Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584965
Zhenlin Lv, Chenfei Zhou, Xiuzhen Lu, Johan Liu
Heat dissipation has become one of the critical challenges of development for microelectronic products because of the increasing of heat accumulation in the devices. A novel laminated composite with high thermal conductivity was fabricated by hot-pressing using graphene films (GFs) and glass fiber reinforced epoxy resin (GFEP). The effect of GFs with different thicknesses and number of layers on the thermal properties of the composites was investigated. An in-plane thermal conductivity of $141mathrm{W}cdot mathrm{m}^{-1},cdot mathrm{K}^{-1}$ for the laminated composites with GFs and GFEP were obtained. The heat dissipation capability of GFs/GFEP composites is evaluated by infrared thermal imaging technology. The maximum temperature difference between the heating elements on GFs/GFEP composites and GFEP increases with the rise of voltage applied to the heating elements. Moreover, the heat dissipation capability of the composite is enhanced with the increased of the number of layers of GFs. The temperature of the heating element assembled on GFs/GFEP composites is $144.3^{circ}mathrm{C}$ lower than that on GFEP at the same voltage. The results indicate that the GFs/GFEP composites is a promising candidate of substrate material with high heat dissipation capability.
{"title":"Highly Thermally Conductive Substrate Based on Graphene Film","authors":"Zhenlin Lv, Chenfei Zhou, Xiuzhen Lu, Johan Liu","doi":"10.23919/empc53418.2021.9584965","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584965","url":null,"abstract":"Heat dissipation has become one of the critical challenges of development for microelectronic products because of the increasing of heat accumulation in the devices. A novel laminated composite with high thermal conductivity was fabricated by hot-pressing using graphene films (GFs) and glass fiber reinforced epoxy resin (GFEP). The effect of GFs with different thicknesses and number of layers on the thermal properties of the composites was investigated. An in-plane thermal conductivity of $141mathrm{W}cdot mathrm{m}^{-1},cdot mathrm{K}^{-1}$ for the laminated composites with GFs and GFEP were obtained. The heat dissipation capability of GFs/GFEP composites is evaluated by infrared thermal imaging technology. The maximum temperature difference between the heating elements on GFs/GFEP composites and GFEP increases with the rise of voltage applied to the heating elements. Moreover, the heat dissipation capability of the composite is enhanced with the increased of the number of layers of GFs. The temperature of the heating element assembled on GFs/GFEP composites is $144.3^{circ}mathrm{C}$ lower than that on GFEP at the same voltage. The results indicate that the GFs/GFEP composites is a promising candidate of substrate material with high heat dissipation capability.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116805130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：