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Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)最新文献

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High reflectivity laser facets by deeply etched DBR buried with benzocyclobutene 高反射率激光切面的深蚀刻DBR埋与苯并环丁烯
M. M. Raj, J. Wiedmann, Y. Saka, H. Yasumoto, S. Arai
Lasers having a DBR facet on one side of the cavity were fabricated in a simple process using one step electron beam (EB) lithography and CH/sub 4//H/sub 2/-reactive ion etching (RIE). The DBR structure consists of deeply etched 3/spl lambda//4 wide grooves, which are buried with benzocyclobutene (BCB) polymer so as to reduce diffraction loss, spaced 3h/4 apart. The reflectivity of the DBR was estimated from the threshold current dependence on cavity length and an output power ratio from the front to the rear facets to be as high as 96% for 10 element DBR.
采用一步电子束(EB)光刻和CH/sub 4//H/sub 2/-反应离子刻蚀(RIE)工艺,制备了在腔体一侧具有DBR facet的激光器。DBR结构由深蚀刻的3/spl λ //4宽沟槽组成,沟槽内埋入苯并环丁烯(BCB)聚合物以减少衍射损失,沟槽间距为3h/4。根据阈值电流对腔长的依赖性和前后侧的输出功率比,DBR的反射率估计为10元DBR高达96%。
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引用次数: 0
InP/GaAsSb/InP double heterojunction bipolar transistors with high cut-off frequencies and breakdown voltages 具有高截止频率和击穿电压的InP/GaAsSb/InP双异质结双极晶体管
N. Matine, M. Dvorak, X.G. Xu, S. Watkins, C. Bolognesi
In this work, we report on the DC and microwave performance of MOCVD-grown carbon-doped InP/GaAsSb/InP double heterojunction transistors (DHBTs) with various collector thicknesses. The cut-off frequencies (and breakdown voltages) are 106 GHz (8 V), 82 GHz (10 V) and 40 GHz (15 V) for the 2000 /spl Aring/, 3000 /spl Aring/ and 5000 /spl Aring/, lightly doped collectors. The 106 GHz, which is the best f/sub T/ ever reported in this material system, is obtained while maintaining a relatively high breakdown voltage (BV/sub CEO/=8 V). The lower cut-off frequencies obtained for the 3000 /spl Aring/ and 5000 /spl Aring/, collectors are attributed to the longer transit time in the collector and also to the Kirk like limitation brought about by high current densities in the thicker collectors.
在这项工作中,我们报告了mocvd生长的不同集电极厚度的掺杂碳的InP/GaAsSb/InP双异质结晶体管(dhbt)的直流和微波性能。2000 /spl Aring/、3000 /spl Aring/和5000 /spl Aring/轻掺杂集电极的截止频率(和击穿电压)分别为106 GHz (8 V)、82 GHz (10 V)和40 GHz (15 V)。在保持较高击穿电压(BV/sub - CEO/=8 V)的情况下,获得了106 GHz的最佳f/sub - T/。3000 /spl和5000 /spl Aring/集热器获得了较低的截止频率,这是由于集热器中的传输时间较长,也归因于高电流密度在较厚的集热器中带来的柯克式限制。
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引用次数: 2
InAlAs/InP/InGaAs/InP DHBTs with a novel composite-emitter design 具有新型复合发射极设计的InAlAs/InP/InGaAs/InP dhbt
R. Driad, W. Mckinnon, S. Mcalister, A. Renaud, T. Garanzotis, A. Springthorpe
We report the design and performance of InAlAs/InP/InGaAs/InP double heterostructure bipolar transistors (DHBTs) with a composite-emitter (CE) design. The CE-DHBT structure combines various advantages of conventional InAlAs/InGaAs and InGaAs/InP HBTs. It allows passivation of the extrinsic base with a selective etch, and also allows the possibility of enhancing performance through nonequilibrium transport in the base. The CE-DHBT structure demonstrated an offset voltage (/spl Delta/V/sub CE0/) of 0.25 V with a saturation voltage (V/sub SAT/) of 0.6 V and a dc current gain of 25 for a base doping level of 7/spl times/10/sup 19/ cm/sup -3/.
本文报道了采用复合发射极(CE)设计的InAlAs/InP/InGaAs/InP双异质结构双极晶体管(dhbt)的设计和性能。CE-DHBT结构结合了传统InAlAs/InGaAs和InGaAs/InP HBTs的各种优点。它允许通过选择性蚀刻钝化外部碱,并且还允许通过碱中的非平衡传输来提高性能的可能性。CE-DHBT结构的偏置电压(/spl Delta/V/sub CE0/)为0.25 V,饱和电压(V/sub SAT/)为0.6 V,基掺杂水平为7/spl倍/10/sup 19/ cm/sup -3/时,直流电流增益为25。
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引用次数: 0
Indium phosphide-based femtosecond devices for ultrahigh throughput communications and signal-processing systems 用于超高吞吐量通信和信号处理系统的基于磷化铟的飞秒器件
O. Wada
Ultrafast optoelectronic devices are crucial for fulfilling the future requirement of network throughput to enter the 1 Tb/s to 10 Tb/s range. A variety of ultrafast phenomena in InP-based semiconductors are attractive for developing such new optoelectronic devices. This paper discusses the requirements of ultrafast optical communication and signal-processing systems and devices necessary for them. Recent advances in the development of ultrafast semiconductor-based optoelectronic devices, such as ultrashort pulse lasers and ultrafast all-optical switches, are described,.
超快光电器件对于满足未来网络吞吐量进入1tb /s到10tb /s范围的要求至关重要。基于inp的半导体中的各种超快现象对开发这种新型光电器件具有吸引力。本文讨论了超高速光通信和信号处理系统的要求及其所需的器件。介绍了基于半导体的超快光电器件的最新进展,如超短脉冲激光器和超快全光开关。
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引用次数: 4
High performance InP-based HEMTs with dry etched gate recess for the fabrication of low-noise microwave oscillators 干蚀刻栅极凹槽的高性能inp基hemt用于制造低噪声微波振荡器
H. Duran, L. Ren, M. Py, O. Homan, U. Lott, W. Bachtold
In this paper, a technology for the fabrication of high performance InP-based HEMTs using dry gate recess etching is reported. The dry etched devices show better uniformity and considerably reduced low-frequency noise compared to conventionally wet etched ones. As an application of the technology, a dielectric resonator oscillator (DRO) operating in the frequency range of 23.2-24.8 GHz was designed and fabricated using dry or wet etched InGaAs-InAlAs-InP HEMTs. An output power of 12 dBm and a phase noise of -107 dBc/Hz at 100 kHz offset from the carrier were measured for DROs with dry etched HEMTs. These values were superior by nearly 10 dB to those obtained with conventionally wet etched devices. The reduction in phase noise is attributed to hydrogen trap passivation during dry gate recess etching with a methane/hydrogen plasma.
本文报道了一种利用干栅凹槽刻蚀技术制备高性能inp基hemt的方法。与传统的湿蚀刻器件相比,干蚀刻器件表现出更好的均匀性和显著降低的低频噪声。作为该技术的应用,设计并制作了一个工作频率为23.2-24.8 GHz的介质谐振振荡器(DRO),该振荡器采用干式或湿式蚀刻InGaAs-InAlAs-InP HEMTs。采用干蚀刻hemt的DROs,在距载波100 kHz偏移时,输出功率为12 dBm,相位噪声为-107 dBc/Hz。这些值比传统湿蚀刻器件获得的值高出近10 dB。在甲烷/氢等离子体的干栅凹槽蚀刻过程中,氢阱钝化导致了相位噪声的降低。
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引用次数: 0
Fermi-level dependence of implanted Be diffusion in InP 注入Be在InP中扩散的费米能级依赖性
B. Molnar
The diffusion of ion implanted Be was studied by comparing the implanted profiles with their annealed profiles. The Be diffusion had been investigated in semi-insulating InP and in n- and p-type InP. The medium and high doses Be implants after a few seconds of activation anneal displayed fully developed redistribution. The redistribution is dependent on the background doping level. There is no redistribution during any type of anneal in highly n-type substrates, but as the Fermi-level is shifted towards the valence band by changing the background doping, the Be redistributes by developing a "tail". The implantation damage induced transient enhanced interstitial Be diffusion is assumed to be responsible for the redistribution.
通过对离子注入Be的分布与退火后的分布进行比较,研究了离子注入Be的扩散。研究了Be在半绝缘InP、n型和p型InP中的扩散。中剂量和高剂量Be植入体在几秒钟的激活退火后显示出完全发育的再分布。再分配依赖于背景兴奋剂水平。在高n型衬底中,在任何类型的退火过程中都没有再分布,但随着费米能级通过改变背景掺杂而向价带移动,Be通过形成“尾巴”而重新分布。假定注入损伤引起的瞬态强化间质Be扩散是造成重分布的主要原因。
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引用次数: 0
Properties of solution TMI/sup TM/ as an OMVPE source 解决方案TMI/sup TM/作为OMVPE源的特性
M. Ravetz, L. Smith, S. Rushworth, A. B. Leese, R. Kanjolia, J. I. Davies, R. Blunt
Solid trimethylindium (TMI) is the precursor of choice for the vast majority of MOVPE applications. However consistent pick up has been a problem under normal operating conditions. Epichem's solutions to this problem have included solution TMI/sup TM/ (TMI suspended in a high boiling point amine adducted to TMI) and dual reverse flow bubblers of solid TMI. A detailed investigation of solution TMI/sup TM/ is being continued at Epichem in order to understand the chemical and physical properties of this indium source. Results have proved solution TMI to have a more consistent 'pick up' than any alternative method and it has been identified as the best precursor for low oxygen applications.
固体三甲基lindium (TMI)是绝大多数MOVPE应用的首选前体。然而,在正常操作条件下,持续拾取一直是一个问题。Epichem针对该问题的解决方案包括溶液TMI/sup TM/ (TMI悬浮在与TMI结合的高沸点胺中)和固体TMI的双逆流起泡器。Epichem正在继续对溶液TMI/sup TM/进行详细研究,以了解这种铟源的化学和物理性质。结果证明,TMI溶液比任何替代方法都具有更一致的“拾取”效果,并且已被确定为低氧应用的最佳前体。
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引用次数: 0
Transferred-substrate heterojunction bipolar transistor integrated circuit technology 转移衬底异质结双极晶体管集成电路技术
M. Rodwell, Q. Lee, D. Mensa, J. Guthrie, Y. Betser, S. Martin, R.P. Smith, S. Jaganathan, T. Mathew, P. Krishnan, C. Serhan, S. Long
Using substrate transfer processes, we have fabricated heterojunction bipolar transistors with 0.4 /spl mu/m emitter-base and collector-base junctions, minimizing RC parasitics and increasing f/sub max/ to 820 GHz, the highest yet reported for a transistor. The process provides microstrip interconnects on a low-/spl epsiv//sub /spl tau// polymer dielectric with a electroplated copper ground plane and substrate. Substrate thermal resistance is reduced 5:1 over InP. Important wiring parasitics, including wiring capacitance, ground via inductance, and IC-package ground-return inductance, are substantially reduced. Demonstrated ICs include lumped and distributed amplifiers with bandwidths to 85 GHz, master-slave flip-flops operable at over 48 GHz, and 50 GHz AGC/limiting amplifiers. Current efforts include further improvement in bandwidth, development of power devices, and demonstration of more complex mixed-signal ICs.
利用衬底转移工艺,我们制造了具有0.4 /spl mu/m发射基和集电极基结的异质结双极晶体管,最大限度地减少了RC寄生,并将f/sub max/提高到820 GHz,这是迄今为止报道的最高晶体管。该工艺在低/spl epsiv//sub /spl tau//聚合物介质上提供微带互连,并具有电镀铜地平面和衬底。衬底热阻在InP上降低了5:1。重要的布线寄生,包括布线电容、经地电感和ic封装接地返回电感,大大降低。演示的ic包括带宽达85 GHz的集总和分布式放大器,可在48 GHz以上工作的主从触发器,以及50 GHz AGC/限制放大器。目前的工作包括进一步改进带宽,开发功率器件,以及演示更复杂的混合信号集成电路。
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引用次数: 15
Imaging studies of strained InGaAsP/InP heterostructures by photoluminescence microscopy 应变InGaAsP/InP异质结构的光致发光显微镜成像研究
A. Bernussi, W. Carvalho, M. Furtado, A. Gobbi, M. Cotta
Strained In/sub 1-x/Ga/sub x/As/sub y/P/sub 1-y//InP single quantum wells grown by low-pressure metal-organic vapor phase epitaxy were investigated by photoluminescence microscopy imaging (PLM), photoluminescence spectroscopy, X-ray diffraction and atomic force microscopy techniques. PLM images of strained structures revealed the presence of a large number of non-radiative centers (dark spots). The dark spot density was dependent on tensile strain magnitude, barrier material and cap layer thickness. PLM images of highly tensile and compressive strained quaternary layers grown with the same structure exhibited quite different relaxation mechanisms.
采用光致发光显微镜成像(PLM)、光致发光光谱、x射线衍射和原子力显微镜技术研究了低压金属-有机气相外延生长的应变In/sub 1-x/Ga/sub x/As/sub y/P/sub 1-y/ InP单量子阱。应变结构的PLM图像显示存在大量非辐射中心(黑点)。暗斑密度与拉伸应变大小、阻挡材料和帽层厚度有关。在相同结构下生长的高拉伸和高压缩应变第四系层的PLM图像显示出截然不同的松弛机制。
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引用次数: 0
Uniformity of Fe-diffused semi-insulating InP wafers fe扩散半绝缘InP晶圆的均匀性
R. Fornari, T. Gorog, J. Jiménez, E. de la Puente, I. Grant, M. Brozel, M. Nicholls
A study on the uniformity of Fe-diffused semi-insulating InP wafers is presented. The electrical characterisation showed that after the diffusion annealing the wafers became semi-insulating, with resistivities generally above 10/sup 8/ /spl Omega/ cm and mobilities in the range 3000-4000 cm/sup 2//Vs. PL and resistivity mapping showed that the short range uniformity is excellent but that sometimes the wafers exhibit long range gradients of resistivity and luminescence intensity. The gradients are believed to be associated with temperature gradients inside the annealing furnace.
对fe扩散半绝缘InP片的均匀性进行了研究。电学表征表明,经扩散退火后晶圆呈半绝缘状态,电阻率一般在10/sup 8/ /spl ω / cm以上,迁移率在3000 ~ 4000 cm/sup 2//Vs之间。PL和电阻率图显示,晶圆的近程均匀性很好,但有时会出现电阻率和发光强度的长程梯度。这些梯度被认为与退火炉内部的温度梯度有关。
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引用次数: 0
期刊
Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)
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