Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484338
K. Mikkelsen
Transport and storage wafer carriers manufactured from different materials vary greatly in their initial cost. Many fabs have based their transport and storage carrier selection solely on this initial cost. However, total cost or cost of ownership depends on much more than the initial cost. This paper deals with the interrelationship between material properties, such as, particle generation, dimensional stability, outgassing, and temperature and how they affect cost of ownership. For example, particle generation and outgassing affect yield and the frequency of carrier and wafer cleaning steps. Dimensional accuracy and stability has an impact on equipment down time, wafer loss and particle generation. Temperature capabilities affect throughput and number of wafer transfers required. Dimensional stability and outgassing are also dependent on the temperature capabilities (thermal properties) of the transport wafer carrier material.
{"title":"Transport and storage wafer carrier cost of ownership","authors":"K. Mikkelsen","doi":"10.1109/ASMC.1995.484338","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484338","url":null,"abstract":"Transport and storage wafer carriers manufactured from different materials vary greatly in their initial cost. Many fabs have based their transport and storage carrier selection solely on this initial cost. However, total cost or cost of ownership depends on much more than the initial cost. This paper deals with the interrelationship between material properties, such as, particle generation, dimensional stability, outgassing, and temperature and how they affect cost of ownership. For example, particle generation and outgassing affect yield and the frequency of carrier and wafer cleaning steps. Dimensional accuracy and stability has an impact on equipment down time, wafer loss and particle generation. Temperature capabilities affect throughput and number of wafer transfers required. Dimensional stability and outgassing are also dependent on the temperature capabilities (thermal properties) of the transport wafer carrier material.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131207507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484380
T. Yurtsever, M. Comerford
Equipment Management System (EMS) is a software tool used to monitor and track equipment states, restrictions and PM schedules in real time. EMS has been designed and customized to support the MOS-2 die production facility. The system provides graphical representation of the entire factory. Color coded icons represent equipment's current state (i.e. qualification, production, unscheduled maintenance, etc.). Preventative maintenance schedules and restrictions are indicated using different patterns. Users can Click on these icons and use pull down menus to change, modify and display current or historical information. The purpose of the system is to collect variable equipment data to facilitate equipment utilization improvement and to increase the visibility of the production areas In this paper, we discuss the system description, implementation and training process, impact of EMS on manufacturing and benefits of the systems.
{"title":"Equipment management system (EMS)","authors":"T. Yurtsever, M. Comerford","doi":"10.1109/ASMC.1995.484380","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484380","url":null,"abstract":"Equipment Management System (EMS) is a software tool used to monitor and track equipment states, restrictions and PM schedules in real time. EMS has been designed and customized to support the MOS-2 die production facility. The system provides graphical representation of the entire factory. Color coded icons represent equipment's current state (i.e. qualification, production, unscheduled maintenance, etc.). Preventative maintenance schedules and restrictions are indicated using different patterns. Users can Click on these icons and use pull down menus to change, modify and display current or historical information. The purpose of the system is to collect variable equipment data to facilitate equipment utilization improvement and to increase the visibility of the production areas In this paper, we discuss the system description, implementation and training process, impact of EMS on manufacturing and benefits of the systems.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"71 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114123668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484393
C. Recker, M. Hackerott
This paper presents the historical and future partnership strategy that Motorola has undertaken to deploy and provide future support for a very large scale Engineering Data Analysis System at Motorola. Motorola made a strategic decision to partner with an outside supplier to assist with the deployment and maintenance of the system so that Motorola could focus internal resources on strategic development. Motorola selected KLA Instruments, a supplier with a proven interest and expertise in the area of wafer fab yield management, as its strategic partner. In this unique partnership, KLA has the opportunity to extend the system into a commercially viable product to market as its own, as well as provide needed deployment and maintenance support to Motorola. Processes were established to achieve mutual success regarding technology transfer, installation, maintenance, and co-development of components of the product by the partners. KLA Instruments created a business division dedicated to the partnership. Motorola and KLA are moving forward together in a unique partnership agreement.
{"title":"Win-win supplier-customer CIM partnering","authors":"C. Recker, M. Hackerott","doi":"10.1109/ASMC.1995.484393","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484393","url":null,"abstract":"This paper presents the historical and future partnership strategy that Motorola has undertaken to deploy and provide future support for a very large scale Engineering Data Analysis System at Motorola. Motorola made a strategic decision to partner with an outside supplier to assist with the deployment and maintenance of the system so that Motorola could focus internal resources on strategic development. Motorola selected KLA Instruments, a supplier with a proven interest and expertise in the area of wafer fab yield management, as its strategic partner. In this unique partnership, KLA has the opportunity to extend the system into a commercially viable product to market as its own, as well as provide needed deployment and maintenance support to Motorola. Processes were established to achieve mutual success regarding technology transfer, installation, maintenance, and co-development of components of the product by the partners. KLA Instruments created a business division dedicated to the partnership. Motorola and KLA are moving forward together in a unique partnership agreement.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123429451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484357
R. Singh, R. Sharangpani, K. F. Poole, M. Moslehi
The availability of ULSI CMOS operating at 1 V can lead to several revolutionary applications. In addition to innovative circuit designs, new materials and processes need to be developed for low power electronics. This is due to the fact that power dissipation depends on parasitic capacitance. Critical technologies are high quality high and low K dielectric materials and appropriate metalization schemes. We have successfully used rapid isothermal processing (RIP) for the deposition of high K and low K dielectric materials. We have used RIP assisted metalorganic chemical vapor deposition (MOCVD) technique for the deposition of high K materials having very low leakage current density (<1 pA/cm/sup 2/ at 1 V). It has been found that even at low processing temperatures (300 to 400/spl deg/C) the residual stress of the materials processed by conventional furnaces is much higher than that can be obtained by RIP. From the manufacturing point of view, new equipments need to be developed for the successful implementation of new technologies. The objective of this paper is to present our recent materials and processing results and the possible directions in meeting the equipment and process integration challenges.
工作在1v的ULSI CMOS的可用性可以导致几个革命性的应用。除了创新的电路设计外，还需要为低功耗电子产品开发新的材料和工艺。这是因为功率耗散取决于寄生电容。关键技术是高质量的高、低K介电材料和合适的金属化方案。我们已经成功地使用快速等温处理(RIP)沉积高K和低K介电材料。我们使用RIP辅助金属有机化学气相沉积(MOCVD)技术沉积了泄漏电流密度非常低(<1 pA/cm/sup 2/ at 1 V)的高K材料。研究发现，即使在较低的加工温度(300至400/spl℃)下，传统炉加工的材料的残余应力也远高于RIP。从制造的角度来看，新技术的成功实施需要开发新设备。本文的目的是介绍我们最近的材料和加工成果以及可能的方向，以满足设备和工艺集成的挑战。
{"title":"Critical technology challenges in low power electronics","authors":"R. Singh, R. Sharangpani, K. F. Poole, M. Moslehi","doi":"10.1109/ASMC.1995.484357","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484357","url":null,"abstract":"The availability of ULSI CMOS operating at 1 V can lead to several revolutionary applications. In addition to innovative circuit designs, new materials and processes need to be developed for low power electronics. This is due to the fact that power dissipation depends on parasitic capacitance. Critical technologies are high quality high and low K dielectric materials and appropriate metalization schemes. We have successfully used rapid isothermal processing (RIP) for the deposition of high K and low K dielectric materials. We have used RIP assisted metalorganic chemical vapor deposition (MOCVD) technique for the deposition of high K materials having very low leakage current density (<1 pA/cm/sup 2/ at 1 V). It has been found that even at low processing temperatures (300 to 400/spl deg/C) the residual stress of the materials processed by conventional furnaces is much higher than that can be obtained by RIP. From the manufacturing point of view, new equipments need to be developed for the successful implementation of new technologies. The objective of this paper is to present our recent materials and processing results and the possible directions in meeting the equipment and process integration challenges.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129845644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484333
C. R. Dedera
Arguably over the last 10 years Activity Based Costing (ABC) and the Theory of Constraints (TOC) have become two of the hottest trends in manufacturing. Companies are spending millions of dollars to start up state of the art ABC systems. Spurred on by TOC, manufacturing organizations are reevaluating how they run the factory and think of capacity. The conflict between TOC and ABC stems from the writings of Dr. E.M. Goldratt, the author of The Goal (1992). Clearly, Goldratt portrays cost accounting (ABC based or otherwise) as the villain preventing companies from obtaining their 'goal' to make more money. This paper addresses how Harris Semiconductor (HSS) is reconciling the apparent conflicts between ABC and TOC. HSS has had a state of the art ABC system for three years, but in the last year the manufacturing organization has begun using the concepts of TOC. The question HSS has had to answer is, can and should ABC and TOC coexist. HSS is redefining ABC's role within the context of its TOC manufacturing environment and believes they can coexist. TOC's focus is clear by emphasizing Throughput (T) and Inventory (I) while de-emphasizing Operating Expense (OE). Upper management struggles with TOC's de-emphasis on OE and its lack of a cost control alternative. To address this concern, operations management is turning to ABC as a tool to effectively control OE. HSS's perspective is unique in the TOC environment, which questions the value of ABC in manufacturing.
{"title":"Can TOC and ABC coexist? [semiconductor manufacturing]","authors":"C. R. Dedera","doi":"10.1109/ASMC.1995.484333","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484333","url":null,"abstract":"Arguably over the last 10 years Activity Based Costing (ABC) and the Theory of Constraints (TOC) have become two of the hottest trends in manufacturing. Companies are spending millions of dollars to start up state of the art ABC systems. Spurred on by TOC, manufacturing organizations are reevaluating how they run the factory and think of capacity. The conflict between TOC and ABC stems from the writings of Dr. E.M. Goldratt, the author of The Goal (1992). Clearly, Goldratt portrays cost accounting (ABC based or otherwise) as the villain preventing companies from obtaining their 'goal' to make more money. This paper addresses how Harris Semiconductor (HSS) is reconciling the apparent conflicts between ABC and TOC. HSS has had a state of the art ABC system for three years, but in the last year the manufacturing organization has begun using the concepts of TOC. The question HSS has had to answer is, can and should ABC and TOC coexist. HSS is redefining ABC's role within the context of its TOC manufacturing environment and believes they can coexist. TOC's focus is clear by emphasizing Throughput (T) and Inventory (I) while de-emphasizing Operating Expense (OE). Upper management struggles with TOC's de-emphasis on OE and its lack of a cost control alternative. To address this concern, operations management is turning to ABC as a tool to effectively control OE. HSS's perspective is unique in the TOC environment, which questions the value of ABC in manufacturing.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"6 11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127513000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484399
B. Prendergast
Summary form only given. With the decreased lifetime of new technologies and increased cost of new facilities, there is increased pressure to ramp successfully, and as efficiently as possibly. At Fab 10, Intel's European Semiconductor Manufacturing site, this continuously challenging environment dictated a need for flexible cross-functional teams to take ownership of problems and solutions real-time. Focusing on the support team involved with the Amat 5000 dielectric by equipment set, a Station Improvement Team (SIT) was setup who's charter was to continuous improvement performance as measured by objective indicators measurable at the station. This paper details how the team coordinated Bay layout, improved operating logistics producing 30% utilization increase, reduced scrap by 2X and achieved synergy across shifts resulting in improved procedures on the floor.
{"title":"Inter-discipline cross-shift teams for station improvements-a case study","authors":"B. Prendergast","doi":"10.1109/ASMC.1995.484399","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484399","url":null,"abstract":"Summary form only given. With the decreased lifetime of new technologies and increased cost of new facilities, there is increased pressure to ramp successfully, and as efficiently as possibly. At Fab 10, Intel's European Semiconductor Manufacturing site, this continuously challenging environment dictated a need for flexible cross-functional teams to take ownership of problems and solutions real-time. Focusing on the support team involved with the Amat 5000 dielectric by equipment set, a Station Improvement Team (SIT) was setup who's charter was to continuous improvement performance as measured by objective indicators measurable at the station. This paper details how the team coordinated Bay layout, improved operating logistics producing 30% utilization increase, reduced scrap by 2X and achieved synergy across shifts resulting in improved procedures on the floor.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115755995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484373
J. Durham, V.J. Marcos, T. Vincent, J. Martinez, S. Shelton, G. Fortner, M. Clayton, S. Felker
Etch processing equipment has become increasingly complicated and precise etch control has become more critical as device geometry shrinks. To meet this challenge, internal microprocessors are currently used to control wafer handling, lot and wafer logistics, processing and process control, and maintenance functions. Recently, external systems have been developed to provide additional monitoring and control capabilities. This paper addresses the automation of a single wafer etch platform that can be used for polysilicon, oxide, or metal etching. In addition to the main processing chamber, the vacuum load locks can be configured for pre-etch or post-etch processes. The system microprocessor and existing SECS II software package make the tool a good candidate for external automation and statistical process control (ASPC). This paper will discuss two automation packages currently in use at Motorola's MOS6 wafer fab. The first automation package is a family of diagnostic and planned maintenance (PM) tools that interface with the etcher. The automation tools perform real time statistical process control on the wafers as they are processed. The second tool used for ASPC is the Cell Controller. The Cell Controller is a local recipe management system used to download recipes and recipe information to the etcher. A description of the software tools and the implementation in manufacturing will be presented. Techniques used for problem identification, troubleshooting and the status of the project are discussed.
{"title":"Automation and statistical process control of a single wafer etcher in a manufacturing environment","authors":"J. Durham, V.J. Marcos, T. Vincent, J. Martinez, S. Shelton, G. Fortner, M. Clayton, S. Felker","doi":"10.1109/ASMC.1995.484373","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484373","url":null,"abstract":"Etch processing equipment has become increasingly complicated and precise etch control has become more critical as device geometry shrinks. To meet this challenge, internal microprocessors are currently used to control wafer handling, lot and wafer logistics, processing and process control, and maintenance functions. Recently, external systems have been developed to provide additional monitoring and control capabilities. This paper addresses the automation of a single wafer etch platform that can be used for polysilicon, oxide, or metal etching. In addition to the main processing chamber, the vacuum load locks can be configured for pre-etch or post-etch processes. The system microprocessor and existing SECS II software package make the tool a good candidate for external automation and statistical process control (ASPC). This paper will discuss two automation packages currently in use at Motorola's MOS6 wafer fab. The first automation package is a family of diagnostic and planned maintenance (PM) tools that interface with the etcher. The automation tools perform real time statistical process control on the wafers as they are processed. The second tool used for ASPC is the Cell Controller. The Cell Controller is a local recipe management system used to download recipes and recipe information to the etcher. A description of the software tools and the implementation in manufacturing will be presented. Techniques used for problem identification, troubleshooting and the status of the project are discussed.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114113088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484367
M. Brillouet
The Centre Commun CNET SGS-THOMSON in Crolles, France, integrates advanced technology research within a 200 mm ASIC CMOS and BiCMOS evolutive production line, in order to reduce the development cost and optimise the cycle time from early research to production. This presentation review some key factors which contributed to the good co-operation between R&D and manufacturing in this line.
{"title":"Centre Commun CNET SCS-THOMSON in Crolles, France or how R&D and manufacturing cooperate in the same production line","authors":"M. Brillouet","doi":"10.1109/ASMC.1995.484367","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484367","url":null,"abstract":"The Centre Commun CNET SGS-THOMSON in Crolles, France, integrates advanced technology research within a 200 mm ASIC CMOS and BiCMOS evolutive production line, in order to reduce the development cost and optimise the cycle time from early research to production. This presentation review some key factors which contributed to the good co-operation between R&D and manufacturing in this line.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124383602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484365
Patti Wasmund
Timely procurement of high quality parts is essential in production of reliable, high technology products. To achieve this end, FSI International has adopted a new supplier management philosophy: FSI and its suppliers are partners working toward a common goal of reduced costs, consistent, high quality parts and increased on-time deliveries. To implement this philosophy, FSI has defined its expectations and requirements of its suppliers, improved communication with its suppliers and restructured its Purchasing Department. Partnering relationships between FSI and its suppliers have resulted in clear improvements in cost, quality and on-time delivery.
{"title":"Partnering relationships with suppliers result in improved cost, quality and delivery performance","authors":"Patti Wasmund","doi":"10.1109/ASMC.1995.484365","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484365","url":null,"abstract":"Timely procurement of high quality parts is essential in production of reliable, high technology products. To achieve this end, FSI International has adopted a new supplier management philosophy: FSI and its suppliers are partners working toward a common goal of reduced costs, consistent, high quality parts and increased on-time deliveries. To implement this philosophy, FSI has defined its expectations and requirements of its suppliers, improved communication with its suppliers and restructured its Purchasing Department. Partnering relationships between FSI and its suppliers have resulted in clear improvements in cost, quality and on-time delivery.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122365481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484389
J. Schuler
A common problem confronting the semiconductor industry is the number of redundant and often conflicting quality audits device manufacturers require of their suppliers-the members of SEMI. Thousands of hours and millions of dollars are consumed by customers and suppliers annually in the search for the holy grail of supplier quality. Customers and suppliers alike are subject to a disorganized pursuit for meaningful information about supplier quality. One approach being used by SEMATECH member companies is a Standardized Supplier Quality Assessment, or SSQA. These companies have agreed to use a common documentation and quality assessment process and to cooperate in staffing the assessment teams. This paper reports on the results and benefits of the SEMATECH SSQA assessments in the industry. Information was obtained from a survey of SEMATECH members and companies that have participated in the SSQA process. Results are reported in graphical form to compare the expectations of the device manufacturers and the companies subject to the assessment. The survey attempts to provide insight into the effectiveness of the SSQA process in gathering quality data, as a mechanism for partnering between supplier/customer and as a tool for continuous improvement.
{"title":"The SEMATECH SSQA for supplier quality assessment and continuous improvement","authors":"J. Schuler","doi":"10.1109/ASMC.1995.484389","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484389","url":null,"abstract":"A common problem confronting the semiconductor industry is the number of redundant and often conflicting quality audits device manufacturers require of their suppliers-the members of SEMI. Thousands of hours and millions of dollars are consumed by customers and suppliers annually in the search for the holy grail of supplier quality. Customers and suppliers alike are subject to a disorganized pursuit for meaningful information about supplier quality. One approach being used by SEMATECH member companies is a Standardized Supplier Quality Assessment, or SSQA. These companies have agreed to use a common documentation and quality assessment process and to cooperate in staffing the assessment teams. This paper reports on the results and benefits of the SEMATECH SSQA assessments in the industry. Information was obtained from a survey of SEMATECH members and companies that have participated in the SSQA process. Results are reported in graphical form to compare the expectations of the device manufacturers and the companies subject to the assessment. The survey attempts to provide insight into the effectiveness of the SSQA process in gathering quality data, as a mechanism for partnering between supplier/customer and as a tool for continuous improvement.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124833013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：