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GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)最新文献

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Metamorphic PIN photodiodes for the 40 Gb/s fiber market 用于40gb /s光纤市场的变形PIN光电二极管
C. Whelan, P. Marsh, R. Leoni, J. Hunt, M. Grigas, W. Hoke, K. C. Hwang, T. Kazior, A. Joshi, X. Wang
High-speed metamorphic PIN diodes that absorb at 1.55 /spl mu/m wavelength light were fabricated on a GaAs substrate. The In/sub 0.53/Ga/sub 0.47/As-based top-illuminated structure showed a low, stable dark current of 7 nA at 10 V reverse bias. The packaged diode demonstrated a -3 dB bandwidth of 52 GHz and 0.52 A/W responsivity. This state-of-the-art diode fabricated on a highly manufacturable GaAs substrate is clearly suitable for the 40 Gbit/s fiber optic telecommunication market, and opens the door for metamorphic OEICs.
在GaAs衬底上制备了吸收1.55 /spl μ m波长光的高速变质PIN二极管。基于In/sub 0.53/Ga/sub 0.47/ as的顶光结构在10 V反向偏置下具有7 nA的低稳定暗电流。封装二极管的带宽为- 3db,为52 GHz,响应率为0.52 a /W。这种在高度可制造的GaAs衬底上制造的最先进的二极管显然适用于40 Gbit/s光纤电信市场,并为变质oeic打开了大门。
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引用次数: 8
Comparisons of technologies and MMICS results for military needs 军事需要的技术和mics结果的比较
F. Murgadella, P. Coulon, C. Moreau
During the last 3 years, the French MoD has supported technology developments and/or specific MMICs designs for power amplification from S-band to Ku-band (i.e. 18 GHz), for radar and electronic warfare applications. Our objective in this paper, is to present and analyse the results obtained on three X-band power amplifiers using different GaAs technologies and designs with a view to meeting the same specifications target. To our knowledge, this is the first time a concrete comparison is conducted on three different state-of-the art technologies, simultaneously taking into account, technology, reliability issues and microwave measurements of MMICs.
在过去的3年中,法国国防部支持了从s波段到ku波段(即18 GHz)功率放大的技术开发和/或特定mmic设计,用于雷达和电子战应用。我们在本文中的目标是介绍和分析使用不同GaAs技术和设计的三个x波段功率放大器获得的结果,以满足相同的规格目标。据我们所知,这是第一次对三种不同的最先进技术进行具体比较,同时考虑到mmic的技术、可靠性问题和微波测量。
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引用次数: 4
Reliability of InGaP/GaAs HBT's under high current acceleration 高电流加速下InGaP/GaAs HBT的可靠性
K. Feng, L. Runshing, P. Canfield, Wanxiu Sun
The reliability of InGaP/GaAs heterojunction bipolar transistors (HBT's) under high emitter current density stress has been investigated. The current acceleration of transistor lifetime is modeled as a power law relationship. Over a range of 25kA/cm/sup 2/ to 150 kA/cm/sup 2/, we have extracted a square root dependence of lifetime on current density. These results compare with an approximate square law result measured on AlGaAs HBT's.
研究了InGaP/GaAs异质结双极晶体管在高发射极电流密度应力下的可靠性。电流加速度对晶体管寿命的影响是幂律关系。在25kA/cm/sup 2/至150ka /cm/sup 2/的范围内,我们提取了寿命与电流密度的平方根依赖关系。这些结果与在AlGaAs HBT上测量的近似平方律结果进行了比较。
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引用次数: 7
High reliability of 0.1 /spl mu/m InGaAs/InAlAs/InP HEMT MMICs on 3-inch InP production process 在3英寸InP生产工艺上实现0.1 /spl mu/m InGaAs/InAlAs/InP HEMT mmic的高可靠性
Y. Chou, D. Leung, R. Lai, J. Scarpulla, M. Barsky, R. Grundbacher, D. Eng, P. Liu, A. Oki, D. Streit
The high-reliability performance of K-band MMIC amplifiers fabricated using 0.1 /spl mu/m T-gate InGaAs/InAlAs/InP HEMTs on 3-inch wafers using a high volume production process is reported. Operating at an accelerated life test condition of V/sub ds/=1.2 V and I/sub ds/=150 mA/mm, two-stage balanced amplifiers were life tested at three temperatures (T/sub 1/=215/spl deg/C, T/sub 2/=230/spl deg/C and T/sub 3/=250/spl deg/C) in a N/sub 2/ ambient. The activation energy (E/sub a/) is as high as 2 eV, achieving a projected median-time-to-failure (MTF) >1/spl times/10/sup 8/ hours at a 125/spl deg/C junction temperature. MTF was determined by 3-temperature constant current stress using | /spl Delta/S21 | >1.0 dB as the failure criteria. This is the first demonstration of 3-temperature high reliability 0.1 /spl mu/m InGaAs/InAlAs/InP HEMT based on small-signal microwave characteristics of HEMT MMIC. This result demonstrates a robust InGaAs/InAlAs/InP HEMT production technology.
本文报道了在3英寸晶圆上采用0.1 /spl mu/m t栅InGaAs/InAlAs/InP hemt制备的k波段MMIC放大器的高可靠性性能。在V/sub /=1.2 V, I/sub /=150 mA/mm的加速寿命测试条件下,在N/sub /环境中,对两级平衡放大器进行了三种温度(T/sub 1/=215/spl度/C, T/sub /=230/spl度/C和T/sub /=250/spl度/C)的寿命测试。活化能(E/sub / a/)高达2 eV,在125/spl℃的结温下,实现了预计的中失效时间(MTF) bb0.1 /spl次/10/sup 8/小时。以| /spl Delta/S21 | >1.0 dB为失效准则,采用3℃恒流应力法测定MTF。这是基于HEMT MMIC小信号微波特性的3温高可靠性0.1 /spl mu/m InGaAs/InAlAs/InP HEMT的首次演示。这一结果证明了一种强大的InGaAs/InAlAs/InP HEMT生产技术。
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引用次数: 4
A 3.5 GHz fully integrated power amplifier module 3.5 GHz全集成功率放大器模块
P. Blount, J. Cuggino, J. McPhee
In this paper we present a state-of-the-art Power Amplifier module operating at S-band. The power module consists of an InGaP HBT MMIC amplifier at 3.5 GHz with the necessary bias and output matching networks integrated using standard surface mount components. As such the module is truly 50 /spl Omega/ matched at input and output ports with no external circuitry required. The technology chosen for the module is a low cost, high volume ball grid array (BGA) technology, which is widely available. The power module gave a peak output power of 27.5 dBm and a power added efficiency of 44% from a single +5 V supply.
在本文中,我们提出了一种工作在s波段的最先进的功率放大器模块。该功率模块由3.5 GHz的InGaP HBT MMIC放大器组成,该放大器使用标准表面贴装组件集成了必要的偏置和输出匹配网络。因此,该模块在输入和输出端口上是真正的50 /spl ω /匹配,不需要外部电路。该模块选择的技术是一种低成本、高容量的球栅阵列(BGA)技术,该技术广泛应用。电源模块的峰值输出功率为27.5 dBm,单个+ 5v电源的功率增加效率为44%。
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引用次数: 2
An LMDS, subharmonically pumped image reject mixer 一种LMDS,次谐波泵浦图像抑制混频器
P. Blount
In this paper we present a 25-34 GHz subharmonically pumped image reject mixer (IRM). This is to the author's knowledge the first detailed report of a subharmonic IRM MMIC in this frequency band (Smith and Novak, 1998). It directly addresses the LMDS frequency band, and also 26 GHz and 28 GHz point to point radio applications. The IRM has a conversion loss of 11dB, an image rejection of 22-24 dB and an input IP3 of +17 dBm. To further reduce the required MMW system complexity, an on-board LO amplifier has been included reducing the required LO drive to 2 dBm while drawing only 28 mA at 4 V. Due to lumped element matching throughout, the design occupies only 2.28 mm/sup 2/ of GaAs area.
本文提出了一种25-34 GHz次谐波泵浦图像抑制混频器(IRM)。据作者所知,这是该频段的次谐波IRM MMIC的第一份详细报告(Smith and Novak, 1998)。它直接针对LMDS频段,以及26 GHz和28 GHz点对点无线电应用。IRM的转换损耗为11dB,图像抑制为22-24 dB,输入IP3为+17 dBm。为了进一步降低所需的毫米波系统复杂性,已包括板载LO放大器,将所需的LO驱动器降低到2 dBm,同时在4 V时仅消耗28 mA。由于集总元件匹配,设计仅占用2.28 mm/sup / GaAs面积。
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引用次数: 11
InP and GaAs components for 40 Gbps applications 用于40 Gbps应用的InP和GaAs组件
D. Streit, R. Lai, A. Gutierrez-Aitken, M. Siddiqui, B. Allen, A. Chau, W. Beale, A. Oki
We have developed a number of products for 40 Gbps applications, including GaAs and InP HEMT modulator drivers, InP-based monolithically integrated PIN-TIA circuits, InP double heterojunction HBT TIAs, and high responsivity dual-absorption PIN diodes. A number of other products are currently in development, including a number of InP DHBT digital circuits.
我们已经开发了许多用于40 Gbps应用的产品,包括GaAs和InP HEMT调制器驱动器,基于InP的单片集成PIN- tia电路,InP双异质结HBT TIAs和高响应双吸收PIN二极管。许多其他产品目前正在开发中,包括一些InP DHBT数字电路。
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引用次数: 25
Ultra low noise 2.5 Gbit/s 3.3V transimpedance amplifier with automatic gain control 超低噪声2.5 Gbit/s 3.3V跨阻放大器,自动增益控制
A. Gasmi, B. Wroblewski, R. Leblanc, D. Smith, M. Rocchi
We present a high performance 2.5 Gb/s Transimpedance Amplifier (TIA) with the lowest input noise current ever reported at 3.3 V. Typical use is as a low noise preamplifier for lightwave receiver modules in optical fiber with an exceptionally good sensitivity and high gain. The circuit features a very small chip size, differential outputs, very low power consumption and built in Automatic Gain Control (AGC) to allow operation over a wide dynamic range. We have used an advanced enhancement-depletion mode PHEMT process to fabricate the device. This type of process offers the designer the flexibility and options required to obtain both a very good noise figure and low power consumption.
我们提出了一种高性能的2.5 Gb/s跨阻放大器(TIA),其输入噪声电流最低,为3.3 V。典型用途是作为光纤中光波接收模块的低噪声前置放大器,具有非常好的灵敏度和高增益。该电路具有非常小的芯片尺寸,差分输出,非常低的功耗和内置的自动增益控制(AGC),允许在宽动态范围内工作。我们使用了先进的增强耗尽模式PHEMT工艺来制造该器件。这种类型的工艺为设计人员提供了灵活性和选择,以获得非常好的噪声系数和低功耗。
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引用次数: 0
1-W 1:16 DEMUX and one-chip CDR with 1:4 DEMUX for 10 Gbit/s optical communication systems 1-W 1:16 DEMUX和单片CDR与1:4 DEMUX适用于10gbit /s光通信系统
K. Ishii, H. Nosaka, H. Nakajima, K. Kurishima, M. Ida, N. Watanabe, Y. Yamane, E. Sano, T. Enoki
Using InP/InGaAs heterojunction bipolar transistor (HBT) technology, we have successfully designed and fabricated a low power 1:16 demultiplexer (DEMUX) IC and one-chip clock and data recovery (CDR) with a 1:4 DEMUX IC for 10 Gbit/s optical communication systems. The HBTs were fabricated by a non-self-aligned process to achieve high productivity and uniformity of device characteristics. The 1:16 DEMUX IC and the one-chip CDR with the 1:4 DEMUX IC consist of approximately 1200 and 460 transistors, respectively. We have confirmed error-free operation at 10 Gbit/s for all data outputs of both ICs. The 1:16 DEMUX IC and the one-chip CDR with the 1:4 DEMUX IC consume only 1 W and 950 mW, respectively. These results demonstrate the feasibility of InP/InGaAs HBTs for low-power, high-integration optical communication ICs.
利用InP/InGaAs异质结双极晶体管(HBT)技术,我们成功地设计和制造了低功耗1:16解复用器(DEMUX) IC和具有1:4 DEMUX IC的单片时钟和数据恢复(CDR),用于10 Gbit/s光通信系统。采用非自对准工艺制备了高生产率和均匀性器件。1:16 DEMUX IC和带有1:4 DEMUX IC的单片CDR分别由大约1200和460个晶体管组成。我们已经确认两个ic的所有数据输出都以10gbit /s的速度无错误运行。1:16 DEMUX IC和1:4 DEMUX IC的单片CDR分别仅消耗1w和950mw。这些结果证明了InP/InGaAs HBTs用于低功耗、高集成度光通信集成电路的可行性。
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引用次数: 0
45 GHz distributed amplifier with a linear 6-Vp-p output for a 40 Gb/s LiNbO/sub 3/ modulator driver circuit 45 GHz分布式放大器,线性6 vp -p输出,40gb /s LiNbO/sub - 3/调制器驱动电路
H. Shigematsu, N. Yoshida, M. Sato, N. Hara, T. Hirose, Y. Watanabe
We developed a coplanar waveguided-type distributed amplifier for a LiNbO/sub 3/ modulator driver (LN driver) using double-doped AlGaAs/InGaAs/AlGaAs-pseudomorphic High Electron Mobility Transistors (p-HEMTs). By using a stabilization and impedance control technique, we obtained a 45 GHz bandwidth for coplanar waveguided (CPW) lines with a 600 /spl mu/m thick substrate and 54 GHz bandwidth for grounded coplanar waveguided (GCPW) lines with a 75 /spl mu/m thick substrate, and a linear 6-Vp-p output at 40 Gb/s. These results indicate that our circuit design technique is suitable for use in fiber-optic communication systems.
我们利用双掺杂AlGaAs/InGaAs/AlGaAs伪晶高电子迁移率晶体管(p-HEMTs)开发了一种用于LiNbO/sub - 3/调制器驱动器(LN驱动器)的共面波导型分布式放大器。通过稳定和阻抗控制技术,我们获得了基片厚度为600 /spl mu/m的共面波导(CPW)线的45 GHz带宽和基片厚度为75 /spl mu/m的接地共面波导(GCPW)线的54 GHz带宽,以及40 Gb/s的6 vp -p线性输出。这些结果表明,我们的电路设计技术适用于光纤通信系统。
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引用次数: 28
期刊
GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)
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