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Proceedings of 1994 IEEE GaAs IC Symposium最新文献

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A 1.2 W, 60% efficient power amplifier IC for commercial applications 用于商业应用的1.2 W, 60%效率的功率放大器IC
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636961
J. Naber, J. Griffiths, J. Salvey
A 1.2 Watt, 6 V, 60% efficient, dual bias power amplifier GaAs IC operating in the AMPS (Advanced Mobile Phone service) band of 824 MHz to 849 MHz has been demonstrated. The IC is a two stage, class AB biased amplifier that has 24 dB of power gain. The input return loss is 12 dB over the band. The IC is packaged in a SOIC 16-pin plastic package that measures 30 mm/sup 2/.
一个1.2瓦,6 V, 60%效率,双偏置功率放大器GaAs IC工作在AMPS(高级移动电话服务)频段824 MHz至849 MHz已经证明。该集成电路为两级AB类偏置放大器,功率增益为24db。整个频带的输入回波损耗为12db。该IC封装在SOIC 16针塑料封装中,尺寸为30mm /sup /。
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引用次数: 2
A V-band AlGaAs/InGaAs heterojunction FET MMIC dielectric resonator oscillator 一种v波段AlGaAs/InGaAs异质结FET MMIC介电谐振振荡器
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636912
M. Funabashi, K. Ohata, K. Onda, K. Hosoya, T. Inoue, M. Kuzuhara, K. Kanckawa, Y. Kobayashi
This paper reports a high performance V-band MMIC dielectric resonator oscillator (DRO). The DRO utilizing a 0.15 /spl mu/m gate AlGaAs/InGaAs heterojunction FET has exhibited stabilized oscillation with low phase noise of -88 dBc/Hz at 100 kHz off-carrier and the output power of 3.7 dBm at 55.135 GHz. The oscillation frequency stability of -1.9 ppm//spl deg/C was obtained with a dielectric resonator of +3.3 ppm//spl deg/C temperature coefficient.
本文报道了一种高性能v波段MMIC介质谐振振荡器。采用0.15 /spl mu/m栅极AlGaAs/InGaAs异质结FET的DRO在100 kHz离载波时表现出稳定的振荡,相位噪声为-88 dBc/Hz,在55.135 GHz时输出功率为3.7 dBm。在温度系数为+3.3 ppm//spl℃的介质谐振腔中,振荡频率稳定度为-1.9 ppm//spl℃。
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引用次数: 30
Active, self-adjusting L-S band MMIC filters 有源,自调节L-S波段MMIC滤波器
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636915
P. Katzin, V. Aparin
We describe the design and measured performance of active, tunable GaAs MMIC band-pass filters and matched closed-loop MMIC control circuits, both fabricated using a standard 1 /spl mu/m foundry process. Separate, 3-section filter circuits covered the 1.34-2.2 GHz and 1.84-2.7 GHz bands, with -3 dB bandwidths of 91/spl plusmn/7 MHz and 123/spl plusmn/12 MHz, respectively, and mean pass-band insertion losses of 0 dB at each tuning frequency. The control circuits generate filter tuning and Q-control bias voltages by tracking a sub-harmonic reference signal. This circuit automatically maintains the filter insertion loss to within /spl plusmn/0.5 dB over more than a 1.3:1 frequency-tuning range, and regulates the center-frequency and insertion loss to within better than /spl plusmn/1.2 MHz and /spl plusmn/0.3 dB over a temperature range of -50/spl deg/C to +75/spl deg/C.
我们描述了有源、可调谐GaAs MMIC带通滤波器和匹配的闭环MMIC控制电路的设计和测量性能,两者都采用标准的1 /spl mu/m铸造工艺制造。独立的3段滤波电路覆盖1.34-2.2 GHz和1.84-2.7 GHz频段,-3 dB带宽分别为91/spl plusmn/7 MHz和123/spl plusmn/12 MHz,每个调谐频率下的平均通带插入损耗为0 dB。控制电路通过跟踪次谐波参考信号产生滤波器调谐和q控制偏置电压。该电路在超过1.3:1的频率调谐范围内自动保持滤波器插入损耗在/spl plusmn/0.5 dB以内,并在-50/spl°C至+75/spl°C的温度范围内,将中心频率和插入损耗调节到/spl plusmn/1.2 MHz和/spl plusmn/0.3 dB以内。
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引用次数: 7
Implementation of GaAs E/D HEMT analog components for oversampling analog/digital conversion 实现GaAs E/D HEMT模拟元件的过采样模拟/数字转换
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636973
S. Feng, J. Sauerer, D. Seitzer
The paper presents design considerations and implementation of analog components, including an operational amplifier, latched comparator, 1 bit D/A converter and second-order modulator, for a fully differential delta-sigma modulation oversampling A/D converter in a 0.5 /spl mu/m GaAs E/D HEMT technology. On-wafer measurements demonstrate that the second-order modulator achieves a 60 dB dynamic range at a Nyquist conversion rate of 5.0 MHz with a sampling frequency of 500 MHz.
本文介绍了模拟元件的设计考虑和实现,包括运算放大器,锁存比较器,1位D/A转换器和二阶调制器,用于0.5 /spl mu/m GaAs E/D HEMT技术的全差分δ - σ调制过采样A/D转换器。晶片上测量表明,二阶调制器在奈奎斯特转换速率为5.0 MHz、采样频率为500 MHz的情况下实现了60 dB的动态范围。
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引用次数: 6
Manufacturability of dummy-gate self-aligned LDD GaAs MESFETs for high volume production 用于大批量生产的假栅自对准LDD GaAs mesfet的可制造性
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636944
S. Nakajima, G. Ishii, Y. Saito, N. Kuwata, T. Fukuzawa, K. Koike, H. Nishizawa
A manufacturable self-aligned LDD GaAs MESFET process called SRD has been developed. In this process, we controlled the fabrication conditions from lot to lot. Excellent control of the device characteristics not only across the wafer but also from wafer to wafer is obtained. The controllability of Vth is within /spl plusmn/50 mV. The standard deviation of Vth across the 3-in wafer is less than 30 mV for 0.5 /spl mu/m devices. In addition, other parameters such as g/sub m/, g/sub d/ are also well controlled within /spl plusmn/7% (Max-Min).
一种可制造的自对准LDD GaAs MESFET工艺被称为SRD。在这个过程中,我们对每个批次的制造条件进行了控制。不仅在晶圆上,而且在晶圆与晶圆之间都获得了优异的器件特性控制。Vth的可控性在/spl plusmn/ 50mv以内。对于0.5 /spl mu/m器件,Vth在3-in晶圆上的标准差小于30 mV。此外,g/sub m/、g/sub d/等参数也控制在/spl + usmn/7%以内(Max-Min)。
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引用次数: 6
2.3 V operation GaAs power MESFET with 68% power-added efficiency 2.3 V工作GaAs功率MESFET,功率增加效率68%
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636948
Jong-Lam Lee, J. Mun, Hae-cheon Kim, Jae Jin Lee, Hyung‐Moo Park, S. Park
A state-of-the-art GaAs power MESFET operating at a drain bias of 2.3 V has been developed using the low-high doped channel structure. The device has 0.8-/spl mu/m gate length and 21-mm gate width. The power performance tested at a 2.3 V drain bias under 900 MHz operation frequency was output power of 31.3-dBm with 11.3-dB gain and 69-percent power-added efficiency. A third-order intercept point was evaluated to be 50.7-dBm. A Linearity Figure-of-Merit of 55.6 was recorded for 21-mm-wide FET.
采用低-高掺杂沟道结构,开发了工作在2.3 V漏极偏压下的最先进的GaAs功率MESFET。该器件栅极长度为0.8-/spl μ m,栅极宽度为21mm。在900mhz工作频率下,在2.3 V漏极偏置下测试的功率性能为输出功率为31.3 dbm,增益为11.3 db,功率附加效率为69%。三阶截距点估计为50.7 dbm。21 mm宽场效应管的线性性能指数为55.6。
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引用次数: 6
Modeling and suppression of the surface trap effect on drain current frequency dispersions in GaAs MESFETs 表面陷阱对GaAs mesfet漏极电流频散影响的建模与抑制
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636981
Y. Kohno, H. Matsubayashi, M. Komaru, H. Takano, O. Ishihara, S. Mitsui
Drain current frequency dispersions (gate-lag) in GaAs MESFETs have been investigated and a novel surface trap model is proposed which reveals the mechanism of gate-lag. Assuming two kinds of surface traps with a delay time of 28 msec and 5 msec, the fitting curve agrees with the measured drain current transients. The dependence of gate-lag on various operating bias conditions such as pulse period, applied pulse voltage, and drain bias has been also observed. Furthermore, it is confirmed that the double recessed structure with the inner recess depth of 500 /spl Aring/ is available for the reduction of gate-lag.
研究了GaAs mesfet中的漏极电流频散(门滞后),提出了一种新的表面陷阱模型,揭示了门滞后的机理。假设两种表面陷阱的延迟时间分别为28 msec和5 msec,拟合曲线与测量的漏极电流瞬态吻合。还观察到门滞后与各种工作偏置条件(如脉冲周期、外加脉冲电压和漏极偏置)的关系。此外,还证实了内凹槽深度为500 /spl / Aring/的双凹槽结构可用于减小门滞后。
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引用次数: 27
GaAs MMIC thermal analysis for epoxy-mount compared with AuSn-mount 环氧树脂贴片与ausn贴片的GaAs MMIC热分析
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636984
K. Nishihori, K. Ishida, Y. Kitaura, N. Uchitomi
The effect of attachment for chip-mounting upon the thermal resistance of GaAs power FET modules has been experimentally investigated. The thermal resistance was evaluated by electrical method, which is related to the temperature dependence of Schottky-barrier in the GaAs MESFETs. The thermal resistance of low-cost epoxy-mounted modules was found to be almost the same as that of AuSn-mounted ones for a chip-thickness of 250 /spl mu/m. Applicable expression has also been presented for optimizing thermal design of power MMICs, suggesting that the optimum chip thickness depends on the thermal conductivity of attachment material.
实验研究了贴片对GaAs功率场效应管模块热阻的影响。用电学方法对热阻进行了评价,认为热阻与GaAs mesfet中肖特基势垒的温度依赖性有关。当芯片厚度为250 /spl mu/m时,低成本环氧树脂封装模块的热阻与ausn封装模块的热阻基本相同。给出了优化功率mmic热设计的适用表达式,表明最佳芯片厚度取决于附着材料的热导率。
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引用次数: 1
An 800 MHz monolithic GaAs HBT serrodyne modulator 800mhz单片GaAs HBT伺服调制器
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636913
L. Kushner, G. V. Andrews, W. White, J. Delaney, M. Vernon, M. Harris, David A. Whitmire
An 800 MHz monolithic mixed-signal serrodyne modulator IC has been developed in GaAs/AlGaAs HBT HI/sup 2/L process optimized for digital applications. This 3/spl times/2.8 mm, 2000+ transistor chip consists of a 7-bit phase accumulator driving a vector modulator, implemented as of a pair of balanced mixers, 5-bit switched-attenuators, buffer amplifiers, and control circuits. The balanced mixer's LO leakage and 3-1 products are typically 25 dB below the carrier at the nominal operating point, with all other spurs better than -50 dBc. Over a 32 dB control range, the 5-bit switched attenuator typically achieves worst-case amplitude and phase errors of 1.5 dB and 1.5/spl deg/, respectively, from 50 to 250 MHz. This first generation chip consumes 2.5 W of dc power and clocks to speeds in excess of 925 MHz.
在针对数字应用优化的GaAs/AlGaAs HBT HI/sup 2/L工艺中,开发了800 MHz单片混合信号伺服调制器IC。这款3/spl倍/2.8 mm, 2000+晶体管芯片由一个7位相位累加器驱动矢量调制器组成,由一对平衡混频器,5位开关衰减器,缓冲放大器和控制电路实现。平衡混合器的LO泄漏和3-1产品在标称工作点通常比载波低25 dB,所有其他杂散都优于-50 dBc。在32 dB控制范围内,5位开关衰减器通常在50至250 MHz范围内分别实现1.5 dB和1.5/spl度/的最坏情况幅度和相位误差。这第一代芯片消耗2.5 W直流功率,时钟速度超过925 MHz。
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引用次数: 4
Gigabit networking technologies and beyond 千兆网络技术及其他技术
Pub Date : 1994-10-16 DOI: 10.1109/GAAS.1994.636905
N. Cheung
Gives a survey of the ongoing gigabit testbeds in the U.S. and other countries. This is followed by a review of the recent progress in SONET- and ATM-based gigabit networking technologies, and a projection of the technology trends in the near future. The author also discusses the potential opportunities and challenges of migrating the ongoing experimental gigabit testbeds to an ubiquitous and highly reliable National Information Infrastructure.
对美国和其他国家正在进行的千兆测试平台进行了调查。随后回顾了基于SONET和atm的千兆网络技术的最新进展,并预测了不久的将来的技术趋势。作者还讨论了将正在进行的实验千兆测试平台迁移到无处不在且高度可靠的国家信息基础设施的潜在机遇和挑战。
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引用次数: 2
期刊
Proceedings of 1994 IEEE GaAs IC Symposium
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