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Control of wire melting behavior using coaxial hybrid solid wire : Development of pure Ar-MIG welding 同轴混合实心焊丝熔化行为的控制:纯Ar-MIG焊接的发展
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.35S
Terumi Nakamura, K. Hiraoka, Manabu Tanaka
The wire melting behavior in pure Ar shielding gas can be controlled with a coaxial hybrid solid (CHS) wire which has a coaxial double structure with a different composition in its inner and outer parts. This wire can prevent the generation of a column of liquid metal (CLM) at the wire tip due to the difference in the materials properties of the inner and outer parts and stabilize MIG welding in pure Ar shielding gas (Ar-MIG welding). We examine the effects of the material properties (melting temperature, specific heat and thermal conductivity) on the wire melting behavior, then propose and show the effectiveness of a design guide for the CHS wire by carrying out a simulation and a welding examination on the new CHS wire which was developed based on this design guide.
采用内外部成分不同的同轴双结构的同轴混合固体(CHS)丝可以控制丝在纯氩保护气体中的熔化行为。该焊丝可防止因内外件材料性能不同而在焊丝尖端产生一柱液态金属(CLM),在纯氩保护气体(Ar-MIG焊)下稳定MIG焊接。研究了材料性能(熔化温度、比热和导热系数)对线材熔化行为的影响,并通过对基于该设计指南开发的新型CHS线材进行仿真和焊接试验,提出并证明了CHS线材设计指南的有效性。
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引用次数: 3
Numerical Analysis of Deformation and Thermal Behavior during Ultrasonic Al Ribbon Bonding 超声铝带键合变形及热行为的数值分析
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.138S
Shinji Suzuki, Y. Oyama, M. Maeda, Yasuo Takahashi
Ultrasonic bonding process for wiring an Al ribbon to electric pads on substrate is affected by ribbon deformation and thermal behavior, i.e., (temperature rise of the materials during bonding). In the present study, the deformation and thermal behavior are analyzed. Numerical simulations of temperature rise and the deformation of the ribbon (wiring materials) were carried out by finite difference and element methods, respectively. As a result, the temperature rise and deformation processes were visualized by graphic images. It was suggested that the temperature of ribbon rose up to greater than 373 K during bonding. The ribbon deformation and the frictional slip behaviors influenced each other. Ultrasonic vibration enhances the equivalent stress in the Al ribbon very largely.
铝带与衬底电垫片的超声波键合工艺受带变形和热行为的影响,即(键合过程中材料的温升)。在本研究中,分析了变形和热行为。采用有限差分法和单元法分别对带材(布线材料)的温升和变形进行了数值模拟。结果,温度上升和变形过程是可视化的图形图像。结果表明,在键合过程中,条带温度上升到373 K以上。带材变形与摩擦滑移行为相互影响。超声振动大大提高了铝带的等效应力。
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引用次数: 5
Preliminary numerical research of microstructural fracture behavior in metal by using interface element 基于界面元的金属微结构断裂行为的初步数值研究
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.109S
Seigo Tomiyama, H. Serizawa, T. Hajima, H. Murakawa
In order to demonstrate not only the deformation of grain but also the opening and/or sliding at grain boundary, the interface element was introduced into the ordinary finite element method, and this numerical method was applied for examining the microstructural fracture behavior in two-dimensional ideal microstructure obtained through Voronoi tessellations. As for the grain, the anisotropy in elastic modulus due to the grain orientation was taken into account, while the fracture strength at grain boundary was assumed to be related to the boundary energy which could be determined by the atomic disorder at the boundary. From the serial computational results for examining the influences of elastic properties in grain (isotropy and anisotropy), mechanical property at grain boundary (interaction between opening and sliding deformation), and grain configurations, it was revealed that all the factors varied in this research might affect the microstructural fracture behavior. Also, it can be concluded that this numerical method with the interface element can be useful for demonstrating the microstructural fracture behavior including the deformation at grain boundary.
为了既能反映晶粒的变形,又能反映晶界处的张开和滑动,在普通有限元方法中引入界面单元,并应用该数值方法对Voronoi镶嵌得到的二维理想微观结构的微观组织断裂行为进行了研究。对于晶粒,考虑了晶粒取向引起的弹性模量各向异性,而晶界断裂强度则假定与晶界能有关,而晶界能由晶界原子无序度决定。通过对晶粒弹性性能(各向同性和各向异性)、晶界力学性能(开口和滑动变形之间的相互作用)和晶粒形态影响的一系列计算结果,揭示了本研究中所有因素的变化都可能影响微观组织断裂行为。结合界面元的数值计算方法可以较好地反映包括晶界变形在内的微观组织断裂行为。
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引用次数: 1
Numerical analysis on effects of power source characteristics on arc properties in gas tungsten arc 电源特性对钨气电弧电弧特性影响的数值分析
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.1S
Y. Tsujimura, S. Tashiro, Manabu Tanaka
Arc properties in Gas Tungsten Arc (GTA) strongly depend on welding conditions such as an arc current, an arc length and so on. In GTA, the arc current and an arc voltage are determined by an external characteristic of a power source and an electrical characteristic of the arc. There are two kinds of external characteristics of power sources, namely, Constant Current (CC) and Constant Voltage (CV) characteristics. The electrical characteristic of the arc depends on the arc length. In this study, dependences of the arc properties and relationships between the current and the voltage on the arc length in GTA employing power sources with the CC and the CV characteristics were numerically analyzed. As a result, it was found that the voltage and power of the arc decreased with decrease of the arc length in case of the CC characteristic and the current and the power of the arc increase dramatically with decrease of the arc length in case of the CV characteristic. Furthermore, with variation of the arc length, the arc power hardly changes for the CC characteristic, although the arc power largely changes for the CV characteristic.
钨气弧焊的电弧性能与电弧电流、弧长等焊接条件密切相关。在GTA中,电弧电流和电弧电压由电源的外部特性和电弧的电气特性决定。电源的外部特性有两种,即恒流特性(CC)和恒压特性(CV)。电弧的电特性取决于电弧的长度。本文通过数值模拟的方法,分析了具有CC和CV特性的GTA电弧特性与电弧长度的关系以及电流和电压之间的关系。结果表明,在CC特性下,电弧电压和功率随弧长减小而减小;在CV特性下,电弧电流和功率随弧长减小而显著增大。随着弧长的变化,直流特性的电弧功率几乎没有变化,而直流特性的电弧功率变化很大。
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引用次数: 0
Microstructure and mechanical properties of overlaying specimens in GMAW hybrid an additional longitudinal electromagnetic field 外加纵向电磁场作用下GMAW复合材料堆焊试样的显微组织和力学性能
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.76S
Ji’an Luo
In order to meet requirements of hot forge mould in the plastic manufacturing fields, the gas metal arc welding (GMAW) with a longitudinal electromagnetic field (LMF-GMAW) is applied to manufacture the bimetal thermal forming mould and repair the old die. The microstructure and mechanical properties are analyzed by SEM, EDS, micro-hardness, wear-resistance and thermal physical simulation testing methods. Our study shows that the LMF-GMAW method can increase the wear resistance property of the surfacing layer, enhance the interface bonding ability and improve the thermal mechanical strength of bimetal overlay work pieces.
为了满足塑料制造领域对热锻模具的要求,采用纵向电磁场气体金属弧焊(llf -GMAW)制造双金属热成型模具和修复旧模具。采用SEM、EDS、显微硬度、耐磨性和热物理模拟测试等方法分析了复合材料的显微组织和力学性能。研究表明,llf - gmaw方法可以提高堆焊层的耐磨性,增强界面结合能力,提高双金属堆焊件的热机械强度。
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引用次数: 2
Measurement of dynamical variation in two-dimensional temperature distribution of TIG pulsed-arcs TIG脉冲电弧二维温度分布动态变化的测量
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.23S
H. Sawato, S. Tashiro, K. Nakata, Manabu Tanaka, E. Yamamoto, K. Yamazaki, Keiichi Suzuki
TIG pulsed-arc welding is suitable for back-bead welding, thin plate welding and so on, because the heat source properties can be controlled by current waveform. The heat flux onto the base metal is affected mainly by thermal conduction and electron condensation from the arc. Both factors strongly depend on the temperature distribution and current path in the arc. In order to clarify the heat source properties of TIG pulsed-arc, dynamic variation in two-dimensional temperature distribution of TIG pulsed-arc was measured through Fowler-Milne method with a high speed video camera as a first step of the study. As a result, it was found that the arc column was expanded in radial direction and the maximum arc temperature was 20,000K during the peak current of 200A. On the other hand, the width of the arc column decreased especially in the downstream region of the arc and the maximum arc temperature fell to 17,500K during the base current of 50A.
TIG脉冲电弧焊适用于背焊、薄板焊接等,其热源特性可由电流波形控制。热传导和电弧产生的电子凝结主要影响基体金属的热流密度。这两个因素在很大程度上取决于电弧中的温度分布和电流路径。为了明确TIG脉冲电弧的热源特性,作为研究的第一步,利用高速摄像机采用Fowler-Milne法测量了TIG脉冲电弧二维温度分布的动态变化。结果发现,电弧柱呈径向膨胀,峰值电流为200A时最高电弧温度为20000 k。另一方面,在基极电流为50A时,电弧柱宽度减小,特别是在电弧下游区域,电弧最高温度降至17500 k。
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引用次数: 10
Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating 镀Sn-3.0Ag-0.5Cu钎料/Co-P与镀Ni-Co-P的界面反应
Pub Date : 2010-12-01 DOI: 10.2207/QJJWS.29.142S
T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami
In response to health and safety concerns, lead-free soldering has become a popular technology in electronics packaging. Compared with the lead-containing solders, Sn- 3.0mass%Ag-0.5mass%Cu (SAC, all mass% unless specified otherwise) solder widely used in Japan has a relatively low impact reliability owing to the solder alloy hardness that induces a high stress concentration at the interface. In general, there is a correlation between the impact reliability and the morphology and thickness of the reaction layer formed at the solder/under bump metallurgy (UBM) interface. The most common UBM is electroless Ni-P plating over copper pad. Electroless Ni-P acts as a diffusion barrier layer between the copper and the solder. However, due to nickel diffusion, P-rich layers form at the interface between the solder and electroless Ni-P. Solder joint failure is related to the growth of these layers and to their brittleness and affects the mechanical reliability of joints. Recently, a new composition of UBM is proposed as diffusion barrier 1-4) . For instance, Magagnin et al. reported that electroless Co-P strongly limits interdiffusion and intermetallic compounds formation as compared with the electroless Ni-P with Sn-Ag-Cu alloy. Furthermore, in the Co-P samples, P-rich layers did not form at the interface 4) . It is important to investigate the relationship between morphology of reaction layer and UBM. This study aims to clarify the effect of Co-P and Ni-Co-P on the morphology of reaction layer formed at the solder/UBM interface. 2. Experimental SAC solder (0.3 g) was used in this study. Electroless Co-P(Au) (3.1 Pm) and electroless Ni-Co-P(Au) (5.2 Pm) finished Cu plates on FR-4 PCBs (25.0×25.0×1.6 mm) were prepared as UBM. Electroless Ni-P(Au) (5.0 Pm) substrate was also used as a reference substrate. These substrates were plated with gold to avoid oxidation of the cobalt and nickel surface. The experimental procedure is shown in Fig. 1 .T he substrate was immersed in 4% HCl solution for 120 s and then rinsed with deionized water. Then, solder was put on the center of the substrate and activated flux (0.01 ml) was dropped on the solder. The test specimen was put into a radiation furnace in a nitrogen atmosphere and heated according to the temperature rise profile shown in Fig. 2. The reflow peak temperature was 513 K with the sample above 490 K for 115 s. After soldering, the spreading area of the solder on the UBM was measured by using the optical microscope (OM).�Three tests were conducted to obtainan average value for each specimen. Then, specimens were cut and the cross-section of the specimens was polished to observe the interface between the solder and UBM. The reaction layer at the interface was observed by scanning electron microscope (SEM).
为了应对健康和安全问题,无铅焊接已成为电子封装中的一种流行技术。与含铅焊料相比,日本广泛使用的Sn- 3.0质量% ag -0.5质量%Cu (SAC,除特别注明外均为质量%)焊料的冲击可靠性较低,这是由于焊料合金硬度高,在界面处产生较高的应力集中。一般来说,冲击可靠性与焊接/碰撞冶金(UBM)界面上形成的反应层的形貌和厚度之间存在相关性。最常见的UBM是在铜衬垫上化学镀镍磷。化学镀镍磷作为铜和焊料之间的扩散阻挡层。然而,由于镍的扩散,在焊料和化学Ni-P之间的界面形成富p层。焊点的失效与这些层的生长和脆性有关,影响焊点的机械可靠性。最近,一种新的UBM组成被提出作为扩散屏障(1-4)。例如,Magagnin等人报道,与化学镀Ni-P和Sn-Ag-Cu合金相比,化学镀Co-P强烈限制了相互扩散和金属间化合物的形成。此外,Co-P样品在界面处没有形成富p层(4)。研究反应层形貌与UBM之间的关系具有重要意义。本研究旨在阐明Co-P和Ni-Co-P对钎料/UBM界面反应层形貌的影响。2. 本研究采用实验SAC焊料(0.3 g)。在FR-4 pcb (25.0×25.0×1.6 mm)上制备了化学Co-P(Au) (3.1 Pm)和化学Ni-Co-P(Au) (5.2 Pm)成品Cu板。化学镀Ni-P(Au) (5.0 Pm)衬底也被用作基准衬底。这些衬底被镀金以避免钴和镍表面氧化。实验过程如图1所示,将底物浸泡在4%盐酸溶液中120秒,然后用去离子水冲洗。然后,将焊料置于衬底中央,并将活性助焊剂(0.01 ml)滴在焊料上。将试样置于氮气气氛下的辐射炉中,按照图2所示的温升曲线进行加热。回流峰温度为513 K,样品在490 K以上停留115 s。焊接后,用光学显微镜(OM)测量焊料在UBM上的扩散面积。进行了三次测试,以获得每个样品的平均值。然后,切割试样,并对试样的横截面进行抛光,观察焊料与UBM的界面。用扫描电镜观察了界面处的反应层。
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引用次数: 1
Micro Welding of Thin Stainless Steel Foil with a Direct Diode Laser 薄不锈钢箔的直接二极管激光微焊接
Pub Date : 2005-07-01 DOI: 10.2351/1.5060105
N. Abe, Y. Funada, T. Imanaka, M. Tsukamoto
Recently, industrial product parts and components are being made smaller to reduce energy consumption and save space, creating a growing need for the micro-welding of thin foil less than 100μm thick. For this purpose, laser processing is expected to be the method of choice because it allows more precise heat control compared with arc and plasma processing. In this report, the practicability of welding thin stainless steel foil with a direct diode laser system was investigated. The elliptically shaped laser beam of the direct diode laser enabled successful butt-welding of thin stainless steel foil 100μm and less in thickness. At a output power of 100W, 100μm and 50μm thick foils could be welded at a high speed of 6.0m/min and 18.0m/min, respectively. They had narrow bead widths of 100μm which was narrower than the beam size of the laser. No spatter or plasma plume was observed when welding without an assist gas. The tensile strength of the weld bead was nearly the same as that of the base material.
最近,为了减少能源消耗和节省空间,工业产品零部件的尺寸越来越小,因此对厚度小于100μm的薄箔的微焊接需求越来越大。为此,激光加工有望成为首选方法,因为与电弧和等离子体加工相比,激光加工允许更精确的热控制。本文研究了用直接二极管激光系统焊接薄不锈钢箔的可行性。直接二极管激光器的椭圆激光束使厚度小于100μm的薄不锈钢箔成功对接焊接。在100W的输出功率下,可以分别以6.0m/min和18.0m/min的高速焊接100μm和50μm厚的箔片。它们的头宽为100μm,比激光的光束尺寸窄。在没有辅助气体的情况下焊接时,没有飞溅或等离子体羽流。焊缝的抗拉强度与母材的抗拉强度基本一致。
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引用次数: 27
Dynamic Observation of High Speed Laser-Arc Combination Welding of Thick Steel Plates(Physics, Processes, Instruments & Measurements) 厚钢板高速激光-电弧组合焊接的动态观察(物理、工艺、仪器与测量)
Pub Date : 1997-12-01 DOI: 10.2351/1.5059717
N. Abe, Y. Kunugita, M. Hayashi, Yoshiaki Tsuchitani
Leading Path Laser-Arc Combination (LPLAC) welding, which consists of laser-arc combination welding with a leading path for the laser beam, enables much deeper penetration than conventional laser-arc combination welding. It also enables higher speed and more stable welding compared with the conventional arc welding with a narrow V groove. To elucidate the reasons for this greater effectiveness, the behavior of the laser plasma, arc plasma, and the molten metal were observed during LPLAC welding using a high-speed video camera operating at 500 frames per second. It was found that the laser plasma stabilized the arc at an optimal distance between the laser and the arc, accounting for the very high speed and deep penetration of this method.Leading Path Laser-Arc Combination (LPLAC) welding, which consists of laser-arc combination welding with a leading path for the laser beam, enables much deeper penetration than conventional laser-arc combination welding. It also enables higher speed and more stable welding compared with the conventional arc welding with a narrow V groove. To elucidate the reasons for this greater effectiveness, the behavior of the laser plasma, arc plasma, and the molten metal were observed during LPLAC welding using a high-speed video camera operating at 500 frames per second. It was found that the laser plasma stabilized the arc at an optimal distance between the laser and the arc, accounting for the very high speed and deep penetration of this method.
超前路径激光-电弧组合焊(lplacc)是一种激光-电弧组合焊,具有激光束的超前路径,比传统的激光-电弧组合焊具有更深的熔深。与传统的窄V型坡口弧焊相比,焊接速度更快,焊接更稳定。为了阐明这种更有效的原因,使用每秒500帧的高速摄像机观察了激光等离子体、电弧等离子体和熔融金属在lplacs焊接过程中的行为。结果表明,激光等离子体使电弧稳定在激光与电弧之间的最佳距离,这说明了该方法具有很高的速度和深穿透性。超前路径激光-电弧组合焊(lplacc)是一种激光-电弧组合焊,具有激光束的超前路径,比传统的激光-电弧组合焊具有更深的熔深。与传统的窄V型坡口弧焊相比,焊接速度更快,焊接更稳定。为了阐明这种更有效的原因,使用每秒500帧的高速摄像机观察了激光等离子体、电弧等离子体和熔融金属在lplacs焊接过程中的行为。结果表明,激光等离子体使电弧稳定在激光与电弧之间的最佳距离,这说明了该方法具有很高的速度和深穿透性。
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引用次数: 16
THREE-DIMENSIONAL SIMULATION OF MELTING AND EVAPORATION DYNAMICS BY THE UNIFIED SOLVER CIP FOR SOLID, LIQUID AND GAS 用统一求解器cip对固体、液体和气体的熔融和蒸发动力学进行三维模拟
Pub Date : 1996-12-01 DOI: 10.1142/9789812812957_0055
T. Yabe
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引用次数: 15
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Transactions of JWRI
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