Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887635
Hristo Ivanov, M. Valkov
This paper outlines the possibilities to apply sensors and microsystems to improve efficiency and service life durability of LED lighting equipment. An electronic control microsystem is presented. Using sensors of motion, fog, diode temperature, lamp temperature, outdoor temperature and light [1], the performance, operational reliability and durability of this type of lighting equipment designed both for outdoor and indoor lighting can be significantly improved.
{"title":"Application of sensors and control microsystems to improve efficiency and service life durability of LED lighting equipment","authors":"Hristo Ivanov, M. Valkov","doi":"10.1109/ISSE.2014.6887635","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887635","url":null,"abstract":"This paper outlines the possibilities to apply sensors and microsystems to improve efficiency and service life durability of LED lighting equipment. An electronic control microsystem is presented. Using sensors of motion, fog, diode temperature, lamp temperature, outdoor temperature and light [1], the performance, operational reliability and durability of this type of lighting equipment designed both for outdoor and indoor lighting can be significantly improved.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126164797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887587
Damian Nowak, A. Dziedzic
This paper presents systematic studies of thick-film or LTCC fine-line conductors made with the aid of laser-shaping and operating at temperature up to 400°C. The minimum dimensions i.e. conductive path width and spacings were 50 μm. Such small patterns have been created by laser cutting of fired Au- or PdAg-based conductive films. Laser system equipped with Nd:YAG-laser (beam wavelength of 1064 nm) was applied. Additionally, part of the structures was covered with protective overglaze layer. The geometrical as well as electrical and stability properties in temperature range between 25°C and 400°C were measured and analyzed.
{"title":"Reliability of fine-line thick-film and LTCC conductors at high-temperature operation","authors":"Damian Nowak, A. Dziedzic","doi":"10.1109/ISSE.2014.6887587","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887587","url":null,"abstract":"This paper presents systematic studies of thick-film or LTCC fine-line conductors made with the aid of laser-shaping and operating at temperature up to 400°C. The minimum dimensions i.e. conductive path width and spacings were 50 μm. Such small patterns have been created by laser cutting of fired Au- or PdAg-based conductive films. Laser system equipped with Nd:YAG-laser (beam wavelength of 1064 nm) was applied. Additionally, part of the structures was covered with protective overglaze layer. The geometrical as well as electrical and stability properties in temperature range between 25°C and 400°C were measured and analyzed.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122931831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887605
A. Andonova, G. Angelov, P. Chernev
Potential applications of different thermography techniques for the fault diagnostic in packaged integrated circuits (ICs) in order to detect, evaluate, and localize latent and hidden defects are discussed. We present the four basic thermography techniques for qualitative and quantitative non-destructive diagnostic of sub-surface defects - passive, pulsed, step-heating, and lock-in. The results and analyses of different diagnostics of packaged ICs are shown. The option to show temperature distribution of the packed ICs in real time enables easy localization of overheating prone areas.
{"title":"Diagnostics of packaged ICs By infrared thermography","authors":"A. Andonova, G. Angelov, P. Chernev","doi":"10.1109/ISSE.2014.6887605","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887605","url":null,"abstract":"Potential applications of different thermography techniques for the fault diagnostic in packaged integrated circuits (ICs) in order to detect, evaluate, and localize latent and hidden defects are discussed. We present the four basic thermography techniques for qualitative and quantitative non-destructive diagnostic of sub-surface defects - passive, pulsed, step-heating, and lock-in. The results and analyses of different diagnostics of packaged ICs are shown. The option to show temperature distribution of the packed ICs in real time enables easy localization of overheating prone areas.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134451467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887556
D. Seehase, H. Huth, Arne Neiser, M. Nowottnick
For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.
{"title":"Reactive paste for reflow soldering of large components","authors":"D. Seehase, H. Huth, Arne Neiser, M. Nowottnick","doi":"10.1109/ISSE.2014.6887556","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887556","url":null,"abstract":"For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123275940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887595
P. Mach, M. Horák
The goal of this work was to show ageing of capacitors with metalized polypropylene film by the sinusoidal and non-sinusoidal voltage and to find how the shape of the voltage waveform influences the ageing rate. A special device, which makes forming of the voltage of the fundamental and selected higher harmonic component possible, was used as a source for non-sinusoidal load. Capacitors with values from 10 nF to 47 /μF were tested. It was found that the ageing rate of capacitors loaded by the non-sinusoidal voltage is mostly a little bit higher in comparison with those when ageing was carried out by the sinusoidal load. The reason is faster degradation of the film electrodes under the non-sinusoidal voltage or higher temperature of “hot-spots” inside the capacitor.
{"title":"Ageing of self-healing polypropylene film capacitors by non-sinusoidal voltage","authors":"P. Mach, M. Horák","doi":"10.1109/ISSE.2014.6887595","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887595","url":null,"abstract":"The goal of this work was to show ageing of capacitors with metalized polypropylene film by the sinusoidal and non-sinusoidal voltage and to find how the shape of the voltage waveform influences the ageing rate. A special device, which makes forming of the voltage of the fundamental and selected higher harmonic component possible, was used as a source for non-sinusoidal load. Capacitors with values from 10 nF to 47 /μF were tested. It was found that the ageing rate of capacitors loaded by the non-sinusoidal voltage is mostly a little bit higher in comparison with those when ageing was carried out by the sinusoidal load. The reason is faster degradation of the film electrodes under the non-sinusoidal voltage or higher temperature of “hot-spots” inside the capacitor.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121511016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887588
Arne Neiser, D. Seehase, A. Fink, Kevin Lehnzen, H. Beikirch
When testing printed circuit boards in-situ in a test cabinet with a wireless connection, it is very hard to store the necessary energy, especially in a high temperature environment. With a thermoelectric generator (TEG) as an independent energy source in a climate test cabinet, the battery or the external power cable connections for the device under test (DUT) can be omitted. In this paper, we investigate the usability of a TEG in terms of how much energy can be produced by different test utilizations. To have an orientation of the maximum energy a TEG can harvest in such a cabinet, it is inevitable to create some boundary values with the equations based on the Seebeck effect. First experiment results prove that it is possible to archive enough energy to power low-energy radio transceivers for the in-situ data acquisition with a low duty cycle.
{"title":"Thermoelectric generator for stand-alone electronic device operation in temperature test cabinets","authors":"Arne Neiser, D. Seehase, A. Fink, Kevin Lehnzen, H. Beikirch","doi":"10.1109/ISSE.2014.6887588","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887588","url":null,"abstract":"When testing printed circuit boards in-situ in a test cabinet with a wireless connection, it is very hard to store the necessary energy, especially in a high temperature environment. With a thermoelectric generator (TEG) as an independent energy source in a climate test cabinet, the battery or the external power cable connections for the device under test (DUT) can be omitted. In this paper, we investigate the usability of a TEG in terms of how much energy can be produced by different test utilizations. To have an orientation of the maximum energy a TEG can harvest in such a cabinet, it is inevitable to create some boundary values with the equations based on the Seebeck effect. First experiment results prove that it is possible to archive enough energy to power low-energy radio transceivers for the in-situ data acquisition with a low duty cycle.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121625369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887592
A. Otáhal, M. Adamek, I. Szendiuch
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
{"title":"Impact of solder paste drying on the solderability","authors":"A. Otáhal, M. Adamek, I. Szendiuch","doi":"10.1109/ISSE.2014.6887592","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887592","url":null,"abstract":"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"416 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117304304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887614
S. Pleshkova, K. Peeva, Al. Bekyarski
Thermo visual images are produced from thermo vision or infrared cameras and are the source of visual information in the night or darkness for observation of objects and people in widespread security systems. There is usually the need of transmission of thermal images in these surveillance thermo vision security systems. The communication systems used for this purpose introduce the noises and distortions. This leads to quality decreasing of the received thermal images. Therefore, the algorithms necessary to detect and tracking objects and people work poorly and the precision is not satisfactory. The goal of this article is to propose and testing with simulation an appropriate method and algorithm for thermal images quality estimation received from a surveillance thermo vision communication system. The base of this proposition are the methods and algorithms developed for the visible images, but here they are modified according to the specific nature and characteristics of the thermal images and also taking in the account the requirements of the surveillance security systems - to detect and tracking with an appropriate precision the objects and people of interest in area of observation.
{"title":"Received thermal images quality estimation in thermo vision communication systems","authors":"S. Pleshkova, K. Peeva, Al. Bekyarski","doi":"10.1109/ISSE.2014.6887614","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887614","url":null,"abstract":"Thermo visual images are produced from thermo vision or infrared cameras and are the source of visual information in the night or darkness for observation of objects and people in widespread security systems. There is usually the need of transmission of thermal images in these surveillance thermo vision security systems. The communication systems used for this purpose introduce the noises and distortions. This leads to quality decreasing of the received thermal images. Therefore, the algorithms necessary to detect and tracking objects and people work poorly and the precision is not satisfactory. The goal of this article is to propose and testing with simulation an appropriate method and algorithm for thermal images quality estimation received from a surveillance thermo vision communication system. The base of this proposition are the methods and algorithms developed for the visible images, but here they are modified according to the specific nature and characteristics of the thermal images and also taking in the account the requirements of the surveillance security systems - to detect and tracking with an appropriate precision the objects and people of interest in area of observation.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115495485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887646
F. Draghici, M. Pantazica, N. Codreanu, P. Svasta
The paper presents a pilot hands-on project in which 73 Bachelor students have taken part. This project addresses a key issue in the education of future electronic engineers: lack of practical activities. For the time being, this activity is placed in the middle of the academic training undergone by Bachelor students. In general, the disciplines which are found in the curricula have the following activities associated: courses, laboratories, seminars or projects. All of these are limited to the discipline they serve. The project described in this paper has been developed as an interdisciplinary activity and is based on the knowledge gained by students at several disciplines studied during the previous semesters. For this purpose, the knowledge gained by students during the first to the forth semesters is considered a prerequisite for realizing the project in the fifth semester. The novelty of the project is completed by the practical development of the electronic module at the end of the fifth semester and by tests and measurements. The electric measurements are compared with the results obtained after designing and simulating the circuit.
{"title":"Hands-on project — Key issue in the education of future electronic engineers","authors":"F. Draghici, M. Pantazica, N. Codreanu, P. Svasta","doi":"10.1109/ISSE.2014.6887646","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887646","url":null,"abstract":"The paper presents a pilot hands-on project in which 73 Bachelor students have taken part. This project addresses a key issue in the education of future electronic engineers: lack of practical activities. For the time being, this activity is placed in the middle of the academic training undergone by Bachelor students. In general, the disciplines which are found in the curricula have the following activities associated: courses, laboratories, seminars or projects. All of these are limited to the discipline they serve. The project described in this paper has been developed as an interdisciplinary activity and is based on the knowledge gained by students at several disciplines studied during the previous semesters. For this purpose, the knowledge gained by students during the first to the forth semesters is considered a prerequisite for realizing the project in the fifth semester. The novelty of the project is completed by the practical development of the electronic module at the end of the fifth semester and by tests and measurements. The electric measurements are compared with the results obtained after designing and simulating the circuit.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129248998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887593
A. Pietrikova, J. Ďurišin, M. Bazu, V. Ilian
An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.
{"title":"Influence of different methods of ageing on microstructure of solder joints","authors":"A. Pietrikova, J. Ďurišin, M. Bazu, V. Ilian","doi":"10.1109/ISSE.2014.6887593","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887593","url":null,"abstract":"An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129702995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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