Abstract Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production costs and are thinner, lighter, and nonbreakable, resulting in a new form of application for electronic devices. One such use is the employment of electronic gadgets in the daily surroundings to monitor one's vitals. These devices are frequently exposed to dust, perspiration, and moisture. They are frequently subjected to bending and folding action, which causes stresses to accumulate in those devices. These stressors and the hostile environment are frequently minimized by using potting encapsulants to increase durability. In our investigation, we picked six distinct encapsulant formulations and exposed them to varied cure profiles to measure the adhesive bond strength of the encapsulants. The benchmark peel strength was constructed using a Finite element model of the AU-biometric band. The encapsulants peel strength was used to determine which material performed best under experimental conditions. This study presents a sample geometry comprising six different encapsulants and two distinct substrates, polyimide and PET, which were evaluated at four different cure schedules and cleaned using two different cleaning procedures. The encapsulants are ranked against one another to determine their potential future usage in flexible hybrid electronics (FHE) devices.
{"title":"Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications","authors":"Pradeep Lall, Padmanava Choudhury, Scott Miller","doi":"10.1115/1.4056477","DOIUrl":"https://doi.org/10.1115/1.4056477","url":null,"abstract":"Abstract Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production costs and are thinner, lighter, and nonbreakable, resulting in a new form of application for electronic devices. One such use is the employment of electronic gadgets in the daily surroundings to monitor one's vitals. These devices are frequently exposed to dust, perspiration, and moisture. They are frequently subjected to bending and folding action, which causes stresses to accumulate in those devices. These stressors and the hostile environment are frequently minimized by using potting encapsulants to increase durability. In our investigation, we picked six distinct encapsulant formulations and exposed them to varied cure profiles to measure the adhesive bond strength of the encapsulants. The benchmark peel strength was constructed using a Finite element model of the AU-biometric band. The encapsulants peel strength was used to determine which material performed best under experimental conditions. This study presents a sample geometry comprising six different encapsulants and two distinct substrates, polyimide and PET, which were evaluated at four different cure schedules and cleaned using two different cleaning procedures. The encapsulants are ranked against one another to determine their potential future usage in flexible hybrid electronics (FHE) devices.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136082367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Garakani, Udara S. Somarathna, Ashraf Umar, G. Khinda, M. Y. Abdelatty, EI Mehdi Abbara, Sari Al Zerey, M. Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, M. Ronay, M. Poliks
Liquid metal-based gallium conductors exhibit unique physical and electromechanical properties, which make them excellent candidates for the next generation of wearable electronics. In this study, a novel fluid phase-based gallium conductor was stencil printed on thermoplastic polyurethane (TPU) to fabricate a stretchable conductor as well as a stretchable radio frequency (RF) transmission line. The electromechanical reliability of the conductor during high elongation as well as cyclic tension and bend fatigue was evaluated and compared with commercially available stretchable silver-filled polymer paste. The microstructure of the liquid metal conductor and the silver paste was investigated via scanning electron microscopy (SEM) before and after the samples were subjected to high elongation (> 100%). Unlike the silver paste, the liquid metal conductor maintained its microstructural integrity while its resistance showed a linear response to changes in length. A cyclic tension fatigue test confirmed the fatigue-free performance of the liquid metal conductor during 8,000 stretching cycles at a strain amplitude of 30%. The electromagnetic structure of the RF transmission line was simulated and then compared to the measured data. The measurements for insertion loss showed that U-bending, 90o twisting, and 1000 stretching cycles at a strain amplitude of 100% did not have a significant impact on the RF performance. Details of the DC tests and RF measurements, including the microstructural analysis and simulation results, will be discussed in this article.
{"title":"Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics","authors":"B. Garakani, Udara S. Somarathna, Ashraf Umar, G. Khinda, M. Y. Abdelatty, EI Mehdi Abbara, Sari Al Zerey, M. Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, M. Ronay, M. Poliks","doi":"10.1115/1.4056640","DOIUrl":"https://doi.org/10.1115/1.4056640","url":null,"abstract":"\u0000 Liquid metal-based gallium conductors exhibit unique physical and electromechanical properties, which make them excellent candidates for the next generation of wearable electronics. In this study, a novel fluid phase-based gallium conductor was stencil printed on thermoplastic polyurethane (TPU) to fabricate a stretchable conductor as well as a stretchable radio frequency (RF) transmission line. The electromechanical reliability of the conductor during high elongation as well as cyclic tension and bend fatigue was evaluated and compared with commercially available stretchable silver-filled polymer paste. The microstructure of the liquid metal conductor and the silver paste was investigated via scanning electron microscopy (SEM) before and after the samples were subjected to high elongation (> 100%). Unlike the silver paste, the liquid metal conductor maintained its microstructural integrity while its resistance showed a linear response to changes in length. A cyclic tension fatigue test confirmed the fatigue-free performance of the liquid metal conductor during 8,000 stretching cycles at a strain amplitude of 30%. The electromagnetic structure of the RF transmission line was simulated and then compared to the measured data. The measurements for insertion loss showed that U-bending, 90o twisting, and 1000 stretching cycles at a strain amplitude of 100% did not have a significant impact on the RF performance. Details of the DC tests and RF measurements, including the microstructural analysis and simulation results, will be discussed in this article.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43388044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of the solder materials. Real solder joints often encountered in ball grid array (BGA) components have only been considered in limited investigations. In this study, a specialized sandwich BGA test vehicle with a 3×3 solder joint was connected to the two substrates. The alloys were tested at room temperature using an Instron micromechanical tester in both the stress-controlled and strain-controlled methods. The tests were performed at a constant strain rate. Four stresses and four strain levels of the solder alloy Sn-3.0Ag-0.5Cu (SAC305) were examined using organic solderability preservative (OSP) and electroless nickel-immersion silver (ENIG) surface finishes. The work per cycle and plastic strain range were computed based on a systematic recording of the stress-strain (hysteresis) loops of each sample. A novel approach based on inelastic work is developed to calculate the fatigue life of a BGA assembled test vehicle. The results of the stress-controlled and strain-controlled tests indicated that the OSP surface finish outperformed the ENIG surface finish. Regardless of the testing process and surface finish, the Coffin-Manson and Morrow energy models were acceptable for SAC305.
{"title":"Assessing the SAC305 Solder Joint Fatigue in BGA Assembly Using Strain-Controlled and Stress-Controlled Approaches","authors":"Xin Wei, S. Hamasha, Ali Alahmer, M. Belhadi","doi":"10.1115/1.4056559","DOIUrl":"https://doi.org/10.1115/1.4056559","url":null,"abstract":"\u0000 One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of the solder materials. Real solder joints often encountered in ball grid array (BGA) components have only been considered in limited investigations. In this study, a specialized sandwich BGA test vehicle with a 3×3 solder joint was connected to the two substrates. The alloys were tested at room temperature using an Instron micromechanical tester in both the stress-controlled and strain-controlled methods. The tests were performed at a constant strain rate. Four stresses and four strain levels of the solder alloy Sn-3.0Ag-0.5Cu (SAC305) were examined using organic solderability preservative (OSP) and electroless nickel-immersion silver (ENIG) surface finishes. The work per cycle and plastic strain range were computed based on a systematic recording of the stress-strain (hysteresis) loops of each sample. A novel approach based on inelastic work is developed to calculate the fatigue life of a BGA assembled test vehicle. The results of the stress-controlled and strain-controlled tests indicated that the OSP surface finish outperformed the ENIG surface finish. Regardless of the testing process and surface finish, the Coffin-Manson and Morrow energy models were acceptable for SAC305.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"28 1","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41283521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jin Yang, P. Gromala, Sukwon Choi, D. Agonafer, P. McCluskey
{"title":"Special Section on InterPACK2021","authors":"Jin Yang, P. Gromala, Sukwon Choi, D. Agonafer, P. McCluskey","doi":"10.1115/1.4056558","DOIUrl":"https://doi.org/10.1115/1.4056558","url":null,"abstract":"","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46876833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Flexible electronics are electronic devices and components that can be stretched, bent, twisted, and folded without losing their functionality. Flexible electronics is conformable, lightweight, easily tailorable, and low-cost, and thus, flexible electronics is increasingly being explored in health care, internet of things, automotive, aerospace, communication, safety, security, and food-related applications. Also, flexible electronics can now support increased functionality as well as various fabrication techniques. With an increased adaptation of flexible electronics, research is being conducted to better understand the failure mechanism of flexible electronics and thus improve their reliability and service life. In this paper, a cyclic mandrel bend test has been designed and carried out on printed conductors with PET and PI substrates. With the designed test apparatus, both tensile and compressive bend tests have been performed. Using a 4-wire method, the resistance change of the printed conductors with different widths has been measured in-situ under tensile and compressive loading conditions using mandrels with different radii. The results have been compared among different conductor widths, bending modes, and substrate materials. Besides, in-situ SEM images have been taken to understand the failure mechanisms of the printed conductors. Based on the study, it is seen that there exists a direct correlation between the mandrel diameter, the damage in the printed conductor, and thus, the resistance change with cyclic mandrel testing. Also, it is seen that the damage under compressive bending mode is significantly lower than the damage under tensile bending mode.
{"title":"Mandrel Bend Test of Screen-Printed Silver Conductors","authors":"R. Chen, Justin H. Chow, Yi Zhou, S. Sitaraman","doi":"10.1115/1.4056530","DOIUrl":"https://doi.org/10.1115/1.4056530","url":null,"abstract":"\u0000 Flexible electronics are electronic devices and components that can be stretched, bent, twisted, and folded without losing their functionality. Flexible electronics is conformable, lightweight, easily tailorable, and low-cost, and thus, flexible electronics is increasingly being explored in health care, internet of things, automotive, aerospace, communication, safety, security, and food-related applications. Also, flexible electronics can now support increased functionality as well as various fabrication techniques. With an increased adaptation of flexible electronics, research is being conducted to better understand the failure mechanism of flexible electronics and thus improve their reliability and service life. In this paper, a cyclic mandrel bend test has been designed and carried out on printed conductors with PET and PI substrates. With the designed test apparatus, both tensile and compressive bend tests have been performed. Using a 4-wire method, the resistance change of the printed conductors with different widths has been measured in-situ under tensile and compressive loading conditions using mandrels with different radii. The results have been compared among different conductor widths, bending modes, and substrate materials. Besides, in-situ SEM images have been taken to understand the failure mechanisms of the printed conductors. Based on the study, it is seen that there exists a direct correlation between the mandrel diameter, the damage in the printed conductor, and thus, the resistance change with cyclic mandrel testing. Also, it is seen that the damage under compressive bending mode is significantly lower than the damage under tensile bending mode.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48899602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ralf Dӧring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using ‘virtual prototyping’. Here, a virtual flip chip ball grid array (FC-BGA) is examined in compari-son to a reference chip scale package (CSP). The com-parison is performed using finite element (FE) simula-tion. A combined measurement-simulation technique is used to calibrate the finite element simulations on a reference object. The adjustment is based on the in-plane deformation field obtained by both simulation and opti-cal measurement. For the latter, an optical sensor is used for in-plane deformation and strain field analysis based on the gray-scale correlation method. The obtained find-ings can be extrapolated to alternative package types with different but similar design to evaluate their suita-bility for the desired application before physical fabrication.
{"title":"Design Optimization By Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies","authors":"Ralf Dӧring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler","doi":"10.1115/1.4056445","DOIUrl":"https://doi.org/10.1115/1.4056445","url":null,"abstract":"\u0000 A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using ‘virtual prototyping’. Here, a virtual flip chip ball grid array (FC-BGA) is examined in compari-son to a reference chip scale package (CSP). The com-parison is performed using finite element (FE) simula-tion. A combined measurement-simulation technique is used to calibrate the finite element simulations on a reference object. The adjustment is based on the in-plane deformation field obtained by both simulation and opti-cal measurement. For the latter, an optical sensor is used for in-plane deformation and strain field analysis based on the gray-scale correlation method. The obtained find-ings can be extrapolated to alternative package types with different but similar design to evaluate their suita-bility for the desired application before physical fabrication.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48367818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Due to the necessity for flexibility without compromising the LIB's state of health (SOH), the reliability of Li-ion batteries (LIB) is a critical challenge for FHE devices. A thin form factor-based LIB with a thickness of less than 1mm is regarded as the candidate material to suit such demands since it can be folded, bent, and twisted with minimal performance loss. Furthermore, LIB has high specific power (W/Kg) and specific energy (Wh/Kg), as well as a smaller memory effect, making it more appealing for wearable applications. While much research has been done on the chemo-physical effects of repeated charging and discharging LIB, such as SEI development, material deterioration, and so on, but such impacts owing to repeated flexure LIB have not been much studied. The deterioration of the reliability of thin-flexible power sources was investigated in this work under twist, flexing, and flex-to-install to simulate stresses of daily motions of the human body by utilizing motion-control setups in a lab setting. Furthermore, an AI-based regression model has been developed to forecast the SOH of the battery based on many variables such as physical, atmospheric, and chemo-mechanical experimental circumstances that may be difficult to address by manpower. Based on the various variables and their interactions, the generated models are expected to be used to predict battery life and assess the acceleration factors between test circumstances and usage conditions for a range of test scenarios.
{"title":"Reliability of State-of-health of the Flexible Li-ion Batteries Under Various Flexing Conditions and Calendar Aging","authors":"P. Lall, Hye-Yoen Jang","doi":"10.1115/1.4056412","DOIUrl":"https://doi.org/10.1115/1.4056412","url":null,"abstract":"\u0000 Due to the necessity for flexibility without compromising the LIB's state of health (SOH), the reliability of Li-ion batteries (LIB) is a critical challenge for FHE devices. A thin form factor-based LIB with a thickness of less than 1mm is regarded as the candidate material to suit such demands since it can be folded, bent, and twisted with minimal performance loss. Furthermore, LIB has high specific power (W/Kg) and specific energy (Wh/Kg), as well as a smaller memory effect, making it more appealing for wearable applications. While much research has been done on the chemo-physical effects of repeated charging and discharging LIB, such as SEI development, material deterioration, and so on, but such impacts owing to repeated flexure LIB have not been much studied. The deterioration of the reliability of thin-flexible power sources was investigated in this work under twist, flexing, and flex-to-install to simulate stresses of daily motions of the human body by utilizing motion-control setups in a lab setting. Furthermore, an AI-based regression model has been developed to forecast the SOH of the battery based on many variables such as physical, atmospheric, and chemo-mechanical experimental circumstances that may be difficult to address by manpower. Based on the various variables and their interactions, the generated models are expected to be used to predict battery life and assess the acceleration factors between test circumstances and usage conditions for a range of test scenarios.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47154134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Mauromicale, M. Calabretta, G. Scarcella, G. Scelba, A. Sitta
Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in terms of performances and reliability, pose new challenges in the design phase of power switches. This paper analyzes, by means of finite-element simulations, a low-voltage power semiconductor system-in-package devoted to automotive applications, which integrates a MOSFET-based half bridge and a controller. Three simulation physical domains integrated in a unique flow are considered: thermo-mechanical, electromagnetic, and thermal numerical models. The aim is to develop a new comprehensive methodology which starts with a thermo-structural simulation of the package, then computes the on-state resistance and parasitic components to assess the electrical behavior of the package. Finally, a simulation check is made to verify if the power device performances are thermally consistent with applicative conditions.
{"title":"Multi-physics Models of a Low-voltage Power Semiconductor System-in-package for Automotive Applications","authors":"G. Mauromicale, M. Calabretta, G. Scarcella, G. Scelba, A. Sitta","doi":"10.1115/1.4056413","DOIUrl":"https://doi.org/10.1115/1.4056413","url":null,"abstract":"\u0000 Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in terms of performances and reliability, pose new challenges in the design phase of power switches. This paper analyzes, by means of finite-element simulations, a low-voltage power semiconductor system-in-package devoted to automotive applications, which integrates a MOSFET-based half bridge and a controller. Three simulation physical domains integrated in a unique flow are considered: thermo-mechanical, electromagnetic, and thermal numerical models. The aim is to develop a new comprehensive methodology which starts with a thermo-structural simulation of the package, then computes the on-state resistance and parasitic components to assess the electrical behavior of the package. Finally, a simulation check is made to verify if the power device performances are thermally consistent with applicative conditions.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49484231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yang Gangli, Lian Xiaoyan, Xu Han, Hu Zhang, Wen Linjie, Li Shanshan
The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420°C. It was motivated by potential applications of Cu-Sn intermetallic compounds (IMC) solder joint in third-generation wide bandgap semiconductor devices. Experimental results revealed that the Cu41Sn11 phase was unstable under high-temperature conditions, the full Cu41Sn11 joint transformed into the full α(Cu) joint (Cu/α(Cu)/Cu) joint at 150 h during thermal aging. The formed α(Cu) phase was a Cu solid solution with inhomogeneous Sn atomic concentration, and its crystal structure and orientation were consistent with the original Cu plate. The conversion of the Cu41Sn11 to α(Cu) was accompanied by the formation of voids due to the volume shrinkage effect, predominantly near the middle of the solder joint interface. The α(Cu) solder joint presented a decrease in strength but an increase in strain rate sensitivity index compared to the Cu41Sn11 solder joint. Furthermore, the strain rate sensitivity index of α(Cu) and Cu41Sn11 is lower than that of ordinary Sn solders. After the shear test, the fractures that occurred in Cu41Sn11 grains were brittle, while the fractures in α(Cu) grains were ductile.
{"title":"Study On the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-temperature Aging","authors":"Yang Gangli, Lian Xiaoyan, Xu Han, Hu Zhang, Wen Linjie, Li Shanshan","doi":"10.1115/1.4056329","DOIUrl":"https://doi.org/10.1115/1.4056329","url":null,"abstract":"\u0000 The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420°C. It was motivated by potential applications of Cu-Sn intermetallic compounds (IMC) solder joint in third-generation wide bandgap semiconductor devices. Experimental results revealed that the Cu41Sn11 phase was unstable under high-temperature conditions, the full Cu41Sn11 joint transformed into the full α(Cu) joint (Cu/α(Cu)/Cu) joint at 150 h during thermal aging. The formed α(Cu) phase was a Cu solid solution with inhomogeneous Sn atomic concentration, and its crystal structure and orientation were consistent with the original Cu plate. The conversion of the Cu41Sn11 to α(Cu) was accompanied by the formation of voids due to the volume shrinkage effect, predominantly near the middle of the solder joint interface. The α(Cu) solder joint presented a decrease in strength but an increase in strain rate sensitivity index compared to the Cu41Sn11 solder joint. Furthermore, the strain rate sensitivity index of α(Cu) and Cu41Sn11 is lower than that of ordinary Sn solders. After the shear test, the fractures that occurred in Cu41Sn11 grains were brittle, while the fractures in α(Cu) grains were ductile.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44411754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field where semiconductor physics and electrical, thermal, and mechanical design knowledge converge to achieve a practical realization of desired targets in the form of conversion efficiency, power density, and reliability. Due to the promising nature of artificial intelligence in delivering rapid results, engineers are starting to explore the ways in which it can contribute to making power electronics more compact and reliable. Here, we conduct a brief review of the foray of artificial intelligence in three distinct sub-technologies within a power electronics system in the context of electric vehicles: semiconductor devices, power electronics module design and prognostics, and thermal management design. The intent is not to report an exhaustive literature review, but to identify the state of the art and opportunities for artificial intelligence to play a meaningful role in power electronics design, as well as to discuss a few promising future research directions.
{"title":"Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities","authors":"P. Paret, D. Finegan, S. Narumanchi","doi":"10.1115/1.4056306","DOIUrl":"https://doi.org/10.1115/1.4056306","url":null,"abstract":"\u0000 Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field where semiconductor physics and electrical, thermal, and mechanical design knowledge converge to achieve a practical realization of desired targets in the form of conversion efficiency, power density, and reliability. Due to the promising nature of artificial intelligence in delivering rapid results, engineers are starting to explore the ways in which it can contribute to making power electronics more compact and reliable. Here, we conduct a brief review of the foray of artificial intelligence in three distinct sub-technologies within a power electronics system in the context of electric vehicles: semiconductor devices, power electronics module design and prognostics, and thermal management design. The intent is not to report an exhaustive literature review, but to identify the state of the art and opportunities for artificial intelligence to play a meaningful role in power electronics design, as well as to discuss a few promising future research directions.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":""},"PeriodicalIF":1.6,"publicationDate":"2022-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"63503413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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