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IEEE MTT-S International Microwave Symposium Digest, 2003最新文献

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Rigorous analysis of traveling wave photodetectors under high-power illumination 高功率照明下行波光电探测器的严格分析
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1212627
D. Pasalic, R. Vahldieck, Andreas Walter Aste
An efficient hybrid method for the rigorous analysis of traveling-wave photodetectors (TWPDs) is presented. The method consists of a combination of the 2D drift-diffusion based semiconductor simulation in conjunction with a full-wave EM analysis of the overall structure. While the 2D simulation determines the conductivity profile of the semiconductor layers under illuminations of different optical power levels, the 3D simulation characterizes the corresponding RF performance of the TWPD. Comparison with available experimental data has shown excellent agreement.
提出了一种用于行波光电探测器(TWPDs)严格分析的高效混合方法。该方法结合了基于二维漂移扩散的半导体模拟和整体结构的全波EM分析。二维仿真确定了不同光功率水平下半导体层的电导率分布,而三维仿真则表征了TWPD相应的射频性能。与已有的实验数据比较,结果吻合良好。
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引用次数: 2
A new characterization technique of "Four hot S parameters" for the study of nonlinear parametric behaviors of microwave devices 研究微波器件非线性参数行为的“四热S参数”表征新技术
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210458
T. Gasseling, D. Barataud, S. Mons, J. Nebus, J. Villotte, R. Quéré
This paper presents a new characterization system which enables calibrated "Hot S parameter" measurements of power transistors in a load pull environment. The device under test (DUT) is driven by a large signal at a frequency f/sub 0/ while a small signal at a frequency f is injected as a perturbation signal. A frequency sweep of the perturbation tone is performed (basically from 300MHz up to f/sub 0/ (ie lower sideband)). Upper sideband, from f/sub 0/ up to 2f/sub 0/, can be extended in a same manner. The four "Hot S parameters" measured at f are dependent on the nonlinear regime of the DUT forced by the large signal at f/sub 0/. The aim of this experimental purpose is to investigate nonlinear parametric behaviors like nonlinear stability. A description of the proposed measurement set-up is done. Calibration and measurement procedures are described and significant S band measurement results of HBTs are reported and discussed.
本文提出了一种新的表征系统,可以在负载牵引环境下对功率晶体管的“热S参数”进行校准测量。被测器件(DUT)由频率为f/sub 0/的大信号驱动,同时注入频率为f的小信号作为扰动信号。执行扰动音调的频率扫描(基本上从300MHz到f/sub 0/(即下边带))。上边带,从f/下标0/到2f/下标0/,可以用同样的方式扩展。在f处测量的四个“热S参数”取决于在f/sub 0/处的大信号所迫使的被测件的非线性状态。本实验的目的是研究非线性参数行为,如非线性稳定性。对所提出的测量装置进行了描述。描述了校准和测量程序,并报告和讨论了HBTs的重要S波段测量结果。
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引用次数: 14
A coplanar 94 GHz low-noise amplifier MMIC using 0.07 /spl mu/m metamorphic cascode HEMTs 采用0.07 /spl μ /m变质级联hemt的共面94 GHz低噪声MMIC放大器
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210439
A. Tessmann, A. Leuther, C. Schwoerer, H. Massler, S. Kudszus, W. Reinert, M. Schlechtweg
A 94 GHz low-noise amplifier MMIC (LNA) has been developed, based on a coplanar technology utilizing 0.07 /spl mu/m depletion type metamorphic HEMTs (MHEMTs). The realized single stage cascode LNA achieved a small-signal gain of more than 12 dB and an average noise figure of 23 dB over the bandwidth from 80 to 100 GHz. With an indium content of 80% in the channel, a 2/spl times/30 /spl mu/m MHEMT device has shown a transit frequency (f/sub t/) of 290 GHz, an extrinsic transconductance of 1450 mS/mm and a maximum stable gain (MSG) of 11 dB at 94 GHz. Using two HEMTs connected in cascode configuration, the MSG could be increased to 22 dB. To stabilize the cascode device and to increase the bandwidth of the amplifier circuit, a resistive feedback was integrated into the HEMT in common-gate configuration. Coplanar topology in combination with cascode transistors resulted in a chip-size of only 1/spl times/1 mm/sup 2/.
基于共面技术,利用0.07 /spl mu/m损耗型变质HEMTs (MHEMTs)开发了一种94 GHz低噪声放大器MMIC (LNA)。所实现的单级级联码LNA在80 ~ 100 GHz的带宽范围内实现了12 dB以上的小信号增益和23 dB的平均噪声系数。当通道中铟含量为80%时,2/spl倍/30 /spl mu/m的MHEMT器件显示出290 GHz的传输频率(f/sub / t/), 1450 mS/mm的外在跨导和11db的最大稳定增益(MSG)。使用级联配置连接的两个hemt, MSG可以增加到22 dB。为了稳定级联码器件并增加放大电路的带宽,在HEMT中集成了一个电阻反馈的共门配置。共面拓扑结构与级联晶体管相结合,导致芯片尺寸仅为1/spl倍/1 mm/sup / 2。
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引用次数: 26
A high performance V-band monolithic quadruple sub-harmonic mixer 高性能v波段单片四重次谐波混频器
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1212613
Won-Young Uhm, W. Sul, Hyo-Jong Han, Sungchan Kim, H. Lee, D. An, Sam-Dong Kim, D. Shin, Hyung‐Moo Park, J. Rhee
In this paper, we present a high performance V-band quadruple sub-harmonic mixer monolithic circuit which is designed and fabricated for the millimeter wave down converter applications. While the typical sub-harmonic mixers use a half of fundamental frequency, we adopt a quarter of the fundamental frequency. The proposed circuit is based on sub-harmonic mixer with APDP (anti parallel diode pair). Upon the typical mixer design, additional stubs are placed with the modification of original stub length. And the 0.1 /spl mu/m pseudomorphic high electron mobility transistors (PHEMTs) providing better gain are positioned to each port. Used lumped elements at IF port, it provides selectivity of IF frequency, and increases isolation. Maximum conversion gain of 0.8 dB at a LO frequency of 14.5 GHz and at a RF frequency of 60.4 GHz is measured. Both LO-to-RF and LO-to-IF isolations are higher than 40 dB. These conversion gain results and isolation characteristic are the best performances reported among the quadruple sub-harmonic mixers operating in the V-band millimeter wave frequency thus far.
本文提出了一种用于毫米波下变频的高性能v波段四次谐波混频器单片电路。典型的次谐波混频器使用一半的基频,而我们采用四分之一的基频。该电路基于亚谐波混频器和APDP(反并联二极管对)。在典型的混合器设计中,附加的短节被放置在原有短节长度的基础上。提供更好增益的0.1 /spl mu/m伪晶高电子迁移率晶体管(phemt)被定位到每个端口。在中频端口使用集总元件,它提供了中频的选择性,并增加了隔离。在本端频率为14.5 GHz,射频频率为60.4 GHz时,最大转换增益为0.8 dB。低电平对射频和低电平对中频的隔离度均高于40 dB。这些转换增益结果和隔离特性是迄今为止报道的工作在v波段毫米波频率上的四重次谐波混频器中表现最好的。
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引用次数: 11
A monolithic integrated 150 GHz SiGe HBT push-push VCO with simultaneous differential V-band output 具有同步差分v波段输出的单片集成150 GHz SiGe HBT推推式压控振荡器
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1212509
Y. Baeyens, Y. Chen
A fully integrated push-push voltage controlled oscillator (VCO) with simultaneous differential fundamental output is realized using an advanced 0.13/spl mu/m SiGe HBT process. A maximum oscillation frequency of 155 GHz, up to -5 dBm output power at 150 GHz and 30 GHz wide tuning range is achieved. The measured phase-noise in the linear tuning range is around -85 dBc/Hz at 1 MHz offset from carrier. Up to +3 dBm output power and 6 dB lower phase noise is obtained at each of the fundamental frequency differential ports. For a similar but fixed frequency oscillator, -2 dBm output power and a low phase noise of less than -90 dBc/Hz is measured at 1 MHz from the 140 GHz carrier.
采用先进的0.13/spl mu/m SiGe HBT工艺实现了具有同步差分基波输出的全集成推推压控振荡器(VCO)。最大振荡频率为155 GHz,在150 GHz和30 GHz宽调谐范围时输出功率高达-5 dBm。在距离载波1 MHz的偏移处,线性调谐范围内测量到的相位噪声约为-85 dBc/Hz。在每个基频差分端口可获得+ 3dbm输出功率和6db低相位噪声。对于类似的固定频率振荡器,在140ghz载波的1mhz处测量到-2 dBm输出功率和小于- 90dbc /Hz的低相位噪声。
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引用次数: 47
A broadband 100 GHz phase switch/mixer using a uniplanar slotline transition 宽带100 GHz相位开关/混频器,采用单平面槽线过渡
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210612
T. Gaier, D. Dawson, M. Wells
We have developed a broadband 180/spl deg/ phase switch using one-sided planar grounded slotline design. The design is based upon a grounded coplanar waveguide (CPW) to slotline transition acting as a balun. This design offers several advantages over existing topologies making it well suited to monolithic microwave integrated circuit (MMIC) integration. The uniplanar construction allows for simple module integration and the slot transition with a cutoff frequency serves the same function as a waveguide transition used in multipliers and mixers. We fabricated a switch using flip-chip Schottky diodes and demonstrated the circuit as a W-band phase switch and a mixer. The switch has 5 dB insertion loss and phase flatness of 10/spl deg/ from 90-110 GHz. As a mixer the circuit performs with 12 dB conversion loss from 76-112 GHz, with an IF bandwidth exceeding 25 GHz. This performance is comparable to commercially available waveguide mixers, which are incompatible with MMIC integration.
我们开发了一种宽带180/spl度/相位开关,采用单边平面接地槽线设计。该设计基于接地共面波导(CPW)到槽线转换作为平衡器。与现有的拓扑结构相比,该设计提供了几个优点,使其非常适合单片微波集成电路(MMIC)集成。单平面结构允许简单的模块集成,并且具有截止频率的槽过渡与乘法器和混频器中使用的波导过渡具有相同的功能。我们使用倒装肖特基二极管制作了一个开关,并演示了该电路作为w波段相位开关和混频器。该开关在90-110 GHz范围内具有5db插入损耗和10/spl度的相位平坦度。作为混频器,该电路在76-112 GHz范围内的转换损耗为12 dB,中频带宽超过25 GHz。这种性能可与商用波导混频器相媲美,而商用波导混频器与MMIC集成不兼容。
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引用次数: 0
Automated design of waveguide filters using Aggressive Space Mapping with a segmentation strategy and hybrid optimization techniques 基于分割策略和混合优化技术的主动空间映射波导滤波器的自动设计
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1212587
J. Morro, H. Esteban, P. Soto, V. Boria, C. Bachiller, S. Cogollos, B. Gimeno
Microwave waveguide filters are key elements present in many communication systems. In recent times, increasing efforts are being devoted to the development of automated Computed Aided Design (CAD) tools of such devices. In this paper a novel CAD tool which improves the efficiency and robustness of the classical Aggressive Space Mapping (ASM) technique is presented. The use of a new segmentation strategy and the hybridization of various optimization algorithms is proposed. The CAD tool has been successfully validated with the design of a real H plane filter for an LMDS application.
微波波导滤波器是许多通信系统中的关键元件。近年来,越来越多的人致力于开发此类设备的自动化计算机辅助设计(CAD)工具。本文提出了一种新的CAD工具,提高了传统的侵略性空间映射(ASM)技术的效率和鲁棒性。提出了一种新的分割策略和多种优化算法的混合。该CAD工具已通过LMDS应用的实际H平面滤波器的设计成功验证。
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引用次数: 13
Post-enabled precision flip-chip assembly for variable MEMS capacitor 可变MEMS电容器的后使能精密倒装芯片组装
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210535
F. Faheem, N. Hoivik, Y.C. Lee, K. Gupta
A variable capacitor array with a high Q-factor and a high tuning ratio is demonstrated. A novel "post-enabled" flip-chip assembly allows precise multiple digital capacitance levels within one device. This capacitor array is realized by a hybrid integration of a MEMS device with RF circuits on an alumina substrate. The MEMS is prefabricated using a commercially available foundry process and is initially suspended using mechanical tethers on a silicon substrate, which is removed during the flip-chip assembly. The precise gap between the MEMS and the RF circuit is controlled using posts. Each post is designed by a stack of structural layers available in the commercial foundry process. We measured a Q-factor above 200 at 1 GHz, a capacitance ratio of 4.7:1, and tuning range of 171 MHz in a resonator circuit. More importantly, we achieved a digital capacitance level and negligible warpage due to the excellent gap control following the flip-chip assembly.
提出了一种具有高q因子和高调谐比的可变电容阵列。一种新颖的“后启用”倒装芯片组件允许在一个器件内精确的多个数字电容电平。该电容器阵列是通过将MEMS器件与射频电路混合集成在氧化铝衬底上实现的。MEMS采用商用铸造工艺预制,最初在硅衬底上使用机械系绳悬浮,在倒装芯片组装过程中移除。MEMS和RF电路之间的精确间隙是用柱控制的。每个柱子都是由商业铸造工艺中可用的一堆结构层设计的。我们在1 GHz的谐振器电路中测量了超过200的q因子,电容比为4.7:1,调谐范围为171 MHz。更重要的是,我们实现了一个数字电容水平和可忽略的翘曲,由于良好的间隙控制后倒装芯片组装。
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引用次数: 11
Electro/thermal measurements of RF MEMS capacitive switches 射频MEMS电容开关的电/热测量
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210534
R. Reano, D. Peroulis, J. Whitaker
An aspect-ratio-limited fabrication procedure for the secondary handling of miniaturized micromachined and fiber-fed gallium arsenide electrothermal probes is presented, and a completed probe is used to measure the electric field and temperature above an RF MEMS capacitive switch. The probe dimensions are 125 /spl mu/m /spl times/ 125 /spl mu/m /spl times/ 100 /spl mu/m. Measurements of switches with dimensions of 250 /spl mu/m /spl times/ 640 /spl mu/m are performed for RF powers between 252 mW and 6.7 W in the UP and DOWN states. Non-contact temperature measurements 25 /spl mu/m above the switch in the UP state show a thermal rise time of 0.63 /spl plusmn/ 0.05 seconds for an RF input power of 6.7 W. The accompanying temperature rise is 16.8 /spl plusmn/ 0.7/spl deg/C. In the DOWN state, the increase in temperature is 3.0 /spl plusmn/ 0.8/spl deg/C. Spatial line scans of temperature show the localization of heat energy in the UP state and its delocalization in the DOWN state due to conductive heat transfer into the substrate. Electric field measurements yield traveling waves in the UP state and standing waves in the down state. Standing waves in the DOWN state are consistent with preferential substrate heating on the input side to the switch.
提出了一种限制宽高比的微型微机械和光纤馈送砷化镓电热探头的二次处理制造工艺,并将一个完整的探头用于测量射频MEMS电容开关上方的电场和温度。探头尺寸为125 /spl μ m /spl倍/ 125 /spl μ m /spl倍/ 100 /spl μ m。测量尺寸为250 /spl mu/m /spl倍/ 640 /spl mu/m的开关,在上行和下行状态下,射频功率为252 mW至6.7 W。在UP状态下,开关上方25 /spl mu/m的非接触式温度测量显示,射频输入功率为6.7 W时,热上升时间为0.63 /spl plusmn/ 0.05秒。伴随的温升为16.8 /spl plusmn/ 0.7/spl℃。在DOWN状态下,温度升高幅度为3.0 /spl plusmn/ 0.8/spl℃。温度的空间线扫描显示,由于传导热传递到衬底,热能在UP状态下的局部化和在DOWN状态下的局部化。电场测量产生上行状态的行波和下行状态的驻波。DOWN状态下的驻波与开关输入端的基片优先加热相一致。
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引用次数: 7
A UTD/FDTD model to evaluate human exposure to base-station antennas in realistic urban environments
Pub Date : 2003-06-08 DOI: 10.1109/MWSYM.2003.1210962
P. Bernardi, M. Cavagnaro, R. Cicchetti, S. Pisa, E. Pitizzi, O. Testa
A technique combining uniform asymptotic theory of diffraction and finite-difference time-domain (UTD/FDTD), suitable to characterize human exposure in realistic urban environments at a reasonable computational cost, is presented. The technique allows an accurate evaluation of field interaction with penetrable objects (walls, windows, furniture, etc.) and of power absorption in a high-resolution model of the exposed subject. The method has been applied to analyze the exposure of a subject standing behind a window in a building situated in front of a rooftop-mounted base-station antenna. A comparison of the obtained results with those computed neglecting the presence of the building (free-space condition) evidences that a realistic modeling of field propagation in the actual scenario is essential for an accurate evaluation of absorbed power distribution inside the human body.
提出了一种结合衍射均匀渐近理论和时域有限差分(UTD/FDTD)的方法,在合理的计算成本下,适合于在现实城市环境中对人体暴露进行表征。该技术可以准确评估与可穿透物体(墙壁、窗户、家具等)的场相互作用,并在暴露对象的高分辨率模型中评估能量吸收。该方法已被应用于分析在屋顶安装的基站天线前的建筑物中站在窗户后面的受试者的暴露。将所得结果与忽略建筑物存在(自由空间条件)的计算结果进行比较,证明了在实际场景中对场传播进行逼真的建模对于准确评估人体吸收功率分布至关重要。
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引用次数: 6
期刊
IEEE MTT-S International Microwave Symposium Digest, 2003
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