首页 > 最新文献

Proceedings International Symposium on Quality Electronic Design最新文献

英文 中文
A qualification platform for design reuse 设计重用的鉴定平台
Pub Date : 2002-03-18 DOI: 10.1109/ISQED.2002.996698
R. Seepold, N. M. Madrid, A. Vörg, W. Rosenstiel, M. Radetzki, P. Neumann, Jürgen Haase
The application and development of reusable components (intellectual property, IP) has become a regular part of modern design practices. The IP provider on one side and the IP integrator (user) on the other may be in the same company or separate participants in the microelectronic design market. In both cases, the transfer of IP remains a complex and time-consuming task. The qualification of IP gains a significant relevance for successful application and transfer of IP. This paper proposes an IP qualification methodology for an automated quality check that also incorporates current standards. Through embedding of the new concept into the regular design flow, IP transfer comes closer to an easy mix and match of virtual components. The presented approach has been validated during an industrial case study.
可重用组件(知识产权,IP)的应用和开发已经成为现代设计实践的常规部分。一方是IP提供商,另一方是IP集成商(用户),可能是同一家公司,也可能是微电子设计市场中不同的参与者。在这两种情况下,知识产权的转移仍然是一项复杂而耗时的任务。知识产权资格对知识产权的成功申请和转让具有重要意义。本文提出了一种用于自动质量检查的知识产权资格鉴定方法,该方法也结合了当前的标准。通过将新概念嵌入到常规设计流程中,IP传输更接近于虚拟组件的轻松混合和匹配。所提出的方法已在工业案例研究中得到验证。
{"title":"A qualification platform for design reuse","authors":"R. Seepold, N. M. Madrid, A. Vörg, W. Rosenstiel, M. Radetzki, P. Neumann, Jürgen Haase","doi":"10.1109/ISQED.2002.996698","DOIUrl":"https://doi.org/10.1109/ISQED.2002.996698","url":null,"abstract":"The application and development of reusable components (intellectual property, IP) has become a regular part of modern design practices. The IP provider on one side and the IP integrator (user) on the other may be in the same company or separate participants in the microelectronic design market. In both cases, the transfer of IP remains a complex and time-consuming task. The qualification of IP gains a significant relevance for successful application and transfer of IP. This paper proposes an IP qualification methodology for an automated quality check that also incorporates current standards. Through embedding of the new concept into the regular design flow, IP transfer comes closer to an easy mix and match of virtual components. The presented approach has been validated during an industrial case study.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91508971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Integrated inductors modeling and tools for automatic selection and layout generation 集成电感建模和工具,自动选择和布局生成
Pub Date : 2002-03-18 DOI: 10.1109/ISQED.2002.996779
J. R. Sendra, J. Pino, A. Hernández, Javier Hernández, J. Aguilera, A. Garcia-Alonso, A. Núñez
In this work we propose new equivalent circuit models for integrated inductors based on the conventional lumped element model. Automatic tools to assist the designers in selecting and automatically laying-out integrated inductors are also reported. Model development is based on measurements taken from more than 100 integrated spiral inductors designed and fabricated in a standard silicon process. We demonstrate the capacity of the proposed models to accurately predict the integrated inductor behavior in a wider frequency range than the conventional model. Our equations are coded in a set of tools that requests the desired inductance value at a determined frequency and gives back the geometry of the better inductors available in a particular technology.
本文在传统集总元件模型的基础上,提出了新的集成电感等效电路模型。自动工具,以协助设计人员在选择和自动布局集成电感也报告。模型开发是基于在标准硅工艺中设计和制造的100多个集成螺旋电感器的测量结果。我们证明了所提出的模型比传统模型在更宽的频率范围内准确预测集成电感器行为的能力。我们的方程编码在一组工具中,这些工具要求在确定的频率下获得所需的电感值,并给出特定技术中可用的更好电感器的几何形状。
{"title":"Integrated inductors modeling and tools for automatic selection and layout generation","authors":"J. R. Sendra, J. Pino, A. Hernández, Javier Hernández, J. Aguilera, A. Garcia-Alonso, A. Núñez","doi":"10.1109/ISQED.2002.996779","DOIUrl":"https://doi.org/10.1109/ISQED.2002.996779","url":null,"abstract":"In this work we propose new equivalent circuit models for integrated inductors based on the conventional lumped element model. Automatic tools to assist the designers in selecting and automatically laying-out integrated inductors are also reported. Model development is based on measurements taken from more than 100 integrated spiral inductors designed and fabricated in a standard silicon process. We demonstrate the capacity of the proposed models to accurately predict the integrated inductor behavior in a wider frequency range than the conventional model. Our equations are coded in a set of tools that requests the desired inductance value at a determined frequency and gives back the geometry of the better inductors available in a particular technology.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86785721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures using triangular meshes 任意形状导电结构的三角网格耦合电磁仿真
Pub Date : 2002-03-18 DOI: 10.1109/ISQED.2002.996688
V. Jandhyala, Yong Wang, D. Gope, C. Shi
The partial-element-equivalent-circuit (PEEC) approach is an effective method to convert three-dimensional on-chip multiconductor structures to circuit-level descriptions. In this paper, a triangular-mesh-based PEEC approach is described, wherein the surfaces of arbitrarily-shaped conducting structures are represented by triangular mesh tesselations. A coupled EM-circuit formulation is obtained through the separation of the scalar, vector, and ohmic potential interactions between pairs of triangular edges-based basis functions. The overall approach can be interpreted as a SPICE-free, surface-only version of PEEC method and is especially useful for on-chip signal integrity analysis of systems-on-chip layout where components with irregular shapes are common.
部分元件等效电路(PEEC)方法是将片上三维多导体结构转换为电路级描述的有效方法。本文描述了一种基于三角形网格的PEEC方法,其中任意形状的导电结构表面由三角形网格镶嵌表示。通过分离三角边基函数对之间的标量、矢量和欧姆电位相互作用,得到了耦合的电磁电路公式。整体方法可以解释为无spice,仅表面版本的PEEC方法,特别适用于片上系统布局的片上信号完整性分析,其中不规则形状的组件很常见。
{"title":"Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures using triangular meshes","authors":"V. Jandhyala, Yong Wang, D. Gope, C. Shi","doi":"10.1109/ISQED.2002.996688","DOIUrl":"https://doi.org/10.1109/ISQED.2002.996688","url":null,"abstract":"The partial-element-equivalent-circuit (PEEC) approach is an effective method to convert three-dimensional on-chip multiconductor structures to circuit-level descriptions. In this paper, a triangular-mesh-based PEEC approach is described, wherein the surfaces of arbitrarily-shaped conducting structures are represented by triangular mesh tesselations. A coupled EM-circuit formulation is obtained through the separation of the scalar, vector, and ohmic potential interactions between pairs of triangular edges-based basis functions. The overall approach can be interpreted as a SPICE-free, surface-only version of PEEC method and is especially useful for on-chip signal integrity analysis of systems-on-chip layout where components with irregular shapes are common.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84183327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Low power VLSI architecture of Viterbi scorer for HMM-based isolated word recognition 基于hmm的孤立词识别的Viterbi评分器的低功耗VLSI结构
Pub Date : 2002-03-18 DOI: 10.1109/ISQED.2002.996739
Bok-Gue Park, Koon-Shik Cho, Jun-Dong Cho
HMM-based algorithms have been successfully applied to speech recognition since HMM provides a robust modeling capability of various speech signals and maintains high recognition accuracy. Viterbi scoring that searches the best matching word by comparing input utterance with reference speech models is a major task in HMM-based speech recognition. However, due to its operation complexity, Viterbi scoring is a significant source of power and computation when it is implemented by a dedicated VLSI architecture. This paper proposes a noble low power VLSI architecture of Viterbi scorer using modified Viterbi scoring procedure and precomputing logic. This method reduced power consumption by 20% and 27% for 100 and 400 candidate word recognition, respectively, compared with a conventional architecture at a cost of at most 12% increase in area due to additional control logics. As the device shrinks, power consumption becomes more significant than chip area.
基于HMM的算法已成功应用于语音识别,因为HMM提供了对各种语音信号的鲁棒建模能力,并保持了较高的识别精度。Viterbi评分是基于hmm的语音识别中的一项重要任务,它通过对输入的话语与参考的语音模型进行比较来搜索最匹配的词。然而,由于其操作复杂性,Viterbi评分在专用VLSI架构中实现时是一个重要的功率和计算来源。本文采用改进的Viterbi评分程序和预计算逻辑,提出了一种高性能的低功耗Viterbi评分器VLSI架构。与传统架构相比,该方法在100和400候选词识别方面分别降低了20%和27%的功耗,但由于额外的控制逻辑,该方法最多增加了12%的面积。随着器件的缩小,功耗变得比芯片面积更重要。
{"title":"Low power VLSI architecture of Viterbi scorer for HMM-based isolated word recognition","authors":"Bok-Gue Park, Koon-Shik Cho, Jun-Dong Cho","doi":"10.1109/ISQED.2002.996739","DOIUrl":"https://doi.org/10.1109/ISQED.2002.996739","url":null,"abstract":"HMM-based algorithms have been successfully applied to speech recognition since HMM provides a robust modeling capability of various speech signals and maintains high recognition accuracy. Viterbi scoring that searches the best matching word by comparing input utterance with reference speech models is a major task in HMM-based speech recognition. However, due to its operation complexity, Viterbi scoring is a significant source of power and computation when it is implemented by a dedicated VLSI architecture. This paper proposes a noble low power VLSI architecture of Viterbi scorer using modified Viterbi scoring procedure and precomputing logic. This method reduced power consumption by 20% and 27% for 100 and 400 candidate word recognition, respectively, compared with a conventional architecture at a cost of at most 12% increase in area due to additional control logics. As the device shrinks, power consumption becomes more significant than chip area.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86032046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Proceedings International Symposium on Quality Electronic Design 质量电子设计国际研讨会论文集
Pub Date : 2002-01-01 DOI: 10.1109/ISQED.2002.996564
The following topics are dealt with: interconnect extraction and modeling; design for process variations; design issues for power and noise management; low power design techniques; quality and interoperability of EDA tools; power, signal and EMI analysis and optimization; verification in achieving design quality; advanced device technology issues in circuit design; design for test; methods and metrics for design quality; signal integrity; design, planning and closure.
处理以下主题:互连提取和建模;工艺变化的设计;电源和噪音管理的设计问题;低功耗设计技术;EDA工具的质量和互操作性;功率、信号和EMI分析与优化;实现设计质量的验证;电路设计中的先进器件技术问题;试验设计;设计质量的方法和度量;信号完整性;设计、规划和收尾。
{"title":"Proceedings International Symposium on Quality Electronic Design","authors":"","doi":"10.1109/ISQED.2002.996564","DOIUrl":"https://doi.org/10.1109/ISQED.2002.996564","url":null,"abstract":"The following topics are dealt with: interconnect extraction and modeling; design for process variations; design issues for power and noise management; low power design techniques; quality and interoperability of EDA tools; power, signal and EMI analysis and optimization; verification in achieving design quality; advanced device technology issues in circuit design; design for test; methods and metrics for design quality; signal integrity; design, planning and closure.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90122522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
期刊
Proceedings International Symposium on Quality Electronic Design
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1