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Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)最新文献

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Characterization of He-plasma-assisted GSMBE InGaAsP he等离子体辅助GSMBE在aasp中的表征
H. Pinkney, D. Thompson, B. Robinson, P. Simpson, U. Myler, R. Streater
In this paper, we present the properties of InGaAsP (1.55 /spl mu/m) grown by He-plasma-assisted GSMBE. Variable energy positron annihilation studies, room temperature hall effect measurements and SIMS analysis have been performed. It is evident that this material contains traps which reduce the carrier concentration in both doped and undoped samples, open volume defects which enlarge upon anneal, and a small concentration of hydrogen, all of which may play a role in the behavior of this novel material.
本文报道了he等离子体辅助GSMBE生长InGaAsP (1.55 /spl mu/m)的性质。变能正电子湮灭研究,室温霍尔效应测量和SIMS分析已经完成。很明显,该材料中含有降低掺杂和未掺杂样品中载流子浓度的陷阱,在退火后扩大的开体积缺陷,以及小浓度的氢,所有这些都可能在这种新材料的行为中起作用。
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引用次数: 0
Submicron transferred-substrate heterojunction bipolar transistors with greater than 8000 GHz f/sub max/ 大于8000ghz /sub max/的亚微米转移衬底异质结双极晶体管
Q. Lee, S. Martin, D. Mensa, R.P. Smith, J. Guthrie, S. Jaganathan, T. Mathew, S. Krishnan, S. Creran, M. Rodwell
We report submicron transferred-substrate AlInAs/GaInAs heterojunction bipolar transistors. Devices with 0.4 /spl mu/m emitter and 0.9 /spl mu/m collector widths have 17.5 dB unilateral gain at 110 GHz. Extrapolating at -20 dB/decade, the power gain cut-off frequency f/sub max/ is 820 GHz.
我们报道了亚微米转移衬底AlInAs/GaInAs异质结双极晶体管。发射极宽度为0.4 /spl μ /m、集电极宽度为0.9 /spl μ /m的器件在110 GHz时单边增益为17.5 dB。外推-20 dB/ 10,功率增益截止频率f/sub max/为820 GHz。
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引用次数: 25
Observation of resonant tunneling through InAs quantum dots by using novel electrophotoluminescence spectroscopy 用新型电泳发光光谱法观察InAs量子点的共振隧穿
Y. Ohno, K. Asaoka, S. Kishimoto, K. Maezawa, T. Mizutani
The resonant tunneling through single InAs quantum dots embedded in an GaAs/i-Al/sub 0.38/Ga/sub 0.62/As/n-GaAs diode has been studied by using microscopic electrophotoluminescence spectroscopy. A group of sharp luminescence lines which originate from single quantum dots was observed by injecting resonant electrons from the emitter to the dots. Bias dependence of a single luminescence line has been investigated. The peak intensity shows triangular dependence which is similar to the current-voltage characteristics of 3D-0D resonant tunneling. When the bias voltage increases, the peak energy slightly shifts to a lower energy indicating the existence of stark effect, and the linewidth slightly increases. Moreover, the higher the luminescence energy is, the broader the linewidth is. This result agrees with the calculated resonant level width. The lifetime of resonant states is estimated to be 2.4-27 ps for luminescence linewidth of 250-22 /spl mu/eV.
利用显微电泳发光光谱研究了嵌入在GaAs/i-Al/sub 0.38/Ga/sub 0.62/As/n-GaAs二极管中的单个InAs量子点的共振隧穿。通过从发射极向量子点注入共振电子,观察到单个量子点产生的一组尖锐发光线。研究了单个发光线的偏置依赖性。峰值强度呈三角关系,与3D-0D谐振隧道的电流-电压特性相似。当偏置电压增加时,峰值能量略有向较低的能量偏移,表明存在斯塔克效应,线宽略有增加。发光能量越高,线宽越宽。该结果与计算的谐振能级宽度一致。当发光线宽度为250-22 /spl mu/eV时,谐振态寿命估计为2.4- 27ps。
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引用次数: 0
Improved excess noise and temperature dependence of multiplication characteristics in thin InP avalanching regions 改善了薄InP雪崩区倍增特性的过量噪声和温度依赖性
C. H. Tan, K.F. Li, S. Plimmer, J. David, G. Rees, J. Clark, C. Button
We report measurements of electron initiated avalanche noise at room temperature in a range of InP p/sup +/-i-n/sup +/ diodes with i-region widths, M ranging from 2.40 /spl mu/m to 0.24 /spl mu/m. A significant reduction in excess noise is observed with decreasing w at constant multiplication. We also report electron initiated photomultiplication and breakdown voltage of InP p/sup +/-i-n/sup +/ diodes with nominal i-region widths of 0.30 /spl mu/m and 0.50 /spl mu/m at temperatures ranging from 20 K to 300 K. Improved temperature stability is observed as the avalanche region width is reduced.
我们报告了在室温下电子引发雪崩噪声的测量,测量范围为InP p/sup +/-i-n/sup +/二极管,其i-区域宽度M范围为2.40 /spl mu/ M至0.24 /spl mu/ M。在恒定乘法下,随着w的减小,观察到多余噪声的显著减少。我们还报道了InP p/sup +/-i-n/sup +/二极管的电子激发光电倍增和击穿电压,标称i区宽度为0.30 /spl mu/m和0.50 /spl mu/m,温度范围为20 K至300 K。随着雪崩区宽度的减小,温度稳定性得到了改善。
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引用次数: 2
VGF crystal growth and vapor-phase Fe doping technologies for semi-insulating 100 mm diameter InP substrates 半绝缘100mm直径InP衬底的VGF晶体生长和气相Fe掺杂技术
T. Asahi, M. Uchida, K. Kainosho, O. Oda
100 mm diameter <100> semi-insulating InP substrates were obtained after conductive undoped wafers were annealed under volatile FeP/sub 2/ atmosphere. Undoped crystals were grown by the VGF method using a high pressure furnace. In this growth method, we investigated the reduction of the temperature fluctuation by computer simulation for preventing twinning. The temperature fluctuation near the seed crystal could be reduced from /spl plusmn/0.3/spl deg/C to /spl plusmn/0.03/spl deg/C after improvement of the hot-zone, based on the simulation results. Semi-insulating InP is conventionally produced by Fe doping during crystal growth. In the conventional doping method, the Fe concentration is varied along the growth axis due to Fe segregation in InP. In order to obtain good homogeneity of Fe concentrations from wafer to wafer, we have developed a new Fe doping technology in which wafers are annealed under volatile FeP/sub 2/ atmosphere. In this work, we applied this Fe doping technology to 100 mm diameter <100> InP substrates and could obtain large diameter semi-insulating substrates.
在挥发性FeP/亚2/气氛下对未掺杂的导电硅片进行退火处理,得到了直径为100mm的半绝缘InP衬底。采用高压炉VGF法生长未掺杂晶体。在这种生长方法中,我们通过计算机模拟研究了降低温度波动以防止孪生的方法。模拟结果表明,改进热区后,晶种附近的温度波动从/spl plusmn/0.3/spl°C减小到/spl plusmn/0.03/spl°C。半绝缘InP通常是在晶体生长过程中由Fe掺杂产生的。在传统的掺杂方法中,由于InP中的铁偏析,铁浓度沿生长轴变化。为了获得良好的晶片间Fe浓度均匀性,我们开发了一种新的Fe掺杂技术,即在挥发性FeP/亚2/气氛下对晶片进行退火。在这项工作中,我们将这种Fe掺杂技术应用于直径为100mm的InP衬底,可以获得大直径的半绝缘衬底。
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引用次数: 2
Controlled growth variation for the detuning of AlGaInP-based microcavity light emitting diodes algainp基微腔发光二极管失谐的受控生长变化
P. Royo, M. Ilegems, M. Moser, R. Hovel, H. P. Schweizer, K. Gulden
Visible top emitting microcavity light emitting diodes have been fabricated. The structure consists of two AlGaAs-AlAs Bragg reflectors surrounding an AlGaInP cavity with three GaInP quantum wells. The extraction efficiency of these structures can be maximized optimising the detuning between the quantum well emission and the cavity mode wavelength. We have grown a structure with parabolic profiles of thickness for the reflector layers only: the cavity mode wavelength was continuously shifted by 60 nm over the wafer. We measured a maximum of external quantum efficiency of 1.2% corresponding to a detuning of -12 nm in good agreement with analytical simulations. This result enabled us to estimate an internal quantum efficiency of 50% at a current density of 20 A/cm/sup 2/.
制备了可见顶发射微腔发光二极管。该结构由两个alggaas - alas Bragg反射器组成,围绕着一个具有三个GaInP量子阱的AlGaInP腔。通过优化量子阱发射和腔模波长之间的失谐,可以最大限度地提高这些结构的提取效率。我们已经培养了一个仅反射层厚度为抛物线型的结构:在晶圆上,腔模波长连续移动了60 nm。我们测量的最大外量子效率为1.2%,对应于-12 nm的失谐,与分析模拟很好地一致。这一结果使我们能够估计在电流密度为20 a /cm/sup /时的内部量子效率为50%。
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引用次数: 0
InGaAs/GaAs strained quantum wires grown by OMCVD on corrugated substrates 在波纹衬底上OMCVD生长InGaAs/GaAs应变量子线
F. Lelarge, K. Leifer, A. Condó, V. Iakovlev, E. Martinet, C. Constantin, A. Rudra, E. Kapon
Self-ordered, strained InGaAs/GaAs quantum structures are grown on V-grooved GaAs substrates. Indium segregation at the bottom of the groove results in the formation of a vertical InGaAs quantum well structure with In-enriched composition. The lateral definition permits the growth of defect-free strained structures with thickness exceeding that achieved with planar epitaxy. We study the influence of the nominal thickness and In content on the photoluminescence peak wavelength of V-grooved quantum wires. Finally, room temperature emission at 1.12 /spl mu/m with relatively narrow linewidth (30-35 meV) is demonstrated.
在v型沟槽GaAs衬底上生长了自有序、应变的InGaAs/GaAs量子结构。凹槽底部的铟偏析形成了富in成分的垂直InGaAs量子阱结构。横向定义允许生长厚度超过平面外延的无缺陷应变结构。研究了v槽量子线标称厚度和In含量对其光致发光峰值波长的影响。最后,展示了1.12 /spl mu/m的室温发射,相对较窄的线宽(30-35 meV)。
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引用次数: 2
Improvement of CBE grown InGaAs/InP HBT's using a carbon doped and compositionally graded base 采用碳掺杂和成分梯度基底改进CBE生长InGaAs/InP HBT
J. Benchimol, J. Mba, A.R. Duchenois, P. Berdaguer, B. Sermage, G. Le Roux, S. Blayac, M. Riet, J. Thuret, C. Gonzalez, P. Andre
InGaAs/lnP heterojunction bipolar transistors (HBT) with a carbon doped base are shown to have lower gain than those with Be doped base, partly because of lower electron lifetime. In order to keep advantage of the low diffusivity of carbon dopant, a composition graduality is introduced in the base, which significantly improves the current gain of HBT's. This graduality also leads to some advantageous side effects such as higher doping levels, low base sheet resistance and constant gain over a four-decade current range, without degrading the lifetime of the device. Such structures were processed as single HBT devices with high frequency performances (f/sub t/=168 GHz), digital circuits (2:1 MUX) operating at 46 Gbit/s and phototransistors with 35 dB optical gain and 62 GHz optical cut-off frequency.
掺杂碳基的InGaAs/lnP异质结双极晶体管(HBT)的增益比掺杂Be基的低,部分原因是其电子寿命较低。为了保持碳掺杂物低扩散率的优势,在基体中引入成分渐变,显著提高了HBT的电流增益。这种渐进性也导致了一些有利的副作用,如更高的掺杂水平,低基片电阻和超过40年电流范围的恒定增益,而不会降低器件的使用寿命。这些结构被加工成具有高频性能(f/sub /=168 GHz)的单HBT器件,工作速度为46 Gbit/s的数字电路(2:1 MUX)和光增益为35 dB、光截止频率为62 GHz的光电晶体管。
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引用次数: 6
Photonic integration technology without semiconductor etching 无半导体蚀刻的光子集成技术
D. Jahan, P. Legay, F. Alexandre
Monolithic device integration is more and more essential for the realisation of micro and optoelectronic circuits, which can fulfil complex functions with higher performances. The most prevalent approach in the fabrication of photonic integrated circuits (PICs) is the butt-coupling. This can be done in one step by Selective Area Growth (SAG) carried out by Metalorganic Vapour Phase Epitaxy (MOVPE) or by localised selective regrowth by Chemical Beam Epitaxy (CBE). The former technique inconvenient is that the structures of the devices cannot be quite different, especially, if one of them should be doped, the others will be doped as well. The latter method needs one epitaxial step for each integrated structure and requires several etching steps, which can deteriorate the performances of the regrown devices. This study proposes a new procedure to integrate several devices without any etching step.
单片器件集成对于实现微光电电路越来越重要,它可以以更高的性能完成复杂的功能。在光子集成电路(PICs)的制造中,最普遍的方法是对接耦合。这可以通过金属有机气相外延(MOVPE)进行的选择性区域生长(SAG)或化学束外延(CBE)进行的局部选择性再生一步完成。前一种技术的不便之处在于器件的结构不能有很大的不同,特别是如果要掺杂其中一种器件,则其他器件也要掺杂。后一种方法对于每个集成结构需要一个外延步骤,并且需要几个蚀刻步骤,这可能会降低再生器件的性能。本研究提出了一种无需蚀刻步骤即可集成多个器件的新工艺。
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引用次数: 0
Carrier capture in self-assembled InAs/InP quantum dots 自组装InAs/InP量子点中的载流子捕获
S. Hinooda, N. Bertru, S. Fréchengues, B. Lambert, S. Loualiche, M. Paillard, X. Marie, T. Amand
Carrier capture of InAs quantum dots structure on InP (311)B substrate has been studied by optical measurements. Photoluminescence measurements shows a clear decrease of the decay time of the two dimensional confining layer at high temperature under lower excitation. A strong decrease of the decay time has also been observed under high incident excitation even at low temperature. These effects are explained, by a very simple model, as a consequence of carrier capture into quantum dots assisted by a thermal activation of carriers and energy relaxation through the Auger process.
通过光学测量研究了InP (311)B衬底上InAs量子点结构的载流子捕获。光致发光测量表明,在较低激发下,二维围合层在高温下的衰变时间明显缩短。在高入射激发下,即使在低温下,衰变时间也明显缩短。这些效应可以用一个非常简单的模型来解释,这是载流子捕获到量子点的结果,通过俄歇过程辅助载流子的热激活和能量松弛。
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引用次数: 0
期刊
Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)
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