Micromachines最新文献

Inspired by metasurfaces' control over light fields, this study created a liquid microlens coated with a layer of Au@TiO₂, Core-Shell nanospheres. Utilizing the surface plasmon resonance (SPR) effect of Au@TiO₂, Core-Shell nanospheres, and the formation of photonic nanojets (PNJs), this study aimed to extend the imaging system's cutoff frequency, improve microlens focusing, enhance the capture capability of evanescent waves, and utilize nanospheres to improve the conversion of evanescent waves into propagating waves, thus boosting the liquid microlens's super-resolution capabilities. The finite difference time domain (FDTD) method analyzed the impact of parameters including nanosphere size, microlens sample contact width, and droplet's initial contact angle on super-resolution imaging. The results indicate that the full width at half maximum (FWHM) of the field distribution produced by the uncoated microlens is 1.083 times that of the field distribution produced by the Au@TiO₂, Core-Shell nanospheres coated microlens. As the nanosphere radius, droplet contact angle, and droplet base diameter increased, the microlens's light intensity correspondingly increased. These findings confirm that metasurface coating enhances the super-resolution capabilities of the microlens.

We developed a portable microfluidic system that combines spontaneous lumen formation from human umbilical endothelial cells (HUVECs) in fibrin-collagen hydrogels with active perfusion controlled by a braille actuator. Adaptive interstitial flow and feedthrough perfusion switching enabled the successful culture of spontaneously formed naturally branched lumens for more than one month. We obtained many large-area (2 mm × 3 mm) long-term (more than 30 days per run) time-lapse image datasets of the in vitro luminal network using this microfluidic system. We also developed an automatic image analysis pipeline to extract the morphology of the lumen network and node-edge network structure weighted with segmentwise flow parameters. The automatic lumen area measurements revealed that almost all lumens were successfully cultured in this system for approximately 50 days, following the meshwork, sprouting, remodeling, stability, and erosion stages. We found that the optimization of the lumen network during the remodeling stage can be explained by the decrease in the betweenness centrality of the WSS-weighted network and the increase in the strength centrality of the flow-rate-weighted network.

This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering. An SIW with a 3-dB cutoff frequency of 17.2 GHz was fabricated using the proposed process. The fabricated SIW shows an average insertion loss of 1.65 ± 0.54 dB across the 20-35 GHz range. These results highlight the potential of glass substrates with tin TGVs for fabricating millimeter-wave devices.

Three-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research highlights the thermal stability of ceramic substrates; yet, their reliability under high-stress and complex mechanical loading conditions remains a challenge. In this study, 3D-MID components were fabricated using stereolithography (SLA) 3D-printing technology, and the feasibility of circuit miniaturization on high-temperature-resistant resin substrates was explored. Additionally, the influence of laser parameters on resistance values was analyzed using the Response Surface Methodology (RSM). The results demonstrate that SLA 3D-printing achieves substrates with low surface roughness, enabling the precise formation of fine features. Electric circuits are successfully formed on substrates printed with resin mixed with Laser Direct Structuring (LDS) additives, following laser structuring and metallization processes, with a minimum conductor spacing of 150 µm. Furthermore, through the integration of through-holes (vias) and the use of smaller package chips, such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN), the circuits achieve further miniaturization and establish reliable electrical connections via soldering. Taken together, our results demonstrate that thermoset plastics serve as substrates for 3D-MID components, broadening the application scope of 3D-MID technology and providing a framework for circuit miniaturization on SLA-printed substrates.

Minimally invasive endovascular stent electrodes are an emerging technology in neural engineering, designed to minimize the damage to neural tissue. However, conventional stent electrodes often rely on resistive welding and are relatively bulky, restricting their use primarily to large animals or thick blood vessels. In this study, the feasibility is explored of fabricating a laser welding stent electrode as small as 300 μm. A high-precision laser welding technique was developed to join micro-wire electrodes without compromising structural integrity or performance. To ensure consistent results, a novel micro-wire welding with platinum pad method was introduced during the welding process. The fabricated electrodes were integrated with stent structures and subjected to detailed electrochemical performance testing to evaluate their potential as neural interface components. The laser-welded endovascular stent electrodes exhibited excellent electrochemical properties, including low impedance and stable charge transfer capabilities. At the same time, in this study, a simulation is conducted of the electrode distribution and arrangement on the stent structure, optimizing the utilization of the available surface area for enhanced functionality. These results demonstrate the potential of the fabricated electrodes for high-performance neural interfacing in endovascular applications. The approach provided a promising solution for advancing endovascular neural engineering technologies, particularly in applications requiring compact electrode designs.

In recent years, metal nanomaterials and nanoproducts have been developed intensively, and they are now widely applied across various sectors, including energy, aerospace, agriculture, industry, and biomedicine. However, nanomaterials have been identified as potentially toxic, with the toxicity of metal nanoparticles posing significant risks to both human health and the environment. Therefore, the toxicological risk assessment of metal nanomaterials is essential to identify and mitigate potential adverse effects. This review provides a comprehensive analysis of the safety and sustainability of metallic nanoparticles (such as Au NPs, Ag NPs, etc.) in key domains such as medicine, energy, and environmental protection. Using a dual-perspective analysis approach, it highlights the unique advantages of machine learning in data processing, predictive modeling, and optimization. At the same time, it underscores the importance of traditional methods, particularly their ability to offer greater interpretability and more intuitive results in specific contexts. Finally, a comparative analysis of traditional methods and machine learning techniques for detecting the toxicity of metal nanomaterials is presented, emphasizing the key challenges that need to be addressed in future research.

Multilayer piezoelectric stacks, which are multiple layers of piezoelectric materials placed on top of each other, are widely used to achieve precise linear movement and high-force generation. In this paper, a dynamic stiffness (DS) method for the dynamic vibration analysis of multilayer piezoelectric stacks is presented. First, the general solutions for all physical quantities of the three vibration contributions (i.e., pure vibration, symmetrically coupled vibration, and anti-symmetrically coupled vibration) are derived from the governing equations of motion. Then, the DS matrices of each layer of the piezoelectric stack are obtained, and they are assembled to form a global DS matrix. The electrical impedances and the mode shapes of a piezoelectric stack consisting of two piezoelectric disks connected in series and in parallel are calculated using our method as well as by the finite element method. The comparison shows good agreement. Finally, the effect of the number of layers on the dynamic responses of piezoelectric stacks is investigated. The DS method developed here provides an efficient and accurate analytical tool for the parametric and optimization analysis of the coupled vibrations of multilayer piezoelectric structures.

The praseodymium-doped indium zinc oxide (PrIZO) thin-film transistor (TFT) is promising for applications in flat-panel displays, due to its high carrier mobility and stability. Nevertheless, there are few studies on the mechanism of annealing on PrIZO films and the fabrication of flexible devices. In this work, we first optimized the annealing-process parameters on the glass substrate. As the annealing temperature rises, the film tends to be denser and obtains a lower surface roughness, a narrower optical-band gap and less oxygen-vacancy content. However, the μ-PCD test shows the 250 °C-annealed film obtains the least defects. And the PrIZO TFT annealed at 250 °C exhibited a desired performance with a saturation mobility (μ_sat) of 14.26 cm²·V^-1·s^-1, a subthreshold swing (SS) of 0.14 V·dec^-1, an interface trap density (D_it) of 3.17 × 10¹¹, an I_on/I_off ratio of 1.83 × 10⁸ and a threshold voltage (Vth) of -1.15 V. The flexible devices were prepared using the optimized parameters on the Polyimide (PI) substrate and subjected to static bending tests. After bending at a radius of 5 mm, the mobility of devices decreases slightly from 12.48 to 10.87 cm²·V^-1·s^-1, demonstrating the great potential of PrIZO for flexible displays.

The application of smart materials in robots has attracted considerable research attention. This study developed an inchworm robot that integrates smart materials and a bionic design, using the unique properties of magnetorheological elastomers (MREs) to improve the performance of robots in complex environments, as well as their adaptability and movement efficiency. This research stems from solving the problem of the insufficient adaptability of traditional bionic robots on different surfaces. A robot that combines an MRE foot, an electromagnetic control system, and a bionic motion mechanism was designed and manufactured. The MRE foot was made from silicone rubber mixed with carbonyl iron particles at a specific ratio. Systematic experiments were conducted on three typical surfaces, PMMA, wood, and copper plates, to test the friction characteristics and motion performance of the robot. On all tested surfaces, the friction force of the MRE foot was reduced significantly after applying a magnetic field. For example, on the PMMA surface, the friction force of the front leg dropped from 2.09 N to 1.90 N, and that of the hind leg decreased from 3.34 N to 1.75 N. The robot movement speed increased by 1.79, 1.76, and 1.13 times on PMMA, wooden, and copper plate surfaces, respectively. The MRE-based intelligent foot design improved the environmental adaptability and movement efficiency of the inchworm robot significantly, providing new ideas for the application of intelligent materials in the field of bionic robots and solutions to movement challenges in complex environments.

Wireless sensor networks often rely on battery power, which incurs high costs, considerable volume, and a limited lifespan. Additionally, the communication range of existing passive sensor tags remains short, which challenges their suitability for evolving Internet of Things (IoT) applications. This paper, therefore, presents a long-distance passive RFID sensing tag that integrates multi-source energy harvesting and reflection amplification. Multi-source energy harvesting enhances tag receiving sensitivity and extends the system's downlink communication distance, while reflection amplification increases tag reflection power and improves the uplink communication distance, thereby significantly expanding the overall communication range. The test results show that the tag achieves a receiving sensitivity of -45 dBm, a reflection gain of 44 dB, and a communication distance of up to 96 m.