Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6898941
K. Chandrasekar, D. Oh, Arif Rahman
Memory bandwidth requirements for future high-end applications such as graphics, 200G/400G networking and high performance computing is driving the need for more “on-chip memory”. Silicon Interposer based 2.5D integration provides an intermediate path to achieving high memory bandwidth by integrating memory in package. This paper discusses timing budget analysis for realizing wide IO memory interfaces in silicon interposer technology. Traditional signal and power integrity (SI/PI) analysis for closing system timing in DDR interfaces cannot be applied directly to “chip-to-chip scenarios” as it tends to be time consuming because of need for extensive electromagnetic (EM) simulations. In addition, the assumptions on bus activity and IO bandwidth/density/speed are unique to 2.5D memory customer applications. Applying traditional assumptions from off-chip double data rate (DDR) memory interfaces to “in-package” memory interfaces can lead to additional cost overhead at chip/package and board level. The key contributions of this paper are in providing an accurate time efficient SPICE based modeling methodology to design and optimize 2.5D memory applications cost effectively to meet desired timing specifications. This paper notes simultaneous switching noise (SSN) to be a major impairment leading to eye closure in wide memory interfaces with worst case timing jitter numbers of the order of 130ps in FPGA applications. Achieving 500MHz to 1GHz DDR operating speeds primarily require a more rigorous application - based tuning of on-die decoupling capacitance, PDN inductive parasitics, interconnect length and IO drive strength. But the power, bandwidth and latency benefits of wide IO system-in-package (SIP) memory make the additional development effort worthwhile.
{"title":"Timing analysis for wide IO memory interface applications with silicon interposer","authors":"K. Chandrasekar, D. Oh, Arif Rahman","doi":"10.1109/ISEMC.2014.6898941","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898941","url":null,"abstract":"Memory bandwidth requirements for future high-end applications such as graphics, 200G/400G networking and high performance computing is driving the need for more “on-chip memory”. Silicon Interposer based 2.5D integration provides an intermediate path to achieving high memory bandwidth by integrating memory in package. This paper discusses timing budget analysis for realizing wide IO memory interfaces in silicon interposer technology. Traditional signal and power integrity (SI/PI) analysis for closing system timing in DDR interfaces cannot be applied directly to “chip-to-chip scenarios” as it tends to be time consuming because of need for extensive electromagnetic (EM) simulations. In addition, the assumptions on bus activity and IO bandwidth/density/speed are unique to 2.5D memory customer applications. Applying traditional assumptions from off-chip double data rate (DDR) memory interfaces to “in-package” memory interfaces can lead to additional cost overhead at chip/package and board level. The key contributions of this paper are in providing an accurate time efficient SPICE based modeling methodology to design and optimize 2.5D memory applications cost effectively to meet desired timing specifications. This paper notes simultaneous switching noise (SSN) to be a major impairment leading to eye closure in wide memory interfaces with worst case timing jitter numbers of the order of 130ps in FPGA applications. Achieving 500MHz to 1GHz DDR operating speeds primarily require a more rigorous application - based tuning of on-die decoupling capacitance, PDN inductive parasitics, interconnect length and IO drive strength. But the power, bandwidth and latency benefits of wide IO system-in-package (SIP) memory make the additional development effort worthwhile.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123426837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6899038
Xiao Ren, Pratik Maheshwari, Yaojiang Zhang, V. Khilkevich, J. Fan, Yan Zhou, Yadong Bai, Xuequan Yu
The impact of near-field scanning sizes on the accuracy of far-field estimations is studied using a U-shape trace above a large ground plane as an example. Simulation model is built in commercial software and the planar near fields above the trace are obtained. Fourier Transform of the planar near fields is used to calculate the far-field radiations. Different sizes of planar scanning area are chosen and their corresponding computed far field patterns and maximum values are compared with those obtained by the software. It demonstrates that too small scanning size may lead to large errors in far-field calculations. Relationship between scanning plane height and planar scanning size is derived for accurate far field estimation, which is guidance for the extraction of accurate IC radiated emission model by planar near-field scanning technique.
{"title":"The impact of near-field scanning size on the accuracy of far-field estimation","authors":"Xiao Ren, Pratik Maheshwari, Yaojiang Zhang, V. Khilkevich, J. Fan, Yan Zhou, Yadong Bai, Xuequan Yu","doi":"10.1109/ISEMC.2014.6899038","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899038","url":null,"abstract":"The impact of near-field scanning sizes on the accuracy of far-field estimations is studied using a U-shape trace above a large ground plane as an example. Simulation model is built in commercial software and the planar near fields above the trace are obtained. Fourier Transform of the planar near fields is used to calculate the far-field radiations. Different sizes of planar scanning area are chosen and their corresponding computed far field patterns and maximum values are compared with those obtained by the software. It demonstrates that too small scanning size may lead to large errors in far-field calculations. Relationship between scanning plane height and planar scanning size is derived for accurate far field estimation, which is guidance for the extraction of accurate IC radiated emission model by planar near-field scanning technique.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126264324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6899096
M. Barazzetta, D. Micheli, F. Moglie, V. M. Primiani
Fourth generation (4G) cellular systems have been nowadays rolled out already in several countries in the world. With networks open to commercial use, one of the key issues is how the quality perceived by the user is influenced by multipath propagation, like it may happen in indoor locations or in any kind of places where electromagnetic waves are partially reflected by walls and other objects. In order to verify this, the signal of a real 4G base station connected to the real radio access network of Telecom Italia has been transmitted into a reverberation chamber where a client was running FTPs using a 4G capable USB dongle as a modem. This paper describe the tests that have been performed and focus on how changes in propagation conditions affected the performances perceived by the user.
{"title":"Over-the-air performance testing of a real 4G LTE base station in a reverberation chamber","authors":"M. Barazzetta, D. Micheli, F. Moglie, V. M. Primiani","doi":"10.1109/ISEMC.2014.6899096","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899096","url":null,"abstract":"Fourth generation (4G) cellular systems have been nowadays rolled out already in several countries in the world. With networks open to commercial use, one of the key issues is how the quality perceived by the user is influenced by multipath propagation, like it may happen in indoor locations or in any kind of places where electromagnetic waves are partially reflected by walls and other objects. In order to verify this, the signal of a real 4G base station connected to the real radio access network of Telecom Italia has been transmitted into a reverberation chamber where a client was running FTPs using a 4G capable USB dongle as a modem. This paper describe the tests that have been performed and focus on how changes in propagation conditions affected the performances perceived by the user.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115436320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6899048
Xinjun Zhang, C. Ye, M. Wei, Weifeng Shu, X. Ye
Differential impedance optimization is critical for high-speed IO design and has attracted lot of interests for decades. This paper focuses on impedance optimization on a general purpose server design for 10Gbps and above and use SAS3 (Serial Attached SCSI Gen3) as example under HVM (high volume manufacturing) condition. The study starts with theoretical analysis on a two-port network of three cascaded transmission lines to prove that there is an optimal characteristic impedance value of the middle section which can bring the lowest reflection and best transmission to the entire two-port network. In the SAS3 impedance optimization study, statistical distribution for each design variable is considered to address the HVM consideration. The result clearly shows that lower the impedance of baseboard and backplane yields better eye opening at the receiver for the given impedance design range from 85Ω to 100Ω. In other words, 85Ω design on baseboard and backplane is better in performance than 100Ω even if cables, connectors and SAS3 hard disk drives (HDDs) are designed at 100Ω per SAS3 specification.
{"title":"Interconnect impedance optimization for high speed IO up to 12Gbps under HVM condition","authors":"Xinjun Zhang, C. Ye, M. Wei, Weifeng Shu, X. Ye","doi":"10.1109/ISEMC.2014.6899048","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899048","url":null,"abstract":"Differential impedance optimization is critical for high-speed IO design and has attracted lot of interests for decades. This paper focuses on impedance optimization on a general purpose server design for 10Gbps and above and use SAS3 (Serial Attached SCSI Gen3) as example under HVM (high volume manufacturing) condition. The study starts with theoretical analysis on a two-port network of three cascaded transmission lines to prove that there is an optimal characteristic impedance value of the middle section which can bring the lowest reflection and best transmission to the entire two-port network. In the SAS3 impedance optimization study, statistical distribution for each design variable is considered to address the HVM consideration. The result clearly shows that lower the impedance of baseboard and backplane yields better eye opening at the receiver for the given impedance design range from 85Ω to 100Ω. In other words, 85Ω design on baseboard and backplane is better in performance than 100Ω even if cables, connectors and SAS3 hard disk drives (HDDs) are designed at 100Ω per SAS3 specification.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129898237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6899041
Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Y. Qi, J. Fan
In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.
{"title":"De-embedding method to accurately measure high-frequency impedance of an O-shape spring contact","authors":"Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Y. Qi, J. Fan","doi":"10.1109/ISEMC.2014.6899041","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899041","url":null,"abstract":"In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130186788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6899051
C. Yoon, M. Tsiklauri, M. Zvonkin, J. Fan, J. Drewniak, A. Razmadze, Aman Aflaki, Jingook Kim, Q. Chen
Automatic fixture removal (AFR) for asymmetric fixture de-embedding is introduced. Two design criteria for fixture design in AFR, passivity and discontinuity, are proposed. Three different 2x-fixtures are investigated for the verification of proposed two design criteria.
{"title":"Design criteria of automatic fixture removal (AFR) for asymmetric fixture de-embedding","authors":"C. Yoon, M. Tsiklauri, M. Zvonkin, J. Fan, J. Drewniak, A. Razmadze, Aman Aflaki, Jingook Kim, Q. Chen","doi":"10.1109/ISEMC.2014.6899051","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899051","url":null,"abstract":"Automatic fixture removal (AFR) for asymmetric fixture de-embedding is introduced. Two design criteria for fixture design in AFR, passivity and discontinuity, are proposed. Three different 2x-fixtures are investigated for the verification of proposed two design criteria.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121792125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6898974
Yaojiang Zhang, Xinxin Tian, Liehui Ren, Dazhao Liu, J. Fan
A domain decomposition approach, namely hybrid boundary-integral and finite-element method, is proposed for signal integrity analysis of an infinitely-large plate pair with multi-vias in a shared anti-pad. Each via structure is modeled as a multi-mode network containing top/bottom transverse electromagnetic (TEM) ports associated with vias and parallel-plate ports a little far away from the anti-pad. Coupling among parallel-plate ports of all via structures is considered by a plate-pair impedance matrix. The connection of the multi-mode networks of via structures and the impedance matrix constructs a complete noise coupling path from one via structure to another one, and the S-parameter of the entire plate pair can be steadily obtained by simply manipulating S-parameter matrices. Numerical examples are used to verify the accuracy of the approach by comparing with a full-wave solver.
{"title":"An efficient hybrid boundary-integral and finite-element method for signal integrity analysis of multiple vias sharing an anti-pad in an infinitely-large plate pair","authors":"Yaojiang Zhang, Xinxin Tian, Liehui Ren, Dazhao Liu, J. Fan","doi":"10.1109/ISEMC.2014.6898974","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898974","url":null,"abstract":"A domain decomposition approach, namely hybrid boundary-integral and finite-element method, is proposed for signal integrity analysis of an infinitely-large plate pair with multi-vias in a shared anti-pad. Each via structure is modeled as a multi-mode network containing top/bottom transverse electromagnetic (TEM) ports associated with vias and parallel-plate ports a little far away from the anti-pad. Coupling among parallel-plate ports of all via structures is considered by a plate-pair impedance matrix. The connection of the multi-mode networks of via structures and the impedance matrix constructs a complete noise coupling path from one via structure to another one, and the S-parameter of the entire plate pair can be steadily obtained by simply manipulating S-parameter matrices. Numerical examples are used to verify the accuracy of the approach by comparing with a full-wave solver.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126363466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6898936
B. Cordill, S. A. Seguin
The effects of spectral crowding are becoming acutely problematic as new wireless systems are being deployed in adjacent bands to legacy systems. Current spectrum management practices seek to control and limit persistent out-of-band emissions, but fall short on addressing intermittent emissions. Such intermittent interference can be caused by the occasional saturation of a transmitting power amplifier, resulting in unintended emissions into adjacent bands. Such transmitter saturations are common for the high peak-to-average power waveforms commonly found in OFDM systems. This work seeks to quantify the performance degradation of a notional radar system in the face of intermittent interference falling in the radar's operating bandwidth. The results show a rise in the false alarm rate of the radar system in proportion to the saturation rate of the adjacent band system.
{"title":"On intermittent OFDM transmitter saturation and radar system performance","authors":"B. Cordill, S. A. Seguin","doi":"10.1109/ISEMC.2014.6898936","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898936","url":null,"abstract":"The effects of spectral crowding are becoming acutely problematic as new wireless systems are being deployed in adjacent bands to legacy systems. Current spectrum management practices seek to control and limit persistent out-of-band emissions, but fall short on addressing intermittent emissions. Such intermittent interference can be caused by the occasional saturation of a transmitting power amplifier, resulting in unintended emissions into adjacent bands. Such transmitter saturations are common for the high peak-to-average power waveforms commonly found in OFDM systems. This work seeks to quantify the performance degradation of a notional radar system in the face of intermittent interference falling in the radar's operating bandwidth. The results show a rise in the false alarm rate of the radar system in proportion to the saturation rate of the adjacent band system.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125960861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6898965
Dawson Kesling, H. Skinner
Spread spectrum clocking is an established technique for reducing electromagnetic interference arising from clocking signals. Though effective for reducing interference with other devices, SSC can increase the interference with radio receivers inside the device itself. New SSC techniques have been developed to reduce this internal interference while retaining the external interference benefits. Laboratory measurements and test chip results show significant reduction in radio interference. The techniques are applicable to switching voltage regulators and high-speed digital computing and communications systems.
{"title":"New spread spectrum clocking techniques: For improved compatibility with cellular and wireless subsystems","authors":"Dawson Kesling, H. Skinner","doi":"10.1109/ISEMC.2014.6898965","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898965","url":null,"abstract":"Spread spectrum clocking is an established technique for reducing electromagnetic interference arising from clocking signals. Though effective for reducing interference with other devices, SSC can increase the interference with radio receivers inside the device itself. New SSC techniques have been developed to reduce this internal interference while retaining the external interference benefits. Laboratory measurements and test chip results show significant reduction in radio interference. The techniques are applicable to switching voltage regulators and high-speed digital computing and communications systems.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128602276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-20DOI: 10.1109/ISEMC.2014.6898991
M. Azpúrua, E. Paez, X. Parra, Ferran Silva, R. Jaúregui
This paper presents a performance comparison between two validation methods developed specifically for the Computational Electromagnetics purposes: the Feature Selective Validation (FSV) and the Feature Selective Normalized Mutual Information (FSNMI) index. To achieve this goal, a statistical analysis of 40 different cases of study (pairs of data sets) is carried out covering a wide range of real-life applications, such as, frequency domain, noisy and transient data, among others. The results provided an insight of the relationships between each method, showing that more effort is required to achieve generally coherent validation results between the FSV and the FSNMI.
{"title":"Statistical performance comparison between the FSV and the FS-NMI index","authors":"M. Azpúrua, E. Paez, X. Parra, Ferran Silva, R. Jaúregui","doi":"10.1109/ISEMC.2014.6898991","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898991","url":null,"abstract":"This paper presents a performance comparison between two validation methods developed specifically for the Computational Electromagnetics purposes: the Feature Selective Validation (FSV) and the Feature Selective Normalized Mutual Information (FSNMI) index. To achieve this goal, a statistical analysis of 40 different cases of study (pairs of data sets) is carried out covering a wide range of real-life applications, such as, frequency domain, noisy and transient data, among others. The results provided an insight of the relationships between each method, showing that more effort is required to achieve generally coherent validation results between the FSV and the FSNMI.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"227 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132191931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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