Markus Tauscher, Merk Tobias, Aniket Adsule, Andreas Linnemann, Jüergen Wilde
In the past years the Finite Element Analysis has proven to be a suitable way for fatigue prediction of electronic equipment based on the Physics-of-Failure-approach. For this, inelastic strain parameters like creep strain or creep energy density are evaluated in crack susceptible regions of solder joints. Due to the non-linearity of the plastic behavior, which is the basis for these simulations, the computational effort can be significant. This mostly leads to a component focused approach. Global influences on components like local stiffness variations due to adjacent components, copper traces or fixations of the Printed Circuit Board are often ignored. To make creep based fatigue predictions suitable for complex Printed Circuit Board Assemblies, a method for reducing computational effort needs to be established. For this matter, a machine learning based approach for solder joints has been developed. First, the process for data generation and model training has been established. Thereafter, several methods for input parameter reduction are discussed. Lastly, a first model is being trained based on the generated simulation data.
{"title":"Surrogate Modeling for Creep Strain Based Fatigue Prediction of a Ball Grid Array Component","authors":"Markus Tauscher, Merk Tobias, Aniket Adsule, Andreas Linnemann, Jüergen Wilde","doi":"10.1115/1.4062404","DOIUrl":"https://doi.org/10.1115/1.4062404","url":null,"abstract":"\u0000 In the past years the Finite Element Analysis has proven to be a suitable way for fatigue prediction of electronic equipment based on the Physics-of-Failure-approach. For this, inelastic strain parameters like creep strain or creep energy density are evaluated in crack susceptible regions of solder joints. Due to the non-linearity of the plastic behavior, which is the basis for these simulations, the computational effort can be significant. This mostly leads to a component focused approach. Global influences on components like local stiffness variations due to adjacent components, copper traces or fixations of the Printed Circuit Board are often ignored. To make creep based fatigue predictions suitable for complex Printed Circuit Board Assemblies, a method for reducing computational effort needs to be established. For this matter, a machine learning based approach for solder joints has been developed. First, the process for data generation and model training has been established. Thereafter, several methods for input parameter reduction are discussed. Lastly, a first model is being trained based on the generated simulation data.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48366353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, M. Gupta, M. Degner, M. Asheghi, A. Mantooth, K. Goodson
Better thermal management is a key enabler of higher power density in traction inverter power modules. For the first time, we successfully fabricated and tested a microchannel with a 3D manifold cooler (MMC) using AlN-based Directed Bonded Copper (DBC) substrates. The microchannels (width ~300 μm and height ~450 μm) and 3D manifold fluidic passages (width ~300 μm and height ~600 μm) were fabricated in two DBC substrates using the femtosecond laser and subsequently bonded using transition liquid phase (TLP) bonding. In this study, the hydraulic and thermal performance of the 3D MMC is measured and validated with numerical simulation. The proposed 3D MMC is capable of removing heat at 600 W/cm2 with a 10 kPa pressured drop at the thermal thermal resistance of 0.2 cm2-K/W. The optimized designs via geometric and layout rearrangement were conducted, which indicates the pressure drop can be further reduced by 10× while maintaining the same thermal performance.
{"title":"Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module","authors":"Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, M. Gupta, M. Degner, M. Asheghi, A. Mantooth, K. Goodson","doi":"10.1115/1.4062384","DOIUrl":"https://doi.org/10.1115/1.4062384","url":null,"abstract":"\u0000 Better thermal management is a key enabler of higher power density in traction inverter power modules. For the first time, we successfully fabricated and tested a microchannel with a 3D manifold cooler (MMC) using AlN-based Directed Bonded Copper (DBC) substrates. The microchannels (width ~300 μm and height ~450 μm) and 3D manifold fluidic passages (width ~300 μm and height ~600 μm) were fabricated in two DBC substrates using the femtosecond laser and subsequently bonded using transition liquid phase (TLP) bonding. In this study, the hydraulic and thermal performance of the 3D MMC is measured and validated with numerical simulation. The proposed 3D MMC is capable of removing heat at 600 W/cm2 with a 10 kPa pressured drop at the thermal thermal resistance of 0.2 cm2-K/W. The optimized designs via geometric and layout rearrangement were conducted, which indicates the pressure drop can be further reduced by 10× while maintaining the same thermal performance.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46011973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A high ambient contrast ratio (ACR) is essential for achieving a high dynamic range in advanced display applications, but reported ACR enhancement strategies always result in reduced optical efficiency of light-emitting diode (LED) display devices. In this study, an Fe3O4-magnetic particle-chained pillar array (Fe3O4-MPCP) structure was introduced to improve the ACR of LED display devices with low optical loss. The results indicated that the MPCP structure achieved high ACR at an oblique angle using surface pillar array to suppress ambient light reflections, and its internal magnetic particle chain improved the transmissivity to maintain high device efficiency. Compared with the commercial graphite-coated device at typical viewing angles (i.e., 0° and 60°), the ACR of the optimal MPCP device increased by 217 and 140%, while the device efficiency increased by 25 and 12%, respectively. Therefore, the proposed method provides a novel approach for significantly improving ACR at all oblique angles while maintaining high device efficiency, which can be easily integrated into various LED display devices and has significant potential in advanced display applications.
{"title":"Improving Ambient Contrast Ratio of Display Device At Oblique Angle Using a Fe3o4-magnetic Particle Chained Pillar Array Structure","authors":"Zongtao Li, Junhao Wu, Guanwei Liang, Renpeng Yang, Zhihui Yang, Jiasheng Li","doi":"10.1115/1.4062383","DOIUrl":"https://doi.org/10.1115/1.4062383","url":null,"abstract":"\u0000 A high ambient contrast ratio (ACR) is essential for achieving a high dynamic range in advanced display applications, but reported ACR enhancement strategies always result in reduced optical efficiency of light-emitting diode (LED) display devices. In this study, an Fe3O4-magnetic particle-chained pillar array (Fe3O4-MPCP) structure was introduced to improve the ACR of LED display devices with low optical loss. The results indicated that the MPCP structure achieved high ACR at an oblique angle using surface pillar array to suppress ambient light reflections, and its internal magnetic particle chain improved the transmissivity to maintain high device efficiency. Compared with the commercial graphite-coated device at typical viewing angles (i.e., 0° and 60°), the ACR of the optimal MPCP device increased by 217 and 140%, while the device efficiency increased by 25 and 12%, respectively. Therefore, the proposed method provides a novel approach for significantly improving ACR at all oblique angles while maintaining high device efficiency, which can be easily integrated into various LED display devices and has significant potential in advanced display applications.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41483717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The reliability of Fanout package with a ball grid array (BGA) for micro-system is studied under thermal shock. Different heat source powers are applied to the silicon substrate to imitate the power dissipation induced heat of power devices and the thermal fatigue life of the package are studied using the Anand constitutive model and Darveaux life model. The finite element method (FEM) simulation results show that the thermal fatigue life is not positively correlated with the heat source power. In a certain power range, the life first increases and then decreases. To explain this abnormal phenomenon, the fatigue analysis of solder balls with different heating power (10~55W) is carried out. The results show that in the low temperature stage, with the increase of the heat source power, the heat source offsets the low temperature effect to a certain extent, and the stress value of the solder balls decreases. And during the high temperature stage, the stress of the ball is hardly affected. However, with the increase of the heat source power, the thermal deformation of the structure is gradually serious, the effect of offsetting the low temperature effect is reduced, and the thermal fatigue life increases with the increase of the heat source power. The results of the paper can be useful for micro-system package design.
{"title":"Effect of Heating Power On BGA Thermal Shock Reliability for a Fanout Package","authors":"Ke Zhong, Wang Huanpeng, Jingrou Wang, Yuehang Xu","doi":"10.1115/1.4062344","DOIUrl":"https://doi.org/10.1115/1.4062344","url":null,"abstract":"\u0000 The reliability of Fanout package with a ball grid array (BGA) for micro-system is studied under thermal shock. Different heat source powers are applied to the silicon substrate to imitate the power dissipation induced heat of power devices and the thermal fatigue life of the package are studied using the Anand constitutive model and Darveaux life model. The finite element method (FEM) simulation results show that the thermal fatigue life is not positively correlated with the heat source power. In a certain power range, the life first increases and then decreases. To explain this abnormal phenomenon, the fatigue analysis of solder balls with different heating power (10~55W) is carried out. The results show that in the low temperature stage, with the increase of the heat source power, the heat source offsets the low temperature effect to a certain extent, and the stress value of the solder balls decreases. And during the high temperature stage, the stress of the ball is hardly affected. However, with the increase of the heat source power, the thermal deformation of the structure is gradually serious, the effect of offsetting the low temperature effect is reduced, and the thermal fatigue life increases with the increase of the heat source power. The results of the paper can be useful for micro-system package design.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46198714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Fiber optic gyroscopes (FOGs) are widely used in attitude control systems of spacecraft such as satellites and Mars rovers for their superior spatial adaptability. However, changes in ambient temperature can cause errors in the FOG and reduce its output accuracy. In this paper, a fuzzy two-stage temperature control strategy applied to a satellite-borne three-axis integrated fiber optic gyroscope (TAIFOG) is proposed. And the control rules of the fuzzy two-stage temperature controller are described in detail. A thermodynamic model that can quickly and accurately respond to the dynamic thermal characteristics of the satellite-borne TAIFOG is also constructed based on the lumped method. The effectiveness of the proposed fuzzy two-stage temperature control strategy in improving the temperature stability of the satellite-borne TAIFOG in orbit is verified through numerical studies. Numerical results show that this fuzzy two-stage active temperature control strategy can fundamentally improve the thermal state of the satellite-borne TAIFOG and ensure that its sensitive element fiber optic coils maintain high temperature stability while the TAIFOG is in orbit. In addition, the start-up time of TAIFOG is reduced to 308 seconds compared to the case without active temperature control, which is a reduction of 96.27%. This active temperature control strategy is well suited for engineering applications to improve FOG output accuracy.
{"title":"Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope","authors":"Kai‐Guo Chang, Yunze Li, Weishu Wang","doi":"10.1115/1.4062108","DOIUrl":"https://doi.org/10.1115/1.4062108","url":null,"abstract":"\u0000 Fiber optic gyroscopes (FOGs) are widely used in attitude control systems of spacecraft such as satellites and Mars rovers for their superior spatial adaptability. However, changes in ambient temperature can cause errors in the FOG and reduce its output accuracy. In this paper, a fuzzy two-stage temperature control strategy applied to a satellite-borne three-axis integrated fiber optic gyroscope (TAIFOG) is proposed. And the control rules of the fuzzy two-stage temperature controller are described in detail. A thermodynamic model that can quickly and accurately respond to the dynamic thermal characteristics of the satellite-borne TAIFOG is also constructed based on the lumped method. The effectiveness of the proposed fuzzy two-stage temperature control strategy in improving the temperature stability of the satellite-borne TAIFOG in orbit is verified through numerical studies. Numerical results show that this fuzzy two-stage active temperature control strategy can fundamentally improve the thermal state of the satellite-borne TAIFOG and ensure that its sensitive element fiber optic coils maintain high temperature stability while the TAIFOG is in orbit. In addition, the start-up time of TAIFOG is reduced to 308 seconds compared to the case without active temperature control, which is a reduction of 96.27%. This active temperature control strategy is well suited for engineering applications to improve FOG output accuracy.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45031616","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Alzoubi, A. Hensel, Felix Häußler, B. Ottinger, Marcel Sippel, Joerg Franke
Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids, and solar inverters. Die-attach interconnections form a critical part of power electronics devices. Silver sintering is traditionally used for die-attach interconnections because of its high melting point and ability to form very thin thicknesses. However, the processing time compared with soldering is very long. Sintered layers might contain large voids that affect the mechanical stability of the structure. Stresses caused by mechanical and environmental conditions might cause degradation and possibly early failures. This work focuses on studying the combined effect of process factors on the shear strength of small-area die-attach interconnections in silver sintering. Design of Experiments (DoE) tools were used to build an experimental matrix with a 95% confidence level. The results have shown that holding time has a considerable effect on the mechanical stability of the die-attach interconnections. Intermetallic compounds formed in the sintered joints at higher holding times resulted in lesser voids. Furthermore, the treatment level of the holding time highly affects the shear strength under the other factors of temperature and pressure.
{"title":"Process-factor Optimization of Small-area Sintered Interconnects for Power Electronics Applications","authors":"K. Alzoubi, A. Hensel, Felix Häußler, B. Ottinger, Marcel Sippel, Joerg Franke","doi":"10.1115/1.4056992","DOIUrl":"https://doi.org/10.1115/1.4056992","url":null,"abstract":"\u0000 Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids, and solar inverters. Die-attach interconnections form a critical part of power electronics devices. Silver sintering is traditionally used for die-attach interconnections because of its high melting point and ability to form very thin thicknesses. However, the processing time compared with soldering is very long. Sintered layers might contain large voids that affect the mechanical stability of the structure. Stresses caused by mechanical and environmental conditions might cause degradation and possibly early failures. This work focuses on studying the combined effect of process factors on the shear strength of small-area die-attach interconnections in silver sintering. Design of Experiments (DoE) tools were used to build an experimental matrix with a 95% confidence level. The results have shown that holding time has a considerable effect on the mechanical stability of the die-attach interconnections. Intermetallic compounds formed in the sintered joints at higher holding times resulted in lesser voids. Furthermore, the treatment level of the holding time highly affects the shear strength under the other factors of temperature and pressure.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45102537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave Antenna-in-Package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on Redistribution Layer, which brings design inconvenience. In our work, a low-cost PCB antenna with relatively large size is integrated, forms three-dimensional stacked structure. The AiP employs right angle transition board embedded in Epoxy molding compound (EMC), which transmits mm-wave signal to the substrate-integrated waveguide (SIW) antenna stacked on the back of EMC. The SIW antenna consists of 4x4 radiation slots with modified magnetoelectric dipole for bandwidth enhancement. Measured gain is 14dBi at 60GHz with bandwidth beyond 55-65GHz. The SIW antenna works also as heat sink, no extra thermal design is needed for 0.5W power consumption. The AiP module is manufactured and measured on circuit board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration.
{"title":"High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology","authors":"Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai","doi":"10.1115/1.4056991","DOIUrl":"https://doi.org/10.1115/1.4056991","url":null,"abstract":"\u0000 The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave Antenna-in-Package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on Redistribution Layer, which brings design inconvenience. In our work, a low-cost PCB antenna with relatively large size is integrated, forms three-dimensional stacked structure. The AiP employs right angle transition board embedded in Epoxy molding compound (EMC), which transmits mm-wave signal to the substrate-integrated waveguide (SIW) antenna stacked on the back of EMC. The SIW antenna consists of 4x4 radiation slots with modified magnetoelectric dipole for bandwidth enhancement. Measured gain is 14dBi at 60GHz with bandwidth beyond 55-65GHz. The SIW antenna works also as heat sink, no extra thermal design is needed for 0.5W power consumption. The AiP module is manufactured and measured on circuit board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44521201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Doranga, Dongji Xie, J. Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies are, in general, developed through a finite element (FE) model that is correlated using an experimental data measured through sweep sine testing. The frequency response curve (FRF) generated by using a sweep sine testing may suffer from leakage and windowing of the signal may not work correctly, which results in the shift in the amplitude and the resonance frequencies of the package. In consequence, there will be a significant deviation between the actual and the predicted natural frequencies and the amplitude of vibration response in the given excitation range, resulting in the longer time to fail the package during the laboratory based /virtual durability testing. Thus, it is necessary to develop a suitable validation technique in time/frequency domain to address this issue. In this paper, the step sine testing procedure is utilized to validate the FE model of a test vehicle consisting of a board level BGA chip package and the resonance based fatigue testing is performed in the FE based simulation. The global-local modeling approach is utilized to model the test vehicle and the volume average von Mises stress is used to predict the life of the solder joint. Following the numerical simulations, fatigue test is carried out in the test vehicle at the first resonance frequency obtained from the step sine test. Experimental results show that there are full openings of the corner balls in a very short interval of time. The results of the life prediction from the FE model and from experiments are comparable to each other thus validating the proposed methodology.
{"title":"A Time Frequency Domain Based Approach for Bga Solder Joint Fatigue Analysis Using Global Local Modeling Technique","authors":"S. Doranga, Dongji Xie, J. Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov","doi":"10.1115/1.4056886","DOIUrl":"https://doi.org/10.1115/1.4056886","url":null,"abstract":"\u0000 The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies are, in general, developed through a finite element (FE) model that is correlated using an experimental data measured through sweep sine testing. The frequency response curve (FRF) generated by using a sweep sine testing may suffer from leakage and windowing of the signal may not work correctly, which results in the shift in the amplitude and the resonance frequencies of the package. In consequence, there will be a significant deviation between the actual and the predicted natural frequencies and the amplitude of vibration response in the given excitation range, resulting in the longer time to fail the package during the laboratory based /virtual durability testing. Thus, it is necessary to develop a suitable validation technique in time/frequency domain to address this issue. In this paper, the step sine testing procedure is utilized to validate the FE model of a test vehicle consisting of a board level BGA chip package and the resonance based fatigue testing is performed in the FE based simulation. The global-local modeling approach is utilized to model the test vehicle and the volume average von Mises stress is used to predict the life of the solder joint. Following the numerical simulations, fatigue test is carried out in the test vehicle at the first resonance frequency obtained from the step sine test. Experimental results show that there are full openings of the corner balls in a very short interval of time. The results of the life prediction from the FE model and from experiments are comparable to each other thus validating the proposed methodology.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49644543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng
{"title":"Reviewer's Recognition","authors":"","doi":"10.1115/1.4056725","DOIUrl":"https://doi.org/10.1115/1.4056725","url":null,"abstract":"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136252175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test, and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear and nonlinear solutions to the BoR test are reviewed and also provided with theoretical and numerical formulations, respectively. Three different thicknesses (t = 42 μm, 57 μm and 82 μm) of the thin silicon dies (with a size of 10 mm × 10 mm) are tested in the BoR test, and their bending strengths, load-displacement curves and failure modes are presented and thoroughly discussed with a comparison of the published data from the PoEF test. It is found that, for the bending strengths of 57 μm and 82 μm-thick dies, the data from both the BoR and PoEF tests are very consistent, but not for 42 μm-thick dies with a relatively lower value in the BoR test. This lower strength value in the BoR test is attributed to the more pronounced local buckling effect than the PoEF test. Based on that, it can concluded that the PoEF test is better and more reliable than the conventional BoR as for testing the ultra-thin silicon dies, even though both tests are identical for the regularly thin dies.
{"title":"A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests","authors":"M. Tsai, T. Kuo","doi":"10.1115/1.4056717","DOIUrl":"https://doi.org/10.1115/1.4056717","url":null,"abstract":"\u0000 This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test, and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear and nonlinear solutions to the BoR test are reviewed and also provided with theoretical and numerical formulations, respectively. Three different thicknesses (t = 42 μm, 57 μm and 82 μm) of the thin silicon dies (with a size of 10 mm × 10 mm) are tested in the BoR test, and their bending strengths, load-displacement curves and failure modes are presented and thoroughly discussed with a comparison of the published data from the PoEF test. It is found that, for the bending strengths of 57 μm and 82 μm-thick dies, the data from both the BoR and PoEF tests are very consistent, but not for 42 μm-thick dies with a relatively lower value in the BoR test. This lower strength value in the BoR test is attributed to the more pronounced local buckling effect than the PoEF test. Based on that, it can concluded that the PoEF test is better and more reliable than the conventional BoR as for testing the ultra-thin silicon dies, even though both tests are identical for the regularly thin dies.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":1.6,"publicationDate":"2023-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48252437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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