Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887571
M. Klíma, J. Somer, L. Blahová, M. Procházka, I. Szendiuch
This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.
{"title":"Usage of low-temperature co-fired ceramic in hermetic packaging","authors":"M. Klíma, J. Somer, L. Blahová, M. Procházka, I. Szendiuch","doi":"10.1109/ISSE.2014.6887571","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887571","url":null,"abstract":"This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127530576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887605
A. Andonova, G. Angelov, P. Chernev
Potential applications of different thermography techniques for the fault diagnostic in packaged integrated circuits (ICs) in order to detect, evaluate, and localize latent and hidden defects are discussed. We present the four basic thermography techniques for qualitative and quantitative non-destructive diagnostic of sub-surface defects - passive, pulsed, step-heating, and lock-in. The results and analyses of different diagnostics of packaged ICs are shown. The option to show temperature distribution of the packed ICs in real time enables easy localization of overheating prone areas.
{"title":"Diagnostics of packaged ICs By infrared thermography","authors":"A. Andonova, G. Angelov, P. Chernev","doi":"10.1109/ISSE.2014.6887605","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887605","url":null,"abstract":"Potential applications of different thermography techniques for the fault diagnostic in packaged integrated circuits (ICs) in order to detect, evaluate, and localize latent and hidden defects are discussed. We present the four basic thermography techniques for qualitative and quantitative non-destructive diagnostic of sub-surface defects - passive, pulsed, step-heating, and lock-in. The results and analyses of different diagnostics of packaged ICs are shown. The option to show temperature distribution of the packed ICs in real time enables easy localization of overheating prone areas.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134451467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887635
Hristo Ivanov, M. Valkov
This paper outlines the possibilities to apply sensors and microsystems to improve efficiency and service life durability of LED lighting equipment. An electronic control microsystem is presented. Using sensors of motion, fog, diode temperature, lamp temperature, outdoor temperature and light [1], the performance, operational reliability and durability of this type of lighting equipment designed both for outdoor and indoor lighting can be significantly improved.
{"title":"Application of sensors and control microsystems to improve efficiency and service life durability of LED lighting equipment","authors":"Hristo Ivanov, M. Valkov","doi":"10.1109/ISSE.2014.6887635","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887635","url":null,"abstract":"This paper outlines the possibilities to apply sensors and microsystems to improve efficiency and service life durability of LED lighting equipment. An electronic control microsystem is presented. Using sensors of motion, fog, diode temperature, lamp temperature, outdoor temperature and light [1], the performance, operational reliability and durability of this type of lighting equipment designed both for outdoor and indoor lighting can be significantly improved.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126164797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887551
P. Gierth, L. Rebenklau
Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.
{"title":"Wettability of rapid thermal firing silver-Pastes","authors":"P. Gierth, L. Rebenklau","doi":"10.1109/ISSE.2014.6887551","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887551","url":null,"abstract":"Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114998406","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887572
J. Szałapak, Aleksander Gados, K. Kielbasinski, A. Mlozniak, J. Krzemiński, M. Teodorczyk, T. Kowaluk, M. Jakubowska
In Institute of Electronic Materials Technology in Warsaw novel silver pastes were elaborated, that contains silver nanoparticles and are able to sinter at temperatures below 300°C resulting in low resistance layers (2 mQ/□). No other thick film paste is capable of achieving this resistance in such a low curing temperature. Low exposure to heat allows depositing and curing on wide variety of elastic substrates including elastic Kapton foil or paper. In present work the authors proved that this paste is suitable for low temperature joining technique (LTJT) which is an alternative to soldering and adhesive joining. The temperature 300°C was suitable to obtain joints, which can withstand over 30000 cycles in bend test.
{"title":"Nanosilver sintered joints on elastic substrates","authors":"J. Szałapak, Aleksander Gados, K. Kielbasinski, A. Mlozniak, J. Krzemiński, M. Teodorczyk, T. Kowaluk, M. Jakubowska","doi":"10.1109/ISSE.2014.6887572","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887572","url":null,"abstract":"In Institute of Electronic Materials Technology in Warsaw novel silver pastes were elaborated, that contains silver nanoparticles and are able to sinter at temperatures below 300°C resulting in low resistance layers (2 mQ/□). No other thick film paste is capable of achieving this resistance in such a low curing temperature. Low exposure to heat allows depositing and curing on wide variety of elastic substrates including elastic Kapton foil or paper. In present work the authors proved that this paste is suitable for low temperature joining technique (LTJT) which is an alternative to soldering and adhesive joining. The temperature 300°C was suitable to obtain joints, which can withstand over 30000 cycles in bend test.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114232530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887588
Arne Neiser, D. Seehase, A. Fink, Kevin Lehnzen, H. Beikirch
When testing printed circuit boards in-situ in a test cabinet with a wireless connection, it is very hard to store the necessary energy, especially in a high temperature environment. With a thermoelectric generator (TEG) as an independent energy source in a climate test cabinet, the battery or the external power cable connections for the device under test (DUT) can be omitted. In this paper, we investigate the usability of a TEG in terms of how much energy can be produced by different test utilizations. To have an orientation of the maximum energy a TEG can harvest in such a cabinet, it is inevitable to create some boundary values with the equations based on the Seebeck effect. First experiment results prove that it is possible to archive enough energy to power low-energy radio transceivers for the in-situ data acquisition with a low duty cycle.
{"title":"Thermoelectric generator for stand-alone electronic device operation in temperature test cabinets","authors":"Arne Neiser, D. Seehase, A. Fink, Kevin Lehnzen, H. Beikirch","doi":"10.1109/ISSE.2014.6887588","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887588","url":null,"abstract":"When testing printed circuit boards in-situ in a test cabinet with a wireless connection, it is very hard to store the necessary energy, especially in a high temperature environment. With a thermoelectric generator (TEG) as an independent energy source in a climate test cabinet, the battery or the external power cable connections for the device under test (DUT) can be omitted. In this paper, we investigate the usability of a TEG in terms of how much energy can be produced by different test utilizations. To have an orientation of the maximum energy a TEG can harvest in such a cabinet, it is inevitable to create some boundary values with the equations based on the Seebeck effect. First experiment results prove that it is possible to archive enough energy to power low-energy radio transceivers for the in-situ data acquisition with a low duty cycle.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121625369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887593
A. Pietrikova, J. Ďurišin, M. Bazu, V. Ilian
An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.
{"title":"Influence of different methods of ageing on microstructure of solder joints","authors":"A. Pietrikova, J. Ďurišin, M. Bazu, V. Ilian","doi":"10.1109/ISSE.2014.6887593","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887593","url":null,"abstract":"An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129702995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887592
A. Otáhal, M. Adamek, I. Szendiuch
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
{"title":"Impact of solder paste drying on the solderability","authors":"A. Otáhal, M. Adamek, I. Szendiuch","doi":"10.1109/ISSE.2014.6887592","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887592","url":null,"abstract":"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"416 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117304304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887646
F. Draghici, M. Pantazica, N. Codreanu, P. Svasta
The paper presents a pilot hands-on project in which 73 Bachelor students have taken part. This project addresses a key issue in the education of future electronic engineers: lack of practical activities. For the time being, this activity is placed in the middle of the academic training undergone by Bachelor students. In general, the disciplines which are found in the curricula have the following activities associated: courses, laboratories, seminars or projects. All of these are limited to the discipline they serve. The project described in this paper has been developed as an interdisciplinary activity and is based on the knowledge gained by students at several disciplines studied during the previous semesters. For this purpose, the knowledge gained by students during the first to the forth semesters is considered a prerequisite for realizing the project in the fifth semester. The novelty of the project is completed by the practical development of the electronic module at the end of the fifth semester and by tests and measurements. The electric measurements are compared with the results obtained after designing and simulating the circuit.
{"title":"Hands-on project — Key issue in the education of future electronic engineers","authors":"F. Draghici, M. Pantazica, N. Codreanu, P. Svasta","doi":"10.1109/ISSE.2014.6887646","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887646","url":null,"abstract":"The paper presents a pilot hands-on project in which 73 Bachelor students have taken part. This project addresses a key issue in the education of future electronic engineers: lack of practical activities. For the time being, this activity is placed in the middle of the academic training undergone by Bachelor students. In general, the disciplines which are found in the curricula have the following activities associated: courses, laboratories, seminars or projects. All of these are limited to the discipline they serve. The project described in this paper has been developed as an interdisciplinary activity and is based on the knowledge gained by students at several disciplines studied during the previous semesters. For this purpose, the knowledge gained by students during the first to the forth semesters is considered a prerequisite for realizing the project in the fifth semester. The novelty of the project is completed by the practical development of the electronic module at the end of the fifth semester and by tests and measurements. The electric measurements are compared with the results obtained after designing and simulating the circuit.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129248998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887595
P. Mach, M. Horák
The goal of this work was to show ageing of capacitors with metalized polypropylene film by the sinusoidal and non-sinusoidal voltage and to find how the shape of the voltage waveform influences the ageing rate. A special device, which makes forming of the voltage of the fundamental and selected higher harmonic component possible, was used as a source for non-sinusoidal load. Capacitors with values from 10 nF to 47 /μF were tested. It was found that the ageing rate of capacitors loaded by the non-sinusoidal voltage is mostly a little bit higher in comparison with those when ageing was carried out by the sinusoidal load. The reason is faster degradation of the film electrodes under the non-sinusoidal voltage or higher temperature of “hot-spots” inside the capacitor.
{"title":"Ageing of self-healing polypropylene film capacitors by non-sinusoidal voltage","authors":"P. Mach, M. Horák","doi":"10.1109/ISSE.2014.6887595","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887595","url":null,"abstract":"The goal of this work was to show ageing of capacitors with metalized polypropylene film by the sinusoidal and non-sinusoidal voltage and to find how the shape of the voltage waveform influences the ageing rate. A special device, which makes forming of the voltage of the fundamental and selected higher harmonic component possible, was used as a source for non-sinusoidal load. Capacitors with values from 10 nF to 47 /μF were tested. It was found that the ageing rate of capacitors loaded by the non-sinusoidal voltage is mostly a little bit higher in comparison with those when ageing was carried out by the sinusoidal load. The reason is faster degradation of the film electrodes under the non-sinusoidal voltage or higher temperature of “hot-spots” inside the capacitor.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121511016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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