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Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)最新文献

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Single step growth of buried InP layer using selective rapid thermal MOCVD 选择性快速热MOCVD法单步生长埋地InP层
O. Kreinin, G. Bahir
Rapid thermal MOCVD process has been used to study the selective growth of InP on [001] InP substrate using an ion implanted mask-less definition for the selective epitaxy. The selectivity of InP growth on the un-implanted area is controlled by the TMIn partial pressure and can reach complete growth inhibition on the implanted area. We used the combined nature of the rapid thermal MOCVD system to demonstrate two additional steps: (a) in situ annealing of the ion implanted damaged area and (b) re-growth of Fe:InP layers on the primary "masked surface", to produce a buried layer in a single growth sequence. High lateral resolution and high quality un-doped and Fe doped semi-insulated InP layers are demonstrated.
快速热MOCVD工艺被用于研究InP在[001]InP衬底上的选择性生长,使用离子注入的无掩膜定义进行选择性外延。InP在未植入区生长的选择性受TMIn分压控制,可在植入区达到完全生长抑制。我们使用快速热MOCVD系统的组合特性来演示两个额外的步骤:(a)离子注入损伤区域的原位退火和(b) Fe:InP层在初级“掩膜表面”上的重新生长,以在单一生长序列中产生埋藏层。展示了高横向分辨率和高质量的未掺杂和掺铁半绝缘InP层。
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引用次数: 1
A novel flexible, reliable and easy to use technique for the fabrication of optical spot size converters for InP based PICs 一种灵活、可靠和易于使用的新型技术,用于制造基于InP的PICs的光斑尺寸转换器
D. Trommer, R. Steingruber, R. Loffler, A. Umbach
Spot size converters (waveguide tapers) are key elements for photonic integrated circuits (PICs) since they significantly reduce the effort and cost of the device packaging. In comparison to other technologies like micro lenses or lensed fibres the implementation of spot size converters can also reduce the optical insertion loss of the devices. The basic technological challenge is the fabrication of a vertical ramp with a maximum height of around 1 /spl mu/m and a length of 500-1000 /spl mu/m. Several approaches to form this ramp have been reported including shadow mask etching, shadow mask epitaxy and selective area growth. All this methods have in common that they require special processes which are rather complicated, expensive and inflexible in terms of tailoring of the ramp profile. In this paper, we present a novel method for the fabrication of spot size converters which can produce almost arbitrary taper profiles and requires only standard lithography and etching processes and can therefore easily be implemented into standard waveguide processes.
光斑尺寸转换器(波导锥)是光子集成电路(pic)的关键元件,因为它们显着减少了器件封装的工作量和成本。与微透镜或透镜光纤等其他技术相比,光斑尺寸转换器的实施也可以减少设备的光学插入损耗。基本的技术挑战是建造一个垂直坡道,最大高度约为1 /spl亩/米,长度为500-1000 /spl亩/米。已经报道了几种形成这种斜坡的方法,包括阴影掩膜蚀刻,阴影掩膜外延和选择性面积生长。所有这些方法的共同点是,它们需要特殊的过程,这是相当复杂的,昂贵的和不灵活的裁剪斜坡轮廓方面。在本文中,我们提出了一种制造光斑尺寸转换器的新方法,它可以产生几乎任意的锥度轮廓,只需要标准的光刻和蚀刻工艺,因此可以很容易地实现到标准波导工艺中。
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引用次数: 16
Optimizing InP HBT technology for 50 GHz clock-rate MSI circuits 50ghz时钟速率微si电路的InP HBT技术优化
M. Sokolich, C. Fields, G. Raghavan, D. Hitko, M. Lui, D.P. Docter, Y. Brown, M. Case, A. Kramer, J.A. Henige, J. Jensen
Using experimental data and a sum of weighted RC time constant model we optimized AlInAs/GaInAs SHBT devices for minimum gate delay in a static divider. The best result obtained, a 55 GHz maximum clock rate, is to our knowledge the highest toggle rate reported to date. Comparable structures without critical base resistance optimization toggled at no more than 44 GHz. f/sub t/ and f/sub max/ were observed to be only weak indicators of divider performance. The calculated maximum toggle rates obtained from the weighted RC time constant method agree reasonably well with experiment. The experiments and analysis lead to the conclusion that the dominant parasitic component in this regime of ultra-high speed HBT is the base resistance.
利用实验数据和加权RC时间常数总和模型,对静态分压器中栅极延迟最小的AlInAs/GaInAs SHBT器件进行了优化。获得的最佳结果是55 GHz的最大时钟速率,据我们所知,这是迄今为止报道的最高切换速率。没有临界基极电阻优化的可比结构切换频率不超过44 GHz。F /下标t/和F /下标max/仅是分频器性能的弱指标。用加权RC时间常数法计算得到的最大切换率与试验结果吻合较好。实验和分析表明,在这种超高速HBT体制下,主要寄生成分是基极电阻。
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引用次数: 8
Optimisation of butt coupling between deep-ridge and buried ridge waveguides for the realisation of monolithically integrated wavelength selectors 实现单片集成波长选择器的深脊和埋脊波导对接耦合优化
F. Pommereau, R. Mestric, B. Martin, E. Rao, F. Gaborit, D. Leclerc, C. Porcheron, M. Renaud
Butt coupling between deep ridge and buried ridge waveguides has been optimised in terms of morphology and transition tilt angles. Low reflectivities have been found for 15 to 30 degrees tilt angles, allowing the fabrication of a four channel wavelength selector. Loss-less operation has been demonstrated for each channel.
对深脊波导和埋脊波导之间的对接耦合进行了形态学和过渡倾斜角度的优化。低反射率已发现15至30度的倾斜角度,允许制造四通道波长选择器。每个通道都演示了无损操作。
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引用次数: 4
Microarray selective epitaxy (MASE) for integrated photonic devices 集成光子器件的微阵列选择性外延
K. Kudo, T. Nakazaki, M. Yamaguchi
We developed a novel technique, called microarray selective epitaxy (MASE), for selectively growing extremely small PICs. MASE can form densely arrayed (pitch<10 /spl mu/m) multiple-quantum-well (MQW) waveguides, without the need for semiconductor etching, and simultaneously control the bandgap-wavelength of each MQW in the over-300-nm wavelength range.
我们开发了一种新的技术,称为微阵列选择性外延(MASE),用于选择性地生长极小的PICs。MASE可以在不需要半导体蚀刻的情况下形成密集排列(间距<10 /spl mu/m)的多量子阱(MQW)波导,并同时将每个MQW的带隙波长控制在300 nm以上的波长范围内。
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引用次数: 2
Influence of deep levels in AlInAs/GalnAs/InP HFETs 深水平对AlInAs/GalnAs/InP hfet的影响
A. Souifi, B. Georgescu, G. Brémond, M. Py, J. Decobert, G. Post, G. Guillot
The aim of this work is to show how some parasitic phenomena such as kink effect or low frequency noise often observed in the characteristics of AlInAs/GaInAs/InP composite channel HFETs can be correlated with deep levels. HFETs have been characterized using deep level transient spectroscopy (DLTS), current transient spectroscopy (CTS), drain lag (DL), and low frequency noise (LFN) measurements. Output characteristics of the devices have also been recorded under monochromatic optical excitation in order to study the optical properties of the defects. The main trap is related to the AlInAs layers and identified as E3. It is shown that E3 is responsible for a strong generation-recombination noise at room temperature. This trap also contributes to a strong output conductance variation.
这项工作的目的是展示在AlInAs/GaInAs/InP复合沟道hfet的特性中经常观察到的一些寄生现象,如结效应或低频噪声,是如何与深能级相关的。利用深能级瞬态光谱(DLTS)、电流瞬态光谱(CTS)、漏极滞后(DL)和低频噪声(LFN)测量对hfet进行了表征。为了研究缺陷的光学性质,还记录了器件在单色光激发下的输出特性。主要的陷阱与AlInAs层有关,被称为E3。结果表明,在室温下,E3产生了较强的生成复合噪声。这个陷阱也有助于一个强大的输出电导变化。
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引用次数: 2
Modelling of dislocation generation in InP crystal growth InP晶体生长中位错产生的模拟
S. Gondet, T. Duffar, G. Jacob, N. Van den Bogaert, F. Louchet
A Haasen-Sumino model is applied to the generation of the dislocations in InP crystals grown by a modified LEC process. The thermal conditions in the crystal come from a dynamic numerical simulation of the global heat transfer in the furnace. To take into account the behaviour at temperature close to the melting point, a dislocation annihilation model is added and the dislocation density is resolved on each glide system. The computed dislocation densities are in good agreement with the measured values and this method allows a better knowledge on the dislocation multiplication and the optimisation of growth parameters in order to decrease the dislocation density in 3-in iron doped wafer.
将Haasen-Sumino模型应用于改进LEC法生长的InP晶体中位错的产生。晶体内的热条件来自于对炉内整体传热的动态数值模拟。为了考虑在接近熔点的温度下的行为,加入了位错湮灭模型,并在每个滑动系统上求解了位错密度。计算得到的位错密度与实测值吻合较好,该方法可以更好地了解位错倍增和优化生长参数,以降低3英寸掺杂铁晶圆中的位错密度。
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引用次数: 0
A selective low induced damage ICP dry etching process for a self-aligned InP-InGaAs HBT technology 自对准InP-InGaAs HBT技术的选择性低诱导损伤ICP干蚀刻工艺
J. Etrillard, S. Blayac, M. Riet
We report on an inductively coupled plasma (ICP) process using CH/sub 4//H/sub 2//O/sub 2/ chemistry which have been studied for a self-aligned HBT technology. A very low bias voltage is used to reduce the induced damages. The study has concerned the ion flux characteristics: ion current and ion energy. Surface morphology, pattern profile, etch rates and induced damages were investigated as functions of ion energy and density for an optimized ICP reactor configuration. A comparison is made with an ICP process using a SiCl/sub 4/ chemistry. Finally, a selective process allowing one to attempt an almost full dry etching self-aligned process for HBT applications is described.
本文报道了用CH/sub /H/sub /O/sub /化学方法研究自对准HBT技术的电感耦合等离子体(ICP)过程。使用极低的偏置电压来减少诱发损伤。研究了离子通量特性:离子电流和离子能量。在优化的ICP反应器结构中,研究了离子能量和密度对表面形貌、图案轮廓、腐蚀速率和诱导损伤的影响。并与采用SiCl/sub - 4/化学的ICP工艺进行了比较。最后,一个选择性的过程,允许一个尝试几乎完全干蚀刻自对准过程的HBT应用被描述。
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引用次数: 2
New MOVPE process for InP based HBT's using CBr/sub 4/, TBA and TBP in N/sub 2/ ambient 在N/sub - 2/环境下使用CBr/sub - 4/、TBA和TBP的InP基HBT新MOVPE工艺
D. Keiper, U. Eriksson, R. Westphalen, G. Landgren
Carbon doped InGaAs/InP was grown utilising TBA, CBr/sub 4/ in N/sub 2/. The n-doping uniformity for InGaAs shows a standard deviation of less than 1%, utilising SiH/sub 4/. Maximum carbon doping levels of 10/sup 20/ cm/sup -3/ were achieved, comparable to MBE techniques. HBTs with 6.5/spl times/10/sup 18/ cm/sup 3/ doped base layers, grown at 550/spl deg/C, show current amplifications of 130.
利用TBA、CBr/ sub4 /在N/ sub2 /中生长掺杂碳的InGaAs/InP。利用SiH/sub 4/, InGaAs的n掺杂均匀性的标准偏差小于1%。最大碳掺杂水平达到10/sup 20/ cm/sup -3/,与MBE技术相当。掺入6.5/spl倍/10/sup 18/ cm/sup 3/ /基层的HBTs,在550/spl度/C下生长,显示出130的电流放大。
{"title":"New MOVPE process for InP based HBT's using CBr/sub 4/, TBA and TBP in N/sub 2/ ambient","authors":"D. Keiper, U. Eriksson, R. Westphalen, G. Landgren","doi":"10.1109/ICIPRM.1999.773755","DOIUrl":"https://doi.org/10.1109/ICIPRM.1999.773755","url":null,"abstract":"Carbon doped InGaAs/InP was grown utilising TBA, CBr/sub 4/ in N/sub 2/. The n-doping uniformity for InGaAs shows a standard deviation of less than 1%, utilising SiH/sub 4/. Maximum carbon doping levels of 10/sup 20/ cm/sup -3/ were achieved, comparable to MBE techniques. HBTs with 6.5/spl times/10/sup 18/ cm/sup 3/ doped base layers, grown at 550/spl deg/C, show current amplifications of 130.","PeriodicalId":213868,"journal":{"name":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125768172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
InAs(P,Sb)/InAsSb LEDs emitting in the 3-4 /spl mu/m range at room temperature InAs(P,Sb)/InAsSb led在室温下在3-4 /spl mu/m范围内发光
A. Stein, A. Behres, K. Heime, A. Wilk, P. Christol, A. Joullie, M. Brozicek, E. Hulicius, T. Šimeček, S. Rushworth, L. Smith, M. Ravetz
We report the emission characteristics of MOVPE-grown InAs(P,Sb)/InAsSb multiquantum-well (MQW) LEDs operating in the mid-infrared spectral range (3-4 /spl mu/m). InAsP-InAsSb MQW structures exhibit at room temperature strong electroluminescence at 4.2 /spl mu/m, allowing the detection of CO/sub 2/. InAsPSb-InAsSb MQW structures show intense narrow (FWHM=75 nm) spontaneous emission around 3.3 /spl mu/m up to 270 K. The difference in photoluminescence (PL) energies for InAs(P)/InAsSb and InAsPSb-InAsSb MQW structures is explained supposing that the InAsPSb/InAsSb system has type-I band alignment whereas the InAs/InAsSb and InAsP/InAsSb quantum-wells are type-II, which can be confirmed by our calculations.
我们报道了movpe生长的InAs(P,Sb)/InAsSb多量子阱(MQW) led在中红外光谱范围(3-4 /spl mu/m)下的发射特性。InAsP-InAsSb MQW结构在室温下表现出4.2 /spl mu/m的强电致发光,允许检测CO/sub 2/。InAsPSb-InAsSb MQW结构在270 K时表现出强烈的窄自发辐射(FWHM=75 nm),约为3.3 /spl mu/m。对于InAs(P)/InAsSb和InAsPSb-InAsSb MQW结构的光致发光(PL)能量差异的解释,假设InAsPSb/InAsSb体系为i型波段对准,而InAs/InAsSb和InAsP/InAsSb量子阱为ii型波段对准,这可以通过计算得到证实。
{"title":"InAs(P,Sb)/InAsSb LEDs emitting in the 3-4 /spl mu/m range at room temperature","authors":"A. Stein, A. Behres, K. Heime, A. Wilk, P. Christol, A. Joullie, M. Brozicek, E. Hulicius, T. Šimeček, S. Rushworth, L. Smith, M. Ravetz","doi":"10.1109/ICIPRM.1999.773643","DOIUrl":"https://doi.org/10.1109/ICIPRM.1999.773643","url":null,"abstract":"We report the emission characteristics of MOVPE-grown InAs(P,Sb)/InAsSb multiquantum-well (MQW) LEDs operating in the mid-infrared spectral range (3-4 /spl mu/m). InAsP-InAsSb MQW structures exhibit at room temperature strong electroluminescence at 4.2 /spl mu/m, allowing the detection of CO/sub 2/. InAsPSb-InAsSb MQW structures show intense narrow (FWHM=75 nm) spontaneous emission around 3.3 /spl mu/m up to 270 K. The difference in photoluminescence (PL) energies for InAs(P)/InAsSb and InAsPSb-InAsSb MQW structures is explained supposing that the InAsPSb/InAsSb system has type-I band alignment whereas the InAs/InAsSb and InAsP/InAsSb quantum-wells are type-II, which can be confirmed by our calculations.","PeriodicalId":213868,"journal":{"name":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126149982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)
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