Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887551
P. Gierth, L. Rebenklau
Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.
{"title":"Wettability of rapid thermal firing silver-Pastes","authors":"P. Gierth, L. Rebenklau","doi":"10.1109/ISSE.2014.6887551","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887551","url":null,"abstract":"Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114998406","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887572
J. Szałapak, Aleksander Gados, K. Kielbasinski, A. Mlozniak, J. Krzemiński, M. Teodorczyk, T. Kowaluk, M. Jakubowska
In Institute of Electronic Materials Technology in Warsaw novel silver pastes were elaborated, that contains silver nanoparticles and are able to sinter at temperatures below 300°C resulting in low resistance layers (2 mQ/□). No other thick film paste is capable of achieving this resistance in such a low curing temperature. Low exposure to heat allows depositing and curing on wide variety of elastic substrates including elastic Kapton foil or paper. In present work the authors proved that this paste is suitable for low temperature joining technique (LTJT) which is an alternative to soldering and adhesive joining. The temperature 300°C was suitable to obtain joints, which can withstand over 30000 cycles in bend test.
{"title":"Nanosilver sintered joints on elastic substrates","authors":"J. Szałapak, Aleksander Gados, K. Kielbasinski, A. Mlozniak, J. Krzemiński, M. Teodorczyk, T. Kowaluk, M. Jakubowska","doi":"10.1109/ISSE.2014.6887572","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887572","url":null,"abstract":"In Institute of Electronic Materials Technology in Warsaw novel silver pastes were elaborated, that contains silver nanoparticles and are able to sinter at temperatures below 300°C resulting in low resistance layers (2 mQ/□). No other thick film paste is capable of achieving this resistance in such a low curing temperature. Low exposure to heat allows depositing and curing on wide variety of elastic substrates including elastic Kapton foil or paper. In present work the authors proved that this paste is suitable for low temperature joining technique (LTJT) which is an alternative to soldering and adhesive joining. The temperature 300°C was suitable to obtain joints, which can withstand over 30000 cycles in bend test.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114232530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887565
B. Platek, T. Falat, J. Felba
This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube and silicon rod were proposed. The first one was with closed ends of CNT and the second one with opened ends CNT bonded to the silicon.
{"title":"Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations","authors":"B. Platek, T. Falat, J. Felba","doi":"10.1109/ISSE.2014.6887565","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887565","url":null,"abstract":"This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube and silicon rod were proposed. The first one was with closed ends of CNT and the second one with opened ends CNT bonded to the silicon.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129939093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887590
K. Dušek, I. Beshajová Pelikánová, D. Bušek, Marek Zeidler
Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regeneration of solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was measured by rotation viscometer Brookfield Synchroelectric Viscometer, model HBT. The article describes if the addition of jelly flux to the aged solder pastes regenerates their properties.
{"title":"Measurements of solder paste viscosity during its tempering and aging","authors":"K. Dušek, I. Beshajová Pelikánová, D. Bušek, Marek Zeidler","doi":"10.1109/ISSE.2014.6887590","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887590","url":null,"abstract":"Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regeneration of solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was measured by rotation viscometer Brookfield Synchroelectric Viscometer, model HBT. The article describes if the addition of jelly flux to the aged solder pastes regenerates their properties.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133304367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887613
Snezhana Pleshkova-Bekyarska, Al. Bekyarski
Motion detection of objects or people is an important operation in visual and also in thermo visual surveillance systems. From speed of execution and accuracy of motion detection operation strongly are depended the main characteristics of a real working surveillance system. Therefore, the goal of this article is to develop of a multicore DSP thermal image sequence processing module suitable for real time objects or people motion detection and tracking and also to present here the experimental results from this development. The development of multicore DSP module is based on Xilinx module Zynq-7000 All Programmable SoC. The proposed algorithm of motion detection in thermal images is first modeled using OpenCV library functions for image processing, and then the algorithm is accelerating using Xilinx Vivado HLS Video Libraries to implement the algorithm of motion detection in thermal images in Xilinx module Zynq-7000. The presented in this article experimental results show the ability to detect in real time motions of objects or people in thermal images and to use the results for next steps of a whole algorithm for thermo visual surveillance - objects and people tracking in thermal images.
{"title":"Multicore DSPs thermal image sequence processing for real time motion detection in thermal surveillance system","authors":"Snezhana Pleshkova-Bekyarska, Al. Bekyarski","doi":"10.1109/ISSE.2014.6887613","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887613","url":null,"abstract":"Motion detection of objects or people is an important operation in visual and also in thermo visual surveillance systems. From speed of execution and accuracy of motion detection operation strongly are depended the main characteristics of a real working surveillance system. Therefore, the goal of this article is to develop of a multicore DSP thermal image sequence processing module suitable for real time objects or people motion detection and tracking and also to present here the experimental results from this development. The development of multicore DSP module is based on Xilinx module Zynq-7000 All Programmable SoC. The proposed algorithm of motion detection in thermal images is first modeled using OpenCV library functions for image processing, and then the algorithm is accelerating using Xilinx Vivado HLS Video Libraries to implement the algorithm of motion detection in thermal images in Xilinx module Zynq-7000. The presented in this article experimental results show the ability to detect in real time motions of objects or people in thermal images and to use the results for next steps of a whole algorithm for thermo visual surveillance - objects and people tracking in thermal images.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133326707","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887630
C. Tămaş, N. Codreanu, C. Grecu, I. Marghescu
The paper investigates and compares two different solutions to improve a printed circuit board designed for a portable computer main board. The issue represents the analog circuits and switching power supplies. The main example is a simple analog circuit, low dropout regulator (LDO), integrated into a complex analog circuit. The LDO stability versus the printed circuit board (PCB) design rules represents today a real challenge for electrical engineers and PCB designers.
{"title":"Investigations on silicon and PCB ground system design for new 1.2V DDR4 power sources","authors":"C. Tămaş, N. Codreanu, C. Grecu, I. Marghescu","doi":"10.1109/ISSE.2014.6887630","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887630","url":null,"abstract":"The paper investigates and compares two different solutions to improve a printed circuit board designed for a portable computer main board. The issue represents the analog circuits and switching power supplies. The main example is a simple analog circuit, low dropout regulator (LDO), integrated into a complex analog circuit. The LDO stability versus the printed circuit board (PCB) design rules represents today a real challenge for electrical engineers and PCB designers.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131529191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887633
T. Garami, Norbert Reti, O. Krammer
This paper focuses on the cooling rate of soldering process. Our target was to create a well-controlled equipment that is used to set the adjustable slope of the cooling curve with three special sections. The three sections are: near the melting point, above and below the melting point. The unit uses cooling fans to create a forced convection air flow. K-type thermocouple is used for the temperature measurement in the temperature feedback loop. The cooling rate is adjustable in a wide range, between 0.25 K/s and 10 K/s. To understand the effect of different cooling rates, the undercooling mechanism near the solidus point of the solder has to be investigated. Experiments showed that there is a flat section in the temperature profile when the solder reaches the solidus point during cooling. With the control unit this phenomenon and the effect of various cooling rates can also be investigated.
{"title":"Controlling the cooling rate of soldering processes with PIC microcontroller","authors":"T. Garami, Norbert Reti, O. Krammer","doi":"10.1109/ISSE.2014.6887633","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887633","url":null,"abstract":"This paper focuses on the cooling rate of soldering process. Our target was to create a well-controlled equipment that is used to set the adjustable slope of the cooling curve with three special sections. The three sections are: near the melting point, above and below the melting point. The unit uses cooling fans to create a forced convection air flow. K-type thermocouple is used for the temperature measurement in the temperature feedback loop. The cooling rate is adjustable in a wide range, between 0.25 K/s and 10 K/s. To understand the effect of different cooling rates, the undercooling mechanism near the solidus point of the solder has to be investigated. Experiments showed that there is a flat section in the temperature profile when the solder reaches the solidus point during cooling. With the control unit this phenomenon and the effect of various cooling rates can also be investigated.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127790704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887607
K. Jankowski, A. Wymyslowski
Occurring from many years a impetuous growth of electronic devices manufacturing, induced by introducing a new functionalities for customers and moving towards replacing hazardous substances such as lead in electrical and electronic equipment caused that a reliability of solder joints is more important issue in electronic assembly. Reliability of solder joints plays a major role in the electronic packaging. Indeed, the solder joints serve not only for the transmitting of electrical signals, but also for the heat transportation and as a structural support which is one of the most important aspects. Therefore very important is to estimate behavior of solder joints in various work conditions. The best way to solve that problem is to take a focus on creep and fatigue phenomena which initiate degradation process. Currently creep and fatigue phenomena are considered only in self-dependent way. Consequently reliability prototyping is long lasting and expensive. The usual tests take advantage of only one dominating failure mode which can last even for a number of months. In addition all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. To accelerate that kind of tests creep and fatigue phenomena should be taken into account at the same time [1]. That combination can help to develop analytical, experimental and numerical approach for understanding the combined multi-loading and multi-failure problem. Therefore an appropriate understanding and development of analytical methods and experimental tools for multi-failure criteria analysis could be very helpful. The study will present new method, which allow introduce multi-failure conditions to tested joints.
{"title":"Acceleration of life prediction of solder joints using multi-failure criteria","authors":"K. Jankowski, A. Wymyslowski","doi":"10.1109/ISSE.2014.6887607","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887607","url":null,"abstract":"Occurring from many years a impetuous growth of electronic devices manufacturing, induced by introducing a new functionalities for customers and moving towards replacing hazardous substances such as lead in electrical and electronic equipment caused that a reliability of solder joints is more important issue in electronic assembly. Reliability of solder joints plays a major role in the electronic packaging. Indeed, the solder joints serve not only for the transmitting of electrical signals, but also for the heat transportation and as a structural support which is one of the most important aspects. Therefore very important is to estimate behavior of solder joints in various work conditions. The best way to solve that problem is to take a focus on creep and fatigue phenomena which initiate degradation process. Currently creep and fatigue phenomena are considered only in self-dependent way. Consequently reliability prototyping is long lasting and expensive. The usual tests take advantage of only one dominating failure mode which can last even for a number of months. In addition all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. To accelerate that kind of tests creep and fatigue phenomena should be taken into account at the same time [1]. That combination can help to develop analytical, experimental and numerical approach for understanding the combined multi-loading and multi-failure problem. Therefore an appropriate understanding and development of analytical methods and experimental tools for multi-failure criteria analysis could be very helpful. The study will present new method, which allow introduce multi-failure conditions to tested joints.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130240931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887609
R. Bozomitu, V. Cehan, R. Lupu
This paper presents a new CMOS differential input FM quadrature demodulator for integrated circuits. The proposed circuit is based on Bilotti's quadrature demodulator that uses an external differential phase shift network and a differential phase detector with a single ended output. The phase detector is represented by an analog multiplier implemented with a Gilbert cell and the phase shift network is an external RLC resonator circuit. The current consumption of the FM detection stage is about 258μA from a 3.3V supply voltage. The simulations performed in 0.13μm CMOS technology confirm the theoretical result.
{"title":"A new CMOS differential input FM quadrature demodulator","authors":"R. Bozomitu, V. Cehan, R. Lupu","doi":"10.1109/ISSE.2014.6887609","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887609","url":null,"abstract":"This paper presents a new CMOS differential input FM quadrature demodulator for integrated circuits. The proposed circuit is based on Bilotti's quadrature demodulator that uses an external differential phase shift network and a differential phase detector with a single ended output. The phase detector is represented by an analog multiplier implemented with a Gilbert cell and the phase shift network is an external RLC resonator circuit. The current consumption of the FM detection stage is about 258μA from a 3.3V supply voltage. The simulations performed in 0.13μm CMOS technology confirm the theoretical result.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133425913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887570
K. Hromadka, J. Štulík, J. Řeboun
This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.
{"title":"Thick printed copper conductors on alumina substrates","authors":"K. Hromadka, J. Štulík, J. Řeboun","doi":"10.1109/ISSE.2014.6887570","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887570","url":null,"abstract":"This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129164967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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