Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103087
Zhuangjian Liu
Stretchable electronics system is an emerging technology for next-generation electronics. These type of stretchable system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials themselves. Potential uses include flexible sensors, transmitters and new photovoltaic and medical devices. Computational mechanics studies reveal many of the key underlying aspects of these systems and can establish important design criteria concerning device failure. In this study, numerical simulations are used for investigations of materials and system designs for stretchable electronics, which have excellent mechanical flexibility and make them attractive for these systems. The results show that the new designs are possible to build high performance circuits that are not only bendable but are also, in some cases, reversibly stretchable. And it is a path to build the high performance silicon complementary metal oxide semiconductor that might be interesting for electronics. Furthermore it could optimize mechanics and materials for circuits that exhibit maximum stretchability.
{"title":"Applications of computational mechanics in stretchable electronics","authors":"Zhuangjian Liu","doi":"10.1109/EUROSIME.2015.7103087","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103087","url":null,"abstract":"Stretchable electronics system is an emerging technology for next-generation electronics. These type of stretchable system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials themselves. Potential uses include flexible sensors, transmitters and new photovoltaic and medical devices. Computational mechanics studies reveal many of the key underlying aspects of these systems and can establish important design criteria concerning device failure. In this study, numerical simulations are used for investigations of materials and system designs for stretchable electronics, which have excellent mechanical flexibility and make them attractive for these systems. The results show that the new designs are possible to build high performance circuits that are not only bendable but are also, in some cases, reversibly stretchable. And it is a path to build the high performance silicon complementary metal oxide semiconductor that might be interesting for electronics. Furthermore it could optimize mechanics and materials for circuits that exhibit maximum stretchability.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114382400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103147
J. Al Ahmar, S. Wiese
A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.
{"title":"A finite element modelling and fracture mechanical approach of Multilayer Ceramic Capacitors","authors":"J. Al Ahmar, S. Wiese","doi":"10.1109/EUROSIME.2015.7103147","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103147","url":null,"abstract":"A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114865239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103102
I. Belov, Jonas Arwidson, R. Poder, P. Johannesson, P. Leisner
The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.
{"title":"The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package","authors":"I. Belov, Jonas Arwidson, R. Poder, P. Johannesson, P. Leisner","doi":"10.1109/EUROSIME.2015.7103102","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103102","url":null,"abstract":"The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124187363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103155
S. Mukherjee, B. Zhou, A. Dasgupta, T. Bieler
This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.
{"title":"Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal","authors":"S. Mukherjee, B. Zhou, A. Dasgupta, T. Bieler","doi":"10.1109/EUROSIME.2015.7103155","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103155","url":null,"abstract":"This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125088752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103082
P. Gromala, B. Muthuraman, B. Ozturk, K. Jansen, L. Ernst
This paper presents material characterization utilizing static tensile tests until failure and static tests with relaxation segments until failure for commercially available molding compound. In order to model the material behavior quantitatively a non-linear viscoelastic (NLVE) Bergstrom-Boyce model (BB) is proposed. Material constants of the BB model are optimized utilizing commercially available code optiSLang. In this paper a detailed optimization scheme is presented, including regression and sensitivity analysis. The NLVE model is shown to improve the predictions of the experimental results compared to state-of-the-art linear viscoelastic (LVE) material model. Thus, the BB model is proposed to be used for time, temperature and stress dependent behavior of polymers.
{"title":"Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application","authors":"P. Gromala, B. Muthuraman, B. Ozturk, K. Jansen, L. Ernst","doi":"10.1109/EUROSIME.2015.7103082","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103082","url":null,"abstract":"This paper presents material characterization utilizing static tensile tests until failure and static tests with relaxation segments until failure for commercially available molding compound. In order to model the material behavior quantitatively a non-linear viscoelastic (NLVE) Bergstrom-Boyce model (BB) is proposed. Material constants of the BB model are optimized utilizing commercially available code optiSLang. In this paper a detailed optimization scheme is presented, including regression and sensitivity analysis. The NLVE model is shown to improve the predictions of the experimental results compared to state-of-the-art linear viscoelastic (LVE) material model. Thus, the BB model is proposed to be used for time, temperature and stress dependent behavior of polymers.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116091251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Light-emitting diodes (LEDs) have several advantages over traditional incandescent bulbs and compact fluorescent lamps, such as superior energy efficiency, environmental friendliness, and particularly long lifetime (between 25,000 to 100,000 hours). However, this long lifetime of LED proves inconvenient to manufacturers for conducting reliability tests which require the same amount of time to conclude. To overcome such inconvenience, this paper presents a hybrid numerical approach that combines numerical modeling with analytical analysis to predict the lifetime of LEDs. In this paper, a 60W-equivalent 10W phosphor-converted white LED bulb is studied by two numerical approaches. A one-dimensional (1-D) thermal-resistance circuit analysis and a three-dimensional (3-D) hybrid finite element analysis (FEA) are employed to estimate the LEDs' junction temperature in accord to the data obtained through the experiment. The numerical results showed that both 1-D thermal-resistance circuit and the hybrid FEA model are in agreement with the experiment data, thus invaluable to manufacturers who need to carry out reliability testing. Then the estimated junction temperature is used to determine the LED luminaire's lifetime according to the known LM-80 database and TM-21 method.
{"title":"LED's luminous flux lifetime prediction using a hybrid numerical approach","authors":"Kasemsak Kijkanjanapaiboon, Theodore Wagner Kretschmer, Liangbiao Chen, Xuejun Fan, Jiang Zhou","doi":"10.1109/EUROSIME.2015.7103112","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103112","url":null,"abstract":"Light-emitting diodes (LEDs) have several advantages over traditional incandescent bulbs and compact fluorescent lamps, such as superior energy efficiency, environmental friendliness, and particularly long lifetime (between 25,000 to 100,000 hours). However, this long lifetime of LED proves inconvenient to manufacturers for conducting reliability tests which require the same amount of time to conclude. To overcome such inconvenience, this paper presents a hybrid numerical approach that combines numerical modeling with analytical analysis to predict the lifetime of LEDs. In this paper, a 60W-equivalent 10W phosphor-converted white LED bulb is studied by two numerical approaches. A one-dimensional (1-D) thermal-resistance circuit analysis and a three-dimensional (3-D) hybrid finite element analysis (FEA) are employed to estimate the LEDs' junction temperature in accord to the data obtained through the experiment. The numerical results showed that both 1-D thermal-resistance circuit and the hybrid FEA model are in agreement with the experiment data, thus invaluable to manufacturers who need to carry out reliability testing. Then the estimated junction temperature is used to determine the LED luminaire's lifetime according to the known LM-80 database and TM-21 method.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127452446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103090
T. Rubin, G. Papaioannou, D. Elata
We present a new simple constitutive model for dielectric charging. The model is motivated by the functional form of the Frenkel-Poole conduction, but it enables to track the time evolution of charge distribution within the dielectric. The prediction of charge distribution is used to deduce the voltage buildup in the dielectric. Based on this model, we present a prediction of the current through a Metal-Insulator-Metal (MIM) structure when it is subjected to voltage loading, and present a prediction of the discharge process and its limitations. We propose a voltage-control measurement protocol for the MIM structure, to calibrate the two material parameters of the model.
{"title":"A simple constitutive model for dielectric charging based on Frenkel-Poole mechanism","authors":"T. Rubin, G. Papaioannou, D. Elata","doi":"10.1109/EUROSIME.2015.7103090","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103090","url":null,"abstract":"We present a new simple constitutive model for dielectric charging. The model is motivated by the functional form of the Frenkel-Poole conduction, but it enables to track the time evolution of charge distribution within the dielectric. The prediction of charge distribution is used to deduce the voltage buildup in the dielectric. Based on this model, we present a prediction of the current through a Metal-Insulator-Metal (MIM) structure when it is subjected to voltage loading, and present a prediction of the discharge process and its limitations. We propose a voltage-control measurement protocol for the MIM structure, to calibrate the two material parameters of the model.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"156 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121680366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103106
A. Moujbani, K. Weide-Zaage, Berthold Romer, F. Sabath
Commercial of the shelf (COTS) SRAMS were investigated by measurements and simulation in terms of radiation hardness. For the simulations the GEANT4 tool was used. With GEANT4 it is possible to determine the different particles generated by the applied energy as well as the radiation source. It was found that the single event upsets (SEU) is related to the radiation energy, technology node and react differently for the investigated SRAM. Furthermore a possible correlation between the generated particles and the SEU was found.
{"title":"GEANT4 simulations in terms of radiation hardness of commercially available SRAM","authors":"A. Moujbani, K. Weide-Zaage, Berthold Romer, F. Sabath","doi":"10.1109/EUROSIME.2015.7103106","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103106","url":null,"abstract":"Commercial of the shelf (COTS) SRAMS were investigated by measurements and simulation in terms of radiation hardness. For the simulations the GEANT4 tool was used. With GEANT4 it is possible to determine the different particles generated by the applied energy as well as the radiation source. It was found that the single event upsets (SEU) is related to the radiation energy, technology node and react differently for the investigated SRAM. Furthermore a possible correlation between the generated particles and the SEU was found.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121850120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103084
S. Moreau, F. de Crécy, V. Mandrillon
This paper report a new methodology combining finite element modeling (FEM) and nanoindentation tests in order to extract the plasticity law of ECD copper film. Thanks to this approach, we demonstrate that simple plasticity law (ANSYS Multilinear ISOtropic hardening (MISO) [1]) reaches the goal of fitting instead of more complex ones (Hollomon-like models [2]). In addition, there is no unique solution but a set of good solutions!
{"title":"Application of Design of Computer Experiments (DoCE) method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests","authors":"S. Moreau, F. de Crécy, V. Mandrillon","doi":"10.1109/EUROSIME.2015.7103084","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103084","url":null,"abstract":"This paper report a new methodology combining finite element modeling (FEM) and nanoindentation tests in order to extract the plasticity law of ECD copper film. Thanks to this approach, we demonstrate that simple plasticity law (ANSYS Multilinear ISOtropic hardening (MISO) [1]) reaches the goal of fitting instead of more complex ones (Hollomon-like models [2]). In addition, there is no unique solution but a set of good solutions!","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122726187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103080
A. Sasi, A. Yadur, P. Gromala
The new age product development demands rolling out effective & efficient designs in short time span and reduced costs in the view of increased competition from market players. This requires the time conventionally needed for conceptualization and validation of new designs has to be significantly reduced without having to compromise on the quality. In order to determine the optimized variant, it is necessary to evaluate its thermal, thermo-mechanical, static response under varying material properties. This also helps in ascertaining the sensitive material parameters which influences the critical response. Finite element based simulation plays a crucial role here in predicting system behavior under varying parameters. This method proves to be useful in delivering credible results within a short time span thereby accelerating the design stage.Virtual Design of Experiment (Virtual DoE) is an automated simulation methodology wherein the design space is composed of the range of properties for a particular material which are available in the market. A suitable model is considered for which the range of the properties to be evaluated are defined as design space using central composite faced (CCF) plan. Numerical simulation results for the defined points in the design space are input to obtain the response surface of the considered model. The response surface such as deformation, stress, strain & strain energy helps in determining the effect of each parameter. The degree to which each parameter affects the response determines the critical material parameters of the system. From this information a judicious decision can be taken regarding the material property for the components in a timely & cost effective manner. In the present paper an example is taken up to illustrate the selection of the molding compound for simplified DPAK model. Five parameters: coefficient of thermal expansion below and above glass transition temperature (Tg), glass transition temperature, modulus of elasticity and thermal conductivity; are investigated. Using CCF DoE plan, 52 simulation legs are defined. This covers the entire range of the molding compounds available in the market. The results of the 52 simulation cases are evaluated and later on regression analysis is conducted. Finally an Excel tool is created that is distributed among the process team and allows being used by everyone, without any prior knowledge of ANSYS or DoE software Cornerstone. The graphical representation of simulation and DoE results in the Excel tool enables them to obtain a better understanding of the implications of the varying material properties on the design.
{"title":"Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE","authors":"A. Sasi, A. Yadur, P. Gromala","doi":"10.1109/EUROSIME.2015.7103080","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103080","url":null,"abstract":"The new age product development demands rolling out effective & efficient designs in short time span and reduced costs in the view of increased competition from market players. This requires the time conventionally needed for conceptualization and validation of new designs has to be significantly reduced without having to compromise on the quality. In order to determine the optimized variant, it is necessary to evaluate its thermal, thermo-mechanical, static response under varying material properties. This also helps in ascertaining the sensitive material parameters which influences the critical response. Finite element based simulation plays a crucial role here in predicting system behavior under varying parameters. This method proves to be useful in delivering credible results within a short time span thereby accelerating the design stage.Virtual Design of Experiment (Virtual DoE) is an automated simulation methodology wherein the design space is composed of the range of properties for a particular material which are available in the market. A suitable model is considered for which the range of the properties to be evaluated are defined as design space using central composite faced (CCF) plan. Numerical simulation results for the defined points in the design space are input to obtain the response surface of the considered model. The response surface such as deformation, stress, strain & strain energy helps in determining the effect of each parameter. The degree to which each parameter affects the response determines the critical material parameters of the system. From this information a judicious decision can be taken regarding the material property for the components in a timely & cost effective manner. In the present paper an example is taken up to illustrate the selection of the molding compound for simplified DPAK model. Five parameters: coefficient of thermal expansion below and above glass transition temperature (Tg), glass transition temperature, modulus of elasticity and thermal conductivity; are investigated. Using CCF DoE plan, 52 simulation legs are defined. This covers the entire range of the molding compounds available in the market. The results of the 52 simulation cases are evaluated and later on regression analysis is conducted. Finally an Excel tool is created that is distributed among the process team and allows being used by everyone, without any prior knowledge of ANSYS or DoE software Cornerstone. The graphical representation of simulation and DoE results in the Excel tool enables them to obtain a better understanding of the implications of the varying material properties on the design.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114257994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：