling Of A Sic Based Buck Converter And Its Effects In An Electric Vehicle Application","authors":"Utsav Gupta, Andras Vass-Varnai, Voon H Wong, Ayman Fayed","doi":"10.1115/1.4063883","DOIUrl":"https://doi.org/10.1115/1.4063883","url":null,"abstract":"Abstract Power electronic components are found in all areas of an electric vehicle, from power train to motors and from battery to ancillary loads and these converters are manufactured in Silicon (Si). However, there are many other applications where the design requirements on power converters are too stringent to be met using conventional Silicon-based solutions. This includes applications in electric vehicles, defense & aerospace, subterranean exploration, and geothermal energy. For power converters in such applications, SiC offers many advantages over Si. While doing the electrical design of a power converter, the thermal aspects are usually neglected causing a vast difference in the simulation and real-life application. This paper aims to show how taking thermal characteristics into account for a power converter is beneficial and how it influences the results. This is done with two different SiC device models to replicate the results and to demonstrate the conclusiveness of the analysis. First, the electrical design of a buck converter is presented and then the thermal aspects of a design are explained in detail. Finally, both aspects are combined, and detailed simulations are shown in multiple different cases which provide a significant difference in the results validating the hypothesis.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"25 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135512851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.
{"title":"The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch","authors":"Justin Chow, Suresh Sitaraman","doi":"10.1115/1.4063485","DOIUrl":"https://doi.org/10.1115/1.4063485","url":null,"abstract":"Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135044297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Abstract Jet impingement cooling is an advanced thermal management technique for high heat flux applications. Standard configurations include single, axisymmetric jets with orifice, slot, or pipe nozzles. This choice in nozzle shape, number of jets, and jet inclination greatly influences the turbulence generated by fluid entrainment due to differences in initial velocity profiles and location of secondary stagnation points. Regarding high power electronics with integrated jet impingement schemes, turbulence, and heat transfer rates must be optimized to meet the extreme cooling requirements. In this study, the heat transfer rates of dual inclined converging jets are investigated experimentally. Emphasis is placed on the comparison of different jet schemes with respect to geometrical parameters including nozzle pitch, incline angle, and nozzle-to-target plate spacing. A parametric experimental investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Computational simulations are used to evaluate the effect of jet configuration on stagnation pressure associated with maximum heat transfer rates, and an empirical Nusselt number model is provided. The results show the effects of convergence height on jet behavior and the associated impacts on heat transfer.
{"title":"Converging Jet Impingement for Enhanced Liquid Cooling","authors":"Reece Whitt, Rafael Estrella, David Huitink","doi":"10.1115/1.4063484","DOIUrl":"https://doi.org/10.1115/1.4063484","url":null,"abstract":"Abstract Jet impingement cooling is an advanced thermal management technique for high heat flux applications. Standard configurations include single, axisymmetric jets with orifice, slot, or pipe nozzles. This choice in nozzle shape, number of jets, and jet inclination greatly influences the turbulence generated by fluid entrainment due to differences in initial velocity profiles and location of secondary stagnation points. Regarding high power electronics with integrated jet impingement schemes, turbulence, and heat transfer rates must be optimized to meet the extreme cooling requirements. In this study, the heat transfer rates of dual inclined converging jets are investigated experimentally. Emphasis is placed on the comparison of different jet schemes with respect to geometrical parameters including nozzle pitch, incline angle, and nozzle-to-target plate spacing. A parametric experimental investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Computational simulations are used to evaluate the effect of jet configuration on stagnation pressure associated with maximum heat transfer rates, and an empirical Nusselt number model is provided. The results show the effects of convergence height on jet behavior and the associated impacts on heat transfer.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135044296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Abstract Autonomous vehicles are part of an expanding industry that encompasses various interdisciplinary fields such as dynamic controls, thermal engineering, sensors, data processing, and artificial intelligence. Exposure to extreme environmental conditions, such as changes to temperature and humidity, affects sensor performance. To address potential safety concerns related to sensor perception used in autonomous vehicles in extremely cold real-world situations, specifically Alaska, examination of frosts and water droplets impact on vehicle optical sensors is conducted in both real-world and laboratory-controlled settings. Machine learning models are utilized to determine the vision impediment levels. Potential hardware and software tools are then introduced as solutions for the environmental impacts. Through this research, a better understanding of the potential caveats and algorithm solutions can be suggested to improve autonomous driving, even under challenging weather conditions.
{"title":"Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska","authors":"Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won","doi":"10.1115/1.4063486","DOIUrl":"https://doi.org/10.1115/1.4063486","url":null,"abstract":"Abstract Autonomous vehicles are part of an expanding industry that encompasses various interdisciplinary fields such as dynamic controls, thermal engineering, sensors, data processing, and artificial intelligence. Exposure to extreme environmental conditions, such as changes to temperature and humidity, affects sensor performance. To address potential safety concerns related to sensor perception used in autonomous vehicles in extremely cold real-world situations, specifically Alaska, examination of frosts and water droplets impact on vehicle optical sensors is conducted in both real-world and laboratory-controlled settings. Machine learning models are utilized to determine the vision impediment levels. Potential hardware and software tools are then introduced as solutions for the environmental impacts. Through this research, a better understanding of the potential caveats and algorithm solutions can be suggested to improve autonomous driving, even under challenging weather conditions.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134947740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, <b>145</b>(2), p. 021005; DOI: 10.1115/1.4055591]","authors":"Erica Hodge","doi":"10.1115/1.4063546","DOIUrl":"https://doi.org/10.1115/1.4063546","url":null,"abstract":"","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134946921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Deshpande, Aniket Bharamgonda, Q. Jiang, Abhijit Dasgupta
This paper focuses on anisotropic elastic-plastic constitutive modeling of SAC (SnAgCu) solder grains because of their importance in modeling the behavior of oligocrystalline (few-grained) micron-scale solder joints that are increasingly common in heterogeneous integration. Such grain-scale anisotropic modeling approach provides more accurate assessment of the mechanical response of solder interconnects in terms of predicting different failure modes, failure sites and variability in time-to-failure. Anisotropic plasticity is represented using Hill-Ramberg Osgood continuum plasticity model, which utilizes Hill's anisotropic plastic potential, along with a Ramberb-Osgood (RO) power-law plastic hardening flow rule. Mechanistically motivated empirical scaling factors are proposed to extrapolate the stress-strain response for different grain sizes/shapes and for different coarseness of microstructures within each grain (generated with different cooling rates). This scaling factor can therefore also capture the effects of microstructural coarsening due to isothermal aging. This goal is achieved by first conducting monotonic tensile and shear tests on monocrystalline and oligocrystalline SAC305 solder joints containing grains of various geometries and also intragranular microscale (dendritic and eutectic) structures of various coarseness. The grain structures are characterized for each tested specimen using electron backscattered diffraction (EBSD). The Hill-RO model constants and the empirical scaling factors are then estimated by matching grain-scale anisotropic elastic-plastic finite element models of each tested specimen to the measured stress-strain behavior, using an inverse-iteration process. Grain shape is seen to influence the sensitivity of the effective stress-strain curves to the applied stress state (i.e. to the orientation of the principal stress directions), relative to (i) the material principal directions and (ii) the geometric principal directions of grains with high aspect ratio. Limitations of the current results and opportunities for future improvements are discussed.
{"title":"Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals","authors":"A. Deshpande, Aniket Bharamgonda, Q. Jiang, Abhijit Dasgupta","doi":"10.1115/1.4063325","DOIUrl":"https://doi.org/10.1115/1.4063325","url":null,"abstract":"\u0000 This paper focuses on anisotropic elastic-plastic constitutive modeling of SAC (SnAgCu) solder grains because of their importance in modeling the behavior of oligocrystalline (few-grained) micron-scale solder joints that are increasingly common in heterogeneous integration. Such grain-scale anisotropic modeling approach provides more accurate assessment of the mechanical response of solder interconnects in terms of predicting different failure modes, failure sites and variability in time-to-failure. Anisotropic plasticity is represented using Hill-Ramberg Osgood continuum plasticity model, which utilizes Hill's anisotropic plastic potential, along with a Ramberb-Osgood (RO) power-law plastic hardening flow rule. Mechanistically motivated empirical scaling factors are proposed to extrapolate the stress-strain response for different grain sizes/shapes and for different coarseness of microstructures within each grain (generated with different cooling rates). This scaling factor can therefore also capture the effects of microstructural coarsening due to isothermal aging. This goal is achieved by first conducting monotonic tensile and shear tests on monocrystalline and oligocrystalline SAC305 solder joints containing grains of various geometries and also intragranular microscale (dendritic and eutectic) structures of various coarseness. The grain structures are characterized for each tested specimen using electron backscattered diffraction (EBSD). The Hill-RO model constants and the empirical scaling factors are then estimated by matching grain-scale anisotropic elastic-plastic finite element models of each tested specimen to the measured stress-strain behavior, using an inverse-iteration process. Grain shape is seen to influence the sensitivity of the effective stress-strain curves to the applied stress state (i.e. to the orientation of the principal stress directions), relative to (i) the material principal directions and (ii) the geometric principal directions of grains with high aspect ratio. Limitations of the current results and opportunities for future improvements are discussed.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49044439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]","authors":"W. Yeung, T. Lam","doi":"10.1115/1.4063174","DOIUrl":"https://doi.org/10.1115/1.4063174","url":null,"abstract":"","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45302948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
As surface mount components shrink in size, smaller apertures on stencils during solder paste printing can lead to uneven solder volume on a single resistor. This can result in the formation of irregular solder shapes, which are often deemed acceptable criterion depending on assembly house. However, such irregularities can potentially introduce variations in the fatigue life of the surface mount component. This study employs experimental and numerical approaches to investigate the reliability of differently shaped SAC305 solder joints on a single chip resistor. Four distinct solder shapes, concave, straight, tiny convex, and convex, are generated using varying volumes of solder paste controlled by uniquely designed apertures on a stencil. 8 pairs of differently shaped solder joints are assembled to hold a chip resistor in place. The test assembly involves R1005 and R0402 soldered with SAC305 and undergoes thermal shock cycling. As a single chip resistor assembly consists of two solder joints connecting termination and pads, the effect of solder volume difference between two solder joints are investigated. The fatigue life corresponds to decrease as the solder volume difference increase as 40, 80, and 120%. Conversely, total volume of two solder joints in a single chip resistor increases in scenarios with the same volume difference between two solder joints. Experimental data and FEA lead to a new set of Darveaux's constants specific to this assembly. This study provides guideline to control the solder paste volumes in relation to fatigue life and enables numerical solution using a new Darveaux's constants.
{"title":"Effect of Differently Shaped Solder Joints of Chip Resistor On Fatigue Life","authors":"J. Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park","doi":"10.1115/1.4063058","DOIUrl":"https://doi.org/10.1115/1.4063058","url":null,"abstract":"\u0000 As surface mount components shrink in size, smaller apertures on stencils during solder paste printing can lead to uneven solder volume on a single resistor. This can result in the formation of irregular solder shapes, which are often deemed acceptable criterion depending on assembly house. However, such irregularities can potentially introduce variations in the fatigue life of the surface mount component. This study employs experimental and numerical approaches to investigate the reliability of differently shaped SAC305 solder joints on a single chip resistor. Four distinct solder shapes, concave, straight, tiny convex, and convex, are generated using varying volumes of solder paste controlled by uniquely designed apertures on a stencil. 8 pairs of differently shaped solder joints are assembled to hold a chip resistor in place. The test assembly involves R1005 and R0402 soldered with SAC305 and undergoes thermal shock cycling. As a single chip resistor assembly consists of two solder joints connecting termination and pads, the effect of solder volume difference between two solder joints are investigated. The fatigue life corresponds to decrease as the solder volume difference increase as 40, 80, and 120%. Conversely, total volume of two solder joints in a single chip resistor increases in scenarios with the same volume difference between two solder joints. Experimental data and FEA lead to a new set of Darveaux's constants specific to this assembly. This study provides guideline to control the solder paste volumes in relation to fatigue life and enables numerical solution using a new Darveaux's constants.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44690405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Lau, G. Chen, C. Yang, Vincet Teng, A. Peng, J. Huang, N. Liu, Y. Chen, TJ Tseng, Ming Li
The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two different chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.
{"title":"Hybrid Substrates For Heterogeneous Integration","authors":"J. Lau, G. Chen, C. Yang, Vincet Teng, A. Peng, J. Huang, N. Liu, Y. Chen, TJ Tseng, Ming Li","doi":"10.1115/1.4062993","DOIUrl":"https://doi.org/10.1115/1.4062993","url":null,"abstract":"\u0000 The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two different chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47439969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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