Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584985
J. Kettle, D. Kumar
In this work, biodegradable thin film transistors (TFTs) based on Zinc Oxide (ZnO) active layers are reported. To manufacture high performing devices, a planarization layer was applied onto the biodegradable substrate which led to a substantial decrease in the surface roughness and ensured that the substrate were smooth enough for device fabrication. ZnO TFTs were fabricated onto the planarized surface, tested and data supplied from the transfer curves showed a mobility of 2.9 cm2/s, an on/off ratio of 8 × 106 and a threshold voltage of 2.5 V. Methods to further improve device performance and future applications are discussed.
{"title":"Biodegradable zinc oxide thin film transistors","authors":"J. Kettle, D. Kumar","doi":"10.23919/empc53418.2021.9584985","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584985","url":null,"abstract":"In this work, biodegradable thin film transistors (TFTs) based on Zinc Oxide (ZnO) active layers are reported. To manufacture high performing devices, a planarization layer was applied onto the biodegradable substrate which led to a substantial decrease in the surface roughness and ensured that the substrate were smooth enough for device fabrication. ZnO TFTs were fabricated onto the planarized surface, tested and data supplied from the transfer curves showed a mobility of 2.9 cm2/s, an on/off ratio of 8 × 106 and a threshold voltage of 2.5 V. Methods to further improve device performance and future applications are discussed.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115231042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584964
Benjamin Schellscheidt, Jessica Richter, Oliver Lochthofen, T. Licht
Sintering as a means of die attach in power electronics modules shows advantages over solder connections with regards to reliability and ageing phenomena, especially at higher temperatures. Some wide-bandgap semiconductors such as silicon carbide can be operated at or above the melting point of conventional lead-free solder, making alternative bonding methods mandatory. However, the formation of sintered joints requires more complex machines compared to soldering, as mechanical pressure, in addition to heat, needs to be applied to form a satisfactory connection. As each joint is created individually and joint formation typically takes time in the range of several minutes, this would induce high machine costs or very low throughput in industrial applications. To mitigate this issue, we propose a two-step manufacturing method that requires pressure only in the beginning of joint formation, followed by a pressure-less second step to finalize the sintered connection. This time-consuming second step can be performed in conventional soldering ovens in large batches, increasing throughput compared to consecutive manufacturing in sintering presses. Shear strength of two-step manufactured samples reached above 50 MPa with a pressure-less second sintering step of two hours at $300^{circ}mathrm{C}$ in nitrogen atmosphere. We found the absence of oxygen during the second step to be crucial for strong joint formation, an identical process performed in air yielded a shear strength of only 20 MPa. In conclusion, two-step manufacturing can solve the issue of having to strike a balance between manufacturing throughput and joint strength.
{"title":"Throughput Optimization of a Sintering Die Attach Process","authors":"Benjamin Schellscheidt, Jessica Richter, Oliver Lochthofen, T. Licht","doi":"10.23919/empc53418.2021.9584964","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584964","url":null,"abstract":"Sintering as a means of die attach in power electronics modules shows advantages over solder connections with regards to reliability and ageing phenomena, especially at higher temperatures. Some wide-bandgap semiconductors such as silicon carbide can be operated at or above the melting point of conventional lead-free solder, making alternative bonding methods mandatory. However, the formation of sintered joints requires more complex machines compared to soldering, as mechanical pressure, in addition to heat, needs to be applied to form a satisfactory connection. As each joint is created individually and joint formation typically takes time in the range of several minutes, this would induce high machine costs or very low throughput in industrial applications. To mitigate this issue, we propose a two-step manufacturing method that requires pressure only in the beginning of joint formation, followed by a pressure-less second step to finalize the sintered connection. This time-consuming second step can be performed in conventional soldering ovens in large batches, increasing throughput compared to consecutive manufacturing in sintering presses. Shear strength of two-step manufactured samples reached above 50 MPa with a pressure-less second sintering step of two hours at $300^{circ}mathrm{C}$ in nitrogen atmosphere. We found the absence of oxygen during the second step to be crucial for strong joint formation, an identical process performed in air yielded a shear strength of only 20 MPa. In conclusion, two-step manufacturing can solve the issue of having to strike a balance between manufacturing throughput and joint strength.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114272027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584950
Fei Yang, Chengqun Yu, Johan Liu, Yong Zhang
In this work, laser-induced graphene (LIG)/ polyimide (PI) films with good thermal properties were prepared by directly inducing graphene on the bare PI substrates by a computer numerical control (CNC) laser engraving machine. The obtained samples were characterized by scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy. The results showed that the laser energy density has a significant impact on the microstructures of the samples. Moreover, the thermal diffusivity of LIG/PI was increased from 0.5 mm2/s to 1.6 mm2/s, which is 3 times higher than bare PI. Finally, the electrothermal properties of the LIG films were investigated and the results showed that under a 12 V power supply, the equilibrium temperature of LIG films increases from 45°C to 74°C with the increase of laser energy density from 1.8 J/mm2 to 2.4 J/mm2. Our results indicate that this time-saving, low-cost, and environment-friendly method is promising for fabricating excellent graphene-based materials.
{"title":"Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates","authors":"Fei Yang, Chengqun Yu, Johan Liu, Yong Zhang","doi":"10.23919/empc53418.2021.9584950","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584950","url":null,"abstract":"In this work, laser-induced graphene (LIG)/ polyimide (PI) films with good thermal properties were prepared by directly inducing graphene on the bare PI substrates by a computer numerical control (CNC) laser engraving machine. The obtained samples were characterized by scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy. The results showed that the laser energy density has a significant impact on the microstructures of the samples. Moreover, the thermal diffusivity of LIG/PI was increased from 0.5 mm2/s to 1.6 mm2/s, which is 3 times higher than bare PI. Finally, the electrothermal properties of the LIG films were investigated and the results showed that under a 12 V power supply, the equilibrium temperature of LIG films increases from 45°C to 74°C with the increase of laser energy density from 1.8 J/mm2 to 2.4 J/mm2. Our results indicate that this time-saving, low-cost, and environment-friendly method is promising for fabricating excellent graphene-based materials.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114275877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584959
E. Kolbinger, A. Groth, S. Wagner, M. Schneider-Ramelow
Humidity is one of the critical conditions regarding the lifetime of power electronic components. It can cause electrochemical reactions that degrade the components and lead to failures in the field. Especially for the use in harsh environments, components must have corrosion-resistant properties. Therefore, reliable bond wires with a long lifetime are essential too. The most commonly used heavy bond wires are made of aluminum. This paper deals with the characterization of Al-X bond wires in terms of its corrosion resistance compared to other typical aluminum heavy bond wires. The objective of this study is to determine whether the Al-X bond wire is suitable for use in harsh environmental conditions. The electrochemical measurements show that the Al-X bond wire in deionized water has the lowest corrosion affinity compared to the other bond wires examined. It also shows good results in saline solutions. These are comparable to the results of the corrosion-resistant optimized common Al wire.
{"title":"Characterization of the corrosion behavior of Al-X bond wires","authors":"E. Kolbinger, A. Groth, S. Wagner, M. Schneider-Ramelow","doi":"10.23919/empc53418.2021.9584959","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584959","url":null,"abstract":"Humidity is one of the critical conditions regarding the lifetime of power electronic components. It can cause electrochemical reactions that degrade the components and lead to failures in the field. Especially for the use in harsh environments, components must have corrosion-resistant properties. Therefore, reliable bond wires with a long lifetime are essential too. The most commonly used heavy bond wires are made of aluminum. This paper deals with the characterization of Al-X bond wires in terms of its corrosion resistance compared to other typical aluminum heavy bond wires. The objective of this study is to determine whether the Al-X bond wire is suitable for use in harsh environmental conditions. The electrochemical measurements show that the Al-X bond wire in deionized water has the lowest corrosion affinity compared to the other bond wires examined. It also shows good results in saline solutions. These are comparable to the results of the corrosion-resistant optimized common Al wire.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116050885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584955
Jessica Richter, A. Steenmann, T. Licht
In this paper, we present the differences in intermetallic phase formation between electroplated and physical vapor deposited (PVD) nickel coating layers with soft solder. We investigate the adhesion layer between a power electronic module baseplate and its system solder. The baseplates of these modules consists of a metal matrix composite material, which needs to be coated to become solderable. Today, it is state of the art technology to coat the baseplate with electroplated nickel to form an adhesion layer to the system solder. During the publicly funded project ReffiMaL (resource efficient material solutions for power electronics), electroplated nickel was substituted with PVD nickel. The main advantage of PVD nickel is a significant reduction of layer thickness compared to the electroplating process. Second advantage of PVD nickel is the limitation of the deposition to areas that are soldered, in contrast to a non-selective electroplated coating. This yields both a reduction of material use and a natural formation of a solder mask due to the selective deposition of solder-wettable nickel. When deposited by PVD at room temperature, nickel exhibits columnar growth patterns, whereas electroplated nickel tends to form a laminar layer. The columnar growth leads to an increase in interface area promoting phase formation behavior. To compare both adhesion layers, we investigate the phase formation after soldering. Instead of a standard soft solder preform, we use a tin-based soft-solder copper-composite material. We investigate a wide range of samples of varying solder time and temperature. We were able to confirm the assumption of enhanced interdiffusion behavior with PVD nickel by faster phase growth and a higher concentration of nickel in the resulting intermetallic phases. There is also a difference in the phase formation dynamics at high temperatures on the physical vapor deposited nickel
{"title":"On the Influence of Nickel Deposition Techniques on Solder Joint Phase Formation","authors":"Jessica Richter, A. Steenmann, T. Licht","doi":"10.23919/empc53418.2021.9584955","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584955","url":null,"abstract":"In this paper, we present the differences in intermetallic phase formation between electroplated and physical vapor deposited (PVD) nickel coating layers with soft solder. We investigate the adhesion layer between a power electronic module baseplate and its system solder. The baseplates of these modules consists of a metal matrix composite material, which needs to be coated to become solderable. Today, it is state of the art technology to coat the baseplate with electroplated nickel to form an adhesion layer to the system solder. During the publicly funded project ReffiMaL (resource efficient material solutions for power electronics), electroplated nickel was substituted with PVD nickel. The main advantage of PVD nickel is a significant reduction of layer thickness compared to the electroplating process. Second advantage of PVD nickel is the limitation of the deposition to areas that are soldered, in contrast to a non-selective electroplated coating. This yields both a reduction of material use and a natural formation of a solder mask due to the selective deposition of solder-wettable nickel. When deposited by PVD at room temperature, nickel exhibits columnar growth patterns, whereas electroplated nickel tends to form a laminar layer. The columnar growth leads to an increase in interface area promoting phase formation behavior. To compare both adhesion layers, we investigate the phase formation after soldering. Instead of a standard soft solder preform, we use a tin-based soft-solder copper-composite material. We investigate a wide range of samples of varying solder time and temperature. We were able to confirm the assumption of enhanced interdiffusion behavior with PVD nickel by faster phase growth and a higher concentration of nickel in the resulting intermetallic phases. There is also a difference in the phase formation dynamics at high temperatures on the physical vapor deposited nickel","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125597842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9585005
Hendrik Joost Van Ginkel, J. Romijn, S. Vollebregt, Guo Qi Zhang
The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are therefore needed. Here, a method to direct-write metal tracks on the top and sides of dies is demonstrated. It is based on a spark ablation aerosol printing process entirely performed at room temperature and without any applied force. Therefore, it is suitable for use on soft or temperature-sensitive substrates. The printed metal lines consist of pure Au nanoparticles, without surfactants or contaminants, and do not require any further curing, cleaning, or other processing. The process is demonstrated on Si dies and paper, but is theoretically applicable on a wide variety of substrate materials. It can provide an alternative method to create interconnects or vias on soft materials, temperature sensitive materials, irregularly shaped materials, or curved surfaces.
{"title":"High Step Coverage Interconnects By Printed Nanoparticles","authors":"Hendrik Joost Van Ginkel, J. Romijn, S. Vollebregt, Guo Qi Zhang","doi":"10.23919/empc53418.2021.9585005","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9585005","url":null,"abstract":"The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are therefore needed. Here, a method to direct-write metal tracks on the top and sides of dies is demonstrated. It is based on a spark ablation aerosol printing process entirely performed at room temperature and without any applied force. Therefore, it is suitable for use on soft or temperature-sensitive substrates. The printed metal lines consist of pure Au nanoparticles, without surfactants or contaminants, and do not require any further curing, cleaning, or other processing. The process is demonstrated on Si dies and paper, but is theoretically applicable on a wide variety of substrate materials. It can provide an alternative method to create interconnects or vias on soft materials, temperature sensitive materials, irregularly shaped materials, or curved surfaces.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116446867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584942
Lukas Haas, F. Döpper, K. Schmidt, J. Franke, A. Reinhardt
One of the most challenging aspects of processing electronic parts is the abundance of influencing factors. These have a significant impact on the quality of the finished product. Particularly the affinity to embed moisture in the plastic matrix can lead to severe damage mechanisms. With a moisture gain of up to 0.5 percent by weight [1] delamination and the so-called “popcorn effect” may occur during reflow soldering [2]. This is due to the explosive vaporization and volume gain the embedded water experiences during the heating process. To prevent these failures the floor time has been established. It specifies the maximum amount of time a Surface Mount Device (SMD) can be exposed to certain conditions (floor life) before failures start to occur. After the floor life ends, time-consuming and costly preconditioning in a warm and dry atmosphere is necessary to restart the floor time. The Moisture Sensitivity Level (MSL) in combination with the JEDEC standard defines the exact conditions and times for preconditioning.The proposed article focuses on modeling cause-effect-relations between influence and target values to create a more efficient way to determine when preconditioning is necessary. A literature review of research papers and industry standards is used to determine the quality defining influence parameters. Transferring these insights into two simulation models, one based on the Fickian diffusion mechanism, the other on the two-stage Fickian diffusion, leads to a promising approach for concluding reversible and irreversible moisture diffusion into the SMD components.An experimental setup is determined using the derived dependence model. The experiments consist of defined loading and drying cycles of different samples of MSL 3 and 4 to quantify the moisture de- and absorbed by the part under defined conditions. Subsequently, several differently moisture-loaded parts are reflow soldered to recreate a variety of failure mechanisms. Which, in turn, are used to verify the critical moisture mass absorbed by the SMD-components
{"title":"Studies and Analyses of Moisture Conditioned SMT-Components","authors":"Lukas Haas, F. Döpper, K. Schmidt, J. Franke, A. Reinhardt","doi":"10.23919/empc53418.2021.9584942","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584942","url":null,"abstract":"One of the most challenging aspects of processing electronic parts is the abundance of influencing factors. These have a significant impact on the quality of the finished product. Particularly the affinity to embed moisture in the plastic matrix can lead to severe damage mechanisms. With a moisture gain of up to 0.5 percent by weight [1] delamination and the so-called “popcorn effect” may occur during reflow soldering [2]. This is due to the explosive vaporization and volume gain the embedded water experiences during the heating process. To prevent these failures the floor time has been established. It specifies the maximum amount of time a Surface Mount Device (SMD) can be exposed to certain conditions (floor life) before failures start to occur. After the floor life ends, time-consuming and costly preconditioning in a warm and dry atmosphere is necessary to restart the floor time. The Moisture Sensitivity Level (MSL) in combination with the JEDEC standard defines the exact conditions and times for preconditioning.The proposed article focuses on modeling cause-effect-relations between influence and target values to create a more efficient way to determine when preconditioning is necessary. A literature review of research papers and industry standards is used to determine the quality defining influence parameters. Transferring these insights into two simulation models, one based on the Fickian diffusion mechanism, the other on the two-stage Fickian diffusion, leads to a promising approach for concluding reversible and irreversible moisture diffusion into the SMD components.An experimental setup is determined using the derived dependence model. The experiments consist of defined loading and drying cycles of different samples of MSL 3 and 4 to quantify the moisture de- and absorbed by the part under defined conditions. Subsequently, several differently moisture-loaded parts are reflow soldered to recreate a variety of failure mechanisms. Which, in turn, are used to verify the critical moisture mass absorbed by the SMD-components","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130769545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584986
Zekun Liu, Shuai Zhang, Erzhen Mu, Zhenhua Wu, Duo Yu, Tianyu Chen, Zhiyu Hu
The photothermal effect is the most direct and simple way to use solar energy. Different color materials have different thermal effects under light exposure, which will have wide range of influences on people’s daily life, such as the production of clothing and the choice of paint. This article innovatively proposes a way of using MEMS micro-thermoelectric generator (μ-TEG) to distinguish the photothermal effect of different materials after exposure to light. The design and manufacture of MEMS μ-TEG is the focus of this paper, in which the micro-nano manufacturing technologies such as ultraviolet lithography and magnetron sputtering are mainly used. A hybrid fabrication method combining the non-contact lithography and photoresist melting is used to prepare a top electrode with good electrical contact. In the 5 cm*5 cm area, we integrated 46000 P-N thermoelectric units in series on a silicon wafer and its ultra-thin structure offers very high temperature sensitivity. In our experiment, by changing the substrate materials’ type and color, the light-to-heat effects were studied under monochromatic LED light illumination. The results demonstrated that the difference of the photothermal effects can be used to distinguish the various materials. The experimental samples include cotton, linen, chemical fiber, and paper. Each material includes red, yellow, green, and white. For each sample, ultraviolet/visible/near infrared spectrophotometer was used to measure the absorptivity in the visible light range. At room temperature (298K) and in an enclosed test platform (to minimize air flow), the open circuit voltage of 1~2 mV can be detected by the irradiation of monochromatic LED light source, which can accurately measure and distinguish samples of different colors and materials. It has broad application prospects in the field of photothermal effect temperature measurement and reaction process temperature monitoring.
{"title":"MEMS thermoelecctric multi-color photo-thermal detector","authors":"Zekun Liu, Shuai Zhang, Erzhen Mu, Zhenhua Wu, Duo Yu, Tianyu Chen, Zhiyu Hu","doi":"10.23919/empc53418.2021.9584986","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584986","url":null,"abstract":"The photothermal effect is the most direct and simple way to use solar energy. Different color materials have different thermal effects under light exposure, which will have wide range of influences on people’s daily life, such as the production of clothing and the choice of paint. This article innovatively proposes a way of using MEMS micro-thermoelectric generator (μ-TEG) to distinguish the photothermal effect of different materials after exposure to light. The design and manufacture of MEMS μ-TEG is the focus of this paper, in which the micro-nano manufacturing technologies such as ultraviolet lithography and magnetron sputtering are mainly used. A hybrid fabrication method combining the non-contact lithography and photoresist melting is used to prepare a top electrode with good electrical contact. In the 5 cm*5 cm area, we integrated 46000 P-N thermoelectric units in series on a silicon wafer and its ultra-thin structure offers very high temperature sensitivity. In our experiment, by changing the substrate materials’ type and color, the light-to-heat effects were studied under monochromatic LED light illumination. The results demonstrated that the difference of the photothermal effects can be used to distinguish the various materials. The experimental samples include cotton, linen, chemical fiber, and paper. Each material includes red, yellow, green, and white. For each sample, ultraviolet/visible/near infrared spectrophotometer was used to measure the absorptivity in the visible light range. At room temperature (298K) and in an enclosed test platform (to minimize air flow), the open circuit voltage of 1~2 mV can be detected by the irradiation of monochromatic LED light source, which can accurately measure and distinguish samples of different colors and materials. It has broad application prospects in the field of photothermal effect temperature measurement and reaction process temperature monitoring.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116920694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9585001
M. Del Sarto, L. Maggi, M. Shaw, A. Simonsen, A. Schliesser, M. Moraja, L. Mauri, M. Campaniello, D. Rotta, Aina Serrano Rodrigo, A. Bogoni
A new generation of devices that connects or contains hybrid mechanical-, electrical-, and optical elements on the nano scale are being developed, with potential applications ranging from quantum-enabled hardware to different types of sensors. However, these hybrid optomechanical devices require innovative packaging with not only stress and strain free assembly with high vacuum and hermetic sealing typical of MEMS, but also optical access through windows, fiber alignment and pigtailing. Detailed description of such a module is provided.
{"title":"Assembly of opto-mechanical devices","authors":"M. Del Sarto, L. Maggi, M. Shaw, A. Simonsen, A. Schliesser, M. Moraja, L. Mauri, M. Campaniello, D. Rotta, Aina Serrano Rodrigo, A. Bogoni","doi":"10.23919/empc53418.2021.9585001","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9585001","url":null,"abstract":"A new generation of devices that connects or contains hybrid mechanical-, electrical-, and optical elements on the nano scale are being developed, with potential applications ranging from quantum-enabled hardware to different types of sensors. However, these hybrid optomechanical devices require innovative packaging with not only stress and strain free assembly with high vacuum and hermetic sealing typical of MEMS, but also optical access through windows, fiber alignment and pigtailing. Detailed description of such a module is provided.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"10 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116654532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-09-13DOI: 10.23919/empc53418.2021.9584952
A. Maierna, A. Gritti, L. Maggi, M. D. Sarto, Aurora Sanna, D. Halicki, Giovanni Graziosi
Silicon based semiconductors are becoming a source of innovation in the field of RF solutions, especially involved in devices used in our everyday life. Wi-Fi and Bluetooth® connections adopted in home-networking, consumer platforms and wearable devices, together with the large spread of the IoT solutions, are more and more requiring very high levels in system integration. In particular, the focus on single-package Blue Tooth Low Energy (BTLE) system is increasing in the last few years. In this scenario, an innovative SiP (System in Package) solution with antenna integration on the top is considered as a possible and reliable alternative to SMD (Surface Mounted Device) antenna assembled on the package substrate. This paper will present a complex SiP composed by multiple stacked organic substrates, integrating a meander antenna that works in the Bluetooth® bandwidth. After describing the structure, the design methodology and the assembly strategy, a particular focus will be put on the antenna integration and dimensioning, supported by full-wave 3D electromagnetic simulations. The influence of the surrounding system on the antenna performance, and consequently the importance of co-design and co-simulation, will be emphasized.
{"title":"Packaging Solution for RF SiP with on-top Integrated Antenna","authors":"A. Maierna, A. Gritti, L. Maggi, M. D. Sarto, Aurora Sanna, D. Halicki, Giovanni Graziosi","doi":"10.23919/empc53418.2021.9584952","DOIUrl":"https://doi.org/10.23919/empc53418.2021.9584952","url":null,"abstract":"Silicon based semiconductors are becoming a source of innovation in the field of RF solutions, especially involved in devices used in our everyday life. Wi-Fi and Bluetooth® connections adopted in home-networking, consumer platforms and wearable devices, together with the large spread of the IoT solutions, are more and more requiring very high levels in system integration. In particular, the focus on single-package Blue Tooth Low Energy (BTLE) system is increasing in the last few years. In this scenario, an innovative SiP (System in Package) solution with antenna integration on the top is considered as a possible and reliable alternative to SMD (Surface Mounted Device) antenna assembled on the package substrate. This paper will present a complex SiP composed by multiple stacked organic substrates, integrating a meander antenna that works in the Bluetooth® bandwidth. After describing the structure, the design methodology and the assembly strategy, a particular focus will be put on the antenna integration and dimensioning, supported by full-wave 3D electromagnetic simulations. The influence of the surrounding system on the antenna performance, and consequently the importance of co-design and co-simulation, will be emphasized.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114499327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：