Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484403
K. Wells, D. Parker, K. Pashby
Customer satisfaction in the semiconductor business depends on the ability of manufacturers to provide on-time delivery of quality products. To meet this objective without increasing resources, fabricator productivity must be maximized. At the IBM Microelectronics Division 200-mm semiconductor fabricator in Essex Junction, Vermont, the alternate work schedule (AWS) N1 Team enhanced its productivity by giving responsibility for this key measurement to a team of three nonmanagers. This paper describes how the team increased productivity to a point equal to or better than the measurement stipulated in the fabricator's strategic operating plan. Referred to as the OF-OUT Team, the group focused on moving 14 individual departments comprising the N1 Team to a working arrangement that focused on the team as a whole rather than on the sum of its parts. This concept placed a premium on people working together as a team so that the productivity of each individual could be maximized. By adhering to this concept, the N1 Team realized a 4.7% increase in average daily operational productivity over its first six months without an increase in resources. This improvement occurred by setting one goal for the entire team, challenging the individual operators to find the procedural changes necessary to meet this goal and by bringing people together from different departments to solve problems that ordinarily would be outside their areas of control. The teamwork approach to operational productivity is used today by various departments to examine how they do business and to look for opportunities where this change in strategy can benefit both other departments and the N1 Team as a whole.
{"title":"Developing the methodology to improve productivity within an integrated 200-mm fabricator","authors":"K. Wells, D. Parker, K. Pashby","doi":"10.1109/ASMC.1995.484403","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484403","url":null,"abstract":"Customer satisfaction in the semiconductor business depends on the ability of manufacturers to provide on-time delivery of quality products. To meet this objective without increasing resources, fabricator productivity must be maximized. At the IBM Microelectronics Division 200-mm semiconductor fabricator in Essex Junction, Vermont, the alternate work schedule (AWS) N1 Team enhanced its productivity by giving responsibility for this key measurement to a team of three nonmanagers. This paper describes how the team increased productivity to a point equal to or better than the measurement stipulated in the fabricator's strategic operating plan. Referred to as the OF-OUT Team, the group focused on moving 14 individual departments comprising the N1 Team to a working arrangement that focused on the team as a whole rather than on the sum of its parts. This concept placed a premium on people working together as a team so that the productivity of each individual could be maximized. By adhering to this concept, the N1 Team realized a 4.7% increase in average daily operational productivity over its first six months without an increase in resources. This improvement occurred by setting one goal for the entire team, challenging the individual operators to find the procedural changes necessary to meet this goal and by bringing people together from different departments to solve problems that ordinarily would be outside their areas of control. The teamwork approach to operational productivity is used today by various departments to examine how they do business and to look for opportunities where this change in strategy can benefit both other departments and the N1 Team as a whole.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122553136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484398
E. Rose, R. Odom, R. Murphy, L. Behnke
This paper will describe two Harris Semiconductor success stories and discuss the SDWT (self-directed work team) tools used to be successful. The first story concerns a union factory that, faced with the potential loss of a major customer, tried a new approach to creating dialog between teams from each company. The second story concerns a wafer fabrication line where teams were in place for two years with little signs of improvement. By introducing TOC and TPM, in combination with a structured team environment, the same group of people made significant operational improvements within six months (40% increase in volume, 2x improvement in die yield (quality), 23% reduction in cycle time, and 16% improvement in line yield).
{"title":"SDWT requires tools to be successful","authors":"E. Rose, R. Odom, R. Murphy, L. Behnke","doi":"10.1109/ASMC.1995.484398","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484398","url":null,"abstract":"This paper will describe two Harris Semiconductor success stories and discuss the SDWT (self-directed work team) tools used to be successful. The first story concerns a union factory that, faced with the potential loss of a major customer, tried a new approach to creating dialog between teams from each company. The second story concerns a wafer fabrication line where teams were in place for two years with little signs of improvement. By introducing TOC and TPM, in combination with a structured team environment, the same group of people made significant operational improvements within six months (40% increase in volume, 2x improvement in die yield (quality), 23% reduction in cycle time, and 16% improvement in line yield).","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126503792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484394
V. Wenner, J. Lowell, Jinghong Shi, L. Larson
In this paper we report on a systematic study of ion implantation equipment currently in operation or development by IC manufacturers and equipment vendors. The application of optical surface photovoltage (SPV) to both quantify and qualify bulk implant-induced contaminants in CZ P-type silicon is emphasized. We address the issue of contaminants and exemplify the use of SPV as a passive, in-line technique for assessment of the problem.
{"title":"Non-destructive detection of ion implant contamination: a SEMATECH/AMD study","authors":"V. Wenner, J. Lowell, Jinghong Shi, L. Larson","doi":"10.1109/ASMC.1995.484394","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484394","url":null,"abstract":"In this paper we report on a systematic study of ion implantation equipment currently in operation or development by IC manufacturers and equipment vendors. The application of optical surface photovoltage (SPV) to both quantify and qualify bulk implant-induced contaminants in CZ P-type silicon is emphasized. We address the issue of contaminants and exemplify the use of SPV as a passive, in-line technique for assessment of the problem.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133034605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484347
J. Spier, K. Kempf
When we build a factory, we construct a building, purchase and install some amount of equipment, and hire and train some number of personnel. When we mix the equipment and the personnel, some behavior emerges and it is very difficult to predict what this behavior will be. In part, this is because the equipment will exhibit less than perfect availability due to pseudo-random breakdowns. But a major contribution to this unpredictability is the fact that humans who have been exposed to the same training will behave differently on the factory floor. In fact, the same people will behave differently over time given their ability to learn from experience. Clearly the behavior of the manufacturing system will depend on the integral of the behavior of the individuals and the interactions between the individuals, and will change with time. Current discrete event simulations of manufacturing are equipment-centered and can be run without any modeling of floor personnel since the equipment models include decision making capability. This is obviously not an accurate reflection of the manner in which current manufacturing systems operate. What is needed is a simulation that includes both equipment and personnel, and includes them with accurate emphasis. This paper describes a prototype simulation for a very small, but relatively complete factory. Equipment is modeled in objects that can accept commands and issue status while personnel are modeled in objects that can accept status and issue commands. An information system connects these two distinct types of objects. We demonstrate that the details of human behavior are as important as the details of machine behavior to factory performance.
{"title":"Simulation of emergent behavior in manufacturing systems","authors":"J. Spier, K. Kempf","doi":"10.1109/ASMC.1995.484347","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484347","url":null,"abstract":"When we build a factory, we construct a building, purchase and install some amount of equipment, and hire and train some number of personnel. When we mix the equipment and the personnel, some behavior emerges and it is very difficult to predict what this behavior will be. In part, this is because the equipment will exhibit less than perfect availability due to pseudo-random breakdowns. But a major contribution to this unpredictability is the fact that humans who have been exposed to the same training will behave differently on the factory floor. In fact, the same people will behave differently over time given their ability to learn from experience. Clearly the behavior of the manufacturing system will depend on the integral of the behavior of the individuals and the interactions between the individuals, and will change with time. Current discrete event simulations of manufacturing are equipment-centered and can be run without any modeling of floor personnel since the equipment models include decision making capability. This is obviously not an accurate reflection of the manner in which current manufacturing systems operate. What is needed is a simulation that includes both equipment and personnel, and includes them with accurate emphasis. This paper describes a prototype simulation for a very small, but relatively complete factory. Equipment is modeled in objects that can accept commands and issue status while personnel are modeled in objects that can accept status and issue commands. An information system connects these two distinct types of objects. We demonstrate that the details of human behavior are as important as the details of machine behavior to factory performance.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127753095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484335
D. Devost, P. Miller
The tools, techniques, and methods for implementing activity-based costing, while having been developed only in the past decade, are actually well documented and relatively straightforward to apply in any given situation. Failure or success in an implementation therefore usually hinges on how well the human factors are managed-resources, culture, buy-in, and so forth. This paper is based on lessons learned from an implementation of ABC at one of the world's largest semiconductor facilities, IBM Burlington. During the implementation process, a variety of hurdles were encountered, usually related to the people involved, ranging from management to the customers to the ABC team itself. While the effort was ultimately successful, in large part due to the dedication and creativity displayed by the vast majority of people involved, the obstacles (often unintentional) posed by the remainder are worth noting.
{"title":"Implementing Activity-Based Costing (ABC) is easy! (As long as people aren't involved...)","authors":"D. Devost, P. Miller","doi":"10.1109/ASMC.1995.484335","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484335","url":null,"abstract":"The tools, techniques, and methods for implementing activity-based costing, while having been developed only in the past decade, are actually well documented and relatively straightforward to apply in any given situation. Failure or success in an implementation therefore usually hinges on how well the human factors are managed-resources, culture, buy-in, and so forth. This paper is based on lessons learned from an implementation of ABC at one of the world's largest semiconductor facilities, IBM Burlington. During the implementation process, a variety of hurdles were encountered, usually related to the people involved, ranging from management to the customers to the ABC team itself. While the effort was ultimately successful, in large part due to the dedication and creativity displayed by the vast majority of people involved, the obstacles (often unintentional) posed by the remainder are worth noting.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129147073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484401
J. Cronin, K. Jean, Tina Tang
Newly formed employee teams, over a period of two to five years, tend to move away from self-serving behavior (or "foxholing" in research jargon) toward the ideal of a complete partnership with the parent organization and its customers. The initial foxholing condition, where team members focus on personal entitlement and internal objectives (sometimes at the expense of global objectives), should be accepted by management so that teams can build a strong identity which, in turn, will engender powerful synergistic behavior. This paper discusses the leader's role in helping self-directed work teams at IBM's semiconductor manufacturing facility in Essex junction, Vermont, to achieve their highest potential. The collection of teams, called Wenoti's (we, not I's) have learned to operate with a strong emphasis on balancing both relationships and business-task responsibilities. Described are examples (and measurements) of over-entitled teams and how the "foxhole" culture manifests undesirable group behavior and poor business performance. Comparisons between foxhole teams and "accountable" teams (often the same group of individuals over time) are shown. The paper also presents information from studies conducted by Cornell University, individual case histories, and objective measurables to illustrate the connection between a team's growing maturity and the increasing excellence of its work product.
{"title":"Out of the foxhole-moving toward accountability","authors":"J. Cronin, K. Jean, Tina Tang","doi":"10.1109/ASMC.1995.484401","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484401","url":null,"abstract":"Newly formed employee teams, over a period of two to five years, tend to move away from self-serving behavior (or \"foxholing\" in research jargon) toward the ideal of a complete partnership with the parent organization and its customers. The initial foxholing condition, where team members focus on personal entitlement and internal objectives (sometimes at the expense of global objectives), should be accepted by management so that teams can build a strong identity which, in turn, will engender powerful synergistic behavior. This paper discusses the leader's role in helping self-directed work teams at IBM's semiconductor manufacturing facility in Essex junction, Vermont, to achieve their highest potential. The collection of teams, called Wenoti's (we, not I's) have learned to operate with a strong emphasis on balancing both relationships and business-task responsibilities. Described are examples (and measurements) of over-entitled teams and how the \"foxhole\" culture manifests undesirable group behavior and poor business performance. Comparisons between foxhole teams and \"accountable\" teams (often the same group of individuals over time) are shown. The paper also presents information from studies conducted by Cornell University, individual case histories, and objective measurables to illustrate the connection between a team's growing maturity and the increasing excellence of its work product.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128468887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484395
J. Gil, P.K. Chun, S.K. Chae, E.M. Chun, H.K. Chung
Summary form only given. Dry etching process can cause a significant level of heavy metal contamination on process wafers, and the degree is dependent on the type of dry etcher. Most of these contaminants are removed through subsequent wet cleaning processes, but Cu seems to remain on the wafer surface. The effect of these contaminants on process wafers as well as chemical baths including filters will be discussed.
{"title":"Study of heavy metal contamination from dry etching process and its effects on subsequent wet processing","authors":"J. Gil, P.K. Chun, S.K. Chae, E.M. Chun, H.K. Chung","doi":"10.1109/ASMC.1995.484395","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484395","url":null,"abstract":"Summary form only given. Dry etching process can cause a significant level of heavy metal contamination on process wafers, and the degree is dependent on the type of dry etcher. Most of these contaminants are removed through subsequent wet cleaning processes, but Cu seems to remain on the wafer surface. The effect of these contaminants on process wafers as well as chemical baths including filters will be discussed.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"310 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122778205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484354
M. Thompson
This paper instructs the readers in the practical application of simulation-based, multiple criteria dispatching to the semiconductor front end capacity planning and scheduling problem. Many finite capacity planning and scheduling software systems allow rules to be defined by which machines choose tasks to be performed. The session shows why it is critical for companies to have the ability to develop custom coordinated rules to improve the flow of material through a factory by keeping highly utilized machines busy and allowing feeding machines to sequence work in an intelligent manner. In addition, coordinated rules can consider down stream machine congestion. The paper highlights the use of this technology as it is being applied within SGS-Thomson Microelectronics.
{"title":"Using simulation-based finite capacity planning and scheduling software to improve cycle time in front end operations","authors":"M. Thompson","doi":"10.1109/ASMC.1995.484354","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484354","url":null,"abstract":"This paper instructs the readers in the practical application of simulation-based, multiple criteria dispatching to the semiconductor front end capacity planning and scheduling problem. Many finite capacity planning and scheduling software systems allow rules to be defined by which machines choose tasks to be performed. The session shows why it is critical for companies to have the ability to develop custom coordinated rules to improve the flow of material through a factory by keeping highly utilized machines busy and allowing feeding machines to sequence work in an intelligent manner. In addition, coordinated rules can consider down stream machine congestion. The paper highlights the use of this technology as it is being applied within SGS-Thomson Microelectronics.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130891155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484346
R. Ridgeway
Summary form only given, as follows. Recent attention focusing on semiconductor processing emissions has required the development of analytical methodology for quantifying unused process gases, characterizing and quantifying process by-products, and determining the effectiveness of abatement equipment. Processes emitting Hazardous Air Pollutants (HAPS) and Perfluorinated Compounds (PFCs) have come under scrutiny because of their suspected contribution to environmental and health related problems. This paper described real-time analytical methodology which permits determination of unconsumed process gases and process by-products, and evaluation of abatement effectiveness. Data from state-of-the-art production facilities are presented to demonstrate the effectiveness of real-time analysis. Calibration methodology, which is critical for measurement accuracy, is also discussed. The benefits of performing process and effluent monitoring could be multifold, including cost-of-ownership reductions from increased throughput, increased hardware lifetime, scrubber use reduction, and decreased raw materials costs. Additionally, regulatory compliance issues can be dealt with from a quantitative rather than qualitative standpoint.
{"title":"Determination of emissions and evaluation of abatement equipment for selected semiconductor processes","authors":"R. Ridgeway","doi":"10.1109/ASMC.1995.484346","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484346","url":null,"abstract":"Summary form only given, as follows. Recent attention focusing on semiconductor processing emissions has required the development of analytical methodology for quantifying unused process gases, characterizing and quantifying process by-products, and determining the effectiveness of abatement equipment. Processes emitting Hazardous Air Pollutants (HAPS) and Perfluorinated Compounds (PFCs) have come under scrutiny because of their suspected contribution to environmental and health related problems. This paper described real-time analytical methodology which permits determination of unconsumed process gases and process by-products, and evaluation of abatement effectiveness. Data from state-of-the-art production facilities are presented to demonstrate the effectiveness of real-time analysis. Calibration methodology, which is critical for measurement accuracy, is also discussed. The benefits of performing process and effluent monitoring could be multifold, including cost-of-ownership reductions from increased throughput, increased hardware lifetime, scrubber use reduction, and decreased raw materials costs. Additionally, regulatory compliance issues can be dealt with from a quantitative rather than qualitative standpoint.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132016569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484377
J. N. Pinto, M. Triplett
The Applied Materials (AMAT) P-5000 Plasma Enhanced Chemical Vapor Deposition (PECVD) systems use a plasma-enhanced tetraethoxysilane (TEOS)/oxygen chemistry to deposit an undoped silicon glass (interleave dielectric) film on 200 mm wafers. After each TEOS deposition cycle, the reaction chambers require an in-situ clean to remove residual dielectric materials from the electrodes and chamber walls. Excessive chamber cleaning causes unnecessary process-kit wear. This reaction is caused by the chemical and mechanical attack of the reaction by-products on process-kit parts after the TEOS deposition residues have been cleared. IBM's continued emphasize on cost reduction, environmental concerns and limited availability of chamber-cleaning gases prompted this joint project with Applied Materials, which focused on identifying areas where costs associated with gases used for post-deposition cleaning could be decreased and the time between process-kit replacements increased. This paper describes the tests conducted with an RF metrology system (RFMS) manufactured by Fourth State Technology (FST), Austin, Texas, to determine the optimum clean times for various oxide films and the minimum flows required for efficient post-deposition chamber cleaning. As a result of this experimentation, process changes were made that reduced clean gas consumption and chemical cost. Additional savings were realized by reducing wear on the reaction chamber hardware and achieving longer meantime between process-kit replacements.
{"title":"AMAT P-5000 CVD-clean optimization project","authors":"J. N. Pinto, M. Triplett","doi":"10.1109/ASMC.1995.484377","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484377","url":null,"abstract":"The Applied Materials (AMAT) P-5000 Plasma Enhanced Chemical Vapor Deposition (PECVD) systems use a plasma-enhanced tetraethoxysilane (TEOS)/oxygen chemistry to deposit an undoped silicon glass (interleave dielectric) film on 200 mm wafers. After each TEOS deposition cycle, the reaction chambers require an in-situ clean to remove residual dielectric materials from the electrodes and chamber walls. Excessive chamber cleaning causes unnecessary process-kit wear. This reaction is caused by the chemical and mechanical attack of the reaction by-products on process-kit parts after the TEOS deposition residues have been cleared. IBM's continued emphasize on cost reduction, environmental concerns and limited availability of chamber-cleaning gases prompted this joint project with Applied Materials, which focused on identifying areas where costs associated with gases used for post-deposition cleaning could be decreased and the time between process-kit replacements increased. This paper describes the tests conducted with an RF metrology system (RFMS) manufactured by Fourth State Technology (FST), Austin, Texas, to determine the optimum clean times for various oxide films and the minimum flows required for efficient post-deposition chamber cleaning. As a result of this experimentation, process changes were made that reduced clean gas consumption and chemical cost. Additional savings were realized by reducing wear on the reaction chamber hardware and achieving longer meantime between process-kit replacements.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"22 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132287170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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