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GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)最新文献

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High reliability non-hermetic 0.1 /spl mu/m GaAs pseudomorphic HEMT MMIC amplifiers 高可靠性非密封式0.1 /spl μ m GaAs伪晶HEMT MMIC放大器
Y. Chou, D. Leung, R. Lai, J. Scarpulla, M. Biedenbender, R. Grundbacher, D. Eng, P. Liu, A. Oki, D. Streit
High reliability performance of a Q-band low-noise MMIC amplifier fabricated using 0.1 /spl mu/m production AlGaAs/InGaAs/GaAs HEMT process technology is reported. Operating at an accelerated DC bias condition of Vds=4.2 V and Ids=150 mA/mm, two-stage balanced amplifiers were lifetested at three temperatures (T/sub ambient/=255/spl deg/C, T/sub ambient/=270/spl deg/C, and T/sub ambient/=285/spl deg/C) in air ambient. After stress, MMIC amplifiers were brought down to room temperature and small-signal microwave characteristics were measured. Failure time for each temperature was determined using /spl Delta/S21=-1.0 dB measured at room temperature as the failure criteria. The activation energy (Ea) is 1.7 eV, achieving a projected median-time-to-failure (MTF) of 6/spl times/10/sup 9/ hours at a 125/spl deg/C junction temperature. This is the state-of-art of 0.1 /spl mu/m HEMT reliability based on S21 failure criteria of MMIC amplifiers under DC stress at high junction temperature in air ambient. This result demonstrates a robust HEMT technology which is immune to the stress effects of high electric field under high temperature operation, and demonstrates the suitability of the HEMTs for non-hermetic commercial applications.
报道了采用0.1 /spl μ m量产AlGaAs/InGaAs/GaAs HEMT工艺制备的q波段低噪声MMIC放大器的高可靠性性能。在Vds=4.2 V、Ids=150 mA/mm的加速直流偏置条件下,对两级平衡放大器进行了空气环境下三种温度(T/亚环境/=255/spl°C、T/亚环境/=270/spl°C和T/亚环境/=285/spl°C)的寿命测试。应力结束后,将MMIC放大器降至室温,测量小信号微波特性。每个温度下的失效时间以室温下测量的/spl Delta/S21=-1.0 dB作为失效标准来确定。活化能(Ea)为1.7 eV,在125/spl℃结温下,预计的中位失效时间(MTF)为6/spl次/10/sup /小时。这是基于MMIC放大器在空气环境中高结温直流应力下的S21失效准则的最先进的0.1 /spl mu/m HEMT可靠性。这一结果证明了一种强大的HEMT技术,该技术在高温操作下不受高电场的应力影响,并证明了HEMT在非密封商业应用中的适用性。
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引用次数: 3
Low noise AlGaN/GaN MODFETs with high breakdown and power characteristics 具有高击穿和高功率特性的低噪声AlGaN/GaN modfet
S. Hsu, D. Pavlidis
AlGaN/GaN MODFETs (0.25/spl times/200 /spl mu/m/sup 2/) with low noise, high breakdown and power characteristics have been evaluated. A noise figure of 1.9 dB with 16.2 dB associated gain was obtained at a quiescent point of I/sub DS/=30 mA. and V/sub DS/=10 at 10 GHz. The maximum power measured was 22.9 dBm (/spl sim/1 W/mrn) and PAE was 21.9% at 8.4 GHz at the same bias condition. In addition, a maximum breakdown voltage (V/sub BD/) of /spl sim/115 V at I/sub D/=20 /spl mu/A and I/sub G//spl sim/30 /spl mu/A was measured. A MODFET noise model and its correlation with gate leakage current are also investigated.
对具有低噪声、高击穿和功率特性的AlGaN/GaN modfet (0.25/spl倍/200 /spl μ /m/sup 2/)进行了评价。在I/sub DS/=30 mA的静息点处,噪声系数为1.9 dB,相关增益为16.2 dB。在10ghz时V/sub DS/=10。在相同偏置条件下,测量到的最大功率为22.9 dBm (/spl sim/1 W/mrn),在8.4 GHz时PAE为21.9%。此外,在I/sub D/=20 /spl mu/ a和I/sub G//spl sim/30 /spl mu/ a时测得的最大击穿电压(V/sub BD/)为/spl sim/115 V。研究了MODFET噪声模型及其与栅极漏电流的关系。
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引用次数: 16
Dual-band multi-mode power amplifier module using a third generation HBT technology 双频多模功率放大器模块采用第三代HBT技术
P. Savary, A. Girardot, G. Montoriol, F. Dupis, B. Thibaud, R. Jaoui, L. Chapoux, V. Esnault, L. Cornibert, O. Izumi, D. Hill, M. Sadaka, H. Henry, E. Yu, M. Tutt, M. Majerus, R. Uscola, F. Clayton, C. Rampley, S. Klingbeil, K. Rajagopalan, A. Mitra, A. Reyes
A heterojunction bipolar transistor (HBT) technology utilizing InGaP/GaAs and carbon-doped base has been established in Motorola's high-volume 6" GaAs facility. The technology has been used to develop an integrated dual band (824-849 MHz and 1850-1910 MHz) power amplifier IC with multi-mode operation for 2.5G portable wireless. Both three-stage amplifiers have 30 dB gain, and provide an EDGE (8-PSK) signal at 28 dBm, an NADC signal at 30 dBm, and a GMSK signal at 32 dBm in their respective frequency bands, using a single 3.5 V source. All matching elements external to the chip are included in a low cost epoxy substrate which is 9/spl times/12/spl times/1.6 mm/sup 3/. Prospects of using this technology in W-CDMA applications have also been explored. A prototype achieves an ACPR of -41 dBc at 28 dBm output power with an efficiency of 36%.
利用InGaP/GaAs和碳掺杂基的异质结双极晶体管(HBT)技术已经在摩托罗拉的高产量6" GaAs设施中建立起来。该技术已用于开发具有多模式操作的2.5G便携式无线集成双频(824-849 MHz和1850-1910 MHz)功率放大器IC。两个三级放大器都具有30db增益,并在各自的频段内使用单个3.5 V源提供28dbm的EDGE (8-PSK)信号,30dbm的NADC信号和32dbm的GMSK信号。芯片外部的所有匹配元件都包含在低成本的环氧基板中,其尺寸为9/spl倍/12/spl倍/1.6 mm/sup 3/。并对该技术在W-CDMA中的应用前景进行了展望。一个原型在28 dBm输出功率下实现了-41 dBc的ACPR,效率为36%。
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引用次数: 14
A data-pattern independent clock and data recovery IC with a two-mode phase comparator 一种具有双模相位比较器的数据模式独立时钟和数据恢复集成电路
H. Nosaka, K. Ishii, T. Enoki
Clock and data recovery (CDR) with a novel two-mode phase comparator (PC) is proposed. The 10-Gbit/s CDR IC stably operates both for consecutive identical digits (CIDs) and for data transition density variations. This advancement is achieved by the novel two-mode PC, which enables us to optimize phase-locked loop parameters for various data patterns. Experimental results show that the jitter generation of the CDR IC is less than 7 ps/sub pp/ for a 2/sup 7/-1 pseudorandom bit sequence with up to 1024 CIDs. They also show that the jitter transfer and jitter tolerance are not affected by the data transition density factors between 1/8 and 1/2.
提出了一种新型的双模相位比较器(PC)时钟和数据恢复(CDR)。10gbit /s CDR IC在连续相同数字(cid)和数据转换密度变化下都能稳定运行。这一进步是由新的双模PC实现的,它使我们能够针对各种数据模式优化锁相环参数。实验结果表明,对于2/sup 7/-1伪随机比特序列,CDR IC的抖动产生小于7 ps/sub / pp/,且cid数最多为1024。他们还表明,抖动传递和抖动容差不受数据转移密度因子在1/8和1/2之间的影响。
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引用次数: 0
The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market 台湾GaAs集成电路制造对亚太无线市场的挑战
L.W. Yang, P. Chao, L. Wu
The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.
作者考虑了亚太地区的市场前景,描述了基于硅集成电路制造记录的商业模式,并强调了技术挑战。
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引用次数: 1
An 850 nm wavelength monolithic integrated photoreceiver with a single-power-supplied transimpedance amplifier based on GaAs PHEMT technology 基于砷化镓PHEMT技术的850 nm波长单电源跨阻放大器单片集成光接收器
Xian-jie Li, J. Ao, Rong Wang, Wei-Ji Liu, Zhigong Wang, Q. Zeng, Shiyong Liu, Chun-Guang Liang
An 850 nm wavelength monolithic integrated photoreceiver with a novel single-power-supplied transimpedance amplifier is reported based on 0.8 /spl mu/m depleted GaAs PHEMT technology. The IC consists of an MSM photodetector and a transimpedance amplifier with a 50 ohm-matched differential output. The MSM PD on the chip shows a dark current of 2.0 nA as well as a responsivity of 0.30 A/W under a bias of 3.5 V. The TIA shows a transimpedance gain of more than 58 dB/spl Omega/ with a -3 dB bandwidth of 2.0 GHz. Opening eye diagrams are demonstrated at bit-rates of 1.25 Gbit/s and 2.5 Gbit/s under a +5 V supply.
报道了一种基于0.8 /spl μ m损耗GaAs PHEMT技术的850 nm波长单电源跨阻放大器单片集成光接收器。该集成电路由一个MSM光电探测器和一个带50欧姆匹配差分输出的跨阻放大器组成。芯片上的MSM PD在3.5 V偏置下的暗电流为2.0 nA,响应率为0.30 a /W。TIA显示出超过58 dB/spl ω /的跨阻增益,-3 dB带宽为2.0 GHz。在+ 5v电源下,以1.25 Gbit/s和2.5 Gbit/s的比特率演示了睁眼图。
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引用次数: 6
A space-qualified, hermetically-sealed, Ka-band LNA with 2.0dB noise figure 符合空间要求的密封ka波段LNA,噪声系数为2.0dB
J. Sowers, M. Willis, T. Tieu, W. Findley, K. Hubbard
A space-qualified, hermetically-sealed, Ka-Band LNA with 2.0dB typical noise figure and greater than 38dB of temperature compensated gain has been built tested, and integrated into commercial satellite payloads. Noise figures as low as 1.7dB at 25deg C, have been recorded. A novel matching technique was used to minimize noise figure. This involved designing the LNA input stage with the waveguide to microstrip transition as part of the matching circuitry. In this way, input loss was minimized. Additionally, some tuning elements at the input enhanced the consistency of the design by allowing for device and assembly variations. This paper will describe the design and performance of the LNA. This will include a physical description, LNA design drivers and approach, waveguide to microstrip design, production LNA performance, and some ideas for future improvements. To the author's knowledge, this is the lowest Ka-Band noise figure reported, from a hermetically-sealed, commercial space module currently in production.
一个符合航天标准的、密封的ka波段LNA,典型噪声系数为2.0dB,温度补偿增益大于38dB,已经建成并集成到商业卫星有效载荷中。在摄氏25度时,噪音数字低至1.7分贝。采用了一种新颖的匹配技术来最小化噪声系数。这涉及到设计LNA输入级,将波导到微带转换作为匹配电路的一部分。这样,输入损失最小。此外,输入端的一些调谐元素通过允许设备和装配的变化来增强设计的一致性。本文将介绍LNA的设计和性能。这将包括物理描述、LNA设计驱动和方法、波导到微带设计、生产LNA性能以及未来改进的一些想法。据作者所知,这是目前正在生产的密封商业太空舱所报告的最低ka波段噪声数字。
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引用次数: 9
Low noise, high-speed InP/InGaAs HBTs 低噪声,高速InP/InGaAs HBTs
S. Hsu, D. Pavlidis
High frequency noise characteristics of InP/InGaAs HBTs with various emitter geometries were investigated. A minimum noise figure (F/sub min/) of 1.51 dB and associated gain (G/sub a/) of 9.6 dB at a frequency of 10 GHz and a DC power consumption of only 1.6 mW (V/sub CE/ = 1.6 V, I/sub C/ = 1 mA) at 10 GHz were obtained. The dependence of noise characteristics on bias and geometry is also reported. The dominant noise sources in these HBTs were analyzed and an optimum emitter area of 1.2 /spl times/ 20 /spl mu/m/sup 2/ was found to present minimum noise figure and equivalent noise resistance.
研究了不同发射极几何形状的InP/InGaAs HBTs的高频噪声特性。在10ghz频率下,最小噪声系数(F/sub min/)为1.51 dB,相关增益(G/sub A /)为9.6 dB,直流功耗仅为1.6 mW (V/sub CE/ = 1.6 V, I/sub C/ = 1 mA)。本文还报道了噪声特性与偏压和几何形状的关系。结果表明,最佳的噪声源面积为1.2 /spl倍/ 20 /spl mu/m/sup 2/ /时,噪声系数最小,具有等效的抗噪能力。
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引用次数: 5
A 14-V/sub pp/ 10 Gbit/s E/O modulator driver IC 14v /sub / 10gbit /s E/O调制器驱动IC
J. Carroll, C. Campbell
The development of a high voltage, wideband E/O modulator driver IC is described. The DC coupled, single-ended amplifier exhibits a 3 dB-bandwidth of 11.5 GHz, 9.5 dB small signal gain, and 14-V/sub pp/ output voltage swing. The IC utilizes a 0.25 /spl mu/m pHEMT production process and provides sufficient bandwidth and output power for 10 Gbit/s high voltage E/O modulator applications.
介绍了一种高电压、宽带E/O调制器驱动集成电路的研制。该直流耦合单端放大器具有11.5 GHz的3db带宽,9.5 dB小信号增益和14v /sub /输出电压摆幅。该IC采用0.25 /spl mu/m pHEMT生产工艺,为10gbit /s高压E/O调制器应用提供足够的带宽和输出功率。
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引用次数: 3
Recent advances in lithium battery technology 锂电池技术的最新进展
M.H. Miles
Portable electronics such as cellular telephones and laptop computers have produced a surge in battery development and the introduction of rechargeable lithium battery systems. The most dramatic improvement in rechargeable battery technology was the introduction of the lithium-ion battery in 1990. Today, the sale of lithium-ion systems dominates the rechargeable battery market. The cell voltage for any battery system is determined by the selection of the anode and cathode materials, and the electrolyte determines the chemistry of the system and the rate of the electrode reactions. Applications of lithium batteries range from cardiac pacemakers to thermal batteries for military operations. Various types of lithium batteries are discussed. The next major improvement in lithium battery technology will likely be the use of solid polymer electrolytes that provide a truly all-solid-state battery.
便携式电子产品,如移动电话和笔记本电脑,在电池的发展和可充电锂电池系统的引入方面产生了激增。可充电电池技术最显著的进步是1990年锂离子电池的问世。如今,锂离子电池系统的销售主导了可充电电池市场。任何电池系统的电池电压都是由阳极和阴极材料的选择决定的,电解质决定了系统的化学性质和电极反应的速率。锂电池的应用范围从心脏起搏器到军事行动的热电池。讨论了各种类型的锂电池。锂电池技术的下一个重大改进可能是使用固体聚合物电解质,从而提供真正的全固态电池。
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引用次数: 19
期刊
GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)
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