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Reactor Modelling and Analysis of Amorphous Hydrogenated Silicon Deposition by PECVD PECVD沉积非晶氢化硅的反应器建模与分析
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995536
A. Djelloul, B. Despax, J. Couderc, P. Duverneuil
The behaviour of plasma reactors is complex and affected by a large number of parameters (temperature, pressure, flow rates, power, frequency, etc...). In that context, modeling constitutes a very convenient theoretical approach to analyze the complex parameters influences on the reactors overall performances, in the particular case studied here, amorphous hydrogenated silicon deposition rate profiles on the substrates. This particular study is devoted to a detailed analysis of the reactor behaviour in higher electrical power conditions. It demonstrates that, if relatively simple mechanisms for electron-molecule interactions and gas phase reactions can be used in low power conditions,this do not remain true in higher power conditions where a great number of reactions must be taken into account.
等离子体反应器的行为是复杂的,并受到大量参数(温度、压力、流量、功率、频率等)的影响。在这种情况下,建模是一种非常方便的理论方法来分析影响反应器整体性能的复杂参数,在这里研究的特殊情况下,非晶氢化硅在衬底上的沉积速率分布。这项特别的研究致力于对高功率条件下反应堆的行为进行详细分析。它表明,如果在低功率条件下可以使用相对简单的电子-分子相互作用和气相反应机制,那么在必须考虑大量反应的高功率条件下,这就不成立了。
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引用次数: 1
Barium diketonates as precursors for HTSC thin films: structure and properties 二酮酸钡作为HTSC薄膜的前驱体:结构和性能
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995544
A. Drozdov, S. Troyanov
Homoligand and mixed ligand barium diketonate complexes have been synthesized and characterized by X-ray structure determination. Homoligand complexes with dipivaloylmethane hexafluoroacetone and pivaloyltrifluoroacetone have oligigomeric or polymeric structure. The mixed complexes with additional anionic ligands (Cl - OH - , Piv - ) form pentanuclear complexes. The structures of the mixed ligand complexes with Lewis bases contain either mono or dinuclear chelates. Deoligomerization is accompanied by a decrease of the sublimation temperature and improves a storage stability of barium complexes used in MOCVD process for production of HTSC films.
合成了单配体和混合配体双酮酸钡配合物,并用x射线结构测定对其进行了表征。与二戊酰甲烷六氟丙酮和戊酰三氟丙酮的同聚配合物具有低聚或聚合结构。混合配合物与附加阴离子配体(Cl - OH -, Piv -)形成五核配合物。与路易斯碱混合的配体配合物的结构包含单核或双核螯合物。脱聚伴随着升华温度的降低,提高了用于生产HTSC薄膜的MOCVD工艺的钡配合物的储存稳定性。
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引用次数: 2
HREM Characterization of Interfaces in Thin MOCVD Superconducting Films MOCVD超导体薄膜界面的HREM表征
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955110
D. Dorignac, S. Schamm, C. Grigis, J. Santiso, G. Garcia, A. Figueras
This paper is concerned with high-T c superconducting compounds produced by metal-organic chemical vapour deposition. The nanostructure of different types of interfaces-yttria stabilized zirconia buffer /(1-102)-sapphire substrate, YBa 2 Cu 3 O 7-x film/Y 2 O 3 precipitates as well as YBa 2 Cu 3 O 7-x film/(001)-NdGaO 3 , -SrTiO 3 , and -MgO substrates - has been investigated by high resolution electron microscopy. The orientation relationships and the corresponding layer sequences across the interfaces have been determined with the aid of computer simulations.
本文研究了用金属-有机化学气相沉积法制备的高温超导化合物。利用高分辨电子显微镜研究了不同类型界面——钇稳定氧化锆缓冲液/(1-102)-蓝宝石衬底、YBa 2 Cu 3 O 7-x薄膜/ y2 O 3沉淀物以及YBa 2 Cu 3 O 7-x薄膜/(001)- ndgao 3、- srtio 3和- mgo衬底的纳米结构。通过计算机模拟,确定了各界面间的取向关系和相应的层序。
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引用次数: 0
A Comparative Study of Iron-Based Film Deposition from Iron Pentacarbonyl at 248 nm and 488 nm 248 nm和488 nm五羰基铁沉积铁基薄膜的比较研究
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995581
I. Voicu, R. Alexandrescu, R. Cireasa, I. Morjan, D. Dumitras, S. Mulenko, A. N. Pogorelyǐ, A. Andrei
Thin film deposition by laser irradiation of Fe(CO) 5 at two radiation wavelengths (248 nm and 488 nm) was performed. A perpendicular geometry of irradiation was used. Maximum deposition rates of 14 A/s at λ = 248 nm and 1.5 A/s at λ = 488 nm were obtained, indicating a diffusion limited process. SEM analysis of film morphologies showed significant differencies in the nucleation and growth of films deposited at 248 nm and 488 nm. XPS surface analysis revealed a higher carbon content and carbidic phases in the surface of films deposited at 488 nm on SiO 2 (quartz) substrates. Oxidized surface Fe phases were found in films, with increasing the exposure time to laser radiation. The film properties are discussed in connection with irradiation conditions and specific mechanisms involved.
用激光在248 nm和488 nm两个波长下辐照Fe(CO) 5,制备了Fe(CO) 5薄膜。辐照采用垂直几何形状。在λ = 248 nm处沉积速率最高为14 A/s,在λ = 488 nm处沉积速率最高为1.5 A/s,为扩散受限过程。薄膜形貌的SEM分析表明,在248 nm和488 nm处沉积的薄膜在成核和生长方面存在显著差异。XPS表面分析表明,在488nm sio2(石英)衬底上沉积的薄膜表面具有较高的碳含量和碳化物相。随着激光照射时间的延长,薄膜表面出现氧化铁相。讨论了膜的性能与辐照条件和具体机理的关系。
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引用次数: 3
Low Temperature Plasma Enhanced CVD Synthesis of Piezoactive ZnO Films 低温等离子体增强CVD合成压电活性ZnO薄膜
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995586
T. V. Tabenskaya, V. P. Ovsyannikov, E. Mazurenko
Plasma-enhanced organometallic chemical vapour deposition process has been developed to obtain piezoelectric ZnO films with a highly preferred orientation of the crystallites on sapphire and on SiO 2 /Si substrates. The volatile organic precursor of zinc acetylacetonate Zn(AA) 2 decomposes under r.f. discharge plasma at low temperature in controlled atmosphere of Ar+O 2 gas mixture. The optimal deposition conditions of high quality ZnO film were deduced and investigated. The films obtained have high resistivity and transparency.
采用等离子体增强有机金属化学气相沉积工艺,在蓝宝石和sio2 /Si衬底上制备了具有高度择优取向的ZnO压电薄膜。挥发性有机前驱体乙酰丙酮锌锌(AA) 2在Ar+ o2可控气氛下低温射频放电等离子体分解。推导并研究了制备高质量ZnO薄膜的最佳工艺条件。所得薄膜具有较高的电阻率和透明度。
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引用次数: 3
Heat-Resistance and Phase Composition of Ti-Si Coatings on Niobium 铌基Ti-Si涂层的耐热性及相组成
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995598
A. Kasatkin, S. U. Rybakov, G. M. Anurova
A diffusion silicide coatings on refractory under thermal shock. A prospective method of improving their durability is the formation of multi-component coatings. Ti is one of the widespread oomponents of such coatings. In this work, process of simultaneous diffusion saturation of niobium by Ti and Si in powder mixtures has been investigated. The coatings can be divided into two basic types: Nb-Ti solid solutions and Nb and Ti silicides. The coatings of the first type obtained in Ti-Ti 5 Si 3 powder mixtures. The complex silicide layers were observed in the packs with higher silicon aotivity (Ti 5 Si 3 -TiSi and TiSi 2 -TiSi mixtures). The activities of Ti and Si have been shown to be principal controlling factors in coating phase in composition. The coatings allows to increase heat-resistance of the niobium and niobium alloys up to 2000°C (1,5 hour).
热冲击下耐火材料的扩散硅化物涂层。提高其耐久性的一个有前景的方法是形成多组分涂层。钛是这类涂层中广泛使用的成分之一。本文研究了钛和硅在混合粉末中同时扩散饱和铌的过程。该涂层可分为两种基本类型:铌钛固溶体和铌钛硅化物。第一类涂层是由ti - ti5si3粉末混合物制成的。在硅活性较高的填料(ti5si3 -TiSi和tisi2 -TiSi混合物)中观察到复杂的硅化物层。钛和硅的活性是镀层相组成的主要控制因素。涂层允许增加铌和铌合金的耐热性高达2000°C(1.5小时)。
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引用次数: 0
Plasma-Enhanced Chemical Vapour Deposition of Amorphous Se Films 等离子体增强非晶硒薄膜的化学气相沉积
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955131
P. Nagels, E. Sleeckx, R. Callaerts
The preparation of layers of amorphous Se by plasma-enhanced CVD using the hydride H 2 Se as precursor gas is described. Using a mixture of 15 vol.% H 2 Se in H 2 , partly crystallized films were obtained. Information concerning the structure of the films was obtained from Raman spectroscopy. The spectra of amorphous Se indicated that the dominant molecular structure is the eight-membered ring and/or a chain with Se g molecular fragments. The optical transmission spectrum was recorded at different temperatures in the range 77-300 K. The optical bandgap E r was calculated from the optical absorption coefficients α using Tauc law: αhυ = C(hυ-E T ) 2 , where hυ is the photon energy. The temperature dependence of E T can be approximated by a linear relation: Δ/E T (T 2 -T 1 = -7.6 x 10 -4 x (T 2 -T 1 ).
介绍了以氢化物h2se为前驱体,等离子体增强CVD制备非晶态Se层的方法。在h2中加入15%的h2se,可以得到部分结晶的薄膜。有关薄膜结构的信息是通过拉曼光谱获得的。非晶态硒的光谱表明,非晶态硒的主要分子结构是含硒分子片段的八元环和/或链。在77 ~ 300 K范围内记录了不同温度下的透射光谱。利用tac定律从光吸收系数α计算光带隙E r: αhυ = C(hυ-E T) 2,其中hυ为光子能量。温度对温度的依赖性可以近似为线性关系:Δ/温度(t2 - 1) = -7.6 x 10 -4 x (t2 - 1)。
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引用次数: 0
Deposition of oxide layers by computer controlled 'injection-LPCVD' 计算机控制“注入- lpcvd”沉积氧化层
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955127
F. Felten, J. Sénateur, F. Weiss, R. Madar, A. Abrutis
A new process for stable generation of precursor's vapour pressure for CVD thin layers synthesis is experimented. The vapour pressure is controlled by sequential computer-driven injection of precise micro amounts of liquid in an evaporator, where flash volatilization occurs. During deposition, the precursors are maintained at room temperature under inert gases in an hermetically closed vessel: even thermally unstable precursors may be used. The results reported here are focused on the OMCVD deposition of Ta 2 O 5 . The growth rate increases up to 11 μm/h at 650°C (amorphous layers), and decreases above (crystallized layers). In a second part, we demonstrate the feasibility of Ta 2 O 5 /SiO 2 multilayers using two injectors.
实验了一种稳定生成CVD薄层前驱体蒸汽压的新工艺。蒸汽压力由连续的计算机驱动注入精确的微量液体在蒸发器中控制,在蒸发器中发生闪蒸。在沉积过程中,前驱体在惰性气体的室温下保持在密封容器中,甚至可以使用热不稳定的前驱体。本文报道的结果主要集中在Ta 2o5的OMCVD沉积。在650℃时(非晶层),生长速率增大到11 μm/h,在650℃以上(结晶层),生长速率减小。在第二部分中,我们展示了使用两个注入剂制备t2o5 / sio2多层膜的可行性。
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引用次数: 6
Chemical Vapour Deposition of Thick Tungsten Coatings : Raman Measurements and Mass Transport Modelling 厚钨涂层的化学气相沉积:拉曼测量和质量输运模型
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:1995515
M. Pons, A. Benezech, P. Huguet, R. Gaufrès, P. Diez, D. Lafforet
Thick tungsten coatings have been produced by chemical vapour deposition (CVD) from H 2 -WF 6 at a temperature in the range 773-1073 K under a reduced pressure. The experimental set-up is designed for in situ Raman analysis of the gas phase (temperature and WF 6 concentration) during the growth of tungsten coatings. A two dimensional mass transport model was proposed. It assumes a simple chemical pathway. Only the H 2 reduction of WF 6 has been taken into account. The major objective of the paper is to report on the comparison between (i) the experimental deposition rate and the deposition rate predicted by the model, (it) the values of temperature and gas phase composition deduced from Raman spectroscopy measurements and the values of these quantities obtained by numerical calculations. These comparisons have shown the predictive capabilities of the numerical modelling and that the temperature and WF 6 partial pressures can be recorded by a Raman equipment during the deposition process.
采用化学气相沉积(CVD)方法,在773-1073 K的温度范围内,在减压条件下,用h2 - wf6制备了厚钨涂层。实验装置设计用于原位拉曼分析钨涂层生长过程中的气相(温度和wf6浓度)。提出了二维质量输运模型。它假设一个简单的化学途径。只考虑了wf6的h2减量。本文的主要目的是报告(1)实验沉积速率与模型预测的沉积速率之间的比较,(2)由拉曼光谱测量得出的温度和气相组成值与数值计算得到的这些值之间的比较。这些比较表明了数值模拟的预测能力,并且拉曼设备可以记录沉积过程中的温度和wf6分压。
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引用次数: 0
Atomic layer-by-layer epitaxy of silicon and germanium using flash heating in CVD 在CVD中使用闪蒸加热的硅和锗的原子逐层外延
Pub Date : 1995-06-01 DOI: 10.1051/JPHYSCOL:19955130
J. Murota, M. Sakuraba, T. Watanabe, T. Matsuura, Y. Sawada
Atomic layer-by-layer epitaxy control of Si and Ge in flash-heating CVD using SiH 4 and GeH 4 gases was investigated. Self-limiting SiH 4 reaction on the Ge surface results in Si atomic-layer formation at substrate temperatures below 300 °C even without the flash heating. In the case of Ge growth, by increasing the flash light intensity and the GeH 4 partial pressure, Ge atomic-layer growth on the wet-cleaned Si(100) was achieved with a single flash shot at 275°C. Using these growth controls, resonant tunneling diodes of Ge/Si,Ge 1 (50A)/Ge(50A) / Si 1 Ge 1 (50A)/Ge, in which the Si 1 Ge 1 layers were formed by alternately depositing single atomic-layers of Si and Ge, were fabricated, and clear negative resistance in the current-voltage characteristic was observed at 10 K. The current peaks were expected to be assigned to a hole resonant tunneling via light-hole bound state in the Ge quantum well. This fact suggests that the diode structure has abrupt Si 1 Ge 1 /Ge interfaces by employing a low-temperature atomic layer-by-layer growth process below 300°C.
研究了sih4和geh4气体在闪速加热CVD中对Si和Ge的原子逐层外延控制。当衬底温度低于300°C时,即使没有闪蒸加热,Ge表面的sih4自限制反应也能形成硅原子层。在锗生长的情况下,通过增加闪光光强度和geh4分压,在275°C的单次闪光下,在湿清洗的Si(100)上实现了锗原子层的生长。利用这些生长控制,制备了Ge/Si、Ge 1 (50A)/Ge(50A) /Si 1 Ge 1 (50A)/ Si 1 Ge 1 (50A)/Ge 1 Ge 1 (50A)/Ge的谐振隧道二极管,其中Si 1 Ge 1层由Si和Ge的单原子层交替沉积而成,在10 K时观察到明显的电流-电压特性负电阻。在Ge量子阱中,通过光孔束缚态产生的空穴共振隧穿峰被认为是电流峰值。这一事实表明,采用低于300°C的低温原子逐层生长工艺,二极管结构具有突变的Si 1 Ge 1 /Ge界面。
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引用次数: 5
期刊
Le Journal De Physique Colloques
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