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Proceedings of 1994 IEEE GaAs IC Symposium最新文献

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A 0.1 /spl mu/m W-band HEMT production process for high yield and high performance low noise and power MMICs 用于高产、高性能、低噪声、低功耗mmic的0.1 /spl μ m w波段HEMT生产工艺
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636994
M. Biedenbender, R. Lai, J. Lee, S. Chen, K. Tan, P. Liu, A. Freudenthal, D. Streit, B. Allen, H. Wang
We have developed a W-band HEMT MMIC process which has demonstrated reproducible high performance for both low noise and power amplifier designs. This paper presents the details of the fabrication process as well as device and circuit results from 69 wafers. Three-stage LNAs have demonstrated noise figure as low as 4.4 dB with gains as high as 27 dB from 92 to 96 GHz. The LNA RF lot yield was as high as 78%. The same process has demonstrated power amplifiers with output power of 19 dBm at 94 GHz, with RF yield of 37%.
我们开发了一种w波段HEMT MMIC工艺,该工艺在低噪声和功率放大器设计中都表现出可重复的高性能。本文详细介绍了69片晶圆的制作过程以及器件和电路结果。在92至96 GHz范围内,三级lna的噪声系数低至4.4 dB,增益高达27 dB。LNA RF批次收率高达78%。同样的工艺已经证明了94ghz时输出功率为19dbm的功率放大器,RF产率为37%。
{"title":"A 0.1 /spl mu/m W-band HEMT production process for high yield and high performance low noise and power MMICs","authors":"M. Biedenbender, R. Lai, J. Lee, S. Chen, K. Tan, P. Liu, A. Freudenthal, D. Streit, B. Allen, H. Wang","doi":"10.1109/GAAS.1994.636994","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636994","url":null,"abstract":"We have developed a W-band HEMT MMIC process which has demonstrated reproducible high performance for both low noise and power amplifier designs. This paper presents the details of the fabrication process as well as device and circuit results from 69 wafers. Three-stage LNAs have demonstrated noise figure as low as 4.4 dB with gains as high as 27 dB from 92 to 96 GHz. The LNA RF lot yield was as high as 78%. The same process has demonstrated power amplifiers with output power of 19 dBm at 94 GHz, with RF yield of 37%.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133682165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
A 60 GHz HEMT-MMIC analog frequency divider by two 一个由两个60 GHz HEMT-MMIC模拟分频器组成
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636939
J. Sarkissian, M. Camiade, P. Savary, A. Suárez, R. Quéré, J. Obregon
Monolithic technologies on GaAs allow us to build complex non-linear circuits at very high frequencies. However accurate predictions of circuit performances can be obtained only if non-linear CAD tools are available. A new method has been proposed allowing to overcome the difficulties encountered with commercial CAD software packages when we want to simulate synchronized circuits. For the first time a 60/30 GHz MMIC analog frequency divider has been designed and processed with a 0.25/spl mu/m HEMT process at the THOMSON-CSF foundry. The results obtained are very close to the predicted performances and allow us to think that broadband analog frequency dividers may now be designed at higher frequencies.
GaAs上的单片技术允许我们在非常高的频率下构建复杂的非线性电路。然而,只有当非线性CAD工具可用时,才能获得电路性能的准确预测。提出了一种新的方法,可以克服商业CAD软件包在模拟同步电路时遇到的困难。在THOMSON-CSF代工厂,首次设计了60/30 GHz MMIC模拟分频器,并采用0.25/spl mu/m HEMT工艺进行处理。得到的结果与预测的性能非常接近,使我们认为现在可以在更高的频率上设计宽带模拟分频器。
{"title":"A 60 GHz HEMT-MMIC analog frequency divider by two","authors":"J. Sarkissian, M. Camiade, P. Savary, A. Suárez, R. Quéré, J. Obregon","doi":"10.1109/GAAS.1994.636939","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636939","url":null,"abstract":"Monolithic technologies on GaAs allow us to build complex non-linear circuits at very high frequencies. However accurate predictions of circuit performances can be obtained only if non-linear CAD tools are available. A new method has been proposed allowing to overcome the difficulties encountered with commercial CAD software packages when we want to simulate synchronized circuits. For the first time a 60/30 GHz MMIC analog frequency divider has been designed and processed with a 0.25/spl mu/m HEMT process at the THOMSON-CSF foundry. The results obtained are very close to the predicted performances and allow us to think that broadband analog frequency dividers may now be designed at higher frequencies.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127944113","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 37
GaAs for ADCs: system needs and device requirements 用于adc的GaAs:系统需求和设备要求
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636971
J. Sauerer, F. Oehler, G. Rohmer, U. Schlag
Analog to Digital Converters (ADCs) are the key components at the border between the analog and digital world. They put the most stringent requirements on technology in terms of speed, integration density and matching. The impact of different types of system applications on the ADCs' key performance data will be described. Different ADC architectures for a wide range of resolution and sampling rates will be presented as well as their performance limiting constraints. A few examples of implementation in GaAs technologies are shown to derive the technological requirements necessary for being a good candidate for ADCs.
模数转换器(adc)是介于模拟和数字世界之间的关键部件。他们在速度、集成密度和匹配方面对技术提出了最严格的要求。本文将描述不同类型的系统应用对adc关键性能数据的影响。本文将介绍不同的ADC架构,用于广泛的分辨率和采样率,以及它们的性能限制。在GaAs技术中实现的几个例子显示了作为adc的良好候选所必需的技术要求。
{"title":"GaAs for ADCs: system needs and device requirements","authors":"J. Sauerer, F. Oehler, G. Rohmer, U. Schlag","doi":"10.1109/GAAS.1994.636971","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636971","url":null,"abstract":"Analog to Digital Converters (ADCs) are the key components at the border between the analog and digital world. They put the most stringent requirements on technology in terms of speed, integration density and matching. The impact of different types of system applications on the ADCs' key performance data will be described. Different ADC architectures for a wide range of resolution and sampling rates will be presented as well as their performance limiting constraints. A few examples of implementation in GaAs technologies are shown to derive the technological requirements necessary for being a good candidate for ADCs.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"197 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124415043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Applications for GaAs and silicon ICs in next generation wireless communication systems GaAs和硅集成电路在下一代无线通信系统中的应用
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636956
L. M. Burns
Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon and other technologies. This paper will present several system level architectures for present and proposed radio-based communication systems. The paper will address requirements driving the technologies and appropriate applications of GaAs and silicon integrated circuit technologies.
便携式无线语音和数据通信系统的新兴应用要求提高数据速率和功能。满足成本和性能目标需要仔细注意系统级别的设计和划分,以便在经济有效的解决方案中采用适当的技术。新的电路设计和技术需要满足尺寸,功率和监管限制。这为砷化镓、硅和其他技术提供了一个令人兴奋的机会。本文将介绍当前和拟议的基于无线电的通信系统的几个系统级架构。本文将讨论驱动GaAs和硅集成电路技术的技术和适当应用的需求。
{"title":"Applications for GaAs and silicon ICs in next generation wireless communication systems","authors":"L. M. Burns","doi":"10.1109/GAAS.1994.636956","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636956","url":null,"abstract":"Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon and other technologies. This paper will present several system level architectures for present and proposed radio-based communication systems. The paper will address requirements driving the technologies and appropriate applications of GaAs and silicon integrated circuit technologies.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126464226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Hot-electron-induced degradation of metal-semiconductor field-effect transistors 金属半导体场效应晶体管的热电子诱导退化
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636980
Y. Tkachenko, Y. Lan, D. Whitefield, C. Wei, J.C.M. Hwang, T. Harris, R. Grober, D. Hwang, L. Aucoin, S. Shanfield
Hot-electron trapping in the SiN passivation was found to be a cause for gradual degradation during RF operation of metal-semiconductor field-effect transistors. The time dependence and threshold energy for trap formation was determined by dc and electroluminescence tests. The spatial distribution of trapped electrons was directly observed by a novel high-voltage electron-beam-induced-current imaging technique. Argument was also made for trapping in the SiN instead of at the GaAs/SiN interface.
研究发现,在金属半导体场效应晶体管的射频工作过程中,SiN钝化过程中的热电子捕获是导致其逐渐退化的原因之一。通过直流和电致发光测试确定了形成陷阱的时间依赖性和阈值能量。利用一种新型的高压电子束感应电流成像技术,直接观察了被困电子的空间分布。还提出了在SiN中而不是在GaAs/SiN接口中捕获的论点。
{"title":"Hot-electron-induced degradation of metal-semiconductor field-effect transistors","authors":"Y. Tkachenko, Y. Lan, D. Whitefield, C. Wei, J.C.M. Hwang, T. Harris, R. Grober, D. Hwang, L. Aucoin, S. Shanfield","doi":"10.1109/GAAS.1994.636980","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636980","url":null,"abstract":"Hot-electron trapping in the SiN passivation was found to be a cause for gradual degradation during RF operation of metal-semiconductor field-effect transistors. The time dependence and threshold energy for trap formation was determined by dc and electroluminescence tests. The spatial distribution of trapped electrons was directly observed by a novel high-voltage electron-beam-induced-current imaging technique. Argument was also made for trapping in the SiN instead of at the GaAs/SiN interface.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126548707","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Reliability of GaAs PHEMT under hydrogen containing atmosphere 含氢气氛下GaAs PHEMT的可靠性
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636977
W. Hu, E.P. Parks, T. Yu, P. Chao, A. Swanson
Degradation of PHEMTs by hydrogen was verified by DC life tests in the hermetic packages and in the forming gases containing different hydrogen concentrations. We have found that a hydrogen partial pressure in the order of 2 torr will cause Ids change by 20% in about 800 hours at 125/spl deg/C and about 300 hours at 150/spl deg/C. The signature of hydrogen degradation is a sudden and significant drain current degradation followed by some recovery. It appeared that the degradation is both temperature and H/sub 2/ partial pressure dependent. Failure analysis indicates that the degradation is localized under the gate and that the major failure mechanism is due to the effective gate voltage being modified negatively by the atomic hydrogen.
在密封封装和不同氢浓度的成型气体中进行了直流寿命试验,验证了氢对phemt的降解作用。我们发现,2 torr数量级的氢气分压会使Ids在125/spl℃下约800小时变化20%,在150/spl℃下约300小时变化20%。氢降解的特征是突然和显著的漏极电流降解,然后是一些恢复。结果表明,降解与温度和H/sub /分压有关。失效分析表明,失效发生在栅极下,主要是由于有效栅极电压被原子氢负修正所致。
{"title":"Reliability of GaAs PHEMT under hydrogen containing atmosphere","authors":"W. Hu, E.P. Parks, T. Yu, P. Chao, A. Swanson","doi":"10.1109/GAAS.1994.636977","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636977","url":null,"abstract":"Degradation of PHEMTs by hydrogen was verified by DC life tests in the hermetic packages and in the forming gases containing different hydrogen concentrations. We have found that a hydrogen partial pressure in the order of 2 torr will cause Ids change by 20% in about 800 hours at 125/spl deg/C and about 300 hours at 150/spl deg/C. The signature of hydrogen degradation is a sudden and significant drain current degradation followed by some recovery. It appeared that the degradation is both temperature and H/sub 2/ partial pressure dependent. Failure analysis indicates that the degradation is localized under the gate and that the major failure mechanism is due to the effective gate voltage being modified negatively by the atomic hydrogen.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126678597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Technologies for highly parallel optoelectronic integrated circuits 高度并行光电集成电路技术
Pub Date : 1994-10-01 DOI: 10.1109/GAAS.1994.636967
K. Lear
Market consideration motivate optoelectronic integrated circuits for highly parallel intrasystem optical buses. Surface normal device technology is well suited for these applications. System examples highlight device technology issues.
市场的考虑激发了高度并行系统内光总线的光电集成电路。表面法向器件技术非常适合这些应用。系统示例突出了设备技术问题。
{"title":"Technologies for highly parallel optoelectronic integrated circuits","authors":"K. Lear","doi":"10.1109/GAAS.1994.636967","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636967","url":null,"abstract":"Market consideration motivate optoelectronic integrated circuits for highly parallel intrasystem optical buses. Surface normal device technology is well suited for these applications. System examples highlight device technology issues.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133538875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Complementary GaAs junction-gated heterostructure field effect transistor technology 互补砷化镓结门控异质结构场效应晶体管技术
Pub Date : 1994-09-01 DOI: 10.1109/GAAS.1994.636920
A. Baca, J. Zolper, M. Sherwin, P. Robertson, R. Shul, A. J. Howard, D. Rieger, J. Klem
The first circuit results for a new GaAs complementary logic technology are presented. The technology allows for independently optimizable p- and nchannel transistors with junction gates. Excellent loaded gate delays of 179 ps at 1.2 V and 319 ps at 0.8 V have been demonstrated at low power supply voltages. A power-delay product of 8.9 fJ was obtained at 0.8 V.
介绍了一种新型砷化镓互补逻辑技术的初步电路结果。该技术允许带结门的p沟道和n沟道晶体管独立优化。在低电源电压下,1.2 V和0.8 V的负载门延迟分别为179ps和319ps。在0.8 V电压下获得8.9 fJ的功率延迟积。
{"title":"Complementary GaAs junction-gated heterostructure field effect transistor technology","authors":"A. Baca, J. Zolper, M. Sherwin, P. Robertson, R. Shul, A. J. Howard, D. Rieger, J. Klem","doi":"10.1109/GAAS.1994.636920","DOIUrl":"https://doi.org/10.1109/GAAS.1994.636920","url":null,"abstract":"The first circuit results for a new GaAs complementary logic technology are presented. The technology allows for independently optimizable p- and nchannel transistors with junction gates. Excellent loaded gate delays of 179 ps at 1.2 V and 319 ps at 0.8 V have been demonstrated at low power supply voltages. A power-delay product of 8.9 fJ was obtained at 0.8 V.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131563723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
期刊
Proceedings of 1994 IEEE GaAs IC Symposium
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