Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718188
M. Shamshirian, B. Nanduri
The proliferation of high speed RISC and CISC microprocessors has resulted in an increased demand for high speed data buffers. Standard First-in-First-Out (FIFO) memories have fulfilled a portion of the system's speed requirements, however new systems require faster and easier to design devices. First-in-First-Out (FIFO) memories were first introduced over five years ago. Since their introduction, FIFOs have evolved from a register based cell array to a dual ported RAM cell array. This evolution resulted in a major performance improvement. In recent years, many new FIFOs have been introduced. Aside from higher density version of the existing parts, manufacturers introduced parallel to serial, serial to parallel and bidirectional FIFOs. But perhaps the most important introduction was the Synchronous (Clocked) FIFO. These devices have been designed to meet current and future high speed data buffering requirements.
{"title":"High Speed Clocked FIFOs Yield Lower System Cost And Higher Performance","authors":"M. Shamshirian, B. Nanduri","doi":"10.1109/ELECTR.1991.718188","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718188","url":null,"abstract":"The proliferation of high speed RISC and CISC microprocessors has resulted in an increased demand for high speed data buffers. Standard First-in-First-Out (FIFO) memories have fulfilled a portion of the system's speed requirements, however new systems require faster and easier to design devices. First-in-First-Out (FIFO) memories were first introduced over five years ago. Since their introduction, FIFOs have evolved from a register based cell array to a dual ported RAM cell array. This evolution resulted in a major performance improvement. In recent years, many new FIFOs have been introduced. Aside from higher density version of the existing parts, manufacturers introduced parallel to serial, serial to parallel and bidirectional FIFOs. But perhaps the most important introduction was the Synchronous (Clocked) FIFO. These devices have been designed to meet current and future high speed data buffering requirements.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123366379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718255
L. Baxter, M. Shariff
Telecommunications (both voice and data) is a critical rcsource for most companies. Over the last few years, building cabling has increasingly been recognized as a vital (and costly) part of a company's telecommunications system. In this context, the Electronic Industries Association (EIA) (Figure 1) has undertaken the task of issuing a series of standards covering customer premise cabling. The purpose of these standards is to insure that a building can be pre-cabled without knowledge of the particular types of telecommunications and computing equipment and/or applications to be installed later. There are a number of other organizations which issue standards that affect building wiring. These include: - Underwriters Laboratories (UL) standards are primarily concerned with safety issues, such as electric shok, fire hazards, etc. - The Insulated Cable Engineers Association (ICEA) issues standards relating to cable manufacturing, color-coding, etc. - The National Electric Code is also primarily concerned with safety issues. - There are a number of international standards bodies (e.g., ISO/IEC JTC1/SC25/WG3) which are starting to address building wiring. The EIA/TIA standards are unique in that they were the first to consider building wiring as a system rather than a collection of individual components. These standards place requirements on the architecture and performance of the entire wiring system to ensure compatibility among different applications and equipment.
{"title":"Bulding Wiring Standards","authors":"L. Baxter, M. Shariff","doi":"10.1109/ELECTR.1991.718255","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718255","url":null,"abstract":"Telecommunications (both voice and data) is a critical rcsource for most companies. Over the last few years, building cabling has increasingly been recognized as a vital (and costly) part of a company's telecommunications system. In this context, the Electronic Industries Association (EIA) (Figure 1) has undertaken the task of issuing a series of standards covering customer premise cabling. The purpose of these standards is to insure that a building can be pre-cabled without knowledge of the particular types of telecommunications and computing equipment and/or applications to be installed later. There are a number of other organizations which issue standards that affect building wiring. These include: - Underwriters Laboratories (UL) standards are primarily concerned with safety issues, such as electric shok, fire hazards, etc. - The Insulated Cable Engineers Association (ICEA) issues standards relating to cable manufacturing, color-coding, etc. - The National Electric Code is also primarily concerned with safety issues. - There are a number of international standards bodies (e.g., ISO/IEC JTC1/SC25/WG3) which are starting to address building wiring. The EIA/TIA standards are unique in that they were the first to consider building wiring as a system rather than a collection of individual components. These standards place requirements on the architecture and performance of the entire wiring system to ensure compatibility among different applications and equipment.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123617293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718241
L.A. Derrick, D. Telfer
In today's manufacturing environment, competition and technological advances affect both products and processes. A major management challenge will be to select the proper technologies to make the most efficient use of resources and gain a competitive advantage. Companies must quickly respond to market changes and customer demands in terms of product features, availability, and price. At the same time, costs must be kept low and quality high in design and production. These will not be achieved by technology alone. In addition to organizational changes and new management approaches, computer integrated manufacturing will play a vital role in the future of production environments. The recognition of information from the activities of many varied areas of an organization is important. These include design and manufacturing engineering, production and process planning, marketing, field service, finance, information systems, materials control, operations and distribution. The volume of data from these areas and the need for information collection, storage, and handling resulted in automation via computer technology. However, a by-product of automation is a large number of stand-alone islands incorporating computer technologies. This creates a severe problem for an enterprise because data is stored in multiple locations and changed by many different people, which results in a loss of data integrity. Transfer from one piece of equipment to another is often manual. This is inefficient and allows for many errors to result.
{"title":"An Overview Of Computer Integrated Manufacturing","authors":"L.A. Derrick, D. Telfer","doi":"10.1109/ELECTR.1991.718241","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718241","url":null,"abstract":"In today's manufacturing environment, competition and technological advances affect both products and processes. A major management challenge will be to select the proper technologies to make the most efficient use of resources and gain a competitive advantage. Companies must quickly respond to market changes and customer demands in terms of product features, availability, and price. At the same time, costs must be kept low and quality high in design and production. These will not be achieved by technology alone. In addition to organizational changes and new management approaches, computer integrated manufacturing will play a vital role in the future of production environments. The recognition of information from the activities of many varied areas of an organization is important. These include design and manufacturing engineering, production and process planning, marketing, field service, finance, information systems, materials control, operations and distribution. The volume of data from these areas and the need for information collection, storage, and handling resulted in automation via computer technology. However, a by-product of automation is a large number of stand-alone islands incorporating computer technologies. This creates a severe problem for an enterprise because data is stored in multiple locations and changed by many different people, which results in a loss of data integrity. Transfer from one piece of equipment to another is often manual. This is inefficient and allows for many errors to result.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123647592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718183
W. Tang
In the past decade, numerous microengineered mechanical devices have been fabricated successfully by exploiting and adapting the well-established integrated-circuit technology. Advancements in this field are motivated by potential applications in batch-fabricated integrated sensors and silicon-based microactuators. These devices promise new capabilities, as well as improved performance-to-cost ratio over conventional hybrid-manufactured devices. Micromachined transducers that can be fabricated compatibly with an integrated circuit process are the building blocks for integrated microsystems with added functionality, such as closed-loop control and signal conditioning. Furthermore, miniaturized transducers are powerful tools for research in the micron-sized domain in the physical, chemical and biomedical fields. This paper reviews the development of microengineered actuators (microactuators) based on crystalline silicon and polycrystalline silicon (polysilicon) as the structural materials. Several microactuator examples are first described. Various actuation methods adapted for micro-sized mechanical devices and fabrication techniques are evaluated. Finally, the direction for future research in light of the present challenges and potential applications of microactuators are considered.
{"title":"Microengineered Actuators: A Review","authors":"W. Tang","doi":"10.1109/ELECTR.1991.718183","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718183","url":null,"abstract":"In the past decade, numerous microengineered mechanical devices have been fabricated successfully by exploiting and adapting the well-established integrated-circuit technology. Advancements in this field are motivated by potential applications in batch-fabricated integrated sensors and silicon-based microactuators. These devices promise new capabilities, as well as improved performance-to-cost ratio over conventional hybrid-manufactured devices. Micromachined transducers that can be fabricated compatibly with an integrated circuit process are the building blocks for integrated microsystems with added functionality, such as closed-loop control and signal conditioning. Furthermore, miniaturized transducers are powerful tools for research in the micron-sized domain in the physical, chemical and biomedical fields. This paper reviews the development of microengineered actuators (microactuators) based on crystalline silicon and polycrystalline silicon (polysilicon) as the structural materials. Several microactuator examples are first described. Various actuation methods adapted for micro-sized mechanical devices and fabrication techniques are evaluated. Finally, the direction for future research in light of the present challenges and potential applications of microactuators are considered.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129010791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718284
L. Johnson
Intercity travel is predominately by commercial air transport. However, airports are becoming increasingly congested at a time when there is often substantial local opposition to the expansion of airport infrastructure because of the environmental impacts. This paper explores the potential for integrating high-speed maglev systeras into the airport infrastructure, but more importantly into airline operations.
{"title":"The Potential Role Of Maglev In Short-Haul Airline Operations","authors":"L. Johnson","doi":"10.1109/ELECTR.1991.718284","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718284","url":null,"abstract":"Intercity travel is predominately by commercial air transport. However, airports are becoming increasingly congested at a time when there is often substantial local opposition to the expansion of airport infrastructure because of the environmental impacts. This paper explores the potential for integrating high-speed maglev systeras into the airport infrastructure, but more importantly into airline operations.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132719847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718281
C.-Y.M. Chen, M. White, M. French
This paper addresses the implementation of a semiconductor device used to siniulate the synaptic interconnection in hardware realization of neural network systems. We have incorporated these modifiable synaptic weights into a solid-state electronic linear adaptive neuron with a Widrow-Hoff's delta learning rule as the updating algorithm to investigate the electrical performance of these programmable synapses. The experimental and simulation results are also presented in the paper.
{"title":"A Solid-State Electronic Linear Adaptive Neuron With Electrically Reprogrammabe Synapses","authors":"C.-Y.M. Chen, M. White, M. French","doi":"10.1109/ELECTR.1991.718281","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718281","url":null,"abstract":"This paper addresses the implementation of a semiconductor device used to siniulate the synaptic interconnection in hardware realization of neural network systems. We have incorporated these modifiable synaptic weights into a solid-state electronic linear adaptive neuron with a Widrow-Hoff's delta learning rule as the updating algorithm to investigate the electrical performance of these programmable synapses. The experimental and simulation results are also presented in the paper.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133659626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718297
S. Narayanan
This paper reviews the development of crystalline silicon solar cells since the fabrication of the first silicon solar cell. The main emphasis is on the evolution of high efficiency silicon solar cells and the terrestrial photovoltaic industry.
{"title":"Fifty Years Of Crystalline Silicon Solar Cells","authors":"S. Narayanan","doi":"10.1109/ELECTR.1991.718297","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718297","url":null,"abstract":"This paper reviews the development of crystalline silicon solar cells since the fabrication of the first silicon solar cell. The main emphasis is on the evolution of high efficiency silicon solar cells and the terrestrial photovoltaic industry.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131708418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718271
J. Marshall
In order for boundary scan to become useful it must be implemented at all levels of electronics manufacturing. Widespread use can only be achieved once component and test technology providers introduce products that manufacturers can obtain at a reasonable cost. This paper speaks to the design of boundary scan environments. It addresses some of the electronic, software and mechanical considerations of using such test environments. An example of such a test environment is given.
{"title":"A PC-Based JTAG Test Environment","authors":"J. Marshall","doi":"10.1109/ELECTR.1991.718271","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718271","url":null,"abstract":"In order for boundary scan to become useful it must be implemented at all levels of electronics manufacturing. Widespread use can only be achieved once component and test technology providers introduce products that manufacturers can obtain at a reasonable cost. This paper speaks to the design of boundary scan environments. It addresses some of the electronic, software and mechanical considerations of using such test environments. An example of such a test environment is given.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131654464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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