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Design and Process Sensitivity of a Two Stage 6-18 GHz Monolithic Feedback Amplifier 两级6- 18ghz单片反馈放大器的设计与工艺灵敏度
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1985.1113635
John M. Bean, Stephen, R. Nelson, Ralph E. Williams
The design of a 6-18 GHz, two stage monolithic feedback amplifier is discussed, and the critical process and FET parameters are identified. Variations in circuit performance experienced during a pilot production run are correlated with the predictions of a sensitivity analysis. The critical parameters are substrate height, GaAs sheet resistivity, gate-source capacitance, transconductance, and drain-source resistance. Measured results show the importance of substrate height and sheet resistivity in the control of gain flatness.
讨论了6- 18ghz两级单片反馈放大器的设计,确定了关键工艺和场效应管参数。在试生产运行过程中,电路性能的变化与灵敏度分析的预测相关联。关键参数是衬底高度、砷化镓片电阻率、栅源电容、跨导和漏源电阻。测量结果表明,衬底高度和片材电阻率在控制增益平坦度中的重要性。
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引用次数: 0
A High Gain, Monolithic Distributed Amplifier Using Cascode Active Elements 一种采用级联有源元件的高增益单片分布式放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1986.1114473
R. Larue, S. Bandy, G. Zdasiuk
A novel, monolithic, distributed amplifier has achieved a record gain of over 10 dB from 2-18 GHz. The design utilizes five quarter-micron gate length, cascode connected, FETs on epitaxial material . Circuit simulations predict over 10 dB gain from 2-30 GHz for an amplifier with seven active elements. Novel features of the design, fabrication and testing are discussed.
一种新型的单片分布式放大器在2-18 GHz范围内实现了超过10 dB的创纪录增益。该设计利用五个四分之一微米栅极长度,级联,外延材料上的场效应管。电路仿真预测,在2-30 GHz范围内,具有7个有源元件的放大器增益超过10 dB。讨论了设计、制造和测试的新特点。
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引用次数: 0
An 8-15 GHz GaAs Monolithic Frequency Converter 一种8- 15ghz GaAs单片变频器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114510
R. Ramachandran, S. Moghe, P. Ho, A. Podell
An MMIC frequency converter with an RF bandwidth of 8-15 GHz and an IF bandwidth of 1.5 GHz has been designed and built. The MMlC chip has15 dB conversion gain and includes a two-stage RF amplifier, a two-stage LO buffer amplifier, a double-balanced mixer and a three-stage IF amplifier. This high level of integration is realized on a 48 x 96 mil area, resulting in good RF yields. The circuit employs a push-pull configuration to eliminate the need for via-holes (low-inductance grounds) and facilitate a compact layout.
设计并实现了一个射频带宽为8 ~ 15ghz,中频带宽为1.5 GHz的MMIC变频器。MMlC芯片具有15db转换增益,包括一个两级射频放大器,一个两级LO缓冲放大器,一个双平衡混频器和一个三级中频放大器。这种高集成度在48 x 96 mil的面积上实现,从而产生良好的射频产量。该电路采用推挽配置,以消除对过孔(低电感接地)的需要,并便于紧凑的布局。
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引用次数: 2
A GaAs Double-Balanced Dual-Gate FET Mixer IC for UHF Receiver Front-End Applications 一种用于UHF接收器前端的GaAs双平衡双栅FET混频器IC
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1985.1113640
K. Kanazawa, M. Kazumura, S. Nambu, G. Kanô, I. Teramoto
A double-balanced dual-gate FET mixer has been developed aiming at the application to a front-end circuit of the UHF receivers. An experimental IC has exhibited a 6 - 8 dB conversion gain without matching over a wide frequency range from 100 MHz to 800 MHz with the well suppressed RF/LO feedthough by more than 20 dB and third-order intermodulation product of -60 dB.
针对超高频接收机前端电路的应用,研制了一种双平衡双栅场效应管混频器。实验IC在100 MHz至800 MHz的宽频率范围内显示出6 - 8 dB的转换增益,而不匹配,良好抑制RF/LO馈通超过20 dB,三阶互调积为-60 dB。
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引用次数: 0
A 30 GHz Monolithic Single Balanced Mixer with Integrated Dipole Receiving Element 带有集成偶极子接收元件的30ghz单片平衡混频器
Pub Date : 1900-01-01 DOI: 10.1109/mcs.1985.1113643
S. Nightingale, M. Upton, U. Mishra, S. Palmateer, P.M. Smith
A 30 GHz monolithic low noise balanced mixer has been developed using an integrated 'bow tie' antenna/WG transition and low parasitic Mott diodes. The diodes and mixer circuit were developed on General Electric grown MBE material and were fabricated using a plated air bridge technology. Measurements on the diode at DC and RF showed that the zero bias junction capacitance was 0.025 pF and the series resistance was 10 ohms. A conversion loss of 6 dB was measured at 30 GHz with a 1 GHz IF.
采用集成的“领结”天线/WG过渡和低寄生莫特二极管,开发了一种30 GHz单片低噪声平衡混频器。二极管和混频器电路是在通用电气生长的MBE材料上开发的,并采用镀气桥技术制造。直流和射频测试结果表明,零偏置结电容为0.025 pF,串联电阻为10欧姆。在1 GHz中频下,在30 GHz下测量到6 dB的转换损耗。
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引用次数: 0
A High Performance 2-18.5 GHz Distributed Amplifier, Theory and Experiment 高性能2-18.5 GHz分布式放大器,理论与实验
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1986.1114474
T. Mckay, R. Williams
A high performance 2-18.5 GHz monolithic GaAs MESFET distributed ampIifier has been designed and fabricated. The m-derived drain line design is analyzed theoretically and a closed form gain equation is presented. Theoretical predictions are compared to measured results and more complicated CAD models. The measured small signal gain is typically 8.0 /sup +-/ 0.25dB from 2-18.5 GHz at standard bias. Typical input return loss is greater than 12dB and the output return loss is greater than 15dB. The saturated output power is in excess of 23dBm over most of the band and the noise figure is less than 7.5dB.
设计并制作了一种高性能2-18.5 GHz单片GaAs MESFET分布式放大器。对m型漏极线设计进行了理论分析,并给出了封闭形式的增益方程。将理论预测与测量结果和更复杂的CAD模型进行比较。在标准偏置下,在2-18.5 GHz范围内测量的小信号增益通常为8.0 /sup +-/ 0.25dB。典型的输入回波损耗大于12dB,输出回波损耗大于15dB。大部分频段的饱和输出功率大于23dBm,噪声系数小于7.5dB。
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引用次数: 2
Successful Automated Alloy Attachment of GaAs MMIC's GaAs MMIC的自动合金连接成功
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114531
J. Pavio
Automated alloy attachment of GaAs MMIC's is presented utilizing a reflow furnace for attachment of multiple devices at one time rather than manual scrub of each monolithic separately. Reflow characteristics of a variety of solders were analyzed as well as behavior of those solders during long term temperature bake and during 1000 cycles of thermal cycling. RF and thermal impedance data was measured through 600 thermal cycles in order to verify Iong term electrical performance. Finally, the study addressed fractures in GaAs due to thermal expansion differences between the alloy and the GaAs MMIC itself. The main objective for the monolithic attachment study was to identify alloy materials and to develop processes which provide the following characteristics.
本文介绍了GaAs MMIC的自动合金连接,利用回流炉一次连接多个器件,而不是手动分别擦洗每个单片。分析了各种焊料的回流特性,以及这些焊料在长期温度烘烤和1000次热循环中的行为。通过600个热循环测量射频和热阻抗数据,以验证长期电气性能。最后,该研究解决了由于合金和GaAs MMIC本身的热膨胀差异而导致的GaAs断裂问题。整体附件研究的主要目的是确定合金材料并开发提供以下特性的工艺。
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引用次数: 0
Heterojunction Bipolar Transistors for Microwave and Millimeter-Wave Integrated Circuits 微波和毫米波集成电路用异质结双极晶体管
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114503
P. Asbeck, K. Wang, D.L. Miller, G. Sullivan, N. Sheng, E. Sovero, J. Higgins
This paper reviews the present status of GaAIAs/ GaAs HBT technology and projects the impact of these devices on microwave and millimeter-wave integrated circuits. Devices with f/sub max/ above 100 GHz are described. Differential amplifiers are shown to have offset voltages with standard deviation below 2 mV and voltage gain of 200 per stage. Breakdown voltages (BV/sub CBO/) above 20 V are demonstrated. Frequency dividers operating above 20 GHz are described.
本文综述了GaAIAs/ GaAs HBT技术的现状,展望了这些器件对微波和毫米波集成电路的影响。描述了f/sub max/ 100ghz以上的器件。差分放大器具有标准偏差低于2 mV的偏置电压,每级电压增益为200。击穿电压(BV/sub CBO/)高于20v。描述了工作在20 GHz以上的分频器。
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引用次数: 0
1-6 GHz GaAs MMIC Linear Attenuator with Integral Drivers 集成驱动器的1-6 GHz GaAs MMIC线性衰减器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114526
G. Lizama, T. Andrade, R. Benton
This paper describes the performance of a voltage-controlled attenuator with a 12 dB linear attenuation vs. control voltage range. This linear attenuator greatly facilitates the realization of both closed and open loop gain compensation networks. Over the -55°C to 85°C range the attenuator recorded a 7.2 +- 1 dB/V linear transfer function while using only 25 mW from a single 4 V power supply.
本文描述了一种电压控制衰减器的性能,在控制电压范围内线性衰减为12 dB。这种线性衰减器极大地促进了闭环和开环增益补偿网络的实现。在-55°C至85°C范围内,衰减器记录了7.2 +- 1 dB/V的线性传递函数,同时仅使用来自单个4 V电源的25 mW。
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引用次数: 1
44 GHz Monolithic Low Noise Amplifier 44 GHz单片低噪声放大器
Pub Date : 1900-01-01 DOI: 10.1109/MCS.1987.1114506
J. Berenz, H. Yen, R. Esfandiari, K. Nakano, T. Sato, J. Velebir, K. Ip
The design, fabrication, and performance of a single-stage 44 GHz monolithic HEMT low noise amplifier are described. The chip includes a single heterojunction HEMT with matching and biasing circuits. Greater than 5 dB gain was measured from 43.5 to 45.5 GHz and a noise figure of 5 dB with the associated gain of 5.5 dB was achieved at 44.5 GHz. The chip size is 1.25mm x 1.0mm.
介绍了一种单级44ghz单片HEMT低噪声放大器的设计、制造和性能。该芯片包括一个具有匹配和偏置电路的单异质结HEMT。在43.5至45.5 GHz范围内测量了大于5db的增益,在44.5 GHz处获得了5db的噪声系数和5.5 dB的相关增益。芯片尺寸为1.25mm × 1.0mm。
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引用次数: 2
期刊
Microwave and Millimeter-Wave Monolithic Circuits
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