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Properties of Surface Layers Produced from a Metalorganic Titanium Compound Under Glow Discharge Conditions 辉光放电条件下金属有机钛化合物表面层的性能研究
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995584
T. Wierzchoń, J. Sobiecki
A prospective line in the development of thermo-chemical treatments under glow discharge conditions is to work out new techniques of producing multicomponent layers, e.g., composite layers, by combining various treatments, such as e.g. plasma nitriding and the PACVD method. The combined properties, appropriately selected and complementary to one another, of the single-component layers obtained using one of these processes, permit widening the application range of the layers. The paper specifies the conditions under which the multicomponent layers of Ti(OCN) type and composite layers of the nitrided + TiN or nitrided + Ti(OCN) type can be produced on steel. The structure and properties of the layers thus obtained are also described.
在辉光放电条件下,热化学处理的发展前景是通过结合各种处理方法,如等离子体氮化和PACVD方法,研究出生产多组分层(如复合层)的新技术。使用这些方法之一获得的单组分层的适当选择和相互补充的组合特性允许扩大层的应用范围。阐述了在钢上制备Ti(OCN)型多组分层和氮化+ TiN或氮化+ Ti(OCN)型复合层的条件。还描述了由此获得的层的结构和性能。
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引用次数: 3
Low Temperature Deposition of TiN Ceramic Material by Metal Organic and/or Plasma Enhanced CVD 金属有机和/或等离子体增强CVD低温沉积TiN陶瓷材料
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995587
C. Spee, J. Driessen, A. Kuypers
A review is presented describing the development of TiN-CVD from the classical, high temperature TiCl 4 /N 2 process, towards low temperature MOCVD processes. This development is presented from a chemical point of view. In addition to low pressure (LPCVD) and atmospheric pressure (APCVD) thermal processing, also plasma enhanced (PECVD) techniques are described. In the past few years production facilities for good quality TiN layers for wear resistant applications have come on the market. Production facilities for IC-technology applications of CVD-TiN are on the edge of breaking through. For both applications deposition temperatures have been reduced to 500-600°C. Research developments, have shown even lower deposition temperatures possible for TiN and Ti(C,N) layers.
本文综述了TiN-CVD从经典的高温ticl4 / n2工艺到低温MOCVD工艺的发展。这一发展是从化学的观点提出的。除了低压(LPCVD)和常压(APCVD)热加工外,还介绍了等离子体增强(PECVD)技术。在过去的几年中,用于耐磨应用的高质量TiN层的生产设备已经进入市场。CVD-TiN集成电路技术应用的生产设施即将突破。对于这两种应用,沉积温度都降低到500-600°C。研究进展表明,TiN和Ti(C,N)层的沉积温度可能更低。
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引用次数: 7
Design of Zr(IV) and Hf(IV) Co-Ordination Compounds - Precursors for MOCVD Synthesis of Protective Coatings Zr(IV)和Hf(IV)配位化合物的设计- MOCVD合成保护涂层的前驱体
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995557
A. Grafov, E. Mazurenko, G. Battiston, P. Zanella
Design and creation of new materials with unusual, predictable or predeterminated properties become one of the most actual problems of modern applied chemistry. Main demands are discussed, which are made to chemical compounds used in CVD synthesis of functional materials. A division of volatile metal-containing precursors into main classes is given. On the basis of volatility and thermal stabiliti criteria elaborated at IGIC-NASU, we have designed, synthesized and characterized a series of new advanced precursors for Zr(IV) and Hf(IV). Their properties are compared to those of known species. A possibility of formation of requested properties and structure of final materials is shown.
设计和创造具有不寻常的、可预测的或预先确定的性能的新材料成为现代应用化学最实际的问题之一。讨论了化学气相沉积法合成功能材料时对化合物的主要要求。给出了挥发性含金属前驱体的主要分类。在IGIC-NASU制定的挥发性和热稳定性标准的基础上,我们设计、合成和表征了一系列新的先进的Zr(IV)和Hf(IV)前驱体。将它们的特性与已知物种的特性进行比较。显示了形成最终材料所要求的性能和结构的可能性。
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引用次数: 2
MO CVD of Noble Metals 贵金属的MO CVD
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995556
I. Igumenov
The state of the art in research and application of processes of chemical vapour deposition of noble metal (Pt, Pd, Rh, Ir , Ru, Au) coatings is considered. Systematization of known experimental data on synthesis, thermal properties and saturated vapour pressure of volatile compounds of noble metals with organic ligands is provided. The processes of CVD of noble metals were analized from general requirements to precursors. It is shown that chelate or mixed-ligand noble metal complexes and, in particular β-diketonate derivatives due to their thermal properties are the most suitable for deposition of noble metal thick films.
综述了化学气相沉积贵金属(Pt、Pd、Rh、Ir、Ru、Au)涂层的研究和应用现状。系统的已知实验数据的合成,热性能和饱和蒸汽压的贵金属挥发性化合物与有机配体提供。从一般要求到前驱体,分析了贵金属气相沉积的工艺。结果表明,螯合或混合配体贵金属配合物,特别是β-二酮酸衍生物,由于其热学性质是最适合贵金属厚膜的沉积。
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引用次数: 20
Influence of the Doping Gas on the Axial Uniformity of the Growth Rate and the Electrical Properties of LPCVD In-Situ Doped Polysilicon Layers 掺杂气体对LPCVD原位掺杂多晶硅层生长速率轴向均匀性和电性能的影响
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955105
D. Briand, M. Sarret, P. Duverneuil, T. Mohammed‐Brahim, K. Kis-Sion
We report in-situ doping of polysilicon grown on glass substrates by a LPCVD process. The growth rate, the resistivity and the dopant concentration of boron in-situ doped polysilicon layers are studied as a function of the deposition pressure and the dopant gas to silane mole ratio. A dependence of the axial uniformity on pressure and B 2 H 6 /SiH 4 mole ratio is put forward, and this effect appears to be very strong especially at high pressure. It is explained by a lowering of the diborane concentration in the gas mixture along the load, because of a different threshold for the thermal decomposition of diborane and silane. It is also put forward that a critical concentration of boron exists above which the growth rate is increasing. Improvements of the horizontal homogeneity are obtained by varying the total gas flow rate.
我们报道了通过LPCVD工艺在玻璃衬底上生长的多晶硅的原位掺杂。研究了硼原位掺杂多晶硅层的生长速率、电阻率和掺杂浓度随沉积压力和掺杂气硅摩尔比的变化规律。提出了轴向均匀性与压力和b2h6 / sih4摩尔比的关系,这种影响尤其在高压下表现得非常明显。这可以解释为由于二硼烷和硅烷的热分解阈值不同,气体混合物中的二硼烷浓度沿负载降低。还提出了硼存在一个临界浓度,超过该浓度生长速率增大。通过改变总气量,可以改善水平均匀性。
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引用次数: 5
CVD Conference Recollections CVD会议回忆
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995567
J. Blocher
HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L’archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d’enseignement et de recherche français ou étrangers, des laboratoires publics ou privés. CVD Conference Recollections J. Blocher
它是一个多学科的开放获取档案,用于科学研究文件的存储和传播,无论它们是否出版。这些文件可能来自法国或国外的教学和研究机构,也可能来自公共或私人研究中心。HAL开放多学科档案旨在存放和传播来自法国或外国教育和研究机构、公共或私人实验室的已发表或未发表的研究级科学文件。CVD会议回顾J. Blocher
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引用次数: 0
Powder Dissipation in PECVD for SiH4-CH4-H2 Gas Mixtures SiH4-CH4-H2混合气体PECVD中的粉末耗散
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955133
P. Rava, G. Crovini, F. Demichelis, F. Giorgis, R. Galloni, R. Rizzoli, C. Summonte
The effective dissipated power in SiH 4 -CH 4 -H 2 plasmas excited by 13.56 MHz has been measured for different gas ratios using a subtractive technique to take into account the effects of power losses in the rf circuit. It is found that the dissipated power in general increases with increasing CH 4 concentration and decreases with increasing H 2 concentration. Optical, electrical and defective properties of films deposited under a wide range of deposition conditions have been measured and correlated with dissipated power.
考虑射频电路中功率损耗的影响,用减法测量了13.56 MHz激励下sih4 - ch4 - h2等离子体在不同气体比下的有效耗散功率。耗散功率随ch4浓度的增加而增大,随h2浓度的增加而减小。测量了在各种沉积条件下沉积的薄膜的光学、电学和缺陷特性,并将其与耗散功率相关联。
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引用次数: 1
Deposition of Thick Layers, in a New CVD Reactor 在新型CVD反应器中沉积厚层
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955117
H. Vergnes, E. Scheid, P. Duverneuil, J. Couderc
This paper present a new kind of equipment called the annular reactor, which has been designed to treat a great number of substrates with a particularly good uniformity of thickness of deposits on the batch. Furthermore, a small scale pilot plant of this apparatus, called the sector reactor, has been built. It constitutes a very convenient laboratory piece of equipment, particularly useful to perform, at low cost, the unavoidable experimental part of the development of any new application. Theoretical and experimental results obtained with these reactors are presented and compared to those obtained when using tubular reactors. First tests in order to produce cheap thick layers are also reported.
本文介绍了一种新型设备——环形反应器,该设备设计用于处理大量的衬底,并且在批上沉积厚度均匀性特别好。此外,这种装置的一个小型试验工厂,称为扇形反应堆,已经建成。它构成了一种非常方便的实验室设备,特别适用于以低成本进行任何新应用开发中不可避免的实验部分。本文介绍了这些反应器的理论和实验结果,并与管式反应器的结果进行了比较。为生产廉价厚层而进行的首次试验也有报道。
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引用次数: 2
On the Use of H2 Plasma for the Cleaning and Passivation of InP Substrates H2等离子体在InP衬底清洗和钝化中的应用研究
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995579
G. Bruno, M. Losurdo, P. Capezzuto
The effectiveness of hydrogen plasma for the reduction process of surface native oxide on InP substrates is investigated by X-ray photoelectron spectroscopy (XPS) and by phase modulated spectroscopic ellipsometry (PMSE). H2 plasmas, generated in a quartz tube by applying a r.f. field (13.56 MHz) to external electrodes, produce a very high H-atom flux (5.10 20 atoms/cm 2 .sec) in the downstream region. The ex-situ XPS and in-situ PMSE measurements indicate that the native oxide layer (25 A) is completely removed. The end point of the cleaning process is well detected by kinetic ellipsometry. The plasma treated surface shows a higher stability to reoxidation than that observed for wet etches samples.
利用x射线光电子能谱(XPS)和相位调制光谱椭偏仪(PMSE)研究了氢等离子体对InP衬底表面天然氧化物还原过程的有效性。H2等离子体在石英管中通过对外部电极施加射频场(13.56 MHz)产生,在下游区域产生非常高的h原子通量(5.10 20个原子/ cm2 .sec)。非原位XPS和原位PMSE测量表明,原生氧化层(25 A)被完全去除。用动力学椭偏仪可以很好地检测到清洗过程的终点。等离子体处理的表面显示出比湿蚀刻样品更高的再氧化稳定性。
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引用次数: 1
Growth Kinetics of Copper Films from Photoassisted CVD of Copperacetylacetonate 光辅助CVD法制备乙酰丙酮铜膜的动力学研究
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995575
D. Tonneau, R. Pierrisnard, H. Dallaporta, W. Marine
Copper thin films have been deposited by thermal decomposition of copper acetylacetonate-oxygen mixtures. Copper films of high quality as observed by Auger Electron Spectroscopy (AES) have been obtained at temperatures as low as 300°C. Under UV illumination, this temperature threshold decreased down to 225°C. The influence of substrate temperature and layer thickness on film roughness as observed by Atomic Force Microscopy is discussed. The kinetics of Cu(acac) 2 decomposition has been investigated as a function of precursor partial pressure and substrate temperature in the range of 200-350°C, and the maximum deposition rate of 25 A/min has been reached in the mass transport regime at a substrate temperature of 350°C and a precursor partial pressure of 0.04 Torr. The deposition rate could be substancially enhanced by UV photoassistance.
利用乙酰丙酮铜-氧混合物的热分解法制备了铜薄膜。在低至300°C的温度下,通过俄歇电子能谱(AES)可以获得高质量的铜膜。在紫外线照射下,该温度阈值降至225℃。讨论了原子力显微镜观察到的衬底温度和层厚对薄膜粗糙度的影响。在200 ~ 350℃范围内,研究了Cu(acac) 2的分解动力学与前驱体分压和衬底温度的关系,结果表明,在衬底温度为350℃、前驱体分压为0.04 Torr时,Cu(acac) 2的最大沉积速率为25 a /min。沉积速率可以由紫外线photoassistance实质性组织增强。
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引用次数: 4
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Le Journal De Physique Colloques
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