With the advancement of electronic devices towards greater intelligence, portability, and flexibility, it brings some self-contradictory performance requirements for electromagnetic shielding materials, which need to combine high electromagnetic interference shielding efficiency (EMI SE), high thermal conductivity, and electric insulation within all-in-one material. To address this critical challenge, herein we designed a Janus composite film featuring a dual-layer architecture: one side consists of a fused silver nanowire (AgNW) layer, while the other comprises a thermoplastic polyurethane (TPU)-hexagonal boron nitride (hBN) layer. The as-prepared Janus TPU-hBN/AgNWs (hBN content: 80 wt% for TPU-hBN layer; AgNWs areal density of AgNWs layer: 2.6 mg/cm2) composite film (∼84.6 μm) exhibits exceptional multifunctional properties, including an impressive EMI SE of 93.37 dB at 10 GHz, an in-plane thermal conductivity of 27.23 W m−1K−1 and single-sided electrical insulation. Notably, these properties remain stable even under harsh conditions such as prolonged exposure to acidic/alkaline environments, extreme temperatures, and repeated bending-releasing cycles, underscoring the film's remarkable durability and reliability. Additionally, the composite film demonstrates outstanding Joule heating performance, reaching approximately 88 °C within just 5 s at an input voltage of 0.9 V. These results highlight the Janus TPU-hBN/AgNWs composite film as a promising candidate for next-generation electromagnetic shielding materials, offering a unique combination of high shielding efficiency, thermal management capabilities, and electrical insulation in a robust and adaptable design.
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