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0.5-2.6GHz Si-Monolithic Wideband Amplifier IC 0.5-2.6GHz硅单片宽带放大器IC
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1985.1113639
T. Nakata, S. Miyazaki, K. Shirotori
Using Si, an excellent performances, 0.5-2.6GHz bandwidth and 23dB gain, monolithic wideband amplifier IC has been developed, of which input and output impedances are matched to 50 Omega. The f/sub T/=l0GHz DNP-II manufacturing process with optimization for microwave analog ICs has been developed for this IC. And a single-ended three stages amplifier circuit with local feedback loops is adopted for this monolithic circuit.
利用性能优异、带宽0.5 ~ 2.6 ghz、增益23dB的Si,研制了输入输出阻抗匹配为50 ω的单片宽带放大器IC。针对该集成电路开发了优化的f/sub T/= 10ghz微波模拟集成电路DNP-II制造工艺,并采用带局部反馈回路的单端三级放大电路。
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引用次数: 0
Microwave/Millimeter Wave Monolithic Integrated Circuits (MIMIC) Program 微波/毫米波单片集成电路(MIMIC)程序
Pub Date : 1900-01-01 DOI: 10.1109/mcs.1986.1114468
E. Maynard
The Microwave/Millimeter Wave Monolithic Initiative (M/sup 3/I) was started by concerns in the smart munitions guidance and control community over the projected costs of millimeter wave seekers. A survey of monolithic analog integrated circuits was made by a DoD Working Group, consisting of personnel from OSD, Army, Navy, Air Force, DARPA and SDIO. The team visited 23 companies and several government facilities engaged in development of the technology.
微波/毫米波单片倡议(M/sup 3/I)是由智能弹药制导和控制社区对毫米波导引头的预计成本的关注发起的。国防部工作组对单片模拟集成电路进行了调查,该工作组由OSD、陆军、海军、空军、DARPA和SDIO的人员组成。考察队参观了23家从事这项技术开发的公司和若干政府设施。
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引用次数: 2
Low Cost MMIC Insertion Using Thick Film Processing 使用厚膜加工的低成本MMIC插入
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114532
A. Bettner, B. Hundley, P. Salisbury
Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
多层厚膜电路已经被开发出来,为MMIC芯片提供单电源偏置和无功匹配。其结果是一种以极低成本获得大量增益的方法。
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引用次数: 0
High Performance Monolithic Power Amplifier Using a Unique Ion Implantation Process 采用独特离子注入工艺的高性能单片功率放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1986.1114469
S. Wang, K.G. Wang, C.D. Chang
State-of-the-art X-band power FETs and monolithic amplifiers have been fabricated by a high yield planar process using a unique double-peaked implant profile. A 1-mm FET has achieved 40 percent power added efficiency with 720 mW output power and 6.3 dB gain at 10 GHz. A two-stage monolithic amplifier has delivered 2.2 W output power at 9.5 GHz for a record 0.6 W/mm power density. The monolithic amplifier chips have also achieved 20 percent dc-yield and 5 percent uniformity in /sup I/DSS and /sup V/PO.
最先进的x波段功率场效应管和单片放大器已经通过使用独特的双峰植入轮廓的高良率平面工艺制造。1毫米FET在10 GHz时输出功率为720 mW,增益为6.3 dB,功率增加效率为40%。两级单片放大器在9.5 GHz下提供2.2 W输出功率,功率密度达到创纪录的0.6 W/mm。单片放大器芯片在/sup I/DSS和/sup V/PO中也实现了20%的直流良率和5%的均匀性。
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引用次数: 0
A Stable 2-26.5 GHz Two-Stage Dual-Gate Distributed MMIC Amplifier 一种稳定的2-26.5 GHz两级双门分布式MMIC放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1986.1114472
J. Orr
A 2 to 26.5 GHz monolithic distributed amplifier with 18.75 +- 1.25 dB of gain, better than 12 dB return losses at input and output, and greater than 40 dB of isolation has been realized on a single 3.02mm x 1.62mm chip.
在一个3.02mm × 1.62mm的单片芯片上实现了2 ~ 26.5 GHz单片分布式放大器,增益18.75 +- 1.25 dB,输入输出回波损耗大于12 dB,隔离度大于40 dB。
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引用次数: 0
A W-Band Monolithic Balanced Mixer w波段单片平衡混频器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1985.1113642
L.T. Yuan, P. Asher
A fully monolithic balanced mixer fabricated on a GaAs substrate for operation at W-Band (75 to 110 GHz) is described. The overall size of the mixer chip is 0.075" x 0.075" x 0.004". A minimum conversion loss of 4.6 dB has been measured at 91.1 GHz for narrow band operation. For broadband operation, a conversion loss of less than 8 dB has been achieved over an RF range of 73.6 to 83.6 GHz with a corresponding IF range of 8 to 18 GHz.
描述了一种基于GaAs衬底的全单片平衡混频器,用于w波段(75至110 GHz)的工作。混频器芯片的整体尺寸为0.075“x 0.075”x 0.004“。在91.1 GHz窄带工作下,最小转换损耗为4.6 dB。对于宽带操作,在73.6至83.6 GHz的射频范围内实现了小于8 dB的转换损耗,相应的中频范围为8至18 GHz。
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引用次数: 0
Cost-Effective High Performance Monolithic X-Band Low Noise Amplifiers 性价比高的高性能单片x波段低噪声放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1986.1114480
D.C. Wang, R. G. Pauley, S. Wang, L.C.T. Liu
A low cost and high performance X-band low-noise amplifier with ion-implanted MESFET technology has been demonstrated. Various design, material, and processing approaches have been evaluated in terms of yield, cost, and device performance. An average noise figure of 2.2 dB and standard deviation of 0.1 dB with an associated gain of 22.5 dB and standard deviation of 0.8 dB at center frequency band of 9.5 GHz has been measured.
采用离子注入MESFET技术研制了一种低成本、高性能的x波段低噪声放大器。各种设计、材料和加工方法已经在产量、成本和设备性能方面进行了评估。在9.5 GHz中心频段测得平均噪声系数为2.2 dB,标准差为0.1 dB,相关增益为22.5 dB,标准差为0.8 dB。
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引用次数: 0
A Low Cost Packaging/Testing Procedure for Manufacturing GaAs MMIC 制造GaAs MMIC的低成本封装/测试程序
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114533
R. Esfandiari, D. Yang, S. Chan, S. Lin, R. K. Ellis
The development of a low cost, high throughput testing/packaging procedure for GaAs MMIC is described. Automated on-wafer RF and DC testing is essential for volume production of MMIC chips. However most MMIC circuits cannot be tested at wafer level due to lack of proper RF test environment. The proposed frame tape chip carrier approach takes full advantage of the RF probe system. This technique reduces the high cost of RF package measurements and reliability testing. The measurement and packaging is demonstrated on several MMIC chips. It can easily be automated for high volume production.
描述了一种低成本,高通量的GaAs MMIC测试/封装程序的开发。自动化晶圆上RF和DC测试对于MMIC芯片的批量生产至关重要。然而,由于缺乏适当的射频测试环境,大多数MMIC电路无法在晶圆级进行测试。所提出的帧带芯片载波方法充分利用了射频探测系统的优势。该技术降低了射频封装测量和可靠性测试的高成本。在几个MMIC芯片上演示了测量和封装。它可以很容易地自动化大批量生产。
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引用次数: 0
Two stage dual Gate MESFET Monolithic Gain Control Amplifier for Ka-Band 用于ka波段的两级双门MESFET单片增益控制放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114519
V. Sokolov, J. Geddes, A. Contolatis
A monolithic two stage gain control amplifier has been developed using submicron gate length dual gate MESFETs fabricated on ion implanted material. The amplifier has a gain of 12 dB at 30 GHz with a gain control range of over 30 dB. This ion implanted monolithic IC is readily integrable with other phased array receiver functions such as low noise amplifiers and phase shifters.
采用离子注入材料制备亚微米栅长双栅mesfet,研制了单片两级增益控制放大器。放大器在30 GHz时的增益为12 dB,增益控制范围超过30 dB。这种离子注入的单片集成电路很容易与其他相控阵接收器功能集成,如低噪声放大器和移相器。
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引用次数: 0
State-of-the-Art Ion-Implanted Low-Noise GaAs MESFET and Monolithic Amplifier 最先进的离子注入低噪声砷化镓 MESFET 和单片放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114528
K.G. Wang, S. Wang
State-of-the-art GaAs low-noise MESFET and monolithic amplifier have been fabricated using a high yield, planar, ion-implantation process. A 0.5 µm-gate FET has achieved 1.2 dB noise figure with 8.8 dB associated gain at 12 GHz and 1.7 dB noise figure with 6.6 dB associated gain at 18 GHz. A two-stage monolithic amplifier using this FET process has achieved 1.8 dB noise figure with 23.6 dB associated gain at 9.5 GHz. The dc yield of the amplifier chips is better than 40 percent.
采用高产量、平面离子注入工艺制造出了最先进的砷化镓低噪声 MESFET 和单片放大器。0.5 微米栅极场效应晶体管在 12 千兆赫时的噪声系数为 1.2 分贝,相关增益为 8.8 分贝;在 18 千兆赫时的噪声系数为 1.7 分贝,相关增益为 6.6 分贝。采用这种 FET 工艺的两级单片放大器在 9.5 GHz 时实现了 1.8 dB 的噪声系数和 23.6 dB 的相关增益。放大器芯片的直流成品率优于 40%。
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引用次数: 0
期刊
Microwave and Millimeter-Wave Monolithic Circuits
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